CN213991133U - Novel heat dissipation LED circuit board - Google Patents
Novel heat dissipation LED circuit board Download PDFInfo
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- CN213991133U CN213991133U CN202022847036.7U CN202022847036U CN213991133U CN 213991133 U CN213991133 U CN 213991133U CN 202022847036 U CN202022847036 U CN 202022847036U CN 213991133 U CN213991133 U CN 213991133U
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- circuit board
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- conducting layer
- heat dissipation
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Abstract
The utility model discloses a novel heat dissipation LED circuit board, including circuit board and movable block, be equipped with the installing port that runs through the movable block on the movable block, be equipped with more than one axostylus axostyle in the installing port, the internal face of installing port is just all equipped with the mounting groove to the terminal surface department of axostylus axostyle, all be equipped with the clockwork spring in the mounting groove, the both ends of axostylus axostyle are all installed in the inner circle of clockwork spring, the first heat-conducting layer of circuit board is installed on the surface, install the second heat-conducting layer on the bottom surface of circuit board, first heat-conducting layer and second heat-conducting layer one end all extend to in the installing port, and coil respectively on the axostylus axostyle, install between movable block and the circuit board and adjust positioning mechanism. The utility model discloses simple structure can be according to the size of the first, second heat-conducting layer of inside size adjustment of installation circuit board casing, through the first, the great increase of second heat-conducting layer surface area that expand, has increased heat radiating area and efficiency, has avoided electronic component to damage because of overheated, has increased life.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to novel heat dissipation LED circuit board.
Background
The circuit board is named as a circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultrathin circuit board, a printed (copper etching technology) circuit board and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
The LED circuit board has high requirement on heat dissipation effect, and if the LED circuit board only depends on the surface of an element with a very small surface area to dissipate heat, the LED circuit board can affect the service life of the element once the heat is too high.
Disclosure of Invention
The utility model aims to solve the technical problem that a novel heat dissipation LED circuit board is provided to solve the problem that proposes in the above-mentioned background art.
The utility model discloses a realize through following technical scheme: the utility model provides a novel heat dissipation LED circuit board, including circuit board and movable block, the movable block sets up in one side of circuit board, be equipped with the installing port that runs through the movable block on the movable block, be equipped with more than one axostylus axostyle in the installing port, the internal face of installing port all is equipped with the mounting groove just to the terminal surface department of axostylus axostyle, all be equipped with the clockwork spring in the mounting groove, the outer most circle of clockwork spring is all installed on the inner wall face of mounting groove, the both ends of axostylus axostyle all insert in the inner most circle of clockwork spring, and all with inner most circle welded fastening, the circuit board install first heat-conducting layer on the surface, install the second heat-conducting layer on the bottom surface.
As preferred technical scheme, adjust positioning mechanism and include that more than one locating lever and more than one hand are twisted the bolt, the edge that the circuit board is close to length direction all is equipped with the locating hole, locating lever one end all inserts in the locating hole, the locating lever other end all extends to the external world, and all install on the movable block, the side of circuit board all is equipped with the screw hole with the locating hole intercommunication, the equal threaded connection of hand is twisted the bolt in the screw hole, hand is twisted bolt one end and all offsets with the outer wall of locating lever, the locating lever is all fixed on the circuit board through hand is twisted the bolt locking.
As a preferred technical solution, the first heat conduction layer and the second heat conduction layer are both made of graphene materials.
As the preferred technical scheme, more than one heat dissipation hole is formed in one end, which is not contacted with the circuit board, of the first heat conduction layer and one end, which is not contacted with the circuit board, of the second heat conduction layer.
The utility model has the advantages that: the utility model discloses simple structure can be according to the size of the first, second heat-conducting layer of inside size adjustment of installation circuit board casing, through the first, the great increase of second heat-conducting layer surface area that expand, has increased heat radiating area and efficiency, has avoided electronic component to damage because of overheated, has increased life.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a top view of the present invention with the first heat conductive layer removed.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "disposed" are to be construed broadly, and may for example be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 and fig. 2, a novel heat dissipation LED circuit board of the present invention comprises a circuit board 4 and a moving block 8, the moving block 8 is arranged on one side of the circuit board 4, the moving block 8 is provided with an installation opening 9 penetrating through the moving block 8, more than one shaft lever 11 is arranged in the installation opening 9, the inner wall surface of the installation opening 9 is provided with installation grooves opposite to the end surfaces of the shaft levers, the clockwork spring 1 is arranged in the installation grooves, the outermost ring of the clockwork spring 1 is arranged on the inner wall surface of the installation grooves, the two ends of the shaft lever 11 are inserted into the innermost ring of the clockwork spring 1, and are welded and fixed with the innermost ring, a first heat conduction layer 2 is arranged on the surface of the circuit board 4, a second heat conduction layer 3 is arranged on the bottom surface of the circuit board 4, one end of the first heat conduction layer 2 and one end of the second heat conduction layer 3 extend into the mounting opening 9, and are respectively wound on the shaft lever 11, and an adjusting and positioning mechanism is arranged between the moving block 8 and the circuit board 4.
