CN213960432U - Novel vacuum molding press - Google Patents
Novel vacuum molding press Download PDFInfo
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- CN213960432U CN213960432U CN202022761592.2U CN202022761592U CN213960432U CN 213960432 U CN213960432 U CN 213960432U CN 202022761592 U CN202022761592 U CN 202022761592U CN 213960432 U CN213960432 U CN 213960432U
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Abstract
The utility model discloses a novel vacuum molding press, which comprises a frame, an upper film-loading conveying device, a lower film-loading conveying device, a film-loading cleaning device, a vacuum chamber and a film opening and closing device thereof, a vacuum pump and a vacuum pipeline system thereof, an electric heating system inside the vacuum chamber, and a high-pressure gas pressurizing device inside the vacuum chamber, wherein the film-loading conveying device is transversely arranged inside the frame; the input direction of the film carrying and conveying device is sequentially provided with a cleaning device, a vacuum cavity and a film opening and closing device thereof, an electric heating system in the vacuum cavity and a high-pressure gas pressurizing device in the vacuum cavity; the film carrying cleaning devices are provided with two groups and are arranged in the cleaning area through the rack, and the film carrying conveying devices are respectively arranged above and below the film carrying conveying devices; the vacuum cavity and the film opening and closing device thereof are arranged on the frame corresponding to the upper cavity, the lower cavity, the lifting mechanism, the film closing mechanism, the internal heating systems of the upper cavity and the lower cavity and the silica gel air bag pressurizing system of the upper cavity.
Description
Technical Field
The utility model relates to a circuit board production technical field specifically is a novel vacuum molding press.
Background
The circuit board needs to be subjected to surface pressing molding processing during production, and particularly when a large height difference exists on the surface of the circuit board or a strong binding force requirement is required between a dry film and the board surface, the conventional dry film pasting mode cannot meet the requirement. Meanwhile, the surfaces of materials such as wafers in the semiconductor industry often have certain height difference, or the surfaces needing to be protected are required to be corroded by chemical treatment of a post-process after the materials are pasted with films, and the equipment is also required to be used for production. The existing film pasting mode is that a dry film is tightly pressed on a board surface under constant pressure through a heated silica gel roller, the filling property is poor, the pasting force of the dry film and the board surface is poor, and the requirement of the conventional circuit board film pasting can only be met. Based on the above factors, we developed such a device to meet the needs of the market.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel vacuum molding press satisfies when the face has great difference in height or dry film and face need have very strong cohesion requirement, and conventional dry film pad pasting mode will unable the satisfaction requirement.
In order to achieve the above object, the utility model provides a following technical scheme: a novel vacuum molding press comprises a frame, an upper film carrying conveying device, a lower film carrying conveying device, a film carrying cleaning device, a vacuum cavity and a film opening and closing device thereof, a vacuum pump and a vacuum pipeline system thereof, an electric heating system inside the vacuum cavity, and a high-pressure gas pressurizing device inside the vacuum cavity, wherein the film carrying conveying device is transversely arranged inside the frame;
the input direction of the film carrying conveying device is sequentially provided with a film carrying cleaning device, a vacuum cavity and a film opening and closing device thereof, an electric heating system in the vacuum cavity and a high-pressure gas pressurizing device in the vacuum cavity;
the film carrying cleaning devices are respectively arranged above and below the film carrying conveying device and used for independently cleaning the upper and lower film carrying conveying devices;
the frame is provided with an upper cavity, a lower cavity lifting mechanism, a film combining mechanism, an internal heating system of the upper cavity and the lower cavity and a silica gel air bag pressurizing system of the upper cavity corresponding to the vacuum cavity and the film opening and closing device of the frame.
Specifically, the high-pressure gas pressurizing device in the vacuum cavity locks the vacuum cavity through an inclined wedge self-locking structure pushed by a cylinder and realizes opening and closing of the cavity in a gas-liquid pressurizing mode, the inclined wedge self-locking structure and four seat body structures of the vacuum cavity, and when high-pressure gas in the cavity is pressurized, the force cannot be transmitted to the rack finally.
