CN213988859U - Etching jig and etching device - Google Patents
Etching jig and etching device Download PDFInfo
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- CN213988859U CN213988859U CN202023234952.XU CN202023234952U CN213988859U CN 213988859 U CN213988859 U CN 213988859U CN 202023234952 U CN202023234952 U CN 202023234952U CN 213988859 U CN213988859 U CN 213988859U
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Abstract
The utility model relates to a semiconductor etching technical field, concretely relates to etching tool and etching device. The etching device comprises an etching jig and an etching machine, the etching machine comprises an etching liquid cylinder and a nozzle, the etching jig is located in the etching liquid cylinder and can rotate in the etching liquid cylinder, the nozzle is located above the etching jig and used for spraying etching liquid, the etching jig comprises a jig body, a groove is formed in the jig body, an etching area for placing a wafer to be etched is formed in the inner wall of the groove, and a liquid discharge port is formed in the edge of the jig body. Aiming at the fragile physical properties of materials such as InP/InGaAs, when the wafers form non-standard wafer fragments due to experiments or artificial damages, the etching jig is also applicable, only the non-standard wafer to be etched is placed in the groove, the centrifugal force during rotation and the side wall of the groove have a limiting effect on the non-standard wafer to be etched, and the liquid discharge port can discharge redundant etching liquid, so that the requirements of the etching process of the non-standard wafer are met.
Description
Technical Field
The utility model relates to a semiconductor etching technical field, concretely relates to etching tool and etching device.
Background
Nowadays, with the rapid development of semiconductor processes, the demand for semiconductor wafers is increasing, and the demand quality of semiconductor wafers is also increasing. In the manufacturing process of a semiconductor wafer, etching the semiconductor wafer is one of important processes, which directly affects the performance of the semiconductor wafer, and at present, the etching process is divided into two types, one is wet etching and the other is dry etching. Wet etching is the processing method used for manufacturing the micromechanical structure at the earliest time, the traditional wet etching is to place the semiconductor wafer to be etched in etching solution, the etching solution can carry out wet etching on the position of the surface of the semiconductor wafer needing etching, compared with dry etching, the wet etching has the advantages of high etching rate, poor anisotropy, low cost, high mechanical sensitivity and the like, the etching thickness can reach the thickness of the whole semiconductor wafer, and the wet etching is widely applied to the preparation of the semiconductor wafer.
In the wet etching process of the semiconductor wafer, an etching device is needed, wherein the etching device comprises an etching jig and an etching machine, the etching jig is used for placing the semiconductor wafer in the wet etching process, and the etching machine is used for performing wet etching on the surface of the semiconductor wafer. However, there are many InP/InGaAs wafers in the process, which are very fragile due to their poor physical properties, and the irregular number of chips is too large to use standard etching tools, which is a difficult problem in the etching process.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main objective is: provides an etching tool and an etching device, aiming at the fragile physical properties of InP/InGaAs materials, the smooth proceeding of the etching process is realized.
In order to realize the technical problem, the utility model provides an etching jig, etching jig is used for installing on the etching machine and can rotate on the etching machine, etching jig includes the tool body, set up flutedly on the tool body, the inner wall of recess forms and is used for placing the etching region of treating the etching wafer, just the edge of tool body still is formed with the leakage fluid dram.
Optionally, a surface formed by the bottom wall of the groove is a circular arc surface.
Optionally, the liquid discharge port is a through hole penetrating from the side wall of the groove to the outer surface of the jig body.
Optionally, the liquid discharge port penetrates through the upper surface of the jig body.
Optionally, the liquid discharge port is provided with a plurality of, and a plurality of the liquid discharge ports are evenly arranged along the edge of the jig body.
Optionally, the jig body has a circular cross-sectional shape.
Optionally, the jig body is axisymmetric.
Optionally, the etching area formed by the inner wall of the groove can be used for placing a plurality of wafers to be etched.
Additionally, the utility model provides an etching device, etching device include as above-mentioned arbitrary one etching tool and etching machine, the etching machine includes etching hydraulic cylinder and nozzle, the etching tool is located in the etching hydraulic cylinder, and can etching hydraulic cylinder internal rotation, the nozzle is located the top of etching tool, just the nozzle is used for spraying the etching solution.
Optionally, a projection of the nozzle on the etching jig is located at a central position of the etching jig.
The utility model has the advantages that: the etching jig comprises a jig body, wherein the jig body is provided with a groove, an etching area is formed on the inner wall of the groove and used for placing a wafer to be etched, a liquid discharge port is formed in the edge of the jig body and used for discharging redundant etching liquid. Aiming at the fragile physical properties of materials such as InP/InGaAs, when the wafers form non-standard wafer fragments due to experiments or artificial damages, the etching jig is also applicable, only the non-standard wafer to be etched is placed in the groove, the centrifugal force during rotation and the side wall of the groove have a limiting effect on the non-standard wafer to be etched, and the liquid discharge port can discharge redundant etching liquid, so that the requirements of the etching process of the non-standard wafer are met.
