CN214011939U

CN214011939U - Power panel, single board and power device

Info

Publication number: CN214011939U
Application number: CN202023288090.9U
Authority: CN
Inventors: 张成亚; 赵梦坤; 余叶超; 易盛畅
Original assignee: Comba Network Systems Co Ltd
Current assignee: Comba Network Systems Co Ltd
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2021-08-20
Anticipated expiration: 2030-12-30

Abstract

The application provides a power strip, veneer, power supply unit relates to the communication field. The power panel provided by the application is arranged on the back panel in a plugging mode and is provided with a first MCU; the back plate is also provided with a plurality of single-plate plug-in interfaces; the power panel provides power to the single board inserted into the backboard through the plug-in interface; the first MCU communicates with the second MCU on each single board through the bus on the back board, each second MCU is used for collecting the power state information of the single board, and the first MCU receives the power state information and controls the power of the corresponding single board according to the power state information. In the power panel that this application provided, with the independent power panel of power management part split in the single integrated circuit board of prior art, when power failure appears in the power panel, only need to change this power panel can, need not to change other integrated circuit boards, improved the maintainability of integrated circuit boards, the cost is reduced.

Description

Power panel, single board and power device

Technical Field

The application relates to the technical field of communication, in particular to a power panel, a single board and a power device.

Background

The board card is a printed circuit board, called PCB for short, and has a plug core during manufacturing, and can be inserted into a slot of a main circuit board of a computer to control the operation of hardware, such as a display, a collection card and other devices, and after a driver is installed, the corresponding hardware function can be realized.

In the prior art, control circuits of related devices are generally designed in the same board card. However, the design of a single board card results in that once the power supply fails, the whole board card needs to be replaced, and the maintainability is poor and the cost is high.

Disclosure of Invention

In order to solve at least one of the above technical problems, the present application provides the following technical solutions:

in a first aspect, the application provides a power panel which is installed on a back panel in a plugging manner and is provided with a first MCU; the back plate is also provided with a plurality of single-plate plug-in interfaces; the power panel provides power to the single board inserted into the backboard through the plug-in interface; the first MCU communicates with the second MCU on each single board through the bus on the back board, each second MCU is used for respectively collecting the power state information of the single board, and the first MCU receives the power state information and controls the power of the corresponding single board according to the power state information.

Optionally, the power panel is further provided with a first power IC and a second power IC respectively connected to the first MCU; the first power supply IC is used for providing a first power supply for the single board under the control of the first MCU; the second power supply IC is used for providing a second power supply for a second MCU of the single board under the control of the first MCU.

Optionally, a dry contact warning interface connected to the first MCU is further disposed on the power board, and configured to output dry contact warning information generated based on the power status information.

Optionally, the first MCU is externally connected with a pull-up resistor or a pull-down resistor; and the first MCU reads the IO state of a pin externally connected with a pull-up resistor or a pull-down resistor when the first MCU is started, and is used for representing the ID of the power panel.

In a second aspect, the present application provides a single board, where the single board is installed on a backplane in a plug-in manner, and is provided with a second MCU; the back plate is also provided with a plug-in interface of the power supply plate; the single board receives the power supply output by the power supply board on the backboard through the plug-in interface; the second MCU communicates with the first MCU on the power panel through the bus on the back panel, and the second MCU feeds back the power state information of the single board to the first MCU so that the first MCU can control the power supply of the single board according to the power state information.

Optionally, the single board is further provided with a third power supply IC; the PG pin of the third power supply IC is connected with the second MCU; and the PG pin is connected with a pull-down capacitor.

Optionally, the single board is further provided with a fuse connected with the second MCU; the fuse receives the enable issued by the power panel through the second MCU so as to switch on a power supply for supplying power.

Optionally, the second MCU is externally connected with a pull-up resistor or a pull-down resistor; and the second MCU reads the IO state of a pin externally connected with a pull-up resistor or a pull-down resistor when the second MCU is started, and is used for representing the ID of the single board.

In a third aspect, the present application provides a power supply apparatus comprising: a backplane, the power strip of the first aspect, and at least one veneer of the second aspect.

