CN213907023U - Flexible circuit board with novel heat radiation structure - Google Patents
Flexible circuit board with novel heat radiation structure Download PDFInfo
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- CN213907023U CN213907023U CN202022851295.7U CN202022851295U CN213907023U CN 213907023 U CN213907023 U CN 213907023U CN 202022851295 U CN202022851295 U CN 202022851295U CN 213907023 U CN213907023 U CN 213907023U
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- circuit board
- adapter
- heat dissipation
- plate
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Abstract
The utility model discloses a flexible line way board with novel heat radiation structure, including the circuit board main part, the one end fixed surface of circuit board main part is connected with the heating panel, the one end fixed mounting of circuit board main part has first adapter, the fixed surface of first adapter installs first adapter golden finger, the other end fixed mounting of circuit board main part has the second adapter. A flexible line way board with novel heat radiation structure, through the heat absorbing plate structure that sets up, can evenly effectively conduct the heat that the circuit board produced to dispel the heat through the louvre, conveniently carry out quick absorption to the heat, thereby cooperate other devices to accomplish the operation of falling hot, through the water-cooling structure that sets up, can reach quick cooling's purpose through the hydrologic cycle cooling, contrast natural cooling can make the circuit board keep at suitable operating temperature for a long time, thereby prolong the life of circuit board.
Description
Technical Field
The utility model relates to a flexible line way board technical field, in particular to flexible line way board with novel heat radiation structure.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the advantages that many rigid printed circuit boards do not have, such as the characteristics of high wiring density, light weight, thin thickness and good bending property, the flexible printed circuit board has high space utilization rate, is flexibly arranged and is suitable for digital equipment with narrow space, but the flexible printed circuit board has poor heat dissipation performance, and when the flexible printed circuit board is arranged in the narrow space of the digital equipment, the generated heat affects components inside the equipment, so that the flexible printed circuit board with a heat dissipation structure is currently available in the market; the existing flexible circuit board with the heat dissipation structure has certain defects when in use, the heat dissipation structure can not conduct heat quickly, and the internal heat dissipation devices can not be matched with each other, so that a good heat dissipation effect can not be achieved.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a flexible line way board with novel heat radiation structure, can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a flexible circuit board with a novel heat dissipation structure comprises a circuit board main body, wherein a heat dissipation plate is fixedly connected to the surface of one end of the circuit board main body, a first adapter is fixedly mounted at one end of the circuit board main body, a first adapter golden finger is fixedly mounted on the surface of the first adapter, a second adapter is fixedly mounted at the other end of the circuit board main body, a second adapter golden finger is fixedly mounted on the surface of the second adapter, a clamping groove is fixedly formed in the surface of one end of the heat dissipation plate, a butt joint screw rod is fixedly mounted in the clamping groove, fixing bolts are fixedly mounted at two ends of the butt joint screw rod, the heat dissipation plate is fixedly connected with the circuit board main body through the clamping groove, the butt joint screw rod, the fixing bolts, the second adapter and the second adapter golden finger, a first heat dissipation layer is fixedly mounted in the position, close to the fixing bolts, in the interior of the heat dissipation plate, the surface of the upper end inside the heat dissipation plate is fixedly provided with a water cooling plate, and the inside of the heat dissipation plate is fixedly provided with a heat absorption plate.
Preferably, the surface of the first heat dissipation layer is fixedly provided with a first heat dissipation hole, the bottom surface of the interior of the heat dissipation plate is fixedly provided with a second heat dissipation layer, and the surface of the second heat dissipation layer is fixedly provided with a second heat dissipation hole.
Preferably, the two ends of the water cooling plate are fixedly provided with fixed joints, the surface of the water cooling plate is fixedly provided with a circulating pump, one end of the circulating pump is fixedly connected with a water cooling pipe, and the water cooling plate is fixedly connected with the heat dissipation plate through the fixed joints.
