CN216362414U - Liquid cooling fin and cooling system - Google Patents
Liquid cooling fin and cooling system Download PDFInfo
- Publication number
- CN216362414U CN216362414U CN202121719172.6U CN202121719172U CN216362414U CN 216362414 U CN216362414 U CN 216362414U CN 202121719172 U CN202121719172 U CN 202121719172U CN 216362414 U CN216362414 U CN 216362414U
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- China
- Prior art keywords
- heat dissipation
- heat
- mounting groove
- liquid
- fins
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- 238000001816 cooling Methods 0.000 title abstract description 16
- 239000007788 liquid Substances 0.000 title abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims abstract description 86
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000010521 absorption reaction Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 239000000110 cooling liquid Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a liquid cooling radiating fin and a radiating system, wherein the liquid cooling radiating comprises: the heat dissipation substrate is provided with a mounting groove formed by sinking towards the heat absorption surface; the heat dissipation tooth piece is located in the mounting groove of the heat dissipation substrate, the root of the heat dissipation tooth piece is located below the notch edge of the mounting groove, and the top of the heat dissipation tooth piece is located above the notch edge of the mounting groove. According to the utility model, the root part of the heat dissipation tooth piece is positioned below the notch edge of the mounting groove, and the top part of the heat dissipation tooth piece is positioned above the notch edge of the mounting groove, so that the heat dissipation area is maximized, and the heat dissipation performance is improved.
Description
Technical Field
The utility model relates to the technical field of heat dissipation equipment, in particular to a liquid cooling heat dissipation sheet and a heat dissipation system.
Background
A typical liquid-cooled heat dissipation system must have the following components: the cooling device comprises cooling fins, cooling liquid, a water pump, a pipeline and a heat exchanger. The heat radiating fin is in contact with the CPU chip, absorbs the heat of the CPU chip and conducts the heat to the cooling liquid for heat exchange; the cooling liquid is a liquid, flows in a circulating pipeline under the action of the water pump, the temperature of the cooling liquid rises after absorbing heat, the high-temperature cooling liquid transfers the heat to the heat exchanger with a large surface area, the fan on the heat exchanger takes away the heat of the inflow air, the temperature of the cooling liquid is reduced, and under the driving of the water pump, the cooling liquid flows into the micro-channel formed by the radiating fin and the toothed sheet again to carry out heat exchange and then repeatedly circulate, so that the effect of cooling the chip is achieved. Therefore, it is important to improve the performance of the heat sink to improve the heat dissipation system, such as reducing the thermal resistance of the heat sink, and improving the heat absorption and conduction performance of the heat sink.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to overcoming one or more of the deficiencies of the prior art and providing a liquid-cooled heat sink and a heat dissipation system.
The purpose of the utility model is realized by the following technical scheme: a liquid-cooled heat sink comprising:
the heat dissipation substrate is provided with a mounting groove formed by sinking towards the heat absorption surface, and the bottom of the mounting groove is of a planar structure;
the heat dissipation tooth piece is positioned in the mounting groove of the heat dissipation substrate, the distances from the roots of all the heat dissipation tooth pieces to the heat absorption surface of the heat dissipation substrate are the same, the roots of the heat dissipation tooth pieces are positioned below the notch edge of the mounting groove, and the top of the heat dissipation tooth piece is positioned above the notch edge of the mounting groove.
Preferably, the heat dissipation substrate is a copper alloy or an aluminum alloy, and/or the heat dissipation blade is a copper alloy or an aluminum alloy.
Preferably, the heat dissipation substrate and the heat dissipation tooth piece are of an integrally formed structure.
Preferably, a process groove is arranged between at least one side wall of the mounting groove and the heat dissipation tooth piece.
Preferably, the bottom of the side wall of the mounting groove, which is not provided with the process groove, is connected with the root of the heat dissipation tooth piece, and the side wall is of an inclined structure.
Preferably, the distance between adjacent radiating fins is equal to the thickness of the radiating fins.
Preferably, the thickness between the groove bottom of the mounting groove and the heat absorbing surface of the heat dissipation substrate is 0.4-1.0 mm.
Preferably, the thickness of the radiating tooth sheet is 0.05-0.3 mm.
Preferably, the height of the radiating tooth sheet is 1-10 mm.
A heat dissipation system comprises the liquid cooling heat sink.
