CN213998961U - Polishing fixing protection jig for titanium nitride device spray head of semiconductor equipment - Google Patents
Polishing fixing protection jig for titanium nitride device spray head of semiconductor equipment Download PDFInfo
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- CN213998961U CN213998961U CN202022777761.1U CN202022777761U CN213998961U CN 213998961 U CN213998961 U CN 213998961U CN 202022777761 U CN202022777761 U CN 202022777761U CN 213998961 U CN213998961 U CN 213998961U
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Abstract
The utility model discloses a polishing and fixing protection jig of a titanium nitride device spray head of semiconductor equipment, the fixing protection jig is basin-shaped, and the basin-shaped jig comprises a middle jig cylinder, a bottom jig, a top jig horizontal edge and a jig vertical edge positioned at the outer edge of the jig horizontal edge; the jig positioning hole for being installed on the rotating table is formed in the jig bottom; the bottom end of the jig cylinder is provided with an overflow hole; an overflow groove is formed in the outer edge of the horizontal edge of the jig; the protection jig extends from the vertical edge of the jig to the horizontal edge of the jig and is provided with a taking and placing open slot; through high-precision processing and manufacturing, the component can be better attached and fixed with the table top; the surface of the protected aluminum component spray head cannot be scratched or damaged due to sliding caused by stress, so that the polishing precision is improved; the cleaning and polishing fixed protection jig can be repeatedly used, and the production efficiency can be better improved under the assistance of the pneumatic polishing tool.
Description
Technical Field
The utility model relates to a wash special fixed protection tool of polishing, concretely relates to semiconductor equipment titanium nitride device shower nozzle device part protection tool of polishing.
Background
The surface of a spray head component of a titanium nitride device of semiconductor equipment is required to be polished and polished due to the requirements of smoothness and flatness, the surface of the spray head component is usually polished by adopting manual polishing and pneumatic polishing when the spray head component in cleaning and regeneration is polished and polished, the surface of the spray head component is polished by the manual polishing and the pneumatic polishing, the grains of the surface of the component which is polished by the manual polishing and the pneumatic polishing are irregular, the polishing area is small, the polishing joint can be omitted, the quality of a product can not be effectively guaranteed, and the requirements of semiconductor process development can not be met more and more no matter the flatness or the smoothness is adopted.
SUMMERY OF THE UTILITY MODEL
Problem to prior art existence, the utility model provides a fixed protection tool of polishing of semiconductor equipment titanium nitride device shower nozzle, through high accuracy processing preparation, the part can be better laminate fixedly with the mesa. The surface of the protected aluminum component spray head cannot be scratched due to sliding caused by stress, and the polishing precision is improved. The cleaning and polishing fixed protection jig can be repeatedly used, can better improve the production efficiency under the assistance of a pneumatic polishing tool, and has the characteristics of convenience in use, high precision, reusability, labor saving and material cost saving.
The technical scheme of the utility model is that: a polishing, fixing and protecting jig for a semiconductor equipment titanium nitride device spray head is characterized in that the semiconductor equipment titanium nitride device spray head is in a basin shape, the basin-shaped spray head comprises a middle aluminum product cylinder, a bottom aluminum product bottom and a top aluminum product edge, a plurality of water outlet holes are formed in the aluminum product bottom, and the upper surface of the aluminum product edge, the inner surface of the aluminum product cylinder and the inner surface of the aluminum product bottom are surfaces to be polished of the spray head;
the fixed protection jig is also in a basin shape, and the basin-shaped jig comprises a jig cylinder in the middle, a jig bottom at the bottom, a jig horizontal edge at the top and a jig vertical edge positioned at the outer edge of the jig horizontal edge;
the aluminum material cylinder of the basin-shaped spray head can be embedded in the jig cylinder of the basin-shaped jig, the aluminum material edge bottom surface of the basin-shaped spray head is overlapped on the upper surface of the horizontal edge of the jig of the basin-shaped jig, and the side surface of the aluminum material edge of the basin-shaped spray head is attached to the inner surface of the vertical edge of the jig;
the jig positioning hole for being installed on the rotating table is formed in the jig bottom;
the bottom end of the jig cylinder is provided with an overflow hole;
an overflow groove is formed in the outer edge of the horizontal edge of the jig;
the protection jig is provided with a taking and placing open slot which extends from the vertical edge of the protection jig to the horizontal edge of the protection jig.
Furthermore, there are 4 jig locating holes, and the even setting is on the jig bottom.
