CN214044340U - Semiconductor laser device - Google Patents

Abstract

The utility model provides a semiconductor laser device relates to laser equipment technical field. The semiconductor laser device comprises a laser, wherein the laser comprises a laser bottom plate, a plate glass assembly, a laser protection cover and a laser emission assembly, the plate glass assembly and the laser emission assembly are both installed on the laser bottom plate, the laser protection cover is covered on the laser bottom plate, the plate glass assembly comprises a plate glass and a plate glass installation seat, the plate glass is installed on the plate glass installation seat, a photodiode is arranged inside the laser protection cover, and a part of laser beams are reflected to the photodiode by the plate glass. Utilize the flat glass subassembly to monitor on reflecting partial laser to photodiode, the device can prevent that the outside light of laser instrument from reflecting back to photodiode's interference simultaneously to can carry out accurate monitoring to the power of laser beam, make semiconductor laser device can launch the constant power laser beam.

Description

Semiconductor laser device

Technical Field

The utility model relates to a laser equipment technical field especially relates to a semiconductor laser device.

Background

The semiconductor laser device has the advantages of small volume, light weight, high reliability, long service life and low power consumption, and is widely applied to various fields of national economy, such as pumping, biomedical detection and industrial processing. However, the real-time power of the laser beam emitted by the current semiconductor laser device is difficult to monitor, and the use of the semiconductor laser device is influenced.

SUMMERY OF THE UTILITY MODEL

In view of this, the embodiment of the present invention provides a semiconductor laser device to solve the problem that in the prior art, the real-time power of the laser beam emitted by the semiconductor laser device is difficult to monitor, which affects the use of the semiconductor laser device.

To achieve the above object, an embodiment of the present invention provides a semiconductor laser device, including: the laser device, the laser device includes laser bottom plate, flat glass subassembly, laser safety cover and laser emission subassembly, the flat glass subassembly with the laser emission subassembly all install in the laser bottom plate, the laser safety cover close in on the laser bottom plate, the flat glass subassembly includes flat glass and flat glass mount pad, flat glass install in the flat glass mount pad, the inside photodiode that is equipped with of laser safety cover, flat glass with some laser beam reflection extremely photodiode.

As a further improvement of the above technical solution:

the semiconductor laser device further comprises a laser emitting assembly, wherein the laser emitting assembly comprises a laser seat, two heat insulation blocks and a heating and refrigerating piece, the heating and refrigerating piece is located between the two heat insulation blocks, and the laser seat is installed on the laser bottom plate through the two heat insulation blocks.

In the semiconductor laser device, the upper and lower surfaces of the heating and cooling plate are both adhered with heat conducting materials.

In the semiconductor laser device, the laser emitting assembly further comprises a laser diode and a pressing ring, wherein a thread is arranged on the outer surface of the pressing ring, the laser diode is located in the pressing ring, and the pressing ring is mounted on the laser base through the thread.

In the semiconductor laser device, the laser emission assembly further comprises a collimating lens barrel and a collimating mirror nut, wherein the outer surface of the collimating lens barrel is provided with a thread, the collimating lens barrel is mounted on the collimating mirror nut through the thread, and the collimating mirror nut is mounted on the laser seat through a bolt.

The semiconductor laser device further comprises a temperature sensor, wherein the temperature sensor is installed on the laser seat and used for detecting the temperature of the laser emitting assembly, and the heating refrigeration piece is used for controlling the laser emitting assembly to be at constant temperature.

The semiconductor laser device further comprises an optical base plate and a steering adjusting assembly, wherein the steering adjusting assembly and the laser are both mounted on the optical base plate, a laser beam emitted by the laser penetrates through the steering adjusting assembly, and the steering adjusting assembly is used for adjusting the direction of the laser beam emitted by the laser.

In the semiconductor laser device, the steering adjustment assembly includes a lens, a lens mounting seat and a steering adjustment bracket, the lens is mounted on the lens mounting seat, the lens mounting seat is vertically and rotatably mounted on the steering adjustment bracket, and the steering adjustment bracket is horizontally and rotatably mounted on the optical base plate.

The semiconductor laser device further comprises a steering adjusting support, wherein the steering adjusting support comprises a steering adjusting base and two steering adjusting upright columns, the steering adjusting base is provided with two arc-shaped holes located in the same circle, the steering adjusting base penetrates through the arc-shaped holes through bolts and is installed on the optical bottom plate, and the lens installing seat is rotatably installed between the two steering adjusting upright columns through a rotating shaft.