In this embodiment, adjust positioning mechanism and include more than one locating lever 6 and more than one hand and twist bolt 12, circuit board 4 all is equipped with locating hole 5 near length direction's edge, locating lever 6 one end all inserts in locating hole 5, the locating lever 6 other end all extends to the external world, and all install on movable block 8, circuit board 4's side all is equipped with the screw hole with locating hole 5 intercommunication, hand is twisted equal threaded connection of bolt 12 in the screw hole, hand is twisted 12 one end of bolt and all offsets with the outer wall of locating lever 6, locating lever 6 all is fixed in on circuit board 4 through hand is twisted 12 locking of bolt.
In this embodiment, the first heat conduction layer 2 and the second heat conduction layer 3 are both made of graphene materials, so that the heat transfer effect is increased.
In this embodiment, the ends of the first heat conduction layer 2 and the second heat conduction layer 3 that do not contact the circuit board are respectively provided with more than one heat dissipation holes 7, so as to increase the heat dissipation effect.
During the use, can be according to the inside size adjustment first of installation circuit board casing, the size of second heat-conducting layer, during the adjustment, outwards stimulate the movable block, the removal of movable block has driven first, the second heat-conducting layer, make first, the second heat-conducting layer is emitted from the axostylus axostyle, after reacing certain length, rotatory hand is twisted the bolt, one end until making hand twist the bolt offsets with the locating lever, thereby effectual fix a position the locating lever, otherwise, after unscrewing hand is twisted the bolt, can be with first, the new rolling of second heat-conducting layer through the torsion of clockwork spring, make the movable block can be close to the circuit board, until offset with the circuit board, great reduction the size, the transportation has made things convenient for and has deposited, also do not influence the normal use of circuit board.
The circuit board is mounted on the shell, and the shell is provided with a large heat dissipation opening at one end, so that one ends of the first heat conduction layer and the second heat conduction layer can move to the outside along the heat dissipation opening, and the heat dissipation effect is improved.
The surface area is greatly increased through the first heat conduction layer and the second heat conduction layer which are unfolded, the heat dissipation area and the efficiency are increased, the damage of an electronic element due to overheating is avoided, the service life is prolonged, one end of the circuit board is far away from the first heat conduction layer and the second heat conduction layer, and the temperature of the first heat conduction layer and the second heat conduction layer is lower than that of one end close to the circuit board due to the fact that the first heat conduction layer and the second heat conduction layer are not in contact with the circuit board, so that heat can be rapidly transmitted, and the damage of the circuit board caused by the fact that the heat is remained on the circuit board for a long time is avoided.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (4)
1. The utility model provides a novel heat dissipation LED circuit board which characterized in that: the heat-conducting type wind power generation device comprises a circuit board (4) and a moving block (8), wherein the moving block (8) is arranged on one side of the circuit board (4), a mounting hole (9) penetrating through the moving block (8) is formed in the moving block (8), more than one shaft rod (11) is arranged in the mounting hole (9), mounting grooves are formed in the inner wall surface of each mounting hole (9) and opposite to the end surface of each shaft rod, a spring (1) is arranged in each mounting groove, the outermost ring of each spring (1) is mounted on the inner wall surface of each mounting groove, the two ends of each shaft rod (11) are inserted into the innermost ring of each spring (1) and are welded and fixed with the innermost ring, a first heat-conducting layer (2) is mounted on the surface of the circuit board (4), a second heat-conducting layer (3) is mounted on the bottom surface of the circuit board (4), one ends of the first heat-conducting layer (2) and one end, an adjusting and positioning mechanism is arranged between the moving block (8) and the circuit board (4).
2. The novel heat dissipation LED circuit board of claim 1, characterized in that: adjust positioning mechanism and include more than one locating lever (6) and bolt (12) are twisted to more than one hand, circuit board (4) are close to length direction's edge and all are equipped with locating hole (5), locating lever (6) one end all inserts in locating hole (5), locating lever (6) other end all extends to the external world, and all install on movable block (8), the side of circuit board (4) all is equipped with the screw hole with locating hole (5) intercommunication, bolt (12) equal threaded connection is twisted to the hand in the screw hole, bolt (12) one end is twisted to the hand all offsets with the outer wall of locating lever (6), locating lever (6) are all twisted on bolt (12) locking fixation circuit board (4) through the hand.
3. The novel heat dissipation LED circuit board of claim 1, characterized in that: the first heat conduction layer (2) and the second heat conduction layer (3) are both made of graphene materials.
4. The novel heat dissipation LED circuit board of claim 1, characterized in that: one end of the first heat conduction layer (2) and the second heat conduction layer (3) which are not contacted with the circuit board are respectively provided with more than one heat dissipation hole (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022847036.7U CN213991133U (en) | 2020-11-30 | 2020-11-30 | Novel heat dissipation LED circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022847036.7U CN213991133U (en) | 2020-11-30 | 2020-11-30 | Novel heat dissipation LED circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213991133U true CN213991133U (en) | 2021-08-17 |
Family
ID=77239084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022847036.7U Active CN213991133U (en) | 2020-11-30 | 2020-11-30 | Novel heat dissipation LED circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213991133U (en) |
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2020
- 2020-11-30 CN CN202022847036.7U patent/CN213991133U/en active Active
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