CN213933642U - High-speed automatic laser hole inspection machine for ceramic substrate - Google Patents
High-speed automatic laser hole inspection machine for ceramic substrate Download PDFInfo
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- CN213933642U CN213933642U CN202022912918.7U CN202022912918U CN213933642U CN 213933642 U CN213933642 U CN 213933642U CN 202022912918 U CN202022912918 U CN 202022912918U CN 213933642 U CN213933642 U CN 213933642U
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Abstract
The utility model discloses a high-speed automatic laser hole inspection machine of ceramic substrate, including frame, industrial computer, laser generator, X axle motion platform, Y axle motion platform, year material anchor clamps, go up glassware, unloading manipulator, AOI camera and laser lens down, this industrial computer, laser generator, X axle motion platform, go up glassware, unloading ware, material loading manipulator, unloading manipulator, AOI camera and laser lens all set up in the frame. Through utilizing the industrial computer to control the AOI camera, but automated inspection leak hole position (need not be through artifical point of looking for) generation mistake document, it promotes 400% to examine hole efficiency, can not appear leaking because of personnel's visual fatigue and examine, deuterogamy laser generator and laser camera lens, can automatic reading mistake document will leak fast and beat and the hole that blocks up mends the hole, this equipment practices thrift the human cost, effectively improves the production efficiency of product, reduce the risk that leads to because of artifical leaking examining, bring the facility for the production operation.
Description
Technical Field
The utility model relates to a ceramic substrate field technique especially indicates a high-speed automatic laser hole inspection machine of ceramic substrate.
Background
When the DPC ceramic substrate is punched by laser, ten thousand holes with the inner diameter smaller than 0.1mm need to be punched on one 120mm multiplied by 120mm plate, and the holes are not punched due to light emitting problem in the processing process, so that the holes are few; after laser processing, slag also exists around the through hole, and part of the through hole is blocked in the slag removing process, so that the subsequent process is influenced, and poor functionality is generated.
At present, most of holes are manually checked under a microscope, the efficiency of a manual checking mode is very low, the holes are possibly missed, the holes need to be repaired through secondary manual point finding after the holes are checked, the products with the holes need to be perforated through steel needles, and the steel needles are easily blocked in the holes due to the fact that the hole diameters are too small, so that the holes are blocked. Meanwhile, the hole inspection equipment in the prior art can only detect the through holes but not the through holes, or can only inspect larger holes, so that the use requirement can not be met. Therefore, there is a need to develop a solution to the above problems.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a high-speed automatic laser hole inspection machine for ceramic substrates, which can automatically inspect holes and through holes, thereby effectively improving the production efficiency.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a high-speed automatic laser hole inspection machine for ceramic substrates comprises a rack, an industrial personal computer, a laser generator, an X-axis motion platform, a Y-axis motion platform, a material loading clamp, a material loading device, a material unloading device, a material loading mechanical arm, a material unloading mechanical arm, an AOI camera and a laser lens, wherein the industrial personal computer, the laser generator, the X-axis motion platform, the material loading device, the material unloading mechanical arm, the AOI camera and the laser lens are all arranged on the rack;
the Y-axis motion platform is arranged on the X-axis motion platform, and the X-axis motion platform drives the Y-axis motion platform to move back and forth along the X-axis direction; the material loading clamp is arranged on the Y-axis moving platform, and the Y-axis moving platform drives the material loading clamp to move back and forth along the Y-axis direction;
the feeding device and the discharging device are positioned on one side of the X-axis motion platform and are arranged at intervals along the X-axis direction, and the feeding manipulator and the discharging manipulator are respectively positioned on the sides of the feeding device and the discharging device;
the AOI camera and the laser lens are positioned on the other side of the X-axis motion platform and are arranged at intervals along the X-axis direction, and the laser lens is connected with a laser generator.
As a preferred scheme, the top of the rack is provided with a marble main body, the industrial personal computer and the laser generator are both positioned below the marble main body, and the X-axis motion platform, the feeding device, the discharging device, the feeding manipulator, the discharging manipulator, the AOI camera and the laser lens are all positioned on the marble main body.
