CN214026651U

CN214026651U - Cavity covering film plastic package mold

Info

Publication number: CN214026651U
Application number: CN202023029734.2U
Authority: CN
Inventors: 陈健
Original assignee: Shenzhen Yihao Precision Semiconductor Equipment Co ltd
Current assignee: Shenzhen Yihao Precision Semiconductor Equipment Co ltd
Priority date: 2020-12-16
Filing date: 2020-12-16
Publication date: 2021-08-24
Anticipated expiration: 2030-12-16

Abstract

The utility model discloses a cavity cover film plastic envelope mould, including bed die, locking structure, first bevel gear, two-way cylinder and cardboard, bed die bottom and base fixed connection, and the middle part of base installs the transmission shaft through the bearing, and the second bevel gear is installed in the outside of transmission shaft simultaneously, the upper end and the lead screw fixed connection of transmission shaft to the work pipe is installed to the lead screw upside, and the cavity has been seted up to bed die inside, the work pipe passes bottom plate and base plate fixed connection through the bearing, and the base plate upside installs the chip, first bevel gear tip and working shaft fixed connection, and the fixed rubber circle that has cup jointed in the outside of working shaft, two-way cylinder fixed mounting is on the surface of base. This cavity cover film plastic envelope mould drives the base plate through in the same direction as, anticlockwise rotation runner and rises, the operation of falling, and the high accessible of base plate rotates the runner and adjusts, comes the chip of the different thickness of adaptation.

Description

Cavity covering film plastic package mold

Technical Field

The utility model relates to a plastic envelope mould equipment science and technology technical field specifically is a cavity cover film plastic envelope mould.

Background

Nowadays, in order to meet various high-power chip requirements, a heat sink is mostly attached to the surface of the BGA to improve the heat dissipation effect; although the packaging form increases the heat dissipation effect of the TOP surface of the Package, the height of the BGA product is increased, the trend that the Package requirement is thinner and thinner cannot be met, and the product is difficult to be applied to products requiring thinner packaging, such as handheld devices of mobile phones, notebooks and the like; because of the consideration of multi-core operation and the like, the power requirements and the heat dissipation requirements of chips such as AP and the like are higher and higher, the packaging form without the heat dissipation fins cannot meet the heat dissipation requirements, but the increase of the heat dissipation fins cannot meet the requirements of the application environment of the product on the thickness; in the BGA production method with the heat radiating fins, the heat radiating fins are usually pressed after the Package production and processing are finished, so that the production and manufacturing processes are increased, and the production efficiency is reduced.

Through retrieval, the prior art discloses (application number: CN201420749442.1) a plastic package mold for mounting a graphene heat dissipation film in a plastic package process, wherein the plastic package mold comprises an upper mold 1, a lower mold 2, two rotatable reels 3 and two fixed reels 4; the two rotatable reels 3 are respectively installed at the front end and the rear end of the upper die through an L-shaped support rod 5, the other two fixed reels 4 are respectively installed at the front end and the rear end of the upper die through the L-shaped support rod 5, the two rotatable reels 3 positioned above are installed on a plane, the two fixed reels 4 are installed on the plane, the bottoms of the two fixed reels 4 and the wall of the upper die are on the same horizontal line, and the graphene film can be tightly attached to the wall of the upper die; the upper die of the plastic package die is provided with no groove, the die wall is a smooth plane, the lower die of the plastic package die is provided with a die cavity, and the substrate is placed in the die cavity for injection molding; the chip is placed on the surface of the substrate, the upper end face of the chip needs to be horizontal to the upper end of the lower die 2, the graphene can be adhered to the back face of the chip, the height of the substrate is fixed, but the thicknesses of various chips are different, and therefore the application range of the die is narrow.