Compared with the prior art, the scheme of the application has the following advantages:

(1) the power panel provided by the application is formed by splitting a power management part in a single board card in the prior art into independent board cards, is installed on a back plate in a plugging and unplugging mode and is provided with a first MCU; the back plate is also provided with a plurality of single-plate plug-in interfaces; the power panel provides power to the single board inserted into the backboard through the plug-in interface; the first MCU communicates with the second MCU on each single board through the bus on the back board, the second MCU on each single board is used for respectively collecting the power state information of the single board, and the first MCU receives the power state information and controls the power of the corresponding single board according to the power state information. When the power supply board has power supply failure, the power supply board only needs to be replaced, other board cards (such as a back plate and a single plate) do not need to be replaced, the maintainability of the board cards is improved, and the cost is reduced.

(2) The single board provided by the application is designed in an independent board card by splitting a circuit for controlling one or more devices in a single board card in the prior art, is installed on a back plate in a plugging mode and is provided with a second MCU; the back plate is also provided with a plug-in interface of the power supply plate; the single board receives the power supply output by the power supply board on the backboard through the plug-in interface; the second MCU communicates with the first MCU on the power panel through the bus on the back panel, and the second MCU feeds back the power state information of the single board to the first MCU so that the first MCU can control the power supply of the single board according to the power state information. When the single board breaks down, the single board only needs to be replaced, other board cards (such as a back board and a power supply board) do not need to be replaced, the maintainability of the board cards is improved, and the cost is reduced.

(3) The power supply device comprises a back plate, a power supply board and a single plate, wherein the power supply device is designed to split circuits used for controlling different devices in a single board card in the prior art on different board cards, and the circuits are communicated by adopting a bus of the back plate. When a certain integrated circuit board breaks down, the corresponding integrated circuit board only needs to be replaced, maintainability of the integrated circuit board is improved, and cost is reduced.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a power supply apparatus according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of another power supply apparatus according to an embodiment of the present disclosure;

FIG. 3 is a flowchart of a power management method according to an embodiment of the present application;

fig. 4 is another flowchart of a power management method according to an embodiment of the present application.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

It will be understood by those within the art that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.

The following explains about terms that may be referred to in the embodiments of the present application.

Board card: the board card is a printed circuit board, called PCB for short, and has a plug core during manufacturing, and can be inserted into a slot of a main circuit board (motherboard) of a computer, and can be used to control the operation of hardware, such as a display, a collection card, and other devices, and after a driver is installed, the corresponding hardware function can be realized.

Veneer: the single board is one of the board cards, and one single board can be designed as a board card for controlling the operation of a plurality of devices such as a display, an acquisition card and the like, and also can be designed as a board card for controlling the operation of one device. In this embodiment, the power supply device may include one or more single boards, and the number of the single boards may be set based on actual requirements, which is not limited in this application.

A power panel: the power panel belongs to one of board cards and is used for controlling the power supply condition of each single board in the power supply device.

Backing plate: the backplane is one of the boards and is a circuit board or frame that supports the interconnection of other circuit boards, devices and provides power and data signals to the supported devices. In the embodiment of the application, the backplane is provided with a bus (CAN be a CAN bus or a CANBus) and a plurality of plug-in interfaces, the plug-in interfaces are connected with the single board and the power panel in a plug-in manner, and the single board and the power panel communicate through the bus of the backplane.

In the embodiment of the present application, the bus mainly refers to a CAN bus and a CANBus, where the CAN bus: CAN is a short for Controller Area Network (CAN). CANBus bus: CANBus (Controller Area Net-work Bus) of the ISO11898CAN standard.

MCU: a Micro Control Unit (MCU), also called a Single Chip Microcomputer (Single Chip Microcomputer) or a Single Chip Microcomputer (MCU), is a Chip-level computer formed by appropriately reducing the frequency and specification of a Central Processing Unit (CPU) and integrating peripheral interfaces such as a memory, a counter (Timer), a USB, an a/D converter, a UART, a PLC, a DMA, etc., and even an LCD driving circuit on a Single Chip, and performing different combination control for different applications.