The etching device comprises an etching jig and an etching machine, wherein the etching machine comprises an etching liquid cylinder and a nozzle, the etching jig is positioned in the etching liquid cylinder and can rotate in the etching liquid cylinder, the nozzle above the etching jig continuously sprays etching liquid to a wafer to be etched, and redundant etching liquid can flow out from a liquid discharge port. The etching device comprises an etching jig for placing the wafer to be etched, the wafer to be etched is positioned at the edge of the etching jig by centrifugal force during rotation, the side wall of the groove in the etching jig can prevent the wafer to be etched from being thrown out during rotation, so that the etching process can be conveniently carried out on the wafer to be etched, and in addition, the etching machine is used for etching the surface of the wafer to be etched.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a front view of a non-standard wafer placed on an etching jig of the present invention;
FIG. 2 is a top view of a non-standard wafer placed on the etching fixture of FIG. 1;
wherein the corresponding relations between the reference numbers and the names of the components in fig. 1 and 2 are as follows:
100. etching the jig;
10. a jig body; 11. a groove; 12. a liquid discharge port;
200. a non-standard wafer.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the communication may be direct, indirect via an intermediate medium, or internal to both elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
An embodiment of the present invention provides an etching jig 100 for implementing a wet etching process to the fragile physical properties of InP/InGaAs. As shown in fig. 1 and 2, the etching jig 100 includes a jig body 10, a groove 11 is formed on the jig body 10, an etching area for placing the non-standard wafer 200 to be etched is formed on an inner wall of the groove 11, and a liquid discharge port 12 is further formed on an edge of the jig body 10.
The etching jig 100 comprises a jig body 10, wherein the jig body 10 is provided with a groove 11, an etching area is formed on the inner wall of the groove 11, the etching area is used for placing the non-standard wafer 200 to be etched, a liquid discharge port 12 is further formed on the edge of the jig body 10, and the liquid discharge port 12 is used for discharging redundant etching liquid. Aiming at the fragile physical properties of materials such as InP/InGaAs, when the wafers are damaged by experiments or people to form fragments of the non-standard wafer 200, the etching jig 100 is also applicable, only the non-standard wafer 200 to be etched needs to be placed in the groove 11, the centrifugal force during rotation and the side wall of the groove 11 play a limiting role in limiting the non-standard wafer 200 to be etched, and the liquid discharge port 12 can discharge redundant etching liquid to meet the requirements of the etching process of the non-standard wafer 200.
It should be noted that, in the manufacturing process of a semiconductor wafer, etching of the semiconductor wafer is one of important processes, which directly affects the performance of the semiconductor wafer, and at present, the etching process is divided into two types, one is wet etching and the other is dry etching. Wet etching is the processing method used for manufacturing the micromechanical structure at the earliest, in the process of wet etching of the semiconductor wafer, an etching device is needed, the etching device comprises an etching jig, the etching jig is used for placing the semiconductor wafer to be etched in the etching process, and then wet etching is carried out on the position, needing to be etched, on the surface of the semiconductor wafer through an etching machine. However, there are lots of InP/InGaAs wafers in the process, because these materials have poor physical properties and are very easy to be cracked by experiment or artificial damage, and the cracked semiconductor wafers have irregular shapes and large number, so that the etching process cannot be performed by using standard etching tools. The etching jig 100 of the embodiment can perform the etching process on the semiconductor wafer fragments, so as to achieve the smooth operation of the etching process, and because the etching jig 100 rotates on the etching machine, the non-standard wafer 200 is lighter in weight and always located at the edge position in the groove 11 under the action of centrifugal force during rotation.
In the present embodiment, the surface formed by the bottom wall of the groove 11 is a circular arc surface. The bottom wall of the groove 11 with the arc surface is used for placing the non-standard wafer 200 to be etched, when the etching jig 100 rotates on the etching machine, the non-standard wafer 200 can rotate synchronously in the etching jig 100, the etching requirement of the non-standard wafer 200 placed at any position in the groove 11 is met, the etching quality is improved, and the groove 11 is simple in processing structure and low in manufacturing cost. Of course, in other embodiments, the shape of the surface formed by the bottom wall of the groove 11 is not particularly limited.
In the present embodiment, the liquid discharge port 12 is a through hole penetrating from the sidewall of the recess 11 to the outer surface of the fixture body 10. Thus, during etching, the non-standard wafer 200 to be etched is placed in the groove 11, and then wet etching is performed on the part, needing to be etched, on the surface of the non-standard wafer 200 through the etching solution, and the redundant etching solution flows out from the liquid outlet 12 formed in the through hole, so that the accumulation of the etching solution is avoided. In the present embodiment, the liquid discharge port 12 also penetrates the upper surface of the jig body 10, which facilitates discharge of the excess etching solution and opening of the liquid discharge port 12.
