CN213905309U - High-efficient silicon chip scribbles source device - Google Patents
High-efficient silicon chip scribbles source device Download PDFInfo
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- CN213905309U CN213905309U CN202023307843.6U CN202023307843U CN213905309U CN 213905309 U CN213905309 U CN 213905309U CN 202023307843 U CN202023307843 U CN 202023307843U CN 213905309 U CN213905309 U CN 213905309U
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- brush
- silicon wafer
- box
- source device
- silicon chip
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Abstract
The utility model discloses a high-efficient silicon chip scribbles source device, the power distribution box comprises a box body, box one side top is provided with the mounting panel, the mounting panel top is provided with the motor, motor output shaft and screw rod fixed connection, the screw rod runs through the box, the cover is equipped with the slider on the screw rod, the slider below is provided with the cylinder, piston rod of the cylinder and brush roll fixed connection, the brush roll includes roller and brush, piston rod of the cylinder and roller fixed connection, the roller surface is provided with the brush, the inside bottom surface one end of box is provided with the stock solution bucket, the silicon chip fixed plate has been placed on stock solution bucket next door. The utility model discloses a combination of motor, cylinder and brush can realize the automatic process of scribbling the source, has not only improved efficiency, and has guaranteed the homogeneity of scribbling the source, raises the efficiency, reduces staff working strength, simple structure, and the practicality is strong.
Description
Technical Field
The utility model belongs to the technical field of semiconductor production facility technique and specifically relates to a source device is scribbled to high-efficient silicon chip.
Background
In the production process of semiconductor wafers, a blank surface coating source is needed before boron diffusion production, operations such as coating, baking, collecting and loading are needed before cleaned wafers are subjected to boron diffusion, at present, the coating source is mainly formed by that workers dip a diffusion source by using a writing brush and then fully coat the silicon wafers, the randomness of manually coating the source by using the writing brush is high, the control is not easy, the uniformity of the boron source on the surfaces of the wafers is influenced, the production efficiency is low, the quality is uncontrollable, and the quality of the wafers is influenced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above problems existing in the prior art, the utility model provides a following technical scheme.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a high-efficient silicon chip scribbles source device, includes the box, box one side top is provided with the mounting panel, the mounting panel top is provided with the motor, motor output shaft and screw rod fixed connection, the screw rod runs through the box, the cover is equipped with the slider on the screw rod, the slider below is provided with the cylinder, piston rod of the cylinder and brush roll fixed connection, the inside bottom surface one end of box is provided with the stock solution bucket, the silicon chip fixed plate has been placed on stock solution bucket next door.
In the efficient silicon wafer source coating device, the position where the screw rod is contacted with the box body is provided with the bearing.
The efficient silicon wafer source coating device is characterized in that the brush roll comprises a roll shaft and a brush, a cylinder piston rod is fixedly connected with the roll shaft, and the brush is arranged on the outer surface of the roll shaft.
According to the efficient silicon wafer source coating device, the fixing groove is formed in the upper surface of the silicon wafer fixing plate.
According to the efficient silicon wafer source coating device, the size of the fixing groove is the same as that of the silicon wafer.
The utility model has the advantages that the automatic source coating process can be realized by combining the motor, the cylinder and the brush, the efficiency is improved, and the uniformity of the source coating is ensured; through set up the fixed slot on the silicon chip fixed plate, can fix the silicon chip, liberate both hands, raise the efficiency, reduce staff working strength. The utility model discloses simple structure, the practicality is strong.
Drawings
The present invention will be further explained with reference to the drawings and examples.
FIG. 1 is a schematic view of the present invention;
fig. 2 is a top view of the silicon wafer fixing plate of the present invention.
In the figure, 1, a box body, 2, a sliding block, 3, a motor, 4, an installation plate, 5, an air cylinder, 6, a roll shaft, 7, a liquid storage barrel, 8, a brush, 9, a silicon wafer fixing plate, 10, a screw rod and 11, a fixing groove are arranged.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
[ example 1 ]
The utility model provides a source device is scribbled to high-efficient silicon chip, includes box 1, 1 one side top of box is provided with mounting panel 4, 4 tops of mounting panel are provided with motor 3, 3 output shafts of motor and screw rod 10 fixed connection, screw rod 10 runs through box 1, the cover is equipped with slider 2 on the screw rod 10, 2 belows of slider are provided with cylinder 5, cylinder 5 piston rod and brush roll fixed connection, 1 inside bottom surface one end of box is provided with stock solution bucket 7, silicon chip fixed plate 9 has been placed on stock solution bucket 7 next door.