A power supply IC: the term "power chip IC" refers to the integration of pulse width control of a switching power supply. An LDO (voltage regulator) power chip, a DC/DC (voltage conversion) power chip, and the like may be included in the present application.

A fuse: the fuse is also called as an electronic fuse, the fuse is correctly arranged in the circuit, and the fuse can be fused to cut off the current when the current abnormally rises to a certain height and heat, so that the circuit is protected from running safely.

A diode: a diode is an electronic device made of semiconductor material (silicon, selenium, germanium, etc.). It has one-way conducting performance, that is, when positive voltage is applied to the anode and cathode of the diode, the diode is conducted. When a reverse voltage is applied to the anode and the cathode, the diode is turned off. Therefore, turning on and off the diode corresponds to turning on and off the switch.

Enabling: an Enable (EN) is an input pin of the chip or an input port of the circuit, and the whole module can only work normally if the pin is activated, for example, set to a high level.

PG pin: a Power Good (PG) pin.

Dry contact: dry contact is an electrical switch having 2 states of closed and open. The dry contact has no polarity between the two contacts and can be exchanged.

IO state: the level state is input.

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

In order to solve at least one of the problems, the application provides a power panel, a single board, a power device and a power management method, wherein a single board card in the prior art is split into a plurality of board cards, and when a power failure occurs, only the corresponding board card needs to be replaced, so that the maintainability of the board cards is improved, the cost is reduced, and the operation and maintenance efficiency is improved.

In order to make the objects, technical solutions and advantages of the present application clearer, various alternative embodiments of the present application and how the technical solutions of the embodiments of the present application solve the above technical problems will be described in detail below with reference to specific embodiments and drawings. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments. Embodiments of the present application will be described below with reference to the accompanying drawings.

With reference to fig. 1 and 2, an embodiment of the present application provides a power panel 10 and a single board 20. Specifically, the power board 10 is used for power management, and the single board 20 controls operation of corresponding devices based on power supplied by the power board 10. In one embodiment, the power board 10 and the single board 20 may exist as separate boards.

The power board 10 is provided with a first MCU11 for power management.

The single board 20 is provided with a second MCU21, configured to communicate with the first MCU11 and control operation of corresponding devices.

Specifically, the first MCU11 and the second MCU21 are respectively provided with corresponding programs, which are solidified inside the MCUs and are not changed (i.e., not rewritten) by changes in the external environment.

The back plate 30 is provided with a plug-in interface of the power supply board 10 and a plurality of plug-in interfaces of the single plates 20. The power panel 10 and the single board 20 may be installed on the backplane 30 in a plug-in manner through corresponding plug-in interfaces, the power panel 10 may provide power to the single board 20 inserted into the same backplane 30 through the plug-in interfaces, and the single board 20 may receive power output by the power panel inserted into the same backplane 30 through the plug-in interfaces.

Optionally, as shown in fig. 1 and 2, the current backplane 30 includes one power board 10 and 4 boards 20 (other numbers of boards 20 may also be inserted, and this is only an example). The power supply board 10 can simultaneously supply power to the four boards 20. In an embodiment, the backplane 30 may have an additional plug-in interface of the single board 20 besides the plug-in interface currently inserted at the single board 20, that is, in the using process of the backplane 30, the plug-in interface designed on the basis of the single board 20 on the backplane 30 may be left unused.

In one embodiment, the first MCU11 may communicate with the second MCU21 on each board 20 through a bus on the backplane 30. In the communication process, each second MCU21 may collect the power status information on the board 20 where the board is located and report the power status information to the first MCU11, and the first MCU11 may receive the power status information collected by the second MCU21 and control the power of the corresponding board 20 according to the power status information. The power state (power state) information may represent the power state represented by the state code, that is, the power state information may be the state code, such as D0, D1, D2, D3, etc., and different state codes represent different power states; for example, the state code D0 may be characterized as a fully open state and the state code D1 may be characterized as a low power state. The content of the specific representation of the status code may be set according to actual requirements, and the present application is not limited herein.