Further, in the present embodiment, a plurality of liquid discharge ports 12 are provided, and the plurality of liquid discharge ports 12 are uniformly provided along the edge of the jig body 10. Through setting up a plurality of leakage fluid ports 12 for unnecessary etching solution can be followed a plurality of leakage fluid ports 12 of even setting and evenly flowed out during the etching, guarantees the homogeneity of etching process, further improves the quality of etching process.
In the present embodiment, the jig body 10 has a circular cross-sectional shape. Specifically, in the present embodiment, the jig body 10 is cylindrical. During etching, place tool body 10 in the position department that the etching machine need be placed, because tool body 10 is the column, be convenient for rotate on the etching machine to guarantee going on smoothly of etching process.
In this embodiment, the jig body 10 is axisymmetric, and the groove 11 is formed in the center of the jig body 10, wherein the jig body 10 can be made of plastic. Thus, the jig body 10 is symmetrically disposed on the whole structure while the non-standard wafer 200 is placed to smoothly perform the etching process, so as to smoothly rotate and complete the etching process, thereby further improving the uniformity of etching. In addition, the jig body 10 is axisymmetric, so that the appearance is more beautiful.
It should be noted that, in the present embodiment, the etching area formed by the inner wall of the groove 11 can accommodate a plurality of non-standard wafers 200 to be etched. During etching, a plurality of to-be-etched non-standard wafers 200 can be simultaneously placed in the etching jig 100, so that batch etching process of the plurality of to-be-etched non-standard wafers 200 is realized, the requirement of simultaneously etching the plurality of non-standard wafers 200 is met, and the etching efficiency is improved.
An embodiment of the utility model provides an etching device including above-mentioned etching tool 100 still provides, and etching device still includes the etching machine, and the etching machine includes etching hydraulic cylinder and nozzle, and etching tool 100 is located the etching hydraulic cylinder to can be in etching hydraulic cylinder internal rotation, the nozzle is located etching tool 100's top, and the nozzle is used for spraying the etching solution.
The etching apparatus comprises an etching fixture 100 and an etching machine, wherein the etching machine comprises an etching liquid cylinder and a nozzle, the etching fixture 100 is located in the etching liquid cylinder and can rotate in the etching liquid cylinder, the nozzle above the etching fixture 100 continuously sprays etching liquid to a wafer to be etched, and redundant etching liquid flows out from a liquid outlet 12. Because the etching device comprises the etching jig 100 so as to place the non-standard wafer 200 to be etched, the centrifugal force during rotation enables the non-standard wafer 200 to be etched to be positioned at the edge position of the etching jig 100, and the side wall of the groove 11 on the etching jig 100 can prevent the non-standard wafer 200 to be etched from being thrown out, the etching process is convenient to be carried out on the non-standard wafer 200, and in addition, the etching machine is used for carrying out shape etching on the surface of the non-standard wafer 200 to be etched.
In the present embodiment, the projection of the nozzle on the etching jig 100 is located at the center of the etching jig 100. Because the nozzle is located right above the etching jig 100, and the etching solution sprayed from the nozzle is uniformly sprayed downwards to the surface of the non-standard wafer 200 in a fan shape above the etching jig 100, the redundant etching solution is uniformly discharged from the uniformly arranged liquid discharge ports 12, so that the etching process is completed, the whole etching process is uniformly performed, and the etching quality of the non-standard wafer 200 is ensured.
In the present embodiment, the whole structure of the etching jig 100 is located in the etching liquid tank. Thus, the etching solution flowing out from the liquid outlet 12 of the etching jig 100 flows into the etching solution tank, so that the redundant etching solution is conveniently collected or recycled, and the waste of the etching solution or the difficulty in cleaning the etching solution caused by flowing out to other places is effectively avoided.
In this embodiment, the etching solution sprayed from the nozzle can be adjusted according to the distance between the nozzle and the etching fixture 100 to meet the spraying requirements under different conditions, so as to ensure that the etching solution is sprayed on the outer surface of the whole non-standard wafer 200 and avoid the external spraying of the etching solution.
An etching method for realizing the smooth proceeding of the wet etching process aiming at the fragile physical properties of materials such as InP/InGaAs. The etching method comprises placing the non-standard wafer 200 to be etched in an etching device, rotating the etching jig 100 in an etching liquid cylinder, and opening a nozzle to spray the etching liquid onto the non-standard wafer 200 to be etched, wherein the excessive etching liquid flows out from the liquid outlet 12.
