CN216362413U - Corrugated radiating fin and radiating system - Google Patents

Abstract

The utility model discloses a corrugated heat sink and a heat dissipation system, wherein the corrugated heat sink comprises: a heat-dissipating substrate; the heat dissipation base plate comprises a heat dissipation toothed sheet, wherein a heat dissipation surface of the heat dissipation base plate is provided with a mounting groove formed by sinking towards a heat absorption surface, the heat dissipation toothed sheet is located in the mounting groove of the heat dissipation base plate, the root of the heat dissipation toothed sheet is located below the notch edge of the mounting groove, the top of the heat dissipation toothed sheet is located above the notch edge of the mounting groove, and the heat dissipation toothed sheet is corrugated. The root of the heat dissipation tooth piece is positioned below the edge of the notch of the mounting groove, so that the distance between the heat dissipation tooth piece and the heat absorption surface of the heat dissipation substrate is reduced, the heat dissipation area is increased, and the heat dissipation performance is improved.

Description

Corrugated radiating fin and radiating system

Technical Field

The utility model relates to the technical field of heat dissipation equipment, in particular to a corrugated heat dissipation sheet and a heat dissipation system.

Background

A typical liquid-cooled heat dissipation system must have the following components: the cooling device comprises cooling fins, cooling liquid, a water pump, a pipeline and a heat exchanger. The heat radiating fin is in contact with the CPU chip, absorbs the heat of the CPU chip and conducts the heat to the cooling liquid for heat exchange; the cooling liquid is a liquid, flows in a circulating pipeline under the action of the water pump, the temperature of the cooling liquid rises after absorbing heat, the high-temperature cooling liquid transfers the heat to the heat exchanger with a large surface area, the fan on the heat exchanger takes away the heat of the inflow air, the temperature of the cooling liquid is reduced, and under the driving of the water pump, the cooling liquid flows into the micro-channel formed by the radiating fin and the toothed sheet again to carry out heat exchange and then repeatedly circulate, so that the effect of cooling the chip is achieved. Therefore, it is important to improve the performance of the heat sink to improve the heat dissipation system, such as reducing the thermal resistance of the heat sink, and improving the heat absorption and conduction performance of the heat sink.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to overcoming one or more of the deficiencies of the prior art and to providing a corrugated fin and a heat dissipation system.

The purpose of the utility model is realized by the following technical scheme: a corrugated fin comprising:

a heat-dissipating substrate;

the heat dissipation base plate comprises a heat dissipation toothed sheet, wherein a heat dissipation surface of the heat dissipation base plate is provided with a mounting groove formed by sinking towards a heat absorption surface, the heat dissipation toothed sheet is located in the mounting groove of the heat dissipation base plate, the root of the heat dissipation toothed sheet is located below the notch edge of the mounting groove, the top of the heat dissipation toothed sheet is located above the notch edge of the mounting groove, and the heat dissipation toothed sheet is corrugated.

Preferably, the bottom of the mounting groove is of a planar structure, and the bottom of the mounting groove is parallel to the heat absorbing surface of the heat dissipation substrate.

Preferably, a process groove is arranged between at least one side wall of the mounting groove and the heat dissipation tooth piece.

Preferably, the heat dissipation substrate is a substrate with a fool-proof structure.

Preferably, one corner of the heat-dissipating substrate has a chamfer different from all the remaining corners.

Preferably, the heat dissipation substrate and the heat dissipation tooth piece are of an integrally formed structure.

Preferably, the wave length of the wave shape is 2-3mm, and the wave height of the wave shape is 0.4-0.6 mm.

Preferably, the thickness between the groove bottom of the mounting groove and the heat absorption surface of the heat dissipation substrate is 0.4-1.0mm, the height of the heat dissipation toothed sheet is 1-10mm, and the thickness of the heat dissipation toothed sheet is 0.05-0.3 mm.

Preferably, the distance between adjacent radiating fins is equal to the thickness of the radiating fins.

A heat dissipation system comprises the corrugated heat dissipation plate.

The utility model has the beneficial effects that:

(1) compared with the traditional heat dissipation tooth piece which adopts a plane structure and is arranged on the surface of the heat dissipation substrate, the heat dissipation area is increased by 10-15%, and the heat dissipation performance is improved by 10-20%;

(2) the foolproof structure is arranged on the radiating substrate, so that the foolproof effect is achieved when the radiating fins are assembled, and the assembly errors can be effectively prevented.