The semiconductor laser device further comprises a cylindrical mirror assembly, wherein the cylindrical mirror assembly comprises a cylindrical mirror and a cylindrical mirror base, the cylindrical mirror is movably mounted on the cylindrical mirror base, the cylindrical mirror base is mounted on the optical base plate, a laser beam emitted by the laser can pass through the cylindrical mirror to the steering adjustment assembly, and the moving direction of the cylindrical mirror is parallel to the direction of the laser beam.

The utility model has the advantages that:

the utility model provides a pair of semiconductor laser device, including the laser instrument, the laser instrument includes laser bottom plate, flat glass subassembly, laser safety cover and laser emission subassembly, and flat glass subassembly and laser emission subassembly are all installed in the laser bottom plate, and laser safety cover covers and closes on the laser bottom plate, and the flat glass subassembly includes flat glass and flat glass mount pad, and flat glass installs in the flat glass mount pad, and the inside photodiode that is equipped with of laser safety cover, flat glass reflects a part of laser beam to photodiode. During the use, photodiode monitors the power of laser beam, and power monitoring integration utilizes the flat glass subassembly to monitor on reflecting partial laser to photodiode, and this semiconductor laser device prevents through the safety cover that the outside light of laser instrument from reflecting back the interference to photodiode to can carry out accurate monitoring to the power of laser beam, make semiconductor laser device can launch the constant power laser beam in the inside of laser instrument.

In order to make the aforementioned and other objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 shows a front view of a laser of the present embodiment;

fig. 2 shows a top view of the laser of the present embodiment;

FIG. 3 shows a cross-sectional view of section A-A of FIG. 2;

FIG. 4 is a schematic structural diagram of the collimator nut of the present embodiment;

fig. 5 shows a front view of the semiconductor laser device of the present embodiment;

fig. 6 shows a top view of the semiconductor laser device of the present embodiment;

fig. 7 shows a schematic structural view of the steering adjustment bracket of the present embodiment.

Description of the main element symbols:

100-a laser; 110-laser backplane; 120-a flat glass component; 121-plate glass; 122-plate glass mount; 123-a photodiode; 130-laser protection cover; 140-a laser emitting assembly; 141-laser seat; 142-a thermal insulation block; 143-heating the refrigeration sheet; 144-a laser diode; 145-pressing ring; 146-a collimating lens barrel; 147-collimator nut; 148-a temperature sensor;

200-an optical backplane;

300-a steering adjustment assembly; 310-a lens; 320-a lens mount; 330-steering adjustment bracket; 331-a steering adjustment base; 332-steering adjustment column; 333-arc hole;

400-cylindrical mirror assembly; 410-cylindrical mirror; 420-cylindrical lens base.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Example one

Referring to fig. 1 and 2, the present embodiment provides a semiconductor laser device, which is applied to the medical field to solve the problem in the prior art that the real-time power of a laser beam emitted by the semiconductor laser device is difficult to monitor, which affects the use of the semiconductor laser device.

In the semiconductor laser device provided in this embodiment, the semiconductor laser device includes a laser 100, the laser 100 includes a laser base plate 110, a plate glass assembly 120, a laser protection cover 130 and a laser emitting assembly 140, the plate glass assembly 120 and the laser emitting assembly 140 are mounted on the laser base plate 110, the laser protection cover 130 covers the laser base plate 110, the plate glass assembly 120 includes a plate glass 121 and a plate glass mounting seat 122, the plate glass 121 is mounted on the plate glass mounting seat 122, a photodiode 123 is disposed inside the laser protection cover 130, and the plate glass 121 reflects a portion of laser beams to the photodiode 123.

The photodiode 123 is used for monitoring the power of the laser beam, and in the semiconductor laser device provided in this embodiment, the power monitoring is integrated inside the laser 100, and the flat glass assembly 120 is used to reflect part of the laser beam onto the photodiode 123 for monitoring, so as to prevent the interference of the reflected external light of the laser 100 on the photodiode 123.