Preferably, a plurality of shock absorbers are arranged at the bottom of the frame.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
through utilizing the industrial computer to control the AOI camera, but automated inspection leak hole position (need not be through artifical point of looking for) generation mistake document, it promotes 400% to examine hole efficiency, can not appear leaking because of personnel's visual fatigue and examine, deuterogamy laser generator and laser camera lens, can automatic reading mistake document will leak fast and beat and the hole that blocks up mends the hole, this equipment practices thrift the human cost, effectively improves the production efficiency of product, reduce the risk that leads to because of artifical leaking examining, bring the facility for the production operation.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 is a schematic structural diagram of a preferred embodiment of the present invention.
The attached drawings indicate the following:
1. shock absorber 2 and frame
3. Marble body 4 and industrial personal computer
5. Laser generator 6, Y-axis motion platform
7. Loading device 8 and loading manipulator
9. X-axis motion platform 10 and material loading clamp
11. Blanking manipulator 12 and AOI camera
13. A laser lens 14 and a feeder.
Detailed Description
Referring to fig. 1, a detailed structure of a preferred embodiment of the present invention is shown, which includes a frame 2, an industrial personal computer 4, a laser generator 5, an X-axis motion platform 9, a Y-axis motion platform 6, a material loading clamp 10, a material loading device 7, a material unloading device 14, a material loading manipulator 8, a material unloading manipulator 11, an AOI camera 12, and a laser lens 13.
The industrial personal computer 4, the laser generator 5, the X-axis motion platform 9, the feeding device 7, the discharging device 14, the feeding manipulator 8, the discharging manipulator 11, the AOI camera 12 and the laser lens 13 are all arranged on the rack 2, and the laser generator 5, the X-axis motion platform 9, the Y-axis motion platform 6, the feeding device 7, the discharging device 14, the feeding manipulator 8, the discharging manipulator 11 and the AOI camera 12 are all connected with the industrial personal computer 4.
The Y-axis motion platform 6 is arranged on the X-axis motion platform 9, and the X-axis motion platform 9 drives the Y-axis motion platform 6 to move back and forth along the X-axis direction; the material loading clamp 10 is arranged on the Y-axis moving platform 6, and the Y-axis moving platform 6 drives the material loading clamp 10 to move back and forth along the Y-axis direction.
The loading device 7 and the unloading device 14 are arranged on one side of the X-axis moving platform 9 at intervals along the X-axis direction, and the loading manipulator 8 and the unloading manipulator 11 are respectively arranged on the sides of the loading device 7 and the unloading device 14.
The AOI camera 12 and the laser lens 13 are positioned on the other side of the X-axis moving platform 9 and are arranged at intervals along the X-axis direction, and the laser lens 13 is connected with the laser generator 5.
In this embodiment, the top of the rack 2 has a marble body 3, the industrial personal computer 4 and the laser generator 5 are both located below the marble body 3, and the X-axis motion platform 9, the loader 7, the unloader 14, the loading manipulator 8, the unloading manipulator 11, the AOI camera 12 and the laser lens 13 are all located on the marble body 3; and, a plurality of shock absorbers 1 are provided at the bottom of the frame 2.
Detailed description the working principle of the present embodiment is as follows:
firstly, a set CAD standard drawing file is stored in an industrial personal computer 4, a ceramic substrate to be detected is manually placed in a loading device 7, then the industrial personal computer 4 controls an X-axis motion platform 9 and a Y-axis motion platform 6 to work, so that a loading clamp 10 is moved to a loading position, then the industrial personal computer 4 controls a loading manipulator 8 to place the ceramic substrate on the loading clamp 10, the loading clamp 10 clamps the ceramic substrate, then the industrial personal computer 4 controls the X-axis motion platform 9 and the Y-axis motion platform 6 to work, so that the ceramic substrate moves below an AOI camera 12 along with the loading clamp 10, the industrial personal computer 4 transmits a command to the AOI camera 12 to scan the position to be detected of the ceramic substrate, the I camera 12 transmits a scanning result back to the industrial personal computer 4, the industrial personal computer 4 automatically compares with the CAD drawing file of the original drawing file, and if the position of an original hole or a leakage hole is changed into an AOI layer; then, the industrial personal computer 4 controls the X-axis motion platform 9 and the Y-axis motion platform 6 to work, so that the ceramic substrate moves to the position below the laser lens 13 along with the material loading clamp 10, the industrial personal computer 4 runs a wrong layer with a wrong AOI, the laser generator 5 and the laser lens 13 are matched to receive commands to perform laser processing on a hole plugging position and a hole leaking position for one time, after the processing is completed, the industrial personal computer 4 controls the X-axis motion platform 9 and the Y-axis motion platform 6 to work, so that the ceramic substrate moves to a discharging position along with the material loading clamp 10, and the ceramic substrate of the discharging manipulator 11 moves into the discharging device 14 to complete one-time operation.
