CN214046522U - Precision high-temperature-resistant spacer element for circuit board permeation etching for communication equipment - Google Patents
Precision high-temperature-resistant spacer element for circuit board permeation etching for communication equipment Download PDFInfo
- Publication number
- CN214046522U CN214046522U CN202120122772.8U CN202120122772U CN214046522U CN 214046522 U CN214046522 U CN 214046522U CN 202120122772 U CN202120122772 U CN 202120122772U CN 214046522 U CN214046522 U CN 214046522U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- spacer
- heat insulation
- plates
- communication equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a precise high-temperature resistant spacer element for circuit board permeation etching for communication equipment, which comprises a spacer main body, wherein the spacer main body comprises a spacer frame, a plurality of transverse supporting plates and longitudinal supporting plates which are arranged in the spacer frame, the transverse supporting plates and the longitudinal supporting plates are mutually crossed to form a plurality of grid gaps, supporting blocks are arranged at the four corners of the grid gaps, heat insulation plates are arranged in the grid gaps, the heat insulation plates are supported and fixed by the supporting blocks at the four corners at the bottom, after the installation position of an electronic element on the circuit board is determined, the heat insulation plates are arranged at the grid gap positions under the electronic element to ensure that the heat insulation plates are positioned under the electronic element on the circuit board, the heat insulation plates have good heat insulation effect on the electronic element, the vacant grid gaps play a role in heat radiation at the bottom of the circuit board, and the spacer element plays a role in heat insulation protection for the circuit board, the circuit board is convenient to dissipate heat, and the using effect is good.
Description
Technical Field
The utility model belongs to the technical field of the industry accessory and specifically relates to a circuit board infiltration etching precision high temperature resistant spacer component for communication equipment class is related to.
Background
In the industrial field, in order to avoid direct conduction of external high temperature to the circuit board, it is necessary to mount a circuit board high temperature resistant spacer member on the back surface of the circuit board. The high-temperature resistant spacer element of the circuit board is mainly arranged on the back of the circuit board to play a role in heat insulation protection for the circuit board, the current high-temperature resistant spacer element of the circuit board has a solid heat insulation plate structure, the heat insulation plate adopts heat insulation materials, the heat insulation plate plays a role in heat insulation protection for the circuit board, but also has the function of heat accumulation on the circuit board and is not beneficial to the exposed heat dissipation of the back surface of the circuit board, therefore, a plurality of through holes are arranged on some heat insulation boards and have the function of heat dissipation through the through holes, however, after the positions of the through holes are fixed, when the heat insulation board is used, the through holes can not be ensured to effectively avoid the installation positions of the electronic elements on the circuit board, if the through hole corresponds to the mounting position of the electronic element on the circuit board, the heat insulation effect cannot be achieved, and the circuit board permeation etching precise high-temperature-resistant spacer element for the communication equipment is designed based on the defects of the existing heat insulation plate.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a circuit board permeation etching precise high-temperature-resistant spacer element for communication equipment.
In order to realize the purpose, the utility model discloses a technical scheme as follows:
a precise high-temperature resistant spacer element for the permeation etching of a circuit board for communication equipment comprises a spacer main body, wherein the spacer main body comprises a spacer frame, a plurality of transverse supporting plates and longitudinal supporting plates which are arranged in the spacer frame, the transverse supporting plates and the longitudinal supporting plates are mutually crossed to form a plurality of grid gaps, supporting blocks are arranged at four corners of each grid gap, a heat insulation board is arranged in each grid gap, and the heat insulation board is supported and fixed through the supporting blocks at the four corners at the bottom;
the spacer body is fixedly mounted at the bottom of the circuit board, and the heat insulation plate is positioned right below the electronic element on the circuit board.
Further, the transverse supporting plates, the longitudinal supporting plates, the supporting blocks and the heat insulation plates are made of heat insulation materials.
Further, a plurality of transverse support plates and longitudinal support plates are arranged in a rectangular array on the inner side of the spacer frame.
Furthermore, the four corners of the spacer frame are provided with fixing holes, and the spacer frame is fixed at the bottom of the circuit board through bolts in the fixing holes.
Furthermore, the supporting block is fixed on the transverse supporting plate or the longitudinal supporting plate and is square or circular.
The utility model has the advantages that: the spacer main part fixed mounting of this structure is in the bottom of circuit board, have a plurality of horizontal backup pads and vertical backup pad in the spacer frame, horizontal backup pad and vertical backup pad intercrossing form a plurality of net clearances, the four corners department in net clearance is equipped with the supporting shoe, settle the heat insulating board in the net clearance, the heat insulating board supports fixedly through the supporting shoe of bottom four corners department, after confirming the mounted position of electronic component on the circuit board, it can make the heat insulating board be located electronic component under the circuit board to settle the heat insulating board in electronic component's below net clearance position department under electronic component, the heat insulating board has played fine thermal-insulated effect to electronic component, and vacant net clearance has played the radiating effect in the bottom of circuit board, this spacer component has both played the circuit board thermal-insulated guard action, also make things convenient for circuit board self to dispel the heat, excellent in use effect.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is the structure schematic diagram before the installation of the heat insulation plate of the utility model.
Detailed Description
As shown in fig. 1 and fig. 2, a precise high temperature resistant spacer element for circuit board permeation etching for communication equipment comprises a spacer body 1, wherein the spacer body 1 comprises a spacer frame 2, a plurality of transverse support plates 3 and longitudinal support plates 4 which are arranged in the spacer frame 2, the transverse support plates 3 and the longitudinal support plates 4 are mutually crossed to form a plurality of grid gaps 5, supporting blocks 6 are arranged at four corners of the grid gaps 5, heat insulation plates 7 are arranged in the grid gaps 5, and the heat insulation plates 7 are supported and fixed through the supporting blocks 6 at the four corners at the bottom;
the spacer body 1 is fixedly mounted on the bottom of the circuit board, and the heat insulating plate 7 is located right below the electronic components on the circuit board.