In some specific embodiments, the plate glass 121 has a square structure, the plate glass mounting seat 122 has a clamp structure, the plate glass 121 is clamped in the plate glass mounting seat 122, the plate glass mounting seat 122 is fixedly mounted on the laser base plate 110 by bolts, the photodiode 123 is mounted on the side wall of the plate glass mounting seat 122, and the surface of the plate glass 121 forms an angle of 45 degrees with the laser beam; the laser mount 141 is mounted on the laser base plate 110 by bolts.

Of course, it is understood that the plate glass 121 may have other structures, the plate glass mounting seat 122 may have other structures, the plate glass 121 may be further fixedly mounted on the plate glass mounting seat 122 in other manners, the plate glass mounting seat 122 may be further fixedly mounted on the laser base plate 110 in other manners, the photodiode 123 may be further mounted at other positions, the surface of the plate glass 121 may also form other angles with the laser beam, only the laser beam needs to be reflected to the photodiode 123, and the laser seat 141 may also be further fixedly mounted on the laser base plate 110 in other manners. The plate glass 121 is of a square structure, the plate glass mounting seat 122 is of a clamp structure, the plate glass 121 is clamped in the plate glass mounting seat 122, the plate glass mounting seat 122 is fixedly mounted on the laser base plate 110 through bolts, the photodiode 123 is mounted on the side wall of the plate glass mounting seat 122, and the surface of the plate glass 121 forms an angle of 45 degrees with the laser beam; the laser mount 141 is mounted on the laser base plate 110 by bolts. The above-mentioned is only the utility model discloses an it is preferred technical scheme, it is not right the utility model discloses a technical scheme causes unnecessary restriction, for the sheet glass 121 of other structures, for the sheet glass mount pad 122 of other structures, through sheet glass 121 of other modes fixed mounting on sheet glass mount pad 122, through sheet glass mount pad 122 of other modes fixed mounting on laser bottom plate 110, install in the photodiode 123 of other positions, the surface is the sheet glass 121 of other angles with the laser beam, through laser seat 141 of other modes fixed mounting on laser bottom plate 110, all be within the protection scope of the utility model.

Example two

Referring to fig. 1, fig. 2 and fig. 3, the present embodiment provides a semiconductor laser device, which is an improvement on some structures based on the semiconductor laser device provided in the first embodiment, and compared with the semiconductor laser device provided in the first embodiment, the improvement is as follows:

in the semiconductor laser device provided in this embodiment, the laser emitting assembly 140 includes a laser seat 141, two heat insulation blocks 142 and a heating and cooling sheet 143, the heating and cooling sheet 143 is located between the two heat insulation blocks 142, the laser seat 141 is installed on the laser base plate 110 through the two heat insulation blocks 142, and heat conductive silicone sheets are adhered to the upper and lower surfaces of the heating and cooling sheet 143.

The laser emitting assembly 140 generates a large amount of heat when emitting a laser beam, and therefore, the laser base 141 is mounted on the laser base plate 110 through the heat insulation blocks 142, and the heating cooling plate 143 is disposed between the two heat insulation blocks 142, so that the laser emitting assembly 140 can be neutralized to generate a large amount of heat, thereby preventing the laser emitting assembly 140 from being damaged due to overheating of the laser emitting assembly 140.

The laser emitting assembly 140 further comprises a laser diode 144 and a pressing ring 145, wherein the outer surface of the pressing ring 145 is provided with threads, the laser diode 144 is positioned in the pressing ring 145, and the pressing ring 145 is mounted on the laser base 141 through threads.

The laser emitting assembly 140 further includes a collimating lens barrel 146 and a collimating lens nut 147, please refer to fig. 4, the outer surface of the collimating lens barrel 146 is provided with a thread, the collimating lens barrel 146 is mounted on the collimating lens nut 147 through the thread, and the collimating lens nut 147 is mounted on the laser base 141 through a bolt.

The outer surface of the pressing ring 145 is provided with threads, the pressing ring 145 is used for fixing the laser diode 144, the pressing ring 145 is fixed on the laser seat 141 through threads, the collimating lens barrel 146 is mounted on the collimating lens nut 147 through threads, the collimating lens nut 147 is mounted on the laser seat 141 through a bolt, a bolt hole is formed in the side face of the collimating lens nut 147, the bolt can clamp the collimating lens barrel 146 through the bolt hole, the collimating lens barrel 146 is prevented from rotating, the collimating lens barrel 146 is fixed at any position, bolt holes are formed in the upper face and the two side faces of the laser seat 141, the position of the collimating lens nut 147 can be finely adjusted through the bolt holes, and the light source can move up and down and left and right.