The utility model has the beneficial effects that:
(1) according to the utility model, the root part of the heat dissipation tooth piece is positioned below the notch edge of the mounting groove, and the top part of the heat dissipation tooth piece is positioned above the notch edge of the mounting groove, so that the heat dissipation area is maximized, and the heat dissipation performance is improved;
(2) the groove bottom of the mounting groove is of a plane structure, the distances from the roots of all the radiating tooth sheets to the heat absorption surface of the radiating substrate are equal, the thermal resistance in the heat transfer process is reduced, and the radiating performance is improved.
Drawings
FIG. 1 is a side schematic view of a liquid-cooled heat sink;
FIG. 2 is a schematic side view of a liquid-cooled heat sink;
FIG. 3 is a schematic top view of the heat sink with liquid cooling;
in the figure, 1 is a heat dissipation substrate, 2 is a heat dissipation tooth sheet, 3 is a chip, 4 is a process groove, and 5 is a mounting hole.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1-3, the present embodiment provides a liquid-cooled heat sink and heat dissipation system:
example one
As shown in fig. 1, a liquid cooling fin includes a heat dissipation substrate 1 and heat dissipation fins 2, the heat dissipation surface of the heat dissipation substrate 1 has a mounting groove formed by sinking towards the heat absorption surface of the heat dissipation substrate 1, the groove bottom of the mounting groove is of a planar structure, the heat dissipation fins 2 are located in the mounting groove of the heat dissipation substrate 1, the distances from the roots of all the heat dissipation fins 2 to the heat absorption surface of the heat dissipation substrate 1 are the same, the roots of the heat dissipation fins 2 are located below the notch edge of the mounting groove, and the tops of the heat dissipation fins 2 are located above the notch edge of the mounting groove.
The heat dissipation tooth piece 2 forms a channel for flowing fluid on the heat dissipation substrate 1, and utilizes the characteristics of the micro-channel to maximize the heat dissipation area in the minimum space, thereby increasing the heat convection intensity, reducing the thermal resistance in the heat transfer process, reducing the temperature of the devices needing heat dissipation, such as the chip 3, and the like, and improving the working reliability of the devices, such as the chip 3, and the like. The groove bottom of the mounting groove is of a plane structure, so that the processing difficulty is reduced, the distances from the roots of all the radiating tooth sheets 2 to the heat absorption surface of the radiating substrate 1 are the same, the thermal resistance in the heat transfer process is reduced, and the radiating performance is improved; because the tank bottom of mounting groove is planar structure, when using, can follow all directions and intake and go out water, very convenient.
The surface of the heat dissipation substrate 1, which is connected to a device requiring heat dissipation, such as the chip 3, is a heat absorption surface of the heat dissipation substrate 1, such as the bottom surface of the heat dissipation substrate 1 in fig. 1, and the surface opposite to the heat absorption surface is a heat dissipation surface of the heat dissipation substrate 1, such as the top surface of the heat dissipation substrate 1 in fig. 1. The end of the heat dissipation tooth piece 2 connected with the heat dissipation substrate 1 is the root of the heat dissipation tooth piece 2, such as the top end of the heat dissipation tooth piece 2 in fig. 1; the end of the heat dissipation blade 2 away from the heat dissipation substrate 1 is the top of the heat dissipation blade 2, such as the bottom end of the heat dissipation blade 2 in fig. 1.
In some embodiments, the heat dissipation substrate 1 and the heat dissipation fins 2 are an integrally formed structure, and there is no thermal resistance during heat transfer, so that the heat transfer efficiency is high, and the heat dissipation performance is improved.
In some embodiments, the heat dissipation substrate 1 is a copper alloy or an aluminum alloy, and/or the heat dissipation fins 2 are a copper alloy or an aluminum alloy, which have good heat conductivity and can quickly conduct heat of devices such as the chip 3.