Optionally, as shown in fig. 1 and 2, the power board 10 is further provided with a first power IC12 and a second power IC13 respectively connected to the first MCU 11.

The first power IC12 is used to provide a first power supply (12V as shown in fig. 2) to the board 20 under the control of the first MCU 11. Specifically, the single board 20 is further provided with an electronic fuse 23 connected to the second MCU 21. When the power panel 10 and the single board 20 are inserted into the same backplane 30 for operation, the power panel 10 controls the first power IC to issue an enable signal to the single board 20 through the first MCU 11; specifically, the electronic fuse 23 receives the enable issued by the power board 10 through the second MCU21 to switch on the power supply for supplying power.

The second power IC13 is configured to provide a second power supply (e.g., 3.3V shown in fig. 2) to the second MCU21 of the board 20 under the control of the first MCU 11. Specifically, when the power board 10 and the board 20 are plugged into the same backplane 30 for operation, the power board 10 controls the second power IC to supply power to the second MCU21 in the board 20 through the first MCU 11.

Optionally, the first power source is a power source used by the board 20, the second power source is a power source used by the second MCU21 on the board 20, and the first power source used by the board 20 and the power source used by the second MCU21 are independent from each other and do not interfere with each other, so as to ensure that the second MCU21 can report to the first MCU11 in time when the power sources are abnormal. In a practical embodiment, the power input terminal of the board 20 is further provided with a diode to prevent the power from flowing backward; the power input terminals may include a terminal of the second MCU21 receiving a second power (e.g., a 3.3V power) and a terminal of the second MCU21 receiving a first power (e.g., a 12V power).

In an embodiment, as shown in fig. 1 and 2, the single board 20 is further provided with a third power IC22, and a PG pin of the third power IC22 is connected to the second MCU 21. Since the power board 10 provides the same voltage power to each board 20 inserted into the backplane 30 during operation, the third power IC22 may be used to adjust the voltage received by the board 20 to improve the adaptability of the board 20 due to different operating environments of the devices controlled by each board 20.

Optionally, a pull-down capacitor is further connected to a PG pin of the third power IC22 on the single board 20, and signal debounce can be achieved by changing the layout of the pull-down capacitor, so as to improve the accuracy of power supply abnormality determination.

In an embodiment, considering that a plurality of boards 20 may be inserted into the same backplane 30, in order to improve convenience and accuracy of power management, a pull-up resistor or a pull-down resistor may be externally connected to the second MCU21 of each board 20. When the second MCU21 is started, the IO status of the pin externally connected to the pull-up resistor or the pull-down resistor may be read and reported to the first MCU11, so that the first MCU11 uses the IO status as the ID of the board 20 to distinguish the power status information reported by different boards 20.

Optionally, a pull-up resistor or a pull-down resistor may also be connected to the first MCU11 of the power board 10; the first MCU11 can read the IO status of the external pull-up resistor or pull-down resistor pin when the power board 10 is started to represent the ID of the power board 10 where the first MCU11 is located.

In an embodiment, the power board 10 is further provided with a dry contact warning interface 14 connected to the first MCU11, and configured to output dry contact warning information generated by the first MCU11 based on the collected power status information of each board. Specifically, the dry contact alarm interface 14 may be provided with a dry contact device, and the power board 10 and each board 20 inserted into the same backplane 30 correspond to different ports of the dry contact device, respectively, that is, when the first MCU11 transmits the dry contact alarm information to the dry contact device, the IO status based on the above embodiment is transmitted to the dry contact device through the corresponding port.

Based on the same inventive concept, the embodiment of the present application provides a power supply apparatus, which includes a back plate 30, a power supply board 10, and at least one single plate 20. The specific contents of the back plate 30, the power supply board 10 and the single plate 20 may refer to the contents described in the above embodiments, and are not described in detail herein.

Specifically, different numbers of single boards 20 may be designed in the power supply device according to actual needs, and the number and the positions of the plug-in interfaces on the back board 30 for the single boards 20 may be arranged according to the number of the single boards 20 actually arranged.