Drawings

FIG. 1 is a perspective view of a corrugated fin;

FIG. 2 is a schematic top view of a corrugated fin;

FIG. 3 is an enlarged view at C of FIG. 2;

FIG. 4 is a cross-sectional view taken at the location A-A in FIG. 2;

FIG. 5 is an enlarged view at D of FIG. 4;

FIG. 6 is a cross-sectional view taken at location B-B of FIG. 2;

in the figure, 1 is a heat dissipation substrate, 2 is a heat dissipation tooth sheet, 3 is a process groove, and 4 is an assembly hole.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.

Referring to fig. 1-6, the present embodiment provides a corrugated heat sink and a heat dissipation system:

as shown in fig. 1, a corrugated heat sink includes a heat dissipating substrate 1 and heat dissipating fins 2, wherein the heat dissipating surface of the heat dissipating substrate 1 has a mounting groove formed by recessing toward the heat absorbing surface, the heat dissipating fins 2 are located in the mounting groove of the heat dissipating substrate 1, the roots of the heat dissipating fins 2 are located below the notch edges of the mounting groove, and the tops of the heat dissipating fins 2 are located above the notch edges of the mounting groove, that is, the heat dissipating fins 2 adopt a sunken structure, as shown in fig. 6. Compared with the traditional heat dissipation toothed sheet 2 which adopts a planar structure, the heat dissipation toothed sheet 2 is arranged on the surface of the heat dissipation substrate 1, the distance between the heat dissipation toothed sheet 2 and the heat absorption surface of the heat dissipation substrate 1 is reduced, the heat dissipation area is increased, and the heat dissipation performance is improved.

The heat radiating fins 2 have a corrugated shape as shown in fig. 2 and 3. The heat dissipation tooth piece 2 adopts a corrugated shape, so that the heat dissipation area is increased, and the heat dissipation performance is improved. Generally, the heat dissipation fins 2 have a vertical corrugated structure, a horizontal corrugated structure or an inclined corrugated structure. In some embodiments, the wave length of the wave shape is 2-3mm and the wave height of the wave shape is 0.4-0.6mm, for example, the wave length of the wave shape is 2mm and the wave height is 0.6mm, or the wave length of the wave shape is 2.5mm and the wave height is 0.4mm, or the wave length of the wave shape is 3mm and the wave height is 0.5 mm.

The surface of the heat dissipation substrate 1, which is connected to a device requiring heat dissipation, such as a chip, is a heat absorption surface of the heat dissipation substrate 1, for example, the bottom surface of the heat dissipation substrate 1 in fig. 4, and the surface opposite to the heat absorption surface is a heat dissipation surface of the heat dissipation substrate 1, for example, the top surface of the heat dissipation substrate 1 in fig. 4. The end of the heat dissipation tooth piece 2 connected with the heat dissipation substrate 1 is the root of the heat dissipation tooth piece 2, such as the top end of the heat dissipation tooth piece 2 in fig. 4; the end of the heat dissipation blade 2 away from the heat dissipation substrate 1 is the top of the heat dissipation blade 2, as shown in fig. 4, the bottom end of the heat dissipation blade 2.

In some embodiments, the bottom of the mounting groove is a planar structure, and the bottom of the mounting groove is parallel to the heat absorbing surface of the heat dissipating substrate 1, and the heat dissipating fins 2 are regularly arranged in the mounting groove of the heat dissipating substrate 1 at equal intervals, that is, the distances from the roots of all the heat dissipating fins 2 to the heat absorbing surface of the heat dissipating substrate 1 are the same. The groove bottom of the mounting groove is of a plane structure, so that the processing difficulty is reduced, the distances from the roots of all the radiating tooth sheets 2 to the heat absorption surface of the radiating substrate 1 are the same, the thermal resistance in the heat transfer process is reduced, and the radiating performance is improved; because the tank bottom of mounting groove is planar structure, when using, can follow all directions and intake and go out water, very convenient.

Generally, the heat dissipation substrate 1 is provided with a mounting hole 4, and the mounting hole 4 is used for mounting the corrugated heat dissipation plate. The heat dissipation tooth piece 2 forms a channel for flowing fluid on the heat dissipation substrate 1, and utilizes the characteristics of the micro-channel to maximize the heat dissipation area in the minimum space, thereby increasing the heat convection intensity, reducing the thermal resistance in the heat transfer process, reducing the temperature of devices needing heat dissipation, such as chips, and the like, and improving the working reliability of the devices, such as chips, and the like.