The laser emitting assembly 140 further comprises a temperature sensor 148, the temperature sensor 148 is mounted on the laser base 141, and the temperature sensor 148 is used for detecting the temperature of the laser emitting assembly 140.

The front end of the laser protection cover 130 is further provided with a filter cover, the filter cover is obliquely arranged, the laser beam penetrates through the filter cover to be emitted, the filter cover can filter stray light, the stray light is prevented from being output, and the stray light is also prevented from entering and interfering the laser 100.

EXAMPLE III

Referring to fig. 5 and fig. 6, the present embodiment provides a semiconductor laser device, which is an improvement on some structures based on the semiconductor laser device provided in the first embodiment or the second embodiment, compared with the semiconductor laser device provided in the first embodiment or the second embodiment, the improvement is as follows:

in the semiconductor laser device provided by the embodiment, the semiconductor laser device comprises an optical base plate 200, a turning adjustment assembly 300 and a laser 100, wherein the turning adjustment assembly 300 and the laser 100 are both mounted on the optical base plate 200, a laser beam emitted by the laser 100 passes through the turning adjustment assembly 300, and the turning adjustment assembly 300 is used for adjusting the direction of the laser beam emitted by the laser 100.

When the laser steering adjusting assembly 300 and the laser 100 are used, the laser 100 is turned on, the laser beam emitted by the laser 100 passes through the steering adjusting assembly 300, and the position of the steering adjusting assembly 300 is adjusted to change the direction of the laser beam passing through the steering adjusting assembly 300, so that the laser beam is emitted to a required position. The semiconductor laser device does not need to adjust the position of the whole semiconductor laser, and can only adjust the position of the steering adjusting component 300 so as to achieve the purpose of adjusting the direction of a laser beam, and the operation is simple and convenient.

In some embodiments, the optical base plate 200 is made of steel, the optical base plate 200 is rectangular, and the steering adjustment assembly 300 and the laser 100 are both fixed to the optical base plate 200 by bolts.

Of course, it is understood that the optical substrate 200 may be made of other materials, the optical substrate 200 may have other structures, and the steering adjustment assembly 300 and the laser 100 may be fixedly mounted on the optical substrate 200 by other methods. The optical bottom plate 200 is made of steel, the optical bottom plate 200 is of a rectangular structure, and the steering adjusting assembly 300 and the laser 100 are fixedly mounted on the optical bottom plate 200 through bolts. The aforesaid is only the utility model discloses an it is preferred technical scheme, it is not right the utility model discloses a technical scheme causes the unnecessary restriction, chooses for use the optics bottom plate 200 that other materials were made, for the optics bottom plate 200 of other structures, through other mode fixed mounting on optics bottom plate 200 turn to adjusting part 300 and laser instrument 100, all be within the utility model discloses a within the protection scope.

Example four

Referring to fig. 5 and fig. 6, the present embodiment provides a semiconductor laser device, and the semiconductor laser device provided in the present embodiment is an improvement of some structures on the basis of the semiconductor laser device provided in the first embodiment, the second embodiment, or the third embodiment, compared with the semiconductor laser device provided in the first embodiment, the second embodiment, or the third embodiment, the specific improvements are as follows:

in the semiconductor laser device provided in this embodiment, the steering adjustment assembly 300 includes a lens 310, a lens mounting base 320 and a steering adjustment bracket 330, the lens 310 is mounted on the lens mounting base 320, the lens mounting base 320 is vertically and rotatably mounted on the steering adjustment bracket 330, and the steering adjustment bracket 330 is horizontally and rotatably mounted on the optical base plate 200.

Further, referring to fig. 7, the steering adjustment bracket 330 includes a steering adjustment base 331 and two steering adjustment columns 332, the steering adjustment base 331 has two arc holes 333 located in the same circle, the steering adjustment base 331 is installed on the optical bottom plate 200 through bolts passing through the arc holes 333, and the lens mounting base 320 is rotatably installed between the two steering adjustment columns 332 through a rotating shaft.