Based on the same inventive concept, the embodiment of the present application provides a power management method, which is applied to the power device provided by the above embodiment; specifically, as shown in fig. 3 and 4, the following steps S101 to S104 are included:

step S101: the first MCU communicates with the second MCU through a bus.

Specifically, the power supply device may be installed in the complete machine, and operate as the complete machine is powered on. In the running process of the whole machine, the first MCU on the power panel and the second MCU on the single board which are inserted into the same backboard are continuously communicated through the bus of the backboard. In the communication process, the second MCU can monitor the power state of the single board in real time and report the power state to the first MCU.

Optionally, the step S101 of the first MCU communicating with the second MCU through the bus comprises at least one of the following steps S1011-S1012:

step S1011: the second MCU periodically collects the power state information of the single board and reports the power state information to the first MCU through the bus.

Specifically, the second MCU may collect the power state information of the board based on a preset period time, for example, every 4s, and report the currently collected power state information to the first MCU in real time.

Step S1012: the second MCU periodically collects the power state information of the single board; and the second MCU reports the power state information and/or the power abnormal signal to the first MCU through the bus when determining that the single board is abnormal in power based on the power state information.

Specifically, the second MCU may acquire the power state information of the board based on a preset period time, for example, once every 4 seconds; the second MCU reports the power state information to the first MCU not immediately after acquiring the power state information, but judges whether the power state of the single board is abnormal or not by the second MCU based on the currently acquired power state information, if so, the second MCU reports the power state information and/or a power abnormal signal to the first MCU; otherwise, the second MCU does not report any information to the first MCU. In the implementation of the step, the second MCU firstly screens the acquired power state information of the single board, and only reports the power state information and/or the corresponding power abnormal signal which are judged to have the power abnormality to the first MCU, so that the data resources required by the previous communication between the first MCU and the second MCU can be effectively reduced, and the efficiency of the first MCU in processing the received power state information is improved.

Step S102: and when the first MCU determines that the power supply of the single board is abnormal, judging whether the abnormality is caused by the power supply board.

Specifically, in step S102, determining that the power supply of the board is abnormal by the first MCU may include the following two cases:

(1) based on the implementation in step S1011, the first MCU needs to combine the currently received power state information with the corresponding IO state of the second MCU, analyze whether the current power state and the normal power state of the corresponding board are different, and if so, determine that the power of the board is abnormal.

(2) Based on the implementation of step S1012, when the first MCU receives the power status information and/or the power abnormal signal, it may determine that the power of the board is abnormal. Optionally, the first MCU may further analyze the power state of the board based on the power state information, so as to avoid an analysis error of the second MCU and improve accuracy of power management.

In an embodiment, the determining, by the first MCU in step S102, that the power supply of the board is abnormal may be determining that the power supply of any board is abnormal, or determining that the power supplies of all boards are abnormal. Specifically, in order to determine whether the power supply abnormality is caused by the power supply board subsequently, the determining that the power supply of the board is abnormal by the first MCU may correspond to the following several embodiments:

the first mode is that when the first MCU determines that the power supply of any single board is abnormal, the first MCU immediately enters into the judgment of whether the power supply abnormality is caused by the power supply board, namely, the first MCU analyzes the power supply state information of the power supply board where the first MCU is located, judges whether the power supply state of the current power supply board is consistent with the normal power supply state, and if not, determines that the power supply abnormality of the current power supply device is caused by the power supply board; if the current power supply device is consistent with the single board, the current power supply device is determined to be caused by the single board (which single board is the one with the power supply abnormality can be specifically analyzed by combining the ID of the single board).

In a second mode, considering that the probability that the power supply abnormality caused by the single board itself causes abnormality of the power supplies of all the single boards is low, when the first MCU determines that the power supplies of all the single boards are abnormal, the embodiment of the present application further determines whether the current power supply abnormality is caused by the power board (determines whether the power state of the current power board is consistent with the normal power state), and if so, determines that the current power supply apparatus has the power supply abnormality caused by all the single boards; if not, determining that the power supply abnormality of the current power supply device is caused by the power supply board.