Preferably, the surface of the heat absorbing plate is fixedly provided with an insulating plate, and the surface of the insulating plate is fixedly provided with air holes.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses in, through the heat absorption plate structure that sets up, can carry out even effective conduction to the heat that the circuit board produced to dispel the heat through the louvre, conveniently absorb the heat fast, thereby cooperate other devices to accomplish the operation of falling hot, through the water-cooling structure that sets up, can reach rapid cooling's purpose through the hydrologic cycle cooling, contrast natural cooling can make the circuit board keep at suitable operating temperature for a long time, thereby prolong the life of circuit board.
Drawings
Fig. 1 is a schematic diagram of a main structure of a flexible printed circuit board with a novel heat dissipation structure according to the present invention;
fig. 2 is a schematic diagram of an internal structure of a heat dissipating plate of a flexible printed circuit board with a novel heat dissipating structure according to the present invention;
fig. 3 is a schematic diagram of a water-cooling plate structure of a flexible printed circuit board with a novel heat dissipation structure according to the present invention;
fig. 4 is a schematic structural view of the heat absorbing plate of the flexible printed circuit board with the novel heat dissipating structure of the present invention.
In the figure: 1. a circuit board main body; 101. a first adapter; 102. a first adapter goldfinger; 103. a second adapter; 104. a second adapter golden finger; 2. a heat dissipation plate; 201. a clamping groove; 202. butting a screw rod; 203. fixing the bolt; 3. a first heat dissipation layer; 301. a first heat dissipation hole; 302. a second heat dissipation layer; 303. a second heat dissipation hole; 4. a water-cooling plate; 401. fixing the joint; 402. a circulation pump; 403. a water-cooled tube; 5. a heat absorbing plate; 501. an insulating plate; 502. and (4) air holes.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a flexible circuit board with a novel heat dissipation structure includes a circuit board main body 1, a heat dissipation plate 2 is fixedly connected to a surface of one end of the circuit board main body 1, a first adapter 101 is fixedly mounted at one end of the circuit board main body 1, a first adapter golden finger 102 is fixedly mounted on a surface of the first adapter 101, a second adapter 103 is fixedly mounted at the other end of the circuit board main body 1, and a second adapter golden finger 104 is fixedly mounted on a surface of the second adapter 103; a clamping groove 201 is fixedly formed in the surface of one end of the heat dissipation plate 2, a butt joint screw 202 is fixedly installed inside the clamping groove 201, fixing bolts 203 are fixedly installed at two ends of the butt joint screw 202, the heat dissipation plate 2 is fixedly connected with the circuit board main body 1 through the clamping groove 201, the butt joint screw 202, the fixing bolts 203, the second adapter 103 and the second adapter golden fingers 104, a first heat dissipation layer 3 is fixedly installed in the position, close to the fixing bolts 203, inside the heat dissipation plate 2, a water cooling plate 4 is fixedly installed on the surface of the upper end inside the heat dissipation plate 2, and a heat absorption plate 5 is fixedly installed inside the heat dissipation plate 2;
the surface of the first heat dissipation layer 3 is fixedly provided with a first heat dissipation hole 301, the bottom surface inside the heat dissipation plate 2 is fixedly provided with a second heat dissipation layer 302, the surface of the second heat dissipation layer 302 is fixedly provided with a second heat dissipation hole 303, when the circuit board is used, the first adapter 101 of the circuit board main body 1 is in butt joint with other devices, then the second adapter 103 and the second adapter golden finger 104 on the surface of the second adapter 103 are connected with the heat dissipation plate 2, the first heat dissipation hole 301 in the first heat dissipation layer 3 can conduct heat conduction and heat dissipation horizontally and conveniently, and the second heat dissipation hole 303 in the second heat dissipation layer 302 can conduct heat conduction and heat dissipation in the upper and lower spaces; the two ends of the water cooling plate 4 are fixedly provided with fixed joints 401, the surface of the water cooling plate 4 is fixedly provided with a circulating pump 402, one end of the circulating pump 402 is fixedly connected with a water cooling pipe 403, and the water cooling plate 4 is fixedly connected with the heat dissipation plate 2 through the fixed joints 401; the fixed surface of absorber plate 5 installs insulation plate 501, insulation plate 501's fixed surface has seted up bleeder vent 502, the heat of absorbing coming can make the inside temperature rise gradually of heating panel 2, can start circulating pump 402 on the water-cooling board 4, thereby make water circulate and cool down in water-cooling pipe 403 operation, when the heat conduction effect is not good, absorber plate 5 can see through insulation plate 501 and carry out the heat conduction of heat absorption to centre gripping groove 201, and go out through bleeder vent 502 uniform heat dissipation.
