CN213988879U - IGBT power module terminal - Google Patents
IGBT power module terminal Download PDFInfo
- Publication number
- CN213988879U CN213988879U CN202022436989.4U CN202022436989U CN213988879U CN 213988879 U CN213988879 U CN 213988879U CN 202022436989 U CN202022436989 U CN 202022436989U CN 213988879 U CN213988879 U CN 213988879U
- Authority
- CN
- China
- Prior art keywords
- welding
- terminal
- power module
- igbt power
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention discloses an IGBT power module terminal, which comprises a first connecting part, a second connecting part connected with the first connecting part and a welding part connected with the second connecting part and welded with a bare copper substrate, wherein the first connecting part is provided with a first back surface, the second connecting part is provided with a second back surface, the first back surface is connected with the second back surface, an included angle between the first back surface and the second back surface is 80-90 degrees, and the width of the welding part is 1.5-2 times of the width of the second connecting part. According to the IGBT power module terminal, the welding stress point is bent inwards by 80-90 degrees, so that the pulling force on a welding surface can be reduced in the ultrasonic welding process; meanwhile, the welding contact area is increased, the bonding strength of the welding surface is enhanced, and the product quality is improved.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor product, specifically speaking, the utility model relates to a IGBT power module terminal.
Background
In the manufacturing process of the IGBT power module, a traditional ultrasonic terminal is bonded, a bonding welding head is used for welding a copper terminal on the bare copper surface of the DBC substrate in an ultrasonic cold pressure welding mode, the roughness of the welding surface of the terminal is increased during ultrasonic vibration, and the welding of the welding surface and the bare copper substrate is completed.
The prior art has the following disadvantages:
1. the terminal is a stamping part, and in view of the processing technical characteristics of the stamping part, a welding stress point on the terminal generates a pulling force on a welding surface in the ultrasonic welding process, so that the welding surface is not easy to combine with a bare copper substrate, and a welding spot has a falling risk in the long-time use process;
2. in the ultrasonic welding process, the roughness of the front surface of the terminal and the welding surface is insufficient, and the vibration friction for a longer time is needed to enhance the combination between the welding surfaces;
3. the front surface of the terminal and the welding surface are relatively flat, and the welding time of the welding surface is long; moreover, when the welding surface is warped, the bonding strength between the surfaces is insufficient.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a IGBT power module terminal, the purpose reduces the pulling force to the face of weld in the ultrasonic bonding process.
In order to realize the purpose, the utility model discloses the technical scheme who takes does: the IGBT power module terminal comprises a first connecting portion, a second connecting portion connected with the first connecting portion and a welding portion connected with the second connecting portion and welded with a bare copper substrate, wherein the first connecting portion is provided with a first back face, the second connecting portion is provided with a second back face, the first back face is connected with the second back face, an included angle between the first back face and the second back face is 80-90 degrees, and the width of the welding portion is 1.5-2 times that of the second connecting portion.
The second connecting part is fixedly connected with the welding part at the middle part of the width direction of the welding part, and the width of the first connecting part is the same as that of the second connecting part.
The welding part is of an arc-shaped structure, the welding part is provided with a terminal front face used for being in contact with the bonding welding head and a terminal welding face used for being in contact with the welding face of the bare copper substrate, the terminal front face and the terminal welding face are both arc faces, and the axes of the terminal front face and the terminal welding face are parallel to the welding face of the bare copper substrate.
A plurality of first grooves are formed in the front face of the terminal.
All first grooves on the front face of the terminal are distributed in an n x m matrix form.
The first groove is a rhombic groove.
A plurality of second grooves are formed in the terminal welding surface.
All second grooves on the terminal welding surface are distributed in an n x m matrix form.
The second groove is a rhombic groove.
The IGBT power module terminal of the utility model has the advantages that the welding stress point is bent inwards by 80-90 degrees, so that the pulling force to the welding surface can be reduced in the ultrasonic welding process; meanwhile, the welding contact area is increased, the bonding strength of the welding surface is enhanced, and the product quality is improved.
Drawings
The description includes the following figures, the contents shown are respectively:
FIG. 1 is a schematic diagram of a welding state of an IGBT power module terminal and a bare copper substrate;
fig. 2 is a top view of an IGBT power module terminal;
labeled as: 1. welding stress points; 2. bonding a welding head; 3. a terminal front face; 4. a terminal soldering surface; 5. a back surface of the bare copper substrate; 6. a bonding surface of a bare copper substrate; 7. a ceramic substrate; 8. a first connection portion; 9. a second connecting portion; 10. welding the part; 11. a first front surface; 12. a first back surface; 13. a second front surface; 14. a second back surface.