In some embodiments, the thickness between the groove bottom of the mounting groove and the heat absorbing surface of the heat dissipating substrate 1 is 0.4-1.0mm, that is, the value of h1 in fig. 1 is 0.4-1.0mm, so that the thermal resistance in the heat transfer process is maximally reduced and the heat dissipating performance of the heat dissipating fin is improved on the basis of ensuring the assembling strength, for example, the thickness between the groove bottom of the mounting groove and the heat absorbing surface of the heat dissipating substrate 1 is 0.4mm, 0.6mm, 0.8mm or 1.0 mm; the height of the heat dissipation fins 2 is 1-10mm, that is, the value of Fh in fig. 1 is 1-10mm, for example, the height of the heat dissipation fins 2 is 1mm, 3mm, 5mm, 7mm, 9mm or 10 mm; the thickness of said heat-dissipating fins 2 is 0.05-0.3mm, i.e. Ft in fig. 1 has a value of 0.05-0.3mm, for example, the thickness of the heat-dissipating fins 2 is 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm or 3 mm; in addition, Fp in FIG. 1 has a value of 0.1 to 0.6 mm. In some embodiments, the spacing between adjacent cooling fins 2 is equal to the thickness of the cooling fins 2.
In some embodiments, as shown in fig. 2, a process groove 4 is provided between at least one side wall of the mounting groove and the heat dissipation fins 2, so as to facilitate the processing of the heat dissipation fins; the bottom of the side wall of the mounting groove, which is not provided with the process groove 4, is connected with the root of the heat dissipation tooth piece 2, and the side wall of the mounting groove, which is not provided with the process groove 4, is of an inclined structure.
Generally, the bottom of the mounting groove is parallel to the heat absorbing surface of the heat dissipating substrate 1, the heat dissipating fins 2 are regularly arranged in the mounting groove of the heat dissipating substrate 1 at equal intervals, the heat dissipating substrate 1 is provided with assembling holes 5, and the assembling holes 5 are used for assembling the liquid cooling fins, as shown in fig. 3.
Example two
A heat dissipation system comprising the liquid-cooled heat sink of the first embodiment.
The foregoing is illustrative of the preferred embodiments of this invention, and it is to be understood that the utility model is not limited to the precise form disclosed herein and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the concept as disclosed herein, either as described above or as apparent to those skilled in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the utility model as defined by the appended claims.
Claims (10)
1. A liquid-cooled heat sink, comprising:
the heat dissipation substrate is provided with a mounting groove formed by sinking towards the heat absorption surface, and the bottom of the mounting groove is of a planar structure;
the heat dissipation tooth piece is positioned in the mounting groove of the heat dissipation substrate, the distances from the roots of all the heat dissipation tooth pieces to the heat absorption surface of the heat dissipation substrate are the same, the roots of the heat dissipation tooth pieces are positioned below the notch edge of the mounting groove, and the top of the heat dissipation tooth piece is positioned above the notch edge of the mounting groove.
2. A liquid-cooled heat sink as claimed in claim 1, wherein the heat-dissipating substrate is made of copper alloy or aluminum alloy, and/or the heat-dissipating fins are made of copper alloy or aluminum alloy.
3. The liquid-cooled heat sink as claimed in claim 1, wherein the heat-dissipating substrate and the heat-dissipating fins are integrally formed.
4. A liquid-cooled heat sink as claimed in claim 1, wherein a process groove is formed between at least one side wall of the mounting groove and the heat sink fins.
5. The liquid-cooled heat sink as claimed in claim 4, wherein the bottom of the side wall of the mounting groove without the process groove is connected to the root of the heat sink fin, and the side wall has an inclined structure.
6. A liquid-cooled heat sink as claimed in claim 1, wherein the spacing between adjacent fins is equal to the thickness of the fins.
7. A liquid-cooled heat sink as claimed in claim 1, wherein the thickness between the bottom of the mounting groove and the heat absorbing surface of the heat-dissipating substrate is 0.4-1.0 mm.
8. A liquid-cooled heat sink as claimed in claim 1, wherein the fins have a thickness of 0.05-0.3 mm.
9. A liquid-cooled heat sink as claimed in claim 1, wherein the fins have a height of 1-10 mm.
10. A heat dissipation system comprising the liquid-cooled heat sink of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121719172.6U CN216362414U (en) | 2021-07-27 | 2021-07-27 | Liquid cooling fin and cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121719172.6U CN216362414U (en) | 2021-07-27 | 2021-07-27 | Liquid cooling fin and cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216362414U true CN216362414U (en) | 2022-04-22 |
Family
ID=81189035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121719172.6U Active CN216362414U (en) | 2021-07-27 | 2021-07-27 | Liquid cooling fin and cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216362414U (en) |
-
2021
- 2021-07-27 CN CN202121719172.6U patent/CN216362414U/en active Active
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