Furthermore, the 4 positioning holes are positioned on a first circle concentric with the outer circumference of the jig bottom, and the radius of the first circle is two thirds of the radius of the outer circumference of the jig bottom. The fixation is more stable.
Furthermore, there are 4 spillway holes, even setting on tool cylinder bottom circumference. The water can be conveniently overflowed.
Furthermore, 2 overflow grooves are oppositely arranged at the outer edge of the horizontal edge of the jig; the number of the taking and placing open grooves is 2, and the taking and placing open grooves are also oppositely arranged at the outer edge of the horizontal edge of the jig; the straight line where the 2 overflow grooves are located is perpendicular to the straight line where the 2 taking and placing open grooves are located. So that the two sides of the horizontal edge of the jig overflow through the overflow grooves, and the two sides overflow through taking and placing open grooves. The water overflowing effect is better.
Furthermore, the protection jig is made of a polypropylene material.
The utility model has the advantages that: this fixed protection tool of polishing of semiconductor equipment titanium nitride device shower nozzle is through high accuracy processing preparation, and the shower nozzle subassembly can be better with the mesa laminate fixedly. Compared with the prior art, because the protection of the jig, the surface of the protected aluminum component spray head cannot be scratched due to sliding caused by stress, and the polishing precision is improved. The cleaning and polishing fixed protection jig can be repeatedly used, can better improve the production efficiency under the assistance of a pneumatic polishing tool, and has the characteristics of convenience in use, high precision, reusability, labor saving and material cost saving.
Drawings
FIG. 1 is a schematic structural view of a titanium nitride device showerhead of a semiconductor apparatus;
fig. 2 is a schematic structural view of a polishing, fixing and protecting jig of a titanium nitride device nozzle of a semiconductor device.
In the figure: 1 is the tool cylinder, 2 is at the bottom of the tool, 3 is the horizontal border of tool, 4 is the vertical border of tool, 5 is the tool locating hole, 6 is the spillway hole, 7 is for getting to put the open slot, 8 is the spillway, 11 is the aluminum product cylinder, 12 is at the bottom of the aluminum product, 13 is the aluminum product border, 14 is the apopore, 15 protruding edges.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
The utility model provides a fixed protection tool of polishing of semiconductor equipment titanium nitride device shower nozzle, as shown in figure 1, semiconductor equipment titanium nitride device shower nozzle is the basin form, and the basin form shower nozzle includes middle aluminum product cylinder 11, 12 at the bottom of the aluminum product of bottom and the aluminum product border 13 at top, a plurality of apopores 14 have been seted up on the aluminum product bottom 12, the face of polishing is treated for the shower nozzle to the upper surface at aluminum product border 13, the internal surface of aluminum product cylinder 11 and the internal surface of 12 at the bottom of the aluminum product. The outer edge of aluminum product border 13 is provided with 3 protruding edges 15 towards the top, conveniently takes the shower nozzle.
As shown in fig. 2, the fixed protection fixture is also in the shape of a basin and made of polypropylene, and the basin-shaped fixture includes a middle fixture cylinder 1, a bottom fixture 2, a top fixture horizontal edge 3 and a fixture vertical edge 4 located at the outer edge of the fixture horizontal edge 3.
The aluminum product cylinder 11 of basin form shower nozzle can inlay in the tool cylinder 1 of basin form tool, the aluminum product border 13 bottom surfaces of basin form shower nozzle are taken on the 3 upper surfaces in the tool horizontal border of basin form tool, and the aluminum product border 13 side surfaces of basin form shower nozzle and the 4 interior surface laminating in the vertical border of tool.
And the jig bottom 2 is provided with a jig positioning hole 5 for mounting on the rotating table. The number of the jig positioning holes 5 is 4, the 4 positioning holes are uniformly positioned on a first circle concentric with the outer circumference of the jig bottom 2, and the radius of the first circle is two thirds of that of the outer circumference of the jig bottom 2. The fixation is more stable.
The bottom end of the jig cylinder 1 is provided with an overflow hole 6. The number of the overflow holes 6 is 4, and the overflow holes are uniformly arranged on the circumferential surface of the bottom end of the jig cylinder 1. The water can be conveniently overflowed.
And an overflow groove 8 is formed in the outer edge of the horizontal edge 3 of the jig. The protection tool is provided with a taking and placing open slot 7 which extends from the vertical edge 4 of the tool to the horizontal edge 3 of the tool. The number of the overflow grooves 8 is 2, and the overflow grooves are oppositely arranged at the outer edge of the horizontal edge 3 of the jig. The number of the taking and placing open grooves 7 is 2, and the taking and placing open grooves are also oppositely arranged at the outer edge of the horizontal edge 3 of the jig. The straight line of the 2 overflow grooves 8 is vertical to the straight line of the 2 taking and placing open grooves 7. So that the two sides of the horizontal edge of the jig overflow through the overflow grooves, and the two sides overflow through taking and placing open grooves. The water overflowing effect is better.