Further, a bearing is arranged at the position where the screw 10 contacts the box body 1.
Further, the brush roller includes roller 6 and brush 8, 5 piston rods of cylinder and 6 fixed connections of roller, 6 surfaces of roller are provided with brush 8.
Further, the upper surface of the silicon wafer fixing plate 9 is provided with a fixing groove 11.
Further, the size of the fixing groove 11 is the same as the size of a silicon wafer.
Specifically, the utility model discloses during the use, place the fixed slot 11 with the silicon chip in, it is other to place liquid storage bucket 7 in box 1 with the silicon chip fixed plate of adorning the silicon chip, start cylinder 5, cylinder 5 pushes away brush 8 in liquid storage bucket 7, brush 8 dips in and gets after scribbling source liquid, cylinder 5 lifts up brush 8, motor 3 starts, drive brush 8 and move right, arrive silicon chip fixed plate 9 top, 5 restarts of cylinder push away brush 8 on silicon chip fixed plate 9, brush 8 scribbles the source to the silicon chip on silicon chip fixed plate 9, when reacing the silicon chip fixed plate 9 other end, cylinder 5 lifts up brush 8, motor 3 reverses and drives the brush and gets back to liquid storage bucket 7 top, and simultaneously, silicon chip fixed plate 9 after will scribbling the source completion is walked away, another silicon chip fixed plate 9 who will set the silicon chip is placed the relevant position, get into next circulation.
The above embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and the protection scope of the present invention is defined by the claims. Various modifications and equivalents of the invention can be made by those skilled in the art within the spirit and scope of the invention, and such modifications and equivalents should also be considered as falling within the scope of the invention.
Claims (5)
1. The utility model provides a source device is scribbled to high-efficient silicon chip, includes box (1), its characterized in that: the improved silicon wafer brush box is characterized in that a mounting plate (4) is arranged above one side of the box body (1), a motor (3) is arranged above the mounting plate (4), an output shaft of the motor (3) is fixedly connected with a screw rod (10), the screw rod (10) penetrates through the box body (1), a sliding block (2) is sleeved on the screw rod (10), an air cylinder (5) is arranged below the sliding block (2), a piston rod of the air cylinder (5) is fixedly connected with a brush roller, a liquid storage barrel (7) is arranged at one end of the inner bottom surface of the box body (1), and a silicon wafer fixing plate (9) is placed beside the liquid storage barrel (7).
2. The high-efficiency silicon wafer coating source device according to claim 1, wherein a bearing is arranged at the position where the screw (10) is contacted with the box body (1).
3. The high-efficiency silicon wafer coating source device according to claim 1, wherein the brush roller comprises a roller shaft (6) and a brush (8), a piston rod of the air cylinder (5) is fixedly connected with the roller shaft (6), and the brush (8) is arranged on the outer surface of the roller shaft (6).
4. The high-efficiency silicon wafer coating source device according to claim 1, wherein the upper surface of the silicon wafer fixing plate (9) is provided with fixing grooves (11).
5. The high-efficiency silicon wafer coating source device according to claim 4, wherein the size of the fixing groove (11) is the same as the size of a silicon wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023307843.6U CN213905309U (en) | 2020-12-31 | 2020-12-31 | High-efficient silicon chip scribbles source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023307843.6U CN213905309U (en) | 2020-12-31 | 2020-12-31 | High-efficient silicon chip scribbles source device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213905309U true CN213905309U (en) | 2021-08-06 |
Family
ID=77106918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023307843.6U Active CN213905309U (en) | 2020-12-31 | 2020-12-31 | High-efficient silicon chip scribbles source device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213905309U (en) |
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2020
- 2020-12-31 CN CN202023307843.6U patent/CN213905309U/en active Active
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