The utility model discloses a design focus lies in: through utilizing the industrial computer to control the AOI camera, but automated inspection leak hole position (need not be through artifical point of looking for) generation mistake document, it promotes 400% to examine hole efficiency, can not appear leaking because of personnel's visual fatigue and examine, deuterogamy laser generator and laser camera lens, can automatic reading mistake document will leak fast and beat and the hole that blocks up mends the hole, this equipment practices thrift the human cost, effectively improves the production efficiency of product, reduce the risk that leads to because of artifical leaking examining, bring the facility for the production operation.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (3)
1. The high-speed automatic laser hole inspection machine for the ceramic substrate is characterized in that: the industrial personal computer, the laser generator, the X-axis motion platform, the Y-axis motion platform, the material loading clamp, the material loading device, the material unloading device, the material loading mechanical arm, the material unloading mechanical arm, the AOI camera and the laser lens are all arranged on the rack, and the laser generator, the X-axis motion platform, the Y-axis motion platform, the material loading device, the material unloading device, the material loading mechanical arm, the material unloading mechanical arm and the laser lens are all connected with the industrial personal computer;
the Y-axis motion platform is arranged on the X-axis motion platform, and the X-axis motion platform drives the Y-axis motion platform to move back and forth along the X-axis direction; the material loading clamp is arranged on the Y-axis moving platform, and the Y-axis moving platform drives the material loading clamp to move back and forth along the Y-axis direction;
the feeding device and the discharging device are positioned on one side of the X-axis motion platform and are arranged at intervals along the X-axis direction, and the feeding manipulator and the discharging manipulator are respectively positioned on the sides of the feeding device and the discharging device;
the AOI camera and the laser lens are positioned on the other side of the X-axis motion platform and are arranged at intervals along the X-axis direction, and the laser lens is connected with a laser generator.
2. The high-speed automatic laser hole inspection machine for the ceramic substrate according to claim 1, wherein: the top of frame has a marble main part, and this industrial computer and laser generator all are located the below of marble main part, and this X axle motion platform, material loading ware, unloading ware, material loading manipulator, unloading manipulator, AOI camera and laser lens all are located the marble main part.
3. The high-speed automatic laser hole inspection machine for the ceramic substrate according to claim 1, wherein: the bottom of frame is provided with a plurality of bumper shock absorbers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022912918.7U CN213933642U (en) | 2020-12-08 | 2020-12-08 | High-speed automatic laser hole inspection machine for ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022912918.7U CN213933642U (en) | 2020-12-08 | 2020-12-08 | High-speed automatic laser hole inspection machine for ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213933642U true CN213933642U (en) | 2021-08-10 |
Family
ID=77149364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022912918.7U Active CN213933642U (en) | 2020-12-08 | 2020-12-08 | High-speed automatic laser hole inspection machine for ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213933642U (en) |
-
2020
- 2020-12-08 CN CN202022912918.7U patent/CN213933642U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 516000 No.3, Lvlin North Road, Liuwu management area, Yuanzhou Town, BOLUO County, Huizhou City, Guangdong Province Patentee after: Huizhou Xinci Semiconductor Co.,Ltd. Address before: 516000 No. 3, Greenland North Road, Liuwu management area, Yuanzhou Town, BOLUO County, Dongguan City, Guangdong Province Patentee before: Huizhou Xinci Semiconductor Co.,Ltd. |