Detailed Description
The following detailed description of the embodiments of the present invention will be given with reference to the accompanying drawings, for the purpose of helping those skilled in the art to understand more completely, accurately and deeply the conception and technical solution of the present invention, and to facilitate its implementation.
It should be noted that, in the following embodiments, the "first" and "second" do not represent an absolute distinction relationship in structure and/or function, nor represent a sequential execution order, but merely for convenience of description.
As shown in fig. 1 and 2, the utility model provides an IGBT power module terminal, including first connecting portion 8, the second connecting portion 9 of being connected with first connecting portion 8 and the welding part 10 of being connected with second connecting portion 9 and being welded with the bare copper base plate, first connecting portion 8 has first front 11 and first back 12, second connecting portion 9 has second front 13 and second back 14, first back 12 is connected with second back 14 and the contained angle between first back 12 and the second back 14 is 80-90, the width of welding part 10 is 1.5-2 times of the width of second connecting portion 9, the bare copper base plate is the DBC base plate.
Specifically, as shown in fig. 1 and 2, the first connection portion 8 has a certain length, width and thickness, the length direction, width direction and thickness direction of the first connection portion 8 are perpendicular to each other two by two, and the first front surface 11 and the first back surface 12 of the first connection portion 8 are planes perpendicular to the thickness direction of the first connection portion 8 and parallel to the length direction and width direction of the first connection portion 8. The second connection portion 9 has a certain length, width and thickness, the length direction, width direction and thickness direction of the second connection portion 9 are mutually perpendicular in pairs, and the second front surface 13 and the second back surface 14 of the second connection portion 9 are planes perpendicular to the thickness direction of the second connection portion 9 and parallel to the length direction and width direction of the second connection portion 9. The width direction of the first connecting portion 8 is parallel to the width direction of the second connecting portion 9, one end of the first connecting portion 8 in the length direction is fixedly connected with one end of the second connecting portion 9 in the length direction, and the other end of the second connecting portion 9 in the length direction is fixedly connected with the welding portion 10. The first front surface 11 and the first back surface 12 are opposite surfaces of the first connection portion 8, and a distance between the first front surface 11 and the bare copper substrate is greater than a distance between the first back surface 12 and the bare copper substrate. The second front face 13 and the second back face 14 are opposite surfaces of the second connecting portion 9, and the distance between the second front face 13 and the bonding horn 2 is smaller than the distance between the second back face 14 and the bonding horn 2 during the ultrasonic welding.
As shown in fig. 1 and 2, the second connection portion 9 is fixedly connected to the welding portion 10 at a middle portion of the welding portion 10 in the width direction, the width of the welding portion 10 is larger than the widths of the first connection portion 8 and the second connection portion 9, the widths of the first connection portion 8 and the second connection portion 9 are the same, and two ends of the first connection portion 8 and the second connection portion 9 in the width direction are respectively aligned.
Preferably, as shown in fig. 1 and 2, the welding portion 10 has an arc-shaped configuration, the welding portion 10 has a terminal front surface 3 for contacting the bonding tool 2 and a terminal welding surface 4 for contacting the welding surface 6 of the bare copper substrate, both the terminal front surface 3 and the terminal welding surface 4 are arc-shaped surfaces, and the axes of the terminal front surface 3 and the terminal welding surface 4 are parallel to the welding surface 6 of the bare copper substrate. The distance between the terminal front surface 3 and the bare copper substrate is greater than the distance between the terminal soldering surface 4 and the bare copper substrate, the axis of the terminal front surface 3 is located above the terminal front surface 3, and the axis of the terminal soldering surface 4 is also located above the terminal front surface 3.
As shown in fig. 1 and 2, the terminal face 3 and the terminal weld face 4 are opposite surfaces of the weld 10, and the radian of the terminal face 3 and the terminal weld face 4 is less than 180 degrees. One end of the first back surface 12 is directly connected with one end of the second back surface 14, the other end of the second back surface 14 is connected with one end of the terminal welding surface 4, an included angle between the length direction of the first back surface 12 (namely the length direction of the first connecting portion 8) and the second back surface 14 (namely the length direction of the second connecting portion 9) is 80-90 degrees, a welding stress point is formed at the connecting position of the first back surface 12 and the second back surface 14, the welding stress point is bent inwards by 80-90 degrees, and the pulling force on the welding surface can be reduced in the ultrasonic welding process. One end of the first front surface 11 is connected with one end of the second front surface 13, the two ends are in arc transition connection, and the other end of the second front surface 13 is connected with one end of the terminal front surface 3.