Step S103: if so, the first MCU acquires power state information of the power panel, controls to turn off power output of the power panel, and outputs alarm information through the power panel based on the power state information.

Specifically, when it is determined that the current power board is abnormal, the first MCU controls to turn off the power output of the power board, for example, controls the first power IC to turn off the output of the first power. The first MCU also generates dry contact point warning information based on the acquired power supply state information of the power supply board, and the dry contact point warning information is output through the power supply board to remind a worker to check the power supply device and replace an abnormal board card.

Step S104: if not, the first MCU acquires power state information reported by a second MCU corresponding to the single board with the abnormal power, controls the second MCU to turn off the power input of the single board, and outputs alarm information through the power board based on the power state information.

Specifically, when it is determined that the current power supply abnormality is caused by a board, the first MCU obtains power supply state information reported by a second MCU corresponding to the board with the power supply abnormality, and issues an instruction to the second MCU to control the second MCU to turn off the power supply input of the board where the second MCU is located, such as turning off the input of the first power supply. The power state information reported by the second MCU corresponding to the board with the abnormal power may be reported after the first MCU determines that the power abnormality is caused by the board, or may be reported when the second MCU determines that the board has the abnormal power; that is, the time when the second MCU reports the power state information may not coincide with the time when the first MCU acquires the power state information reported by the second MCU. And the first MCU also generates dry contact point warning information corresponding to the power supply abnormal single board based on the power supply state information and outputs the dry contact point warning information through the power supply board to remind a worker to check the power supply device and replace the abnormal board card.

In an embodiment, before the step S101, the first MCU communicates with the second MCU through the bus, the following steps S201-S203 are further included:

step S201: when the whole machine is powered on, the first MCU determines that the first power supply and the second MCU controlled by the first power supply IC of the power supply board operate normally.

Specifically, when the whole power supply device is powered on, the power supply device is started, the first MCU firstly determines whether the currently output first power supply is normal and whether the second MCU which is communicated with the first MCU through the bus runs normally, and basic interaction is completed so as to ensure that the power supply device enters an initial state before running to be normal. And when the first MCU determines whether the second MCU operates normally, the first MCU determines whether a second power supply controlled by a second IC of the power panel operates normally.

Step S202: the first MCU controls a first power supply IC of the power panel to supply power to the single board.

Optionally, when the first MCU controls the first power IC of the power board to supply power to the board, the method includes supplying power to all boards inserted into the same backplane. It can be understood that, after the step 201 is implemented, the first MCU may issue a power input enabling to turn on the board, so as to supply power to the board.

Step S203: the second MCU collects the current power state information of the single board and reports the current power state information to the first MCU.

Specifically, after the preset time implemented in step S202, the second MCU may collect the current power state information of the board where the second MCU is located and report the current power state information to the first MCU, where the reported power state information may be regarded as the power state information of the board at the normal operation time. The preset time may be 5s, and if the first MCU issues the enable for 5s, the second MCU may collect the power status information of the board where the second MCU is located and report the power status information to the first MCU.

In one embodiment, the power management method further includes the following step a: and the first MCU and/or the second MCU execute signal debouncing operation in the running process of the whole machine.

Specifically, compared to the embodiment that a pull-down capacitor is connected to a PG pin of a third power IC of a single board to perform signal debouncing, step a belongs to performing signal debouncing operation by using software, and an operation task of signal debouncing is written in a program of a first MCU and/or a second MCU, so as to improve accuracy of determining power supply abnormality.

Optionally, for the convenience that improves when the power is unusual, the staff changes unusual integrated circuit board, this application embodiment is carrying out the dry contact and is reported to the police, combines the ID of unusual integrated circuit board to export to the position of the unusual integrated circuit board of automatic identification power improves the efficiency of fortune dimension. Specifically, step S103 outputs the dry contact point warning information through the power board, and includes the following steps B1:

step B1: and when the current power supply abnormality is determined to be caused by the power supply board, outputting dry contact alarm information related to the power supply board through a panel of the power supply board based on the IO state of the first MCU.