The transverse support plates 3, the longitudinal support plates 4, the support blocks 6 and the heat insulation plates 7 are made of heat insulation materials. A plurality of lateral support plates 3 and longitudinal support plates 4 are arranged in a rectangular array inside the spacer frame 2. The four corners of spacer frame 2 are equipped with fixed orifices 8, and spacer frame 2 passes through the bolt fastening in fixed orifices 8 in the bottom of circuit board. The supporting block 6 is fixed on the transverse supporting plate 3 or the longitudinal supporting plate 4, and the supporting block 6 is square or circular.
The spacer main body of the structure is fixedly arranged at the bottom of a circuit board, a plurality of transverse supporting plates 3 and longitudinal supporting plates 4 are arranged in a spacer frame, the transverse supporting plates 3 and the longitudinal supporting plates 4 are mutually crossed to form a plurality of grid gaps 5, supporting blocks 6 are arranged at four corners of the grid gaps 5, heat insulation plates 7 are arranged in the grid gaps 5, the heat insulation plates 7 are supported and fixed through the supporting blocks 6 at the four corners of the bottom, after the installation position of an electronic element on the circuit board is determined, the heat insulation plates 7 are arranged at the positions of the grid gaps 5 under the electronic element, so that the heat insulation plates 7 can be positioned under the electronic element on the circuit board, the heat insulation plates 7 have good heat insulation effect on the electronic element, the vacant grid gaps 5 have a heat dissipation effect at the bottom of the circuit board, the spacer element has a heat insulation protection effect on the circuit board and is convenient for the self heat dissipation of the circuit board, the use effect is good.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the principles of the present invention may be applied to any other embodiment without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. A precise high-temperature resistant spacer element for the permeation etching of a circuit board for communication equipment comprises a spacer main body, wherein the spacer main body comprises a spacer frame, and a plurality of transverse supporting plates and longitudinal supporting plates which are arranged in the spacer frame;
the spacer body is fixedly mounted at the bottom of the circuit board, and the heat insulation plate is positioned right below the electronic element on the circuit board.
2. The precision high temperature resistant spacer element for circuit board penetration etching of communication equipment as claimed in claim 1, wherein the material of the transverse support plate, the longitudinal support plate, the support block and the thermal insulation plate is thermal insulation material.
3. The precision high temperature resistant spacer element for circuit board infiltration etching for communication equipment as claimed in claim 2, wherein a plurality of transverse support plates and longitudinal support plates are arranged in a rectangular array inside the spacer frame.
4. The precision high-temperature-resistant spacer element for circuit board penetration etching of communication equipment as claimed in claim 2, wherein fixing holes are provided at four corners of the spacer frame, and the spacer frame is fixed on the bottom of the circuit board by bolts in the fixing holes.
5. The precision high temperature resistant spacer element for circuit board penetration etching of communication equipment as claimed in claim 2, wherein said supporting block is fixed on the transverse supporting plate or the longitudinal supporting plate, and the supporting block is square or circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120122772.8U CN214046522U (en) | 2021-01-15 | 2021-01-15 | Precision high-temperature-resistant spacer element for circuit board permeation etching for communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120122772.8U CN214046522U (en) | 2021-01-15 | 2021-01-15 | Precision high-temperature-resistant spacer element for circuit board permeation etching for communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214046522U true CN214046522U (en) | 2021-08-24 |
Family
ID=77346693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120122772.8U Active CN214046522U (en) | 2021-01-15 | 2021-01-15 | Precision high-temperature-resistant spacer element for circuit board permeation etching for communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214046522U (en) |
-
2021
- 2021-01-15 CN CN202120122772.8U patent/CN214046522U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214046522U (en) | Precision high-temperature-resistant spacer element for circuit board permeation etching for communication equipment | |
| CN210986573U (en) | High heat dissipation printed wiring board | |
| CN211857412U (en) | Heat dissipation structure for FPGA composite board card | |
| CN212463626U (en) | Multilayer flexible circuit board | |
| CN213178834U (en) | High-efficient air heater of area protection | |
| CN108541133B (en) | Circuit board that permeability is strong | |
| CN209982811U (en) | Environment-friendly industrial control panel | |
| CN210900048U (en) | Chip platform circuit board for realizing mutual switching between 4G and 3G | |
| CN110809362A (en) | High-heat-dissipation printed circuit board and manufacturing method thereof | |
| CN207765847U (en) | A kind of waterproof temperature control electric power cabinet | |
| CN212413510U (en) | Printed circuit board with static electricity removing structure | |
| CN207410588U (en) | A kind of copper base of perfect heat-dissipating | |
| CN214013510U (en) | Dustproof radiating electric power cabinet | |
| CN209777100U (en) | Integrated circuit with shockproof function | |
| CN216700426U (en) | Circuit board penetrating through T-shaped high-rise copper-buried layer | |
| CN220798611U (en) | Novel integrated circuit board | |
| CN214930410U (en) | Based on slide controller mounting structure | |
| CN209947835U (en) | Frame for triode | |
| CN220755279U (en) | Insulating multilayer aluminum-based circuit board | |
| CN213755101U (en) | High-load aluminum-based circuit board | |
| CN214592124U (en) | Anti-interference PCB board of antivibration | |
| CN217693818U (en) | Detachable electronic ceramic substrate | |
| CN211376555U (en) | Air switch fixing frame | |
| CN212210611U (en) | Power panel of monitoring terminal of distribution transformer | |
| CN213638700U (en) | Heat radiation structure suitable for circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |