CN214043612U - Automatic source production line of scribbling of silicon chip - Google Patents
Automatic source production line of scribbling of silicon chip Download PDFInfo
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- CN214043612U CN214043612U CN202023300900.8U CN202023300900U CN214043612U CN 214043612 U CN214043612 U CN 214043612U CN 202023300900 U CN202023300900 U CN 202023300900U CN 214043612 U CN214043612 U CN 214043612U
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- silicon wafer
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Abstract
The utility model discloses an automatic source production line of scribbling of silicon chip, including conveying mechanism, scribble source mechanism and drying mechanism, it includes the cylinder to scribble source mechanism, the brush roll, the cylinder is fixed in scribbling source mechanism top, cylinder piston rod and brush roll fixed connection, conveying mechanism is located scribbles source mechanism the place ahead, the silicon chip fixed plate has been put to the conveying mechanism top, it is equipped with drying mechanism to scribble source mechanism right side, drying mechanism includes driven tooth, the bearing plate, the chain, the initiative tooth, driven tooth, the initiative tooth all is equipped with two, connect through the head rod between two initiative teeth, two driven teeth pass through the second connecting rod and connect, head rod one side and second motor output shaft fixed connection are kept away from to the initiative tooth, driven tooth is located drying mechanism top, driven tooth and initiative tooth surface are equipped with the chain, the fixed stationary blade that is equipped with on the chain, be equipped with the bearing plate on the stationary blade. The utility model discloses an automation of silicon chip is scribbled the source and is dried, has improved production efficiency, has guaranteed product quality, simple structure, and the practicality is strong.
Description
Technical Field
The utility model belongs to the technical field of semiconductor wafer production facility technique and specifically relates to an automatic source production line of scribbling of silicon chip.
Background
In the production process of semiconductor wafers, a blank surface coating source is needed before boron diffusion production, operations such as coating source, baking, collecting and loading are needed before cleaned wafers are subjected to boron diffusion, at present, the coating source is mainly characterized in that workers dip a diffusion source by using a writing brush and then fully coat the silicon wafers, the randomness of manually coating the source by using the writing brush is high, the control is not easy, the uniformity of the boron source on the surfaces of the wafers is influenced, the production efficiency is low, the quality is uncontrollable, and the quality of the wafers is influenced; in the prior art, after the coating is finished, the wafer needs to be manually taken out and then is conveyed to a drying device to be dried, and the efficiency is low.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above problems existing in the prior art, the utility model provides a following technical scheme.
The utility model provides a technical scheme that its technical problem adopted is: an automatic silicon wafer coating production line comprises a conveying mechanism, a coating mechanism and a drying mechanism, wherein the coating mechanism comprises an air cylinder and a brush roll, the air cylinder is fixed above the coating mechanism, an air cylinder piston rod is fixedly connected with the brush roll, the conveying mechanism is positioned in front of the coating mechanism, a silicon wafer fixing plate is placed above the conveying mechanism, the drying mechanism is arranged on the right side of the coating mechanism, the drying mechanism comprises driven teeth, a bearing plate, a chain and driving teeth, the driven teeth and the driving teeth are respectively provided with two numbers, the two driving teeth are connected through a first connecting rod, the two driven teeth are connected through a second connecting rod, one side of the driving teeth, far away from the first connecting rod, is fixedly connected with an output shaft of a second motor, the driven teeth are positioned above the drying mechanism, the surfaces of the driven teeth and the driving teeth are provided with the chain, and a fixing plate is fixedly arranged on the chain, and the fixed plate is provided with a bearing plate.
The automatic source production line of scribbling of foretell silicon chip, conveying mechanism includes conveyer belt, action wheel, follows the driving wheel, action wheel and first motor output shaft fixed connection, action wheel and follow driving wheel surface cover are equipped with the conveyer belt.
According to the automatic silicon wafer coating production line, the driving wheel and the driven wheel are fixed on the ground through the supporting rod.
According to the automatic source coating production line for the silicon wafers, the fixed grooves are formed in the surfaces of the silicon wafer fixing plates.
According to the automatic silicon wafer coating production line, one side, away from the second connecting rod, of the driven tooth is connected to the inner side wall of the drying mechanism through the first fixing rod, and a bearing is arranged at the joint of the first fixing rod and the inner side wall of the drying mechanism.
According to the automatic silicon wafer coating production line, one side, away from the first connecting rod, of the driving tooth is connected to the inner side wall of the drying mechanism through the second fixing rod, and a bearing is arranged at the joint of the second fixing rod and the inner side wall of the drying mechanism.
In the automatic silicon wafer coating production line, the drying mechanism is internally provided with the heating assembly.
According to the automatic silicon wafer source coating production line, the silicon wafer fixing plate passing opening is formed in one side, close to the source coating mechanism, of the drying mechanism.
The utility model has the advantages that the automatic coating of the silicon chip is realized by arranging the cylinder and the conveyer belt, the efficiency is improved, and the product quality is ensured; through setting up conveyer belt and stoving mechanism, can realize scribbling the direct stoving after the source is accomplished, avoid artifical transport, reduce staff's work load, raise the efficiency simultaneously. The utility model discloses simple structure, the practicality is strong.
Drawings
The present invention will be further explained with reference to the drawings and examples.
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a top view of the silicon wafer fixing plate of the present invention;
fig. 3 is a side view of the drying mechanism of the present invention.
In the figure, 1, a conveying belt, 2, a supporting rod, 3, a driving wheel, 4, a silicon wafer fixing plate, 5, a coating source mechanism, 6, an air cylinder, 7, a brush roller, 8, a fixing plate, 9, driven teeth, 10, a bearing plate, 11, a chain, 12, a drying mechanism, 13, driving teeth, 14, a fixing groove, 15, a second motor, 16, a first connecting rod, 17, a second connecting rod and 18, a driven wheel are arranged.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
[ example 1 ]
An automatic silicon wafer coating production line comprises a conveying mechanism, a coating mechanism 5 and a drying mechanism 12, wherein the coating mechanism 5 comprises an air cylinder 6 and a brush roller 7, the air cylinder 6 is fixed above the coating mechanism 5, a piston rod of the air cylinder 6 is fixedly connected with the brush roller 7, the conveying mechanism is positioned in front of the coating mechanism 5, a silicon wafer fixing plate 4 is placed above the conveying mechanism, the drying mechanism 12 is arranged on the right side of the coating mechanism 5, the drying mechanism 12 comprises driven teeth 9, a bearing plate 10, a chain 11 and driving teeth 13, the driven teeth 9 and the driving teeth 13 are respectively provided with two, the two driving teeth 13 are connected through a first connecting rod 16, the two driven teeth 9 are connected through a second connecting rod 17, one side of the driving teeth 13 far away from the first connecting rod 16 is fixedly connected with an output shaft of a second motor 15, the driven teeth 9 are positioned above the drying mechanism 12, the surface of the driven tooth 9 and the surface of the driving tooth 13 are provided with chains 11, the chains 11 are fixedly provided with fixing plates 8, and the fixing plates 8 are provided with bearing plates 10.
Further, conveying mechanism includes conveyer belt 1, action wheel 3, follows driving wheel 18, action wheel 3 and first motor output shaft fixed connection, action wheel 3 overlaps with follow driving wheel 18 surface and is equipped with conveyer belt 1.
Further, the driving wheel 3 and the driven wheel 18 are fixed on the ground through the support rod 2.
Further, the surface of the silicon wafer fixing plate 4 is provided with a fixing groove 14.
Further, one side, away from the second connecting rod 17, of the driven gear 9 is connected to the inner side wall of the drying mechanism 12 through a first fixing rod, and a bearing is arranged at the joint of the first fixing rod and the inner side wall of the drying mechanism 12.
Furthermore, one side of the driving tooth 13, which is far away from the first connecting rod 16, is connected to the inner side wall of the drying mechanism 12 through a second fixing rod, and a bearing is arranged at the joint of the second fixing rod and the inner side wall of the drying mechanism 12.
Further, a heating assembly is arranged inside the drying mechanism 12.
Further, a silicon wafer fixing plate passing opening is formed in one side, close to the coating source mechanism 5, of the drying mechanism 12.
Specifically, the utility model discloses during the use, 1 one end of conveyer belt is placed to silicon chip fixed plate 4 that will put the silicon chip, start first motor, conveying mechanism begins the transmission, start cylinder 6, cylinder 6 drives 7 downstream of brush rolls, conveyer belt 1 drives silicon chip fixed plate 4 and moves 7 below brush rolls, accomplish the source back of scribbling to the silicon chip, continue the transmission, convey silicon chip fixed plate 4 in drying mechanism 12, fall on bearing plate 10, start second motor 15, second motor 15 drives 3 rotations of initiative tooth, and then drive 11 up-and-down motion of chain, aim at silicon chip fixed plate with another bearing plate that does not have silicon chip fixed plate 4 and pass through the mouth, get into next circulation.
The above embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and the protection scope of the present invention is defined by the claims. Various modifications and equivalents of the invention can be made by those skilled in the art within the spirit and scope of the invention, and such modifications and equivalents should also be considered as falling within the scope of the invention.
Claims (8)
1. The utility model provides an automatic source production line that scribbles of silicon chip, includes conveying mechanism, scribbles source mechanism (5) and stoving mechanism (12), its characterized in that: the coating source mechanism (5) comprises an air cylinder (6) and a brush roller (7), the air cylinder (6) is fixed above the coating source mechanism (5), a piston rod of the air cylinder (6) is fixedly connected with the brush roller (7), the conveying mechanism is positioned in front of the coating source mechanism (5), a silicon wafer fixing plate (4) is placed above the conveying mechanism, a drying mechanism (12) is arranged on the right side of the coating source mechanism (5), the drying mechanism (12) comprises driven teeth (9), a bearing plate (10), a chain (11) and driving teeth (13), the driven teeth (9) and the driving teeth (13) are respectively provided with two, the two driving teeth (13) are connected through a first connecting rod (16), the two driven teeth (9) are connected through a second connecting rod (17), one side of the driving teeth (13) far away from the first connecting rod (16) is fixedly connected with an output shaft of a second motor (15), driven tooth (9) are located stoving mechanism (12) top, driven tooth (9) and initiative tooth (13) surface are provided with chain (11), fixed stationary blade (8) that are provided with on chain (11), be provided with bearing plate (10) on stationary blade (8).
2. The automatic silicon wafer coating production line of claim 1, wherein the conveying mechanism comprises a conveying belt (1), a driving wheel (3) and a driven wheel (18), the driving wheel (3) is fixedly connected with an output shaft of a first motor, and the conveying belt (1) is sleeved on the surfaces of the driving wheel (3) and the driven wheel (18).
3. The automatic silicon wafer coating production line according to claim 2, wherein the driving wheel (3) and the driven wheel (18) are fixed on the ground through the supporting rod (2).
4. The automatic silicon wafer coating production line of claim 1, wherein the surface of the silicon wafer fixing plate (4) is provided with fixing grooves (14).
5. The automatic silicon wafer coating production line of claim 1, wherein one side of the driven tooth (9) far away from the second connecting rod (17) is connected to the inner side wall of the drying mechanism (12) through a first fixing rod, and a bearing is arranged at the connection position of the first fixing rod and the inner side wall of the drying mechanism (12).
6. The automatic silicon wafer coating production line of claim 1, wherein one side of the driving tooth (13) away from the first connecting rod (16) is connected to the inner side wall of the drying mechanism (12) through a second fixing rod, and a bearing is arranged at the connection position of the second fixing rod and the inner side wall of the drying mechanism (12).
7. The automatic silicon wafer coating production line according to claim 1, wherein a heating assembly is arranged inside the drying mechanism (12).
8. The automatic silicon wafer coating production line of claim 1, wherein a silicon wafer fixing plate passing opening is formed in one side of the drying mechanism (12) close to the coating mechanism (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023300900.8U CN214043612U (en) | 2020-12-31 | 2020-12-31 | Automatic source production line of scribbling of silicon chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023300900.8U CN214043612U (en) | 2020-12-31 | 2020-12-31 | Automatic source production line of scribbling of silicon chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214043612U true CN214043612U (en) | 2021-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023300900.8U Active CN214043612U (en) | 2020-12-31 | 2020-12-31 | Automatic source production line of scribbling of silicon chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214043612U (en) |
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2020
- 2020-12-31 CN CN202023300900.8U patent/CN214043612U/en active Active
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