The working principle is as follows: and (4) completely matching and aligning the working surface of the fixing jig with the nozzle part of the titanium nitride device to be cleaned and polished, and firmly locking the nozzle part. The fixed jig is locked with the grinding machine through screws to prevent random movement. The nozzle part exposes the area to be cleaned and polished. After polishing, the component is taken down, and the polishing device can be repeatedly used.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (6)
1. A polishing, fixing and protecting jig for a titanium nitride device sprayer of semiconductor equipment is characterized in that the titanium nitride device sprayer of the semiconductor equipment is basin-shaped, the basin-shaped sprayer comprises a middle aluminum product cylinder (11), a bottom aluminum product (12) and a top aluminum product edge (13), a plurality of water outlet holes (14) are formed in the aluminum product bottom (12), and the upper surface of the aluminum product edge (13), the inner surface of the aluminum product cylinder (11) and the inner surface of the aluminum product bottom (12) are surfaces to be polished of the sprayer;
the method is characterized in that: the fixed protection jig is also in a basin shape, and the basin-shaped jig comprises a jig cylinder (1) in the middle, a jig bottom (2) at the bottom, a jig horizontal edge (3) at the top and a jig vertical edge (4) positioned at the outer edge of the jig horizontal edge (3);
the aluminum material cylinder (11) of the basin-shaped sprayer can be embedded into the jig cylinder (1) of the basin-shaped jig, the bottom surface of the aluminum material edge (13) of the basin-shaped sprayer is placed on the upper surface of the horizontal edge (3) of the basin-shaped jig, and the side surface of the aluminum material edge (13) of the basin-shaped sprayer is attached to the inner surface of the vertical edge (4) of the jig;
the jig bottom (2) is provided with a jig positioning hole (5) for being mounted on the rotating table;
the bottom end of the jig cylinder (1) is provided with an overflow hole (6);
an overflow groove (8) is formed in the outer edge of the horizontal edge (3) of the jig;
the protective jig is provided with a taking and placing open slot (7) which extends from the vertical edge (4) of the jig to the horizontal edge (3) of the jig.
2. The grinding, fixing and protecting jig for the titanium nitride device nozzle of the semiconductor equipment according to claim 1, characterized in that: the number of the jig positioning holes (5) is 4, and the jig positioning holes are uniformly formed in the jig bottom (2).
3. The grinding, fixing and protecting jig for the titanium nitride device nozzle of the semiconductor equipment according to claim 2, characterized in that: the 4 positioning holes are positioned on a first circle concentric with the outer circumference of the jig bottom (2), and the radius of the first circle is two thirds of the radius of the outer circumference of the jig bottom (2).
4. The grinding, fixing and protecting jig for the titanium nitride device nozzle of the semiconductor equipment according to claim 1, characterized in that: the number of the overflow holes (6) is 4, and the overflow holes are uniformly formed in the circumferential surface of the bottom end of the jig cylinder (1).
5. The grinding, fixing and protecting jig for the titanium nitride device nozzle of the semiconductor equipment according to claim 1, characterized in that: 2 overflow grooves (8) are oppositely arranged at the outer edge of the horizontal edge (3) of the jig; the number of the taking and placing open grooves (7) is also 2, and the taking and placing open grooves are also oppositely arranged at the outer edge of the horizontal edge (3) of the jig; the straight line where the 2 overflow grooves (8) are located is vertical to the straight line where the 2 taking and placing open grooves (7) are located.
6. The grinding, fixing and protecting jig for the titanium nitride device nozzle of the semiconductor equipment according to claim 1, characterized in that: the protection jig is made of polypropylene materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022777761.1U CN213998961U (en) | 2020-11-26 | 2020-11-26 | Polishing fixing protection jig for titanium nitride device spray head of semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022777761.1U CN213998961U (en) | 2020-11-26 | 2020-11-26 | Polishing fixing protection jig for titanium nitride device spray head of semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213998961U true CN213998961U (en) | 2021-08-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022777761.1U Active CN213998961U (en) | 2020-11-26 | 2020-11-26 | Polishing fixing protection jig for titanium nitride device spray head of semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213998961U (en) |
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2020
- 2020-11-26 CN CN202022777761.1U patent/CN213998961U/en active Active
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