Optionally, in this embodiment of the application, a pull-up resistor or a pull-down resistor is connected to a pin of the first MCU, and an IO state of the pin read when the first MCU is started is used as ID information representing the power board. Because the power panel and the single board respectively correspond to different ports of the main contact equipment, at the moment, the port corresponding to the power panel can be found based on the IO state of the first MCU to input the main contact alarm information to the main contact equipment, and then the main contact alarm information related to the power panel is output through the panel of the power panel.

Specifically, step S104 outputs the dry contact point warning information through the power board, and includes the following steps B2:

step B2: and when the current power supply abnormality is determined to be caused by the single board, outputting dry contact alarm information related to the single board through a panel of the power board based on the IO state of the second MCU.

Optionally, in this embodiment of the application, by connecting a pull-up resistor or a pull-down resistor to a pin of the second MCU, an IO state of the pin read when the second MCU is started is used as ID information representing a board where the second MCU is located. Because the power panel and each single board respectively correspond to different ports of the dry contact equipment, at the moment, the IO state information can be carried to carry out data transmission in the whole process of communication between the second MCU and the first MCU. When the first MCU receives the power state information reported by the second MCU, after generating corresponding dry contact warning information based on the power state information, finding a port corresponding to the single board where the second MCU is located based on the IO state of the second MCU, inputting the dry contact warning information to the dry contact equipment, and then outputting the dry contact warning information related to the single board where the second MCU is located through the panel of the power panel.

In order to better explain the power management method of the embodiment of the present application, a specific process applying the power management method will be described below with reference to each step shown in fig. 4.

Step S1: powering on the whole machine; specifically, the power-on of the whole device is a trigger event of the power management method in the embodiment of the present application, and after the power-on of the whole device, the following step S2 is executed.

Step S2: the second MCU of each single board collects the power state information of the single board; specifically, when the whole machine is powered on, the first MCU controls the first power supply IC to output a first power supply to the single board, and the first MCU controls the second power supply IC to output a second power supply to the second MCU of the single board; at this time, the second MCU of each board collects the power status information of the board when the board is started, and then executes step S3.

Step S3: judging whether the power supply of the single board is normal or not; if yes, go to step S4; if not, executing the step S6; specifically, step S3 may be executed by the second MCU of the board, or may be executed by the first MCU of the power board.

Step S4: the whole machine normally operates; specifically, when it is determined that the power supply of the board is normal, it may be determined that the power supply output by the current power board is normal, and the board has no fault, it is determined that the entire machine operates normally, and then step S5 is executed.

Step S5: the second MCUs on all the single boards monitor in real time and report power state information of the single boards through the bus; specifically, after step S4 determines that the entire device is operating normally, the second MCU on each board monitors the power status information of the board in real time, and reports the current power status information of the board to the first MCU through the bus.

It is understood that the above steps S1-S5 may correspond to the above steps S201-S203 in the above embodiments, and belong to an initial interaction process before the first MCU and the second MCU normally communicate via the bus.

Step S6: judging whether the power panel is abnormal or not; if yes, go to step S7; if not, go to step S9; specifically, if the current power supply of the board is abnormal, it may be caused by a board fault, or may be caused by an abnormal output power supply of the power board, and therefore, it is necessary to determine whether the power board is abnormal or not. Whether the power panel is abnormal or not can be determined by comparing and analyzing the power state information of the current power panel with the normal power state information of the power panel.

Step S7: the first MCU on the power panel with the power failure turns off the output of the power panel; specifically, when it is determined that the power strip is abnormal, the first MCU will control to turn off the power output of the power strip, and then step S8 is performed.

Step S8: the panel of the power panel outputs a dry contact point alarm; specifically, the first MCU generates dry contact point warning information based on the current power state information of the power panel and displays the dry contact point warning information on a panel of the power panel.

Step S9: the second MCU on the failed single board reports the power state information to the first MCU of the power panel through the bus; specifically, when it is determined that the power abnormality of the board is caused by a board fault, the second MCU on the faulty board reports the corresponding power state information to the first MCU through the bus, and then step S10 is executed.