Specifically, the upper and lower carrier film conveying devices, the carrier film cleaning device, the vacuum chamber and the film opening and closing device thereof, the vacuum pump and the vacuum pipeline system thereof, the electric heating system in the vacuum chamber and the high-pressure gas pressurizing device in the vacuum chamber are arranged on the same machine frame. The influence of transportation, vibration and the like on the operation stability of the equipment is reduced.
Specifically, the output end of the rack corresponding to the upper and lower carrier film conveying devices is provided with a link structure connected with equipment in the next process.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model arranges a film-carrying cleaning device, a vacuum cavity and a film opening and closing device thereof, an electric heating system in the vacuum cavity, a high-pressure gas pressurizing device in the vacuum cavity in sequence corresponding to the input of the film-carrying conveying device, the film-carrying cleaning device is matched with the film-carrying conveying device to clean the circuit board, the vacuum cavity and the film opening and closing device thereof are conveyed through the film carrying conveying device, the high-pressure gas pressurizing device in the vacuum cavity drives the circuit board on the film carrying conveying device to be subjected to die pressing operation, the die pressing operation is completed in the vacuum cavity and the film opening and closing device thereof, the circuit board is pushed to a film sealing area by the film carrying conveying device after die pressing, the film sealing equipment is used for matching the film with the circuit board for film sealing operation, the circuit board is output to next process equipment after packaging is completed, the die pressing operation on the circuit board is completed, full-automatic die pressing on the circuit board is realized, the manual input cost of the die pressing is reduced, and the die pressing efficiency is improved.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
In the figure: 1. a frame; 2. a carrier film transfer device; 3. a carrier film cleaning device; 4. a high-pressure gas pressurizing device inside the vacuum cavity; 5. a vacuum cavity and a film opening and closing device thereof; 6. a linking structure.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, a novel vacuum molding press comprises a frame 1, an upper film carrying conveying device 2, a lower film carrying conveying device 2, a film carrying cleaning device 3, a vacuum chamber and a film opening and closing device 5 thereof, a vacuum pump and a vacuum pipeline system thereof, an electric heating system in the vacuum chamber, and a high-pressure gas pressurizing device 4 in the vacuum chamber, wherein the film carrying conveying device 2 is transversely arranged in the frame 1, and is used for conveying a circuit board from a board feeding position to the vacuum chamber and then from the vacuum chamber to a board receiving position from the foremost end to the rearmost end through a film;
the input direction of the film carrying conveying device 2 is sequentially provided with a film carrying cleaning device 3, a vacuum cavity and a film opening and closing device 5 thereof, an electric heating system in the vacuum cavity and a high-pressure gas pressurizing device 4 in the vacuum cavity;
the film-carrying cleaning devices 3 are respectively arranged corresponding to the upper part and the lower part of the film-carrying conveying device 2;
the frame 1 is provided with an upper cavity, a lower cavity lifting mechanism, a film closing mechanism, an internal heating system of the upper cavity and the lower cavity and a silica gel air bag pressurizing system of the upper cavity corresponding to the vacuum cavity and the film opening and closing device 5 thereof.
Specifically, the high-pressure gas pressurizing device 4 inside the vacuum cavity locks the vacuum cavity through an inclined wedge self-locking structure pushed by a cylinder, and the opening and closing of the cavity are realized in a gas-liquid pressurizing mode, and the inclined wedge self-locking structure and the four seat body structures of the vacuum cavity cannot be transmitted to the rack finally when the high-pressure gas of the cavity is pressurized.
Specifically, the upper and lower carrier film conveying devices 2, the carrier film cleaning device 3, the vacuum chamber and the film opening and closing device 5 thereof, the vacuum pump and the vacuum pipeline system thereof, the electric heating system in the vacuum chamber and the high-pressure gas pressurizing device 4 in the vacuum chamber are arranged on the same group of machine frame, so that the influence of transportation, vibration and the like on the operation stability of the equipment is reduced.