Preferably, as shown in fig. 1 and 2, the terminal front surface 3 is provided with a plurality of first grooves, and all the first grooves on the terminal front surface 3 are distributed in an n × m matrix. Set up a plurality of second recesses on the terminal bonding surface 4, all second recesses on the terminal bonding surface 4 are for being n × m matrix distribution. Therefore, the front surface 3 of the terminal and the welding surface 4 of the terminal adopt a concave surface structure design, and meanwhile, by arranging the first groove and the second groove, the welding surface 4 of the terminal and the bare copper substrate can be combined more quickly during ultrasonic welding, and complete welding combination between the two welding surfaces is completed gradually.
Preferably, as shown in fig. 1 and 2, the first grooves and the second grooves are diamond-shaped grooves.
Preferably, the surface roughening treatment is required to be carried out on the terminal front surface 3 and the terminal welding surface 4, so that the friction force of contact between ultrasonic vibration surfaces can be enhanced, and the time of ultrasonic welding can be shortened.
The invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited by the above-described manner. Various insubstantial improvements are made by adopting the method conception and the technical proposal of the utility model; or without improvement, the above conception and technical solution of the present invention can be directly applied to other occasions, all within the protection scope of the present invention.
Claims (7)
- The IGBT power module terminal is characterized by comprising a first connecting portion, a second connecting portion connected with the first connecting portion and a welding portion connected with the second connecting portion and welded with a bare copper substrate, wherein the first connecting portion is provided with a first back face, the second connecting portion is provided with a second back face, the first back face is connected with the second back face, an included angle between the first back face and the second back face is 80-90 degrees, and the width of the welding portion is 1.5-2 times that of the second connecting portion.
- 2. The IGBT power module terminal according to claim 1, wherein the second connection portion is fixedly connected to the soldering portion at an intermediate portion in a width direction of the soldering portion, and widths of the first connection portion and the second connection portion are the same.
- 3. The IGBT power module terminal according to claim 1 or 2, wherein the welding portion has a circular arc-shaped structure, the welding portion has a terminal front surface for contacting a bonding tool and a terminal soldering surface for contacting a soldering surface of the bare copper substrate, the terminal front surface and the terminal soldering surface are both circular arc surfaces, and axes of the terminal front surface and the terminal soldering surface are parallel to the soldering surface of the bare copper substrate.
- 4. The IGBT power module terminal according to claim 3, wherein a plurality of first grooves are provided on the terminal front face.
- 5. The IGBT power module terminal of claim 4, wherein the first groove is a diamond-shaped groove.
- 6. The IGBT power module terminal according to claim 3, wherein a plurality of second grooves are provided on the terminal land.
- 7. The IGBT power module terminal of claim 6, wherein the second groove is a diamond-shaped groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022436989.4U CN213988879U (en) | 2020-10-28 | 2020-10-28 | IGBT power module terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022436989.4U CN213988879U (en) | 2020-10-28 | 2020-10-28 | IGBT power module terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213988879U true CN213988879U (en) | 2021-08-17 |
Family
ID=77259120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022436989.4U Active CN213988879U (en) | 2020-10-28 | 2020-10-28 | IGBT power module terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213988879U (en) |
-
2020
- 2020-10-28 CN CN202022436989.4U patent/CN213988879U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101252112B (en) | Semiconductor device and wire bonding method | |
| JP2009049272A (en) | Semiconductor device, and its manufacturing method | |
| JP2019153752A (en) | Semiconductor device | |
| CN101335252A (en) | Semiconductor device and wire bonding method | |
| TWM508801U (en) | Multi thickness lead frame | |
| CN213988879U (en) | IGBT power module terminal | |
| KR101321190B1 (en) | Folded frame carrier for mosfet bga | |
| JP5884752B2 (en) | Ultrasonic bonding apparatus and semiconductor device manufacturing method | |
| CN111326489A (en) | Power device packaging structure | |
| JP4612550B2 (en) | Bonding ribbon for power device and bonding method using the same | |
| CN112271142B (en) | Welding process of IGBT power module terminal and bare copper substrate | |
| JP4586508B2 (en) | Semiconductor device and manufacturing method thereof | |
| JP2002222909A (en) | Lead frame and semiconductor element housing package using the same | |
| CN215299074U (en) | Silver point structure of static contact | |
| CN220526902U (en) | Power module signal terminal and power module | |
| US5335842A (en) | Self-aligning single point bonding tool | |
| CN218575242U (en) | IGBT packaging torque welding head | |
| CN221621115U (en) | Ultrasonic welding head, ultrasonic welding device and battery production line | |
| CN221185281U (en) | Welding fixture | |
| CN220943792U (en) | Welding jig for semiconductor packaging module | |
| CN213845260U (en) | Semiconductor heat radiation structure | |
| CN218284112U (en) | Multi-directional welding device | |
| CN220710244U (en) | Wire clamp of bonding machine | |
| CN218602423U (en) | Dual in-line package pin structure and lead frame | |
| CN214815931U (en) | Graphite structure for realizing one-time welding |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |