CN213906938U

CN213906938U - MEMS microphone and electronic device

Info

Publication number: CN213906938U
Application number: CN202023086124.6U
Authority: CN
Inventors: 石杰; 王顺; 金龙
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2020-12-17
Filing date: 2020-12-17
Publication date: 2021-08-06
Anticipated expiration: 2030-12-17

Abstract

The utility model discloses a MEMS microphone and electronic device, the MEMS microphone includes shell and at least two MEMS chips; at least two packaging cavities are constructed in the shell, a sound inlet hole is formed in the side wall of each packaging cavity, and a PCB is further arranged on the shell; the two MEMS chips are respectively arranged in the two packaging cavities and are electrically connected with the PCB on the shell, and each MEMS chip corresponds to the sound inlet hole of the packaging cavity where the MEMS chip is arranged. The utility model discloses a MEMS microphone can increase MEMS microphone's SNR, enlarges the scope that MEMS microphone received sound, and then makes MEMS microphone applicable in remote scene on a large scale, improves MEMS microphone's suitability.

Description

MEMS microphone and electronic device

Technical Field

The utility model relates to a microphone technical field, in particular to MEMS microphone and electron device.

Background

Micro Electro Mechanical System (Micro Electro Mechanical System) microphones (abbreviated as MEMS microphones) are commonly applied to electronic devices as acoustic-electric conversion devices. However, the conventional MEMS microphone is usually configured with only one MEMS chip for sensing sound, which makes the signal-to-noise ratio of the MEMS microphone poor, and thus the MEMS microphone can only be applied to a short-distance and small-range scene.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a MEMS microphone aims at increasing MEMS microphone's SNR to enlarge MEMS microphone and receive the scope of sound, and then make MEMS microphone applicable in the long-range scene on a large scale, improve MEMS microphone's suitability.

To achieve the above object, the present invention provides a MEMS microphone, which includes a housing and at least two MEMS chips; at least two packaging cavities are constructed in the shell, a sound inlet hole is formed in the side wall of each packaging cavity, and a PCB is arranged on the shell; the two MEMS chips are respectively arranged in the two packaging cavities and are electrically connected with the PCB on the shell, and each MEMS chip corresponds to the sound inlet hole of the packaging cavity where the MEMS chip is arranged.

Optionally, the two packaging cavities are respectively a first packaging cavity and a second packaging cavity; the side wall of the first packaging cavity, which is back to the second packaging cavity, is provided with a first sound inlet hole; and a second sound inlet hole is formed in the side wall of the second packaging cavity, which is back to the first packaging cavity.

Optionally, the housing includes a first PCB, a second PCB, and a third PCB disposed between layers; wherein: the first packaging cavity is formed between the first PCB and the second PCB, and the first PCB is provided with the first sound inlet; the second packaging cavity is formed between the second PCB and the third PCB, and the third PCB is provided with the second sound inlet hole.

Optionally, the MEMS chip disposed in the first package cavity is a first MEMS chip, and the first MEMS chip is mounted on an inner side surface of the first PCB and covers the first sound inlet hole.

Optionally, the MEMS chip disposed in the second package cavity is a second MEMS chip, and the second MEMS chip is mounted on an inner side surface of the third PCB and covers the second sound inlet hole.

Optionally, the MEMS microphone further includes an ASIC chip, and the ASIC chip is mounted on the first PCB and electrically connected to the first MEMS chip.

Optionally, the MEMS microphone further includes a conductor connector, where the conductor connector passes through the second PCB and electrically connects the first PCB and the third PCB.

Optionally, the conductor connection is a metal piece; or, the conductor connecting piece is a PCB board for connecting the first PCB board and the third PCB board.

Optionally, the housing further includes a fourth PCB and a fifth PCB that are disposed opposite to each other, and the fourth PCB and the fifth PCB are respectively disposed at two ends of the second PCB and connected to the first PCB and the third PCB.

The utility model also provides an electronic device, electronic device includes electron device body and MEMS microphone, the MEMS microphone install in this is internal for the electron device. The MEMS microphone comprises a shell and at least two MEMS chips; at least two packaging cavities are constructed in the shell, and a sound inlet hole is formed in the side wall of each packaging cavity; the two MEMS chips are respectively arranged in the two packaging cavities, and each MEMS chip corresponds to the sound inlet of the packaging cavity where the MEMS chip is located.

The technical scheme of the utility model, through two at least encapsulation chambeies of shell internal construction at the MEMS microphone, each sound inlet hole has been seted up on the lateral wall of encapsulation chamber, and will two the MEMS chip disposes respectively two the encapsulation intracavity, each the MEMS chip corresponds with the sound inlet hole of the encapsulation chamber at its place to two MEMS chip cooperation responses sound from equidirectional response, effectively increases the SNR of MEMS microphone, and then makes the applicable scene on a long distance on a large scale of MEMS microphone, improves the suitability of MEMS microphone.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of the MEMS microphone of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Outer casing	210	A first MEMS chip
110	First PCB board	220	Second MEMS chip
				120	Second PCB board	300	ASIC chip
130	Third PCB board	101	A first packaging cavity
				140	Fourth PCB board	102	Second packaging cavity
150	Fifth PCB board	103	First sound inlet
				200	MEMS chip	104	Second sound inlet

The purpose of the present invention is to provide a novel and improved method and apparatus for operating a computer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only one embodiment of the present invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1, the present invention provides a MEMS microphone, which is a high-performance directional dual MEMS microphone, and the MEMS microphone can increase the signal-to-noise ratio of the MEMS microphone and enlarge the range of the MEMS microphone for receiving sound, so that the MEMS microphone is suitable for a large-range remote scene, and the applicability of the MEMS microphone is improved. The MEMS microphone can be applied to electronic devices, and the electronic devices can be electronic equipment such as mobile phones, flat panels, notebook computers, sensors and the like.

Referring to fig. 1, in an embodiment of the MEMS microphone of the present invention, the MEMS microphone includes a housing 100 and at least two MEMS chips 200; at least two packaging cavities (namely a first packaging cavity 101 and a second packaging cavity 102) are constructed in the shell 100, sound inlet holes (namely a first sound inlet hole 103 and a second sound inlet hole 104) are formed in the side wall of each packaging cavity, and the shell 100 comprises PCBs (such as a first PCB to a fifth PCB); the two MEMS chips 200 are respectively configured in the two packaging cavities, and each MEMS chip 200 corresponds to the sound inlet of the packaging cavity where the MEMS chip is located.

Specifically, the housing 100 includes a PCB board with circuitry integrated thereon. The number of the PCB boards can be reasonably configured according to requirements. For example, the MEMS microphone is configured with a PCB board electrically connected to the MEMS chip 200 in each package cavity. Alternatively, in other embodiments, both MEMS chips 200 are electrically connected to the same PCB board, as described in more detail below.

For convenience of explanation, the two enclosures are herein respectively designated as a first enclosure 101 and a second enclosure 102; the two sound inlet holes are respectively a first sound inlet hole 103 and a second sound inlet hole 104, wherein the first sound inlet hole 103 is arranged on the side wall of the first packaging cavity 101, and the second sound inlet hole 104 is arranged on the side wall of the second packaging cavity 102; of the two MEMS chips 200, the MEMS chip 200 disposed in the first packaging chamber 101 is a first MEMS chip 210, and the MEMS chip 200 disposed in the second packaging chamber 102 is a second MEMS chip 220.

When the MEMS microphone is operated, the first MEMS chip 210 is configured to sense sound transmitted from the first sound inlet hole 103 and convert the sensed sound into an electrical signal; the second MEMS chip 220 is used to sense sound incoming from the second sound inlet hole 104 and convert the sensed sound into an electrical signal. That is, the two MEMS chips 200 sense sound from two different directions (sound entrance directions of the two sound entrance holes), respectively.

The technical scheme of the utility model, through two at least encapsulation chambeies of 100 internal constructions at the shell of MEMS microphone, each sound inlet hole has been seted up on the lateral wall of encapsulation chamber, and will two MEMS chip 200 disposes two respectively the encapsulation intracavity, each the sound inlet hole of the encapsulation chamber at MEMS chip 200 rather than place corresponds to two MEMS chip 200 cooperation senses sound from different directions, effectively increases the SNR of MEMS microphone to enlarge the scope that the MEMS microphone received sound, thereby make the MEMS microphone applicable in long-distance scene on a large scale, and then improve the suitability of MEMS microphone.

Referring to fig. 1, in an embodiment, two of the package cavities are a first package cavity 101 and a second package cavity 102; the first packaging cavity 101 is provided with a first sound inlet hole 103 on the side wall back to the second packaging cavity 102; the second enclosure 102 is provided with a second sound inlet aperture 104 in its side wall facing away from the first enclosure 101.

Specifically, the first sound inlet hole 103 of the first enclosure 101 is opened in a direction back to the second enclosure 102; the second sound inlet hole 104 of the second packaging cavity 102 is opened in a direction back to the first packaging cavity 101, so that the MEMS microphone senses sound from two back to back directions, the range of sensing sound by the MEMS microphone is wider, the MEMS microphone is applicable to long-distance and large-range scenes, and the applicability of the MEMS microphone is improved.

Further, the housing 100 includes a first PCB 110, a second PCB 120, and a third PCB 130 disposed between layers; wherein: a first packaging cavity 101 is formed between the first PCB 110 and the second PCB 120, and the first PCB 110 is provided with a first sound inlet hole 103; a second packaging cavity 102 is formed between the second PCB 120 and the third PCB 130, and a second sound inlet 104 is formed in the third PCB 130.

Specifically, the first PCB 110, the second PCB 120, and the third PCB 130 are sequentially spaced from bottom to top, so that the three PCBs are disposed in layers along the top and bottom directions. Wherein, a first packaging cavity 101 is spaced between the first PCB 110 and the second PCB 120; a second enclosure 102 spaced between the second PCB 120 and a third PCB 130.

Theoretically, the first PCB 110 and the second PCB 120 are located at the upper and lower sides of the first package cavity 101, and the first MEMS chip 210 may be mounted on the first PCB 110 or the second PCB 120. Specifically, in this embodiment, the first MEMS chip 210 is mounted on the inner side surface of the first PCB 110, and covers the first sound inlet hole 103, so that the sound transmitted from the first sound inlet hole 103 is directly transmitted to the diaphragm of the first MEMS chip 210 from the back cavity of the first MEMS chip 210, and the first MEMS chip 210 rapidly senses the sound.

Similarly, the MEMS chip 200 disposed in the second packaging cavity 102 is a second MEMS chip 220, and the second MEMS chip 220 is mounted on the inner side of the third PCB 130 and covers the second sound inlet hole 104. The second MEMS chip 220 is symmetrical to the first MEMS chip 210 in the up-down direction with respect to the second PCB 120. The sound coming from the second sound inlet hole 104 is directly transmitted from the back cavity of the second MEMS chip 220 to the diaphragm of the second MEMS chip 220, so that the second MEMS chip 220 senses the sound quickly.

Referring to fig. 1, in an embodiment, the MEMS microphone further includes an ASIC chip 300, and the ASIC chip 300 is mounted on the first PCB 110 and electrically connected to the first MEMS chip 210. Specifically, the ASIC chip 300 is electrically connected to the first MEMS chip 210 through a metal wire. The first MEMS chip 210 senses sound coming from the first sound inlet hole 103, converts the sound into an electrical signal and sends the electrical signal to the ASIC chip 300, and the ASIC chip 300 processes the electrical signal received by the ASIC chip and sends the electrical signal to the first PCB 110 through a circuit for processing.

Further, the MEMS microphone further includes a conductor connector 400, and the conductor connector 400 passes through the second PCB 120 and electrically connects the first PCB 110 and the third PCB 130. Specifically, the conductor connector 400 is disposed in a column shape, the conductor connector 400 passes through the second PCB 120, the upper end of the conductor connector 400 is connected to the third PCB 130, and the lower end of the conductor connector 400 is connected to the first PCB 110.

It is understood that the conductor connection member 400 serves as a conductive circuit to communicate the circuits of the first PCB 110 and the third PCB 130 to achieve signal transmission between the first PCB 110 and the third PCB 130. That is, the second MEMS chip 220 is electrically connected to the first PCB 110 through the third PCB 130 and the conductor connector 400, so that the second MEMS chip 220 and the first MEMS chip 210 share the same ASIC chip 300, thereby reducing the number of ASIC chips 300 and saving the component cost.

Of course, in other embodiments, an ASIC chip 300 electrically connected to the second MEMS chip 220 may be disposed on the third PCB 130 without considering the cost.

It should be noted that the conductor connector 400 should be made of an electrically conductive material, so that the conductor connector 400 has an electrical conductivity, thereby ensuring that the conductor connector 400 can conduct an electrical circuit and transmit signals between the first PCB 110 and the third PCB 130. Alternatively, the conductor connector 400 may be a metal member, such as a copper material, or a copper alloy material, etc. In other embodiments, the conductor connector 400 may also be a PCB connecting the first PCB 110 and the third PCB 130, and the PCB may be a PCB additionally disposed in the package cavity 201, and may also be a fourth PCB 140 or a fifth PCB 150 (see the following description in detail) of the housing 100.

Referring to fig. 1, based on any of the above embodiments, the housing 100 further includes a fourth PCB 140 and a fifth PCB 150 disposed oppositely, where the fourth PCB 140 and the fifth PCB 150 are respectively disposed at two ends of the second PCB 120 and connected to the first PCB 110 and the third PCB 130.

Specifically, the fourth PCB 140 and the fifth PCB 150 are disposed in a door frame shape, the fourth PCB 140 and the fifth PCB 150 cooperate to fix the first PCB 110, the second PCB 120 and the third PCB 130 therein, and the fourth PCB 140 and the fifth PCB 150 are hermetically connected to the PCBs in contact therewith, so that two package cavities with good sealing performance are formed inside the housing 100.

The utility model also provides an electronic device, which comprises an electronic device body and an MEMS microphone; wherein the MEMS microphone is mounted within the electronic device body. The specific structure of the MEMS microphone refers to the above embodiments, and since the electronic device adopts all the technical solutions of all the above embodiments, all the beneficial effects brought by the technical solutions of the above embodiments are also achieved, and are not described in detail herein. The electronic device can be a sensor, a mobile phone, a panel, a television, a notebook computer and other electronic equipment.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A MEMS microphone, comprising:

the sound-absorbing device comprises a shell, at least two packaging cavities are constructed in the shell, sound inlet holes are formed in the side wall of each packaging cavity, and the shell comprises a PCB (printed circuit board); and

the MEMS chips are respectively arranged in the two packaging cavities and are electrically connected with the PCB on the shell, and each MEMS chip corresponds to the sound inlet hole of the packaging cavity where the MEMS chip is located.

2. The MEMS microphone of claim 1, wherein two of the package cavities are a first package cavity and a second package cavity, respectively; wherein,

the side wall of the first packaging cavity back to the second packaging cavity is provided with a first sound inlet hole;

and a second sound inlet hole is formed in the side wall of the second packaging cavity, which is back to the first packaging cavity.

3. The MEMS microphone of claim 2, wherein the housing comprises a first PCB, a second PCB, and a third PCB disposed between layers; wherein:

the first packaging cavity is formed between the first PCB and the second PCB, and the first PCB is provided with the first sound inlet;

the second packaging cavity is formed between the second PCB and the third PCB, and the third PCB is provided with the second sound inlet hole.

4. The MEMS microphone of claim 3, wherein the MEMS chip disposed in the first package cavity is a first MEMS chip mounted to an inner side of the first PCB and covering the first sound inlet hole.

5. The MEMS microphone of claim 3, wherein the MEMS chip disposed in the second package cavity is a second MEMS chip mounted on an inner side of the third PCB and covering the second sound inlet hole.

6. The MEMS microphone of claim 4, further comprising an ASIC chip mounted to the first PCB board and electrically connected to the first MEMS chip.

7. The MEMS microphone of claim 6, further comprising a conductor connector passing through the second PCB and electrically connecting both the first PCB and the third PCB.

8. The MEMS microphone of claim 7, wherein the conductor connection is a metal piece; or, the conductor connecting piece is a PCB board for connecting the first PCB board and the third PCB board.

9. The MEMS microphone of any one of claims 3 to 7, wherein the housing further comprises a fourth PCB and a fifth PCB, which are disposed opposite to each other, and the fourth PCB and the fifth PCB are respectively disposed at two ends of the second PCB and connected to the first PCB and the third PCB.

10. An electronic device, comprising:

an electronic device body; and

the MEMS microphone of any one of claims 1-9, mounted within the electronic device body.