Step S10: the second MCU on the single board with the power failure cuts off the power input of the single board; specifically, the turning off of the power input of the board by the second MCU may be an operation automatically executed by the second MCU, or an operation executed by the second MCU based on an instruction of the first MCU.

Step S11: and replacing the abnormal board card by the engineering personnel. Specifically, after checking the dry contact point warning information output by the power panel, the engineer replaces the abnormal board card (i.e., directly pulling out the abnormal board card from the backplane and inserting a new board card).

The power management method is applied to a power device, a first MCU of a power panel is used as a control end of power management, when the first MCU and a second MCU are communicated through a bus, the second MCU can report power state information and/or power abnormal signals of a single board where the second MCU is located to the first MCU, and then the first MCU determines whether the current power device has power abnormality or not based on the received power state information and/or power abnormal signals; specifically, when determining that the power supply of the current board is abnormal (which may be determined by the first MCU or determined by the second MCU), further determining whether the abnormality is caused by the power board or the board; if the abnormity caused by the power panel is determined, the first MCU acquires the power state information of the power panel, controls to turn off the power output of the power panel, and outputs the main contact point warning information through the power panel based on the power state information; and if the single board is determined to be abnormal, the first MCU acquires power state information reported by a second MCU corresponding to the single board with the abnormal power, controls the second MCU to turn off the power input of the single board and outputs main contact point alarm information through the power panel based on the power state information. The implementation of this application can improve power management's reliability, and be favorable to providing favourable power management information (dry junction warning information) for the fortune dimension staff, promote the efficiency of fortune dimension.

The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.

Claims

1. A power panel is characterized in that the power panel is installed on a back panel in a plugging mode and is provided with a first MCU;

the back plate is also provided with a plurality of single-plate plug-in interfaces; the power panel provides power to the single board inserted into the backboard through the plug-in interface;

the first MCU communicates with the second MCU on each single board through the bus on the back board, each second MCU is used for respectively collecting the power state information of the single board, and the first MCU receives the power state information and controls the power of the corresponding single board according to the power state information.

2. The power panel of claim 1, further comprising a first power IC and a second power IC respectively connected to the first MCU;

the first power supply IC is used for providing a first power supply for the single board under the control of the first MCU;

the second power supply IC is used for providing a second power supply for a second MCU of the single board under the control of the first MCU.

3. The power strip of claim 1, further comprising a dry contact alarm interface connected to the first MCU, and configured to output dry contact alarm information generated based on the power status information.

4. The power panel of claim 1, wherein the first MCU is externally connected with a pull-up resistor or a pull-down resistor;

and the first MCU reads the IO state of a pin externally connected with a pull-up resistor or a pull-down resistor when the first MCU is started, and is used for representing the ID of the power panel.

5. A single board is characterized in that the single board is installed on a back board in a plugging mode and is provided with a second MCU;

the back plate is also provided with a plug-in interface of the power supply plate; the single board receives the power supply output by the power supply board on the backboard through the plug-in interface;

the second MCU communicates with the first MCU on the power panel through the bus on the back panel, and the second MCU feeds back the power state information of the single board to the first MCU so that the first MCU can control the power supply of the single board according to the power state information.

6. The single board according to claim 5, wherein said single board is further provided with a third power IC; the PG pin of the third power supply IC is connected with the second MCU; and the PG pin is connected with a pull-down capacitor.

7. The single board according to claim 5, wherein the single board is further provided with a fuse connected to the second MCU; the fuse receives the enable issued by the power panel through the second MCU so as to switch on a power supply for supplying power.

8. The single board according to claim 5, wherein the second MCU is externally connected to a pull-up resistor or a pull-down resistor; and the second MCU reads the IO state of a pin externally connected with a pull-up resistor or a pull-down resistor when the second MCU is started, and is used for representing the ID of the single board.

9. A power supply device, comprising: a backplane, the power strip of any of claims 1 to 4, and at least one veneer of any of claims 5 to 8.