In the etching method, during etching, the to-be-etched non-standard wafer 200 is placed in the etching jig 100, the etching jig 100 is positioned in the liquid cylinder and can rotate in the etching liquid cylinder, and simultaneously, the to-be-etched non-standard wafer 200 synchronously rotates in the etching jig 100, at the moment, the etching liquid is continuously sprayed to the to-be-etched non-standard wafer 200 through the nozzle above the etching jig 100, and the redundant etching liquid flows out from the liquid discharge port 12, so that the etching process of the surface of the to-be-etched non-standard wafer 200 is completed. The etching method is simple to operate, when the to-be-etched non-standard wafer 200 is etched, under the action of centrifugal force, the to-be-etched non-standard wafer 200 is located at the edge of the jig body 10, and the side wall of the groove 11 formed in the jig body 10 can prevent the to-be-etched non-standard wafer 200 from being thrown out, so that the to-be-etched non-standard wafer 200 is limited, and the etching process is smoothly carried out.
In the present embodiment, placing the non-standard wafer to be etched 200 in the etching apparatus includes placing the non-standard wafer to be etched 200 at an edge position in the recess 11. Since the non-standard wafer 200 during etching is thrown out from the middle position in the groove 11 to the edge position under the action of the centrifugal force, the non-standard wafer 200 to be etched can be directly placed at the edge position in the groove 11, so that the non-standard wafer 200 is prevented from jumping randomly in the groove 11 during etching, and the side wall of the groove 11 can also prevent the non-standard wafer 200 to be etched from being thrown out under the action of the centrifugal force.
In this embodiment, the etching jig 100 rotates in the etching liquid cylinder at a constant speed, and the nozzle is opened in a fan shape to spray the etching liquid onto the non-standard wafer 200 to be etched. During etching, a plurality of to-be-etched non-standard wafers 200 can be sequentially placed at the edge positions in the grooves 11, the etching jig 100 rotates in the etching liquid cylinder at a constant speed, and the nozzles above the etching jig 100 are uniformly sprayed downwards in a fan shape, so that the etching uniformity of each to-be-etched non-standard wafer 200 is ensured, the etching quality of each non-standard wafer 200 is improved, and the etching uniformity is high.
It should be noted that the drawings in the present specification are only schematically illustrated to facilitate better understanding of the present invention, and the specific contents are to be read in accordance with the description.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. The etching jig is characterized by being arranged on an etching machine and capable of rotating on the etching machine, and comprising a jig body, wherein a groove is formed in the jig body, an etching area for placing a wafer to be etched is formed on the inner wall of the groove, and a liquid discharge port is formed in the edge of the jig body.
2. The etching jig of claim 1, wherein: the surface formed by the bottom wall of the groove is an arc surface.
3. The etching jig according to claim 1 or 2, characterized in that: the liquid discharge port is a through hole which penetrates from the side wall of the groove to the outer surface of the jig body.
4. The etching jig of claim 3, wherein: the liquid discharge port penetrates through the upper surface of the jig body.
5. The etching jig of claim 3, wherein: the liquid discharge port is provided with a plurality of, and is a plurality of the liquid discharge port is along the edge of tool body evenly sets up.
6. The etching jig of claim 1, wherein: the cross section of the jig body is circular.
7. The etching jig of claim 1, wherein: the jig body is axisymmetric.
8. The etching jig of claim 1, wherein: the etching area formed by the inner wall of the groove can be used for placing a plurality of wafers to be etched.
9. An etching apparatus, comprising the etching jig according to any one of claims 1 to 8 and an etching machine, wherein the etching machine comprises an etching liquid cylinder and a nozzle, the etching jig is located in the etching liquid cylinder and can rotate in the etching liquid cylinder, the nozzle is located above the etching jig, and the nozzle is used for spraying etching liquid.
10. The etching apparatus according to claim 9, wherein: the projection of the nozzle on the etching jig is positioned at the center of the etching jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023234952.XU CN213988859U (en) | 2020-12-28 | 2020-12-28 | Etching jig and etching device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202023234952.XU CN213988859U (en) | 2020-12-28 | 2020-12-28 | Etching jig and etching device |
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| CN213988859U true CN213988859U (en) | 2021-08-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635389A (en) * | 2020-12-28 | 2021-04-09 | 芯思杰技术(深圳)股份有限公司 | Etching jig, etching device and etching method |
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- 2020-12-28 CN CN202023234952.XU patent/CN213988859U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635389A (en) * | 2020-12-28 | 2021-04-09 | 芯思杰技术(深圳)股份有限公司 | Etching jig, etching device and etching method |
| CN112635389B (en) * | 2020-12-28 | 2024-10-15 | 芯思杰技术(深圳)股份有限公司 | Etching jig, etching device and etching method |
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