The angle of the lens 310 in the horizontal direction is adjusted by adjusting the position of the bolt in the arc hole 333, and the angle of the lens 310 in the vertical direction is adjusted by rotating the rotation shaft, so that the laser beam emitted from the laser 100 is irradiated to a predetermined direction through the lens 310.

In some specific embodiments, the lens 310 has a square structure, and accordingly, the lens mounting base 320 also has a square structure, the lens 310 is embedded in the lens mounting base 320, two sides of the lens mounting base 320 are provided with rotating shafts rotatably mounted on the steering adjustment columns 332, in this embodiment, the angle of the arc-shaped holes 333 is 60 degrees, that is, the lens 310 can rotate 30 degrees to the left and the right respectively in the horizontal direction, and after the steering adjustment bracket 330 is adjusted to enable the laser beam to pass through the lens 310 and irradiate to a predetermined direction, the steering adjustment bracket 330 is fixed on the optical chassis 200 by tightening the bolts.

Of course, it is understood that lens 310 may have other configurations, lens mount 320 may have other configurations, lens 310 may be mounted in lens mount 320 in other manners, lens mount 320 may be rotatably mounted on steering adjustment post 332 in other manners, arcuate hole 333 may have other angles, and steering adjustment bracket 330 may be secured to optical backplane 200 in other manners. The lens 310 is of a square structure, correspondingly, the lens mounting base 320 is also of a square structure, the lens 310 is embedded in the lens mounting base 320, two sides of the lens mounting base 320 are provided with rotating shafts, the rotating shafts are rotatably mounted on the steering adjusting upright post 332, the angle of the arc-shaped hole 333 is 60 degrees, and the steering adjusting support 330 is fixed on the optical base plate 200 through bolts. The above-mentioned is only the preferred technical scheme of the utility model, it is not right the technical scheme of the utility model causes unnecessary restriction, for the lens 310 of other structures, it is corresponding, for the lens mount pad 320 of other structures, install the lens 310 in lens mount pad 320 with other modes, install in the lens mount pad 320 that turns to on adjusting the stand 332 with other modes rotations, for the arc hole 333 of other angles, be fixed in the regulation support 330 that turns to on the optics bottom plate 200 through other modes, all be in the protection scope of the utility model.

EXAMPLE five

Referring to fig. 5 and fig. 6, the present embodiment provides a semiconductor laser device, and the semiconductor laser device provided in the present embodiment is an improvement of some structures on the basis of the semiconductor laser device provided in any one of the first to fourth embodiments, and compared with the semiconductor laser device provided in any one of the first to fourth embodiments, the improvement is as follows:

in the semiconductor laser device provided in this embodiment, the semiconductor laser device further includes a cylindrical mirror assembly 400, the cylindrical mirror assembly 400 includes a cylindrical mirror 410 and a cylindrical mirror base 420, the cylindrical mirror 410 is movably mounted on the cylindrical mirror base 420, the cylindrical mirror base 420 is mounted on the optical base 200, and the laser beam emitted by the laser 100 can pass through the cylindrical mirror 410 to the steering adjustment assembly 300, and the moving direction of the cylindrical mirror 410 is parallel to the direction of the laser beam.

The laser 100 is turned on, the laser beam emitted from the laser 100 passes through the cylindrical mirror 410 to the steering adjustment assembly 300, and the position of the cylindrical mirror 410 relative to the cylindrical mirror holder 420 is adjusted to focus the laser beam emitted from the laser 100.

In some embodiments, the cylindrical mirror 410 has a square structure, and correspondingly, the cylindrical mirror base 420 has a square structure, a sliding groove is disposed on the outer circumference of the cylindrical mirror 410, a sliding rail is disposed inside the cylindrical mirror base 420, the sliding groove is matched with the sliding rail, the cylindrical mirror 410 is mounted on the cylindrical mirror base 420 by matching the sliding groove with the sliding rail, the cylindrical mirror base 420 has a bolt hole, and the cylindrical mirror base 420 is fixedly mounted on the optical chassis 200 by bolts.