Specifically, the frame 1 is provided with a link structure 6 corresponding to the output end of the upper and lower carrier film conveying devices 2 and connected with the equipment of the next process.
In summary, the following steps: the film carrying cleaning device 3, the vacuum cavity and the film opening and closing device 5 thereof, the electric heating system in the vacuum cavity, the high-pressure gas pressurizing device in the vacuum cavity, the film carrying cleaning device 3 is matched with the circuit board to clean the circuit board and is used for conveying the vacuum cavity and the film opening and closing device 5 thereof through the film carrying conveying device 2, the high-pressure gas pressurizing device in the vacuum cavity drives the circuit board on the film carrying conveying device 2 to be subjected to die pressing operation, the die pressing operation is completed in the vacuum cavity and the film opening and closing device 5 thereof, the circuit board is pushed to a film sealing area by the film carrying conveying device 2 after die pressing, the film sealing device is matched with the film carrying cleaning device and the adhesive collecting structure with the circuit board to be subjected to film sealing operation, the circuit board is output to next process equipment after packaging is completed, the die pressing operation of the circuit board is completed, full-automatic die pressing of the circuit board is realized, and the manual investment cost of the die pressing is reduced, the press molding efficiency is improved.
Claims (4)
1. A novel vacuum molding press is characterized in that: the device comprises a rack (1), an upper film carrying conveying device, a lower film carrying conveying device (2), a film carrying cleaning device (3), a vacuum cavity and a film opening and closing device (5) thereof, a vacuum pump and a vacuum pipeline system thereof, an electric heating system in the vacuum cavity and a high-pressure gas pressurizing device (4) in the vacuum cavity, wherein the film carrying conveying device (2) is transversely arranged in the rack (1);
a film-carrying cleaning device (3), a vacuum cavity and a film opening and closing device (5) thereof, an electric heating system in the vacuum cavity and a high-pressure gas pressurizing device (4) in the vacuum cavity are sequentially arranged in the input direction of the film-carrying conveying device (2);
the film-carrying cleaning devices (3) are respectively arranged above and below the film-carrying conveying device (2);
the frame (1) is provided with an upper cavity, a lower cavity lifting mechanism, a film closing mechanism, an internal heating system of the upper cavity and the lower cavity and a silica gel air bag pressurizing system of the upper cavity corresponding to the vacuum cavity and the film opening and closing device (5) of the vacuum cavity.
2. The vacuum molding press as claimed in claim 1, wherein: the high-pressure gas pressurizing device (4) in the vacuum cavity is used for locking the vacuum cavity and opening and closing the gas-liquid through an inclined wedge self-locking structure pushed by a cylinder.
3. The vacuum molding press as claimed in claim 1, wherein: the upper and lower film carrying conveying devices (2), the film carrying cleaning device (3), the vacuum chamber and the film opening and closing device (5), the vacuum pump and a vacuum pipeline system thereof, an electric heating system in the vacuum chamber and a high-pressure gas pressurizing device (4) in the vacuum chamber are arranged on the same machine frame (1).
4. The vacuum molding press as claimed in claim 1, wherein: and the frame (1) is provided with a link structure (6) connected with equipment in the next process corresponding to the output end of the upper and lower film loading and conveying devices (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022761592.2U CN213960432U (en) | 2020-11-25 | 2020-11-25 | Novel vacuum molding press |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022761592.2U CN213960432U (en) | 2020-11-25 | 2020-11-25 | Novel vacuum molding press |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213960432U true CN213960432U (en) | 2021-08-13 |
Family
ID=77211435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022761592.2U Active CN213960432U (en) | 2020-11-25 | 2020-11-25 | Novel vacuum molding press |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213960432U (en) |
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2020
- 2020-11-25 CN CN202022761592.2U patent/CN213960432U/en active Active
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