Therefore, a cavity covering film plastic package mold is provided to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a cavity cover film plastic envelope mould to solve the defect mentioned in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a plastic package mold for cavity covering film comprises a lower mold, a locking structure, a first bevel gear, a bidirectional cylinder and a clamping plate, the bottom of the lower die is fixedly connected with a base, the middle part of the base is provided with a transmission shaft through a bearing, meanwhile, a second bevel gear is arranged on the outer side of the transmission shaft, the upper end of the transmission shaft is fixedly connected with the screw rod, a working pipe is arranged on the upper side of the screw rod, a cavity is arranged in the lower die, the working pipe passes through the bottom plate through a bearing and is fixedly connected with the base plate, and the upper side of the base plate is provided with a chip, the end part of the first bevel gear is fixedly connected with the working shaft, the outer side of the working shaft is fixedly sleeved with a rubber ring, the bidirectional cylinder is fixedly arranged on the surface of the base, and a telescopic rod of the bidirectional cylinder is fixedly connected with the transmission plate, meanwhile, the upper right side of the transmission plate is fixedly connected with the stress rod, and the right end of the stress rod is fixedly connected with the clamping plate.

Preferably, four groups of guide rods are uniformly and fixedly connected to the bottom of the substrate, and the lower ends of the guide rods penetrate through the bottom plate.

Preferably, a threaded hole is formed in the working pipe, the screw rod is in threaded connection with the inside of the threaded hole, and the base plate is of a lifting structure made of a metal material.

Preferably, the locking structure is composed of four parts, namely a bidirectional cylinder, a transmission plate, a stress rod and a clamping plate, the clamping plate is of an arc-shaped structure made of metal materials, and a layer of rubber pad is bonded on the surface of the clamping plate.

Preferably, the first bevel gear and the second bevel gear are matched in size, the first bevel gear is in meshed connection with the second bevel gear, and the working shaft is in transmission arrangement with the screw rod through the first bevel gear, the second bevel gear and the transmission shaft.

Preferably, the driving plate is internally inserted with a limiting rod, the limiting rod is fixedly connected between the second fixing plate and the first fixing plate, the lower end of the first fixing plate is fixedly connected with the surface of the base, and the two ends of the second fixing plate are fixed on the surface of the base through supporting columns.

Preferably, the clamping plates are arranged to be two groups which are uniformly distributed on two sides of the working shaft, and the two groups of clamping plates are driven by the bidirectional cylinder, the transmission plate and the stress rod to synchronously move and oppositely move.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the rotating wheel is rotated clockwise and anticlockwise to drive the substrate to carry out lifting operation, and the height of the substrate can be adjusted by rotating the rotating wheel to adapt to chips with different thicknesses;

2. the rubber pad joint on two sets of cardboard surfaces is in the both sides of rubber circle, and the fixed parcel of rubber circle is in the outside of working shaft, avoids the rubber circle to take place to slide in the outside of working shaft, carries out spacing and fixed operation to the working shaft, avoids the working shaft to rotate under the effect of external force, guarantees the base plate and at the stability of working duration.

Drawings

FIG. 1 is a front view of the structure of the present invention;

FIG. 2 is a schematic view of the structure of the present invention showing the descending of the substrate;

FIG. 3 is a schematic view of the structure locking structure of the present invention;

FIG. 4 is a schematic diagram of the structure of the rubber pad and the rubber ring of the present invention;

fig. 5 is a side view of the structure of the present invention fig. 3;

fig. 6 is a bottom view of the structure substrate of the present invention.

Reference numbers in the figures: 1. a lower die; 2. a chip; 3. a substrate; 4. a working pipe; 5. a screw rod; 6. a base plate; 7. a guide bar; 8. a cavity; 9. a working shaft; 10. a locking structure; 11. a first bevel gear; 12. a drive shaft; 13. a second bevel gear; 14. a base; 15. a first fixing plate; 16. a telescopic rod; 17. a drive plate; 18. a bidirectional cylinder; 19. a second fixing plate; 20. a limiting rod; 21. a stress beam; 22. clamping a plate; 23. a rubber pad; 24. a rubber ring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution: a plastic package mold for a cavity covering film comprises a lower mold 1, a locking structure 10, a first bevel gear 11, a bidirectional cylinder 18 and a clamping plate 22, wherein the bottom of the lower mold 1 is fixedly connected with a base 14, the middle of the base 14 is provided with a transmission shaft 12 through a bearing, meanwhile, the outer side of the transmission shaft 12 is provided with a second bevel gear 13, the upper end of the transmission shaft 12 is fixedly connected with a screw rod 5, a working pipe 4 is arranged on the upper side of the screw rod 5, a cavity 8 is formed in the lower mold 1, the working pipe 4 penetrates through a bottom plate 6 through the bearing to be fixedly connected with a substrate 3, a chip 2 is arranged on the upper side of the substrate 3, a threaded hole is formed in the working pipe 4, the screw rod 5 is in threaded hole in a threaded manner, and meanwhile, the substrate 3 is a lifting structure made of a metal material; the end part of the first bevel gear 11 is fixedly connected with the working shaft 9, a rubber ring 24 is fixedly sleeved on the outer side of the working shaft 9, the bidirectional cylinder 18 is fixedly installed on the surface of the base 14, the telescopic rod 16 of the bidirectional cylinder 18 is fixedly connected with the transmission plate 17, the upper right side of the transmission plate 17 is fixedly connected with the stress rod 21, and the right end of the stress rod 21 is fixedly connected with the clamping plate 22; four groups of guide rods 7 are uniformly and fixedly connected to the bottom of the base plate 3, and the lower ends of the guide rods 7 penetrate through the bottom plate 6; the locking structure 10 is composed of four parts, namely a bidirectional cylinder 18, a transmission plate 17, a stress rod 21 and a clamping plate 22, the clamping plate 22 is of an arc-shaped structure made of metal materials, and a layer of rubber pad 23 is bonded on the surface of the clamping plate 22; a limiting rod 20 is inserted into the transmission plate 17, the limiting rod 20 is fixedly connected between the second fixing plate 19 and the first fixing plate 15, the lower end of the first fixing plate 15 is fixedly connected with the surface of the base 14, and meanwhile, two ends of the second fixing plate 19 are fixed on the surface of the base 14 through supporting columns; the first bevel gear 11 is matched with the second bevel gear 13 in size, the first bevel gear 11 is meshed with the second bevel gear 13, and the working shaft 9 is in transmission arrangement with the screw rod 5 through the first bevel gear 11, the second bevel gear 13 and the transmission shaft 12; the clamping plates 22 are arranged in two groups and are uniformly distributed on two sides of the working shaft 9, and the two groups of clamping plates 22 are driven by the bidirectional cylinder 18, the transmission plate 17 and the stress rod 21 to synchronously move and oppositely move.

As shown in fig. 3-5: in order to ensure the stability of the base plate 3 when the base plate 3 is static, when the height adjustment of the base plate 3 is completed, the switch of the bidirectional cylinder 18 is started, the telescopic rods 16 at the two ends of the bidirectional cylinder 18 respectively drive the two groups of clamping plates 22 to move oppositely through the driving plate 17 and the stress rod 21, so that the rubber pads 23 on the surfaces of the two groups of clamping plates 22 are clamped at the two sides of the rubber ring 24, the rubber ring 24 is fixedly wrapped at the outer side of the working shaft 9, the rubber ring 24 is prevented from sliding at the outer side of the working shaft 9, the working shaft 9 is limited and fixed, the working shaft 9 is prevented from rotating under the action of external force, and the stability of the base plate 3 during working is ensured, wherein the bidirectional cylinder 18 is a product in the prior art and is disclosed in a wire stripping machine (patent No. CN 201921258736.3).

As shown in fig. 1 and fig. 3-4: the driving plate 17 is in lateral shifting, and its inside is pegged graft and is had gag lever post 20, can carry on spacingly and the direction to lateral shifting's driving plate 17, guarantees driving plate 17 stability at the during operation time, avoids driving plate 17 to take place the slope, and simultaneously base plate 3 is when going up and down, and four group's guide bars 7 of its bottom are pegged graft in four group's guiding holes that bottom plate 6 is inside to be seted up, can carry on spacingly and the direction to vertical movement's base plate 3.

The working principle is as follows: when the cavity covering film plastic package mold is used, when the height of the substrate 3 needs to be adjusted, a rotating wheel is installed at the right end of a working shaft 9, the rotating wheel is rotated clockwise, the rotating wheel drives a first bevel gear 11 to rotate through the working shaft 9, the locking structure 10 is in a release state at the moment, the first bevel gear 11 drives a screw rod 5 to rotate through a second bevel gear 13, the screw rod 5 is in threaded connection with the inside of a working pipe 4 and drives the working pipe 4 to move upwards, the substrate 3 is driven to ascend and descend by clockwise and anticlockwise rotating the rotating wheel, and the height of the substrate 3 can be adjusted by rotating the rotating wheel to be adapted to chips 2 with different thicknesses; the whole working process of the cavity covering film plastic packaging mold is realized.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a cavity cover film plastic envelope mould, includes bed die (1), locking structure (10), first bevel gear (11), two-way cylinder (18) and cardboard (22), its characterized in that: the bottom of the lower die (1) is fixedly connected with the base (14), the middle of the base (14) is provided with a transmission shaft (12) through a bearing, the outer side of the transmission shaft (12) is provided with a second bevel gear (13), the upper end of the transmission shaft (12) is fixedly connected with the lead screw (5), the upper side of the lead screw (5) is provided with a working pipe (4), the lower die (1) is internally provided with a cavity (8), the working pipe (4) penetrates through the bottom plate (6) through the bearing to be fixedly connected with the base plate (3), the upper side of the base plate (3) is provided with the chip (2), the end part of the first bevel gear (11) is fixedly connected with the working shaft (9), the outer side of the working shaft (9) is fixedly sleeved with a rubber ring (24), the bidirectional cylinder (18) is fixedly arranged on the surface of the base (14), and the telescopic rod (16) of the bidirectional cylinder (18) is fixedly connected with the transmission plate (17), meanwhile, the right upper side of the transmission plate (17) is fixedly connected with the stress rod (21), and the right end of the stress rod (21) is fixedly connected with the clamping plate (22).

2. The cavity cover film plastic package mold according to claim 1, characterized in that: the bottom of the base plate (3) is uniformly and fixedly connected with four groups of guide rods (7), and the lower ends of the guide rods (7) penetrate through the bottom plate (6).

3. The cavity cover film plastic package mold according to claim 1, characterized in that: the interior of the working tube (4) is provided with a threaded hole, the screw rod (5) is in threaded connection with the interior of the threaded hole, and the base plate (3) is of a lifting structure made of a metal material.

4. The cavity cover film plastic package mold according to claim 1, characterized in that: the locking structure (10) is composed of four parts, namely a bidirectional cylinder (18), a transmission plate (17), a stress rod (21) and a clamping plate (22), the clamping plate (22) is of an arc-shaped structure made of metal materials, and a layer of rubber pad (23) is bonded on the surface of the clamping plate (22).

5. The cavity cover film plastic package mold according to claim 1, characterized in that: the size of the first bevel gear (11) is matched with that of the second bevel gear (13), the first bevel gear (11) is meshed with the second bevel gear (13) in a connected mode, and meanwhile the working shaft (9) is in transmission arrangement with the screw rod (5) through the first bevel gear (11), the second bevel gear (13) and the transmission shaft (12).

6. The cavity cover film plastic package mold according to claim 1, characterized in that: the inside gag lever post (20) of pegging graft of driving plate (17), and gag lever post (20) fixed connection between second fixed plate (19) and first fixed plate (15), first fixed plate (15) lower extreme and base (14) fixed surface are connected, and the surface at base (14) is fixed through the support column in second fixed plate (19) both ends simultaneously.

7. The cavity cover film plastic package mold according to claim 1, characterized in that: the clamping plates (22) are arranged at two sides of the working shaft (9) in two groups and are uniformly distributed, and the two groups of clamping plates (22) are driven by the bidirectional cylinder (18), the transmission plate (17) and the stress rod (21) to move synchronously and oppositely.