It should be noted that the utility model is a flexible circuit board with a novel heat dissipation structure, when in use, the first adapter 101 of the circuit board body 1 is butted with other devices, and then the second adapter 103 and the second adapter golden finger 104 on the surface are connected with the heat dissipation plate 2, in the holding groove 201, the butt screw 202 and the fixing bolt 203 are used to fix the heat sink, the first heat dissipation hole 301 in the first heat dissipation layer 3 can conduct heat conduction and dissipation horizontally and conveniently, the second heat dissipation hole 303 in the second heat dissipation layer 302 can conduct heat conduction and dissipation in the upper and lower spaces, the absorbed heat can gradually raise the temperature inside the heat dissipation plate 2, the circulating pump 402 on the water cooling plate 4 can be started, therefore, water is circulated and cooled in the water cooling pipe 403, and when the heat conduction effect is poor, the heat absorption plate 5 absorbs heat and conducts heat to the clamping groove 201 through the insulating plate 501, and the heat is uniformly dissipated through the air holes 502.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. The utility model provides a flexible line way board with novel heat radiation structure which characterized in that: including circuit board main part (1), the one end fixed surface of circuit board main part (1) is connected with heating panel (2), the one end fixed mounting of circuit board main part (1) has first adapter (101), the fixed surface of first adapter (101) installs first adapter golden finger (102), the other end fixed mounting of circuit board main part (1) has second adapter (103), the fixed surface of second adapter (103) installs second adapter golden finger (104), centre gripping groove (201) have been seted up to the one end fixed surface of heating panel (2), the inside fixed mounting of centre gripping groove (201) has butt joint screw rod (202), the both ends fixed mounting of butt joint screw rod (202) has fixing bolt (203), heating panel (2) are through centre gripping groove (201), butt joint screw rod (202), fixing bolt (203), Second adapter (103) and second adapter golden finger (104) and circuit board main part (1) fixed connection, the inside of heating panel (2) is close to fixing bolt (203) fixed mounting and has first heat dissipation layer (3), the inside upper end fixed surface of heating panel (2) installs water-cooling plate (4), the inside fixed mounting of heating panel (2) has absorber plate (5).
2. The flexible circuit board with the novel heat dissipation structure as claimed in claim 1, wherein: the surface fixing of first heat dissipation layer (3) has seted up first louvre (301), the inside bottom surface fixing of heating panel (2) has second heat dissipation layer (302), second louvre (303) have been seted up to the surface fixing of second heat dissipation layer (302).
3. The flexible circuit board with the novel heat dissipation structure as claimed in claim 1, wherein: the water-cooling plate is characterized in that fixed joints (401) are fixedly mounted at two ends of the water-cooling plate (4), a circulating pump (402) is fixedly mounted on the surface of the water-cooling plate (4), a water-cooling pipe (403) is fixedly connected to one end of the circulating pump (402), and the water-cooling plate (4) is fixedly connected with the heat dissipation plate (2) through the fixed joints (401).
4. The flexible circuit board with the novel heat dissipation structure as claimed in claim 1, wherein: the surface of the heat absorbing plate (5) is fixedly provided with an insulating plate (501), and the surface of the insulating plate (501) is fixedly provided with air holes (502).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022851295.7U CN213907023U (en) | 2020-12-01 | 2020-12-01 | Flexible circuit board with novel heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022851295.7U CN213907023U (en) | 2020-12-01 | 2020-12-01 | Flexible circuit board with novel heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213907023U true CN213907023U (en) | 2021-08-06 |
Family
ID=77099913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022851295.7U Active CN213907023U (en) | 2020-12-01 | 2020-12-01 | Flexible circuit board with novel heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213907023U (en) |
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2020
- 2020-12-01 CN CN202022851295.7U patent/CN213907023U/en active Active
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