Of course, it is understood that the cylindrical mirror 410 may have other structures, and accordingly, the cylindrical mirror base 420 may have other structures, and the cylindrical mirror 410 may be movably mounted on the cylindrical mirror base 420 in other manners, and the cylindrical mirror base 420 may be fixedly mounted on the optical backplane 200 in other manners. The cylindrical mirror 410 is of a square structure, correspondingly, the cylindrical mirror base 420 is also of a square structure, a sliding groove is formed in the periphery of the cylindrical mirror 410, a sliding rail is arranged inside the cylindrical mirror base 420, the sliding groove and the sliding rail are matched with each other, the cylindrical mirror 410 is installed on the cylindrical mirror base 420 in a matched mode through the sliding groove and the sliding rail, a bolt hole is formed in the cylindrical mirror base 420, and the cylindrical mirror base 420 is fixedly installed on the optical base plate 200 through bolts. The aforesaid is only the utility model discloses an it is preferred technical scheme, it is not right the utility model discloses a technical scheme causes unnecessary restriction, for the cylindrical mirror 410 of other structures, corresponding, for the cylindrical mirror seat 420 of other structures, through other portable cylindrical mirror 410 of installing on cylindrical mirror seat 420 of mode, through other mode fixed mounting cylindrical mirror seat 420 on optics bottom plate 200, all be within the protection scope of the utility model.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims (10)

1. A semiconductor laser device, comprising: the laser device, the laser device includes laser bottom plate, flat glass subassembly, laser safety cover and laser emission subassembly, the flat glass subassembly with the laser emission subassembly all install in the laser bottom plate, the laser safety cover close in on the laser bottom plate, the flat glass subassembly includes flat glass and flat glass mount pad, flat glass install in the flat glass mount pad, the inside photodiode that is equipped with of laser safety cover, flat glass with some laser beam reflection extremely photodiode.

2. The semiconductor laser device according to claim 1, wherein the laser emitting assembly comprises a laser base, two heat insulation blocks and a heating and cooling plate, the heating and cooling plate is located between the two heat insulation blocks, and the laser base is mounted on the laser base plate through the two heat insulation blocks.

3. The semiconductor laser device according to claim 2, wherein the upper and lower surfaces of the heating/cooling plate are both adhered with a heat conductive material.

4. The semiconductor laser device according to claim 2, wherein the laser emitting assembly further comprises a laser diode and a pressing ring, wherein the outer surface of the pressing ring is provided with a thread, the laser diode is located in the pressing ring, and the pressing ring is mounted on the laser base through the thread.

5. The semiconductor laser device according to claim 4, wherein the laser emission assembly further comprises a collimating lens barrel and a collimating lens nut, wherein a screw thread is provided on an outer surface of the collimating lens barrel, the collimating lens barrel is mounted on the collimating lens nut through the screw thread, and the collimating lens nut is mounted on the laser base through a bolt.

6. The semiconductor laser device according to claim 4, wherein the laser emitting assembly further comprises a temperature sensor mounted to the laser mount, the temperature sensor being configured to detect a temperature of the laser emitting assembly.

7. The semiconductor laser device according to claim 1, further comprising an optical substrate and a turning adjustment assembly, wherein the turning adjustment assembly and the laser are mounted on the optical substrate, and the laser beam emitted by the laser passes through the turning adjustment assembly, and the turning adjustment assembly is configured to adjust a direction of the laser beam emitted by the laser.

8. The semiconductor laser device according to claim 7, wherein the steering adjustment assembly comprises a lens, a lens mounting seat and a steering adjustment bracket, the lens is mounted on the lens mounting seat, the lens mounting seat is vertically rotatably mounted on the steering adjustment bracket, and the steering adjustment bracket is horizontally rotatably mounted on the optical base plate.

9. The semiconductor laser device according to claim 8, wherein the steering adjustment bracket comprises a steering adjustment base and two steering adjustment columns, the steering adjustment base is provided with two arc-shaped holes located on the same circle, the steering adjustment base is installed on the optical base plate by passing through the arc-shaped holes through bolts, and the lens installation base is rotatably installed between the two steering adjustment columns through a rotating shaft.

10. The semiconductor laser device as claimed in claim 7, further comprising a cylindrical mirror assembly, wherein the cylindrical mirror assembly comprises a cylindrical mirror and a cylindrical mirror base, the cylindrical mirror is movably mounted on the cylindrical mirror base, the cylindrical mirror base is mounted on the optical base plate, and the laser beam emitted by the laser can pass through the cylindrical mirror to the steering adjustment assembly, and the moving direction of the cylindrical mirror is parallel to the direction of the laser beam.

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