In some embodiments, the thickness between the groove bottom of the mounting groove and the heat absorbing surface of the heat dissipating substrate 1 is 0.4-1.0mm, that is, the value of h1 in fig. 5 is 0.4-1.0mm, so that the thermal resistance during heat transfer is maximally reduced and the heat dissipating performance of the heat dissipating fin is improved on the basis of ensuring the assembling strength, for example, the thickness between the groove bottom of the mounting groove and the heat absorbing surface of the heat dissipating substrate 1 is 0.4mm, 0.6mm, 0.8mm or 1.0 mm; the height of the heat dissipation fins 2 is 1-10mm, that is, the value of Fh in fig. 5 is 1-10mm, for example, the height of the heat dissipation fins 2 is 1mm, 3mm, 5mm, 7mm, 9mm or 10 mm; the thickness of the heat dissipation fins 2 is 0.05-0.3mm, that is, the value of Ft in fig. 5 is 0.05-0.3mm, for example, the thickness of the heat dissipation fins 2 is 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, or 3 mm; in addition, Fp (the sum of the thickness of one fin 2 and the pitch of one fin 2) in FIG. 5 is 0.1 to 0.6 mm. In some embodiments, the spacing between adjacent cooling fins 2 is equal to the thickness of the cooling fins 2.

In some embodiments, the heat dissipation substrate 1 is a substrate with a fool-proof structure, and the fool-proof structure plays a fool-proof role when assembling the heat dissipation fins, so that the assembling error of the corrugated heat dissipation fins can be effectively prevented. For example, one corner of the heat dissipation substrate 1 has a chamfer different from all other corners, so that the heat dissipation substrate 1 has a fool-proof structure, thereby implementing the fool-proof function, as shown in fig. 1 and 2, the heat dissipation substrate 1 is square, three corners of the heat dissipation substrate 1 are chamfered, and the other corner of the heat dissipation substrate 1 is chamfered, so that the heat dissipation substrate 1 has the fool-proof structure; the shape of the heat dissipating substrate 1 is not limited to a square shape, and may be a rectangular shape or the like; the fool-proof structure can also adopt other structures as long as the fool-proof in the assembling process of the corrugated radiating fin can be realized.

In some embodiments, as shown in fig. 5, a process groove 3 is provided between at least one side wall of the mounting groove and the heat dissipation fins 2, so as to facilitate the processing of the heat dissipation fins.

In some embodiments, the heat dissipation substrate 1 and the heat dissipation fins 2 are an integrally formed structure, and there is no thermal resistance during heat transfer, so that the heat transfer efficiency is high, and the heat dissipation performance is improved.

In some embodiments, the heat dissipation substrate 1 is a copper alloy or an aluminum alloy, and/or the heat dissipation fins 2 are a copper alloy or an aluminum alloy, and the copper alloy and the aluminum alloy have good heat conductivity and can quickly conduct heat of devices such as chips.

Example two

A heat dissipating system comprising the corrugated fin as described in the first embodiment.

The foregoing is illustrative of the preferred embodiments of this invention, and it is to be understood that the utility model is not limited to the precise form disclosed herein and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the concept as disclosed herein, either as described above or as apparent to those skilled in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims (10)

1. A corrugated fin, comprising:

a heat-dissipating substrate;

the heat dissipation base plate comprises a heat dissipation toothed sheet, wherein a heat dissipation surface of the heat dissipation base plate is provided with a mounting groove formed by sinking towards a heat absorption surface, the heat dissipation toothed sheet is located in the mounting groove of the heat dissipation base plate, the root of the heat dissipation toothed sheet is located below the notch edge of the mounting groove, the top of the heat dissipation toothed sheet is located above the notch edge of the mounting groove, and the heat dissipation toothed sheet is corrugated.

2. The corrugated heat sink as claimed in claim 1, wherein the bottom of the mounting groove is a planar structure, and the bottom of the mounting groove is parallel to the heat absorbing surface of the heat dissipating substrate.

3. The corrugated fin as claimed in claim 1, wherein a process groove is formed between at least one side wall of the installation groove and the fin.

4. The corrugated fin as claimed in claim 1, wherein the heat-dissipating substrate is a substrate having a fool-proof structure.

5. The corrugated fin as claimed in claim 4, wherein one corner of said heat-dissipating substrate has a chamfer different from all the other corners.

6. The corrugated fin as claimed in claim 1, wherein said heat dissipating base plate and said heat dissipating fin are of an integrally formed structure.

7. A corrugated fin as claimed in claim 1, wherein said corrugated shape has a wavelength of 2 to 3mm and a wave height of 0.4 to 0.6 mm.

8. The corrugated fin as claimed in claim 2, wherein the thickness between the bottom of the mounting groove and the heat absorbing surface of the heat dissipating substrate is 0.4 to 1.0mm, the height of the heat dissipating fins is 1 to 10mm, and the thickness of the heat dissipating fins is 0.05 to 0.3 mm.

9. The corrugated fin as claimed in claim 1, wherein the interval between the adjacent radiating fins is equal to the thickness of the radiating fins.

10. A heat dissipating system comprising the corrugated fin as recited in any one of claims 1 to 9.

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