CN213905295U - Low-stress GaN film of large-size SiC substrate - Google Patents
Low-stress GaN film of large-size SiC substrate Download PDFInfo
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- CN213905295U CN213905295U CN202023343971.6U CN202023343971U CN213905295U CN 213905295 U CN213905295 U CN 213905295U CN 202023343971 U CN202023343971 U CN 202023343971U CN 213905295 U CN213905295 U CN 213905295U
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Abstract
The utility model belongs to the technical field of the semiconductor, a jumbo size SiC substrate low stress GaN film is disclosed. The large-size SiC substrate low-stress GaN film sequentially comprises a substrate, an AlN nucleating layer, a buffer layer and an undoped GaN film from bottom to top; the buffer layer is InxAl1‑xN buffer layer or InxAl1‑xN/In0.18Al0.82And an N buffer layer. The utility model not only improves the problem of lattice mismatch between the large-size SiC substrate and the GaN material, effectively controls the stress of the epitaxial wafer, and has obvious promotion effect on the overall performance and yield of the device; is beneficial to preparing large-size silicon carbide-based gallium nitride deviceAnd (3) a component.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor, concretely relates to with jumbo size SiC substrate low stress GaN film.
Background
Gallium nitride material, as a representative of third-generation semiconductors, has become a material that is most likely to replace Si in the future semiconductor field due to its characteristics of large forbidden band width, high electron mobility, and the like. In particular, gallium nitride-based devices are widely applied to electronic systems such as wireless communication, radar and the like in microwave and millimeter wave frequency bands, and have very wide development prospects in the fields of photoelectrons and microelectronics.
High performance devices are realized in combination with high quality material preparation and good device processing techniques. Since the currently used substrate preparation technology is difficult to apply to the production of GaN substrates, the produced GaN substrates are limited in size and expensive. However, in the current semiconductor development trend, material growth and device processing are performed on a large-sized substrate, so that homoepitaxy using GaN as a substrate is very difficult to realize. Substrates commonly used in the industry today are silicon carbide, sapphire and single crystal silicon. Compared with silicon and sapphire, the silicon carbide substrate has high thermal conductivity and good heat dissipation, and is the first choice for preparing GaN radio frequency and power devices. However, as with other substrates, heteroepitaxy using SiC substrates still has two unavoidable problems: lattice mismatch and thermal mismatch. The lattice mismatch of the material and the substrate causes a very large lattice mismatch stress to be generated in the GaN epitaxial layer at the initial growth stage, and when the thickness of the grown GaN epitaxial layer exceeds a certain critical thickness, the lattice mismatch stress accumulated in the GaN epitaxial layer is released in the form of dislocations and defects at the interface, which deteriorates the crystal quality of the GaN material and thus degrades the performance of subsequent devices. The influence of the lattice mismatch problem is particularly obvious when the substrate with large size is grown. The common methods for transferring and releasing the mismatch stress between the substrate and the GaN in the current production are as follows: the substrate and the stress buffer layer are patterned. The stress buffer layers commonly used at present comprise a thick GaN buffer layer, a high-low temperature AlN buffer layer, an AlGaN component gradient buffer layer and the like, although the effect on transferring and releasing mismatch stress is limited, the stress of the prepared epitaxial wafer is difficult to control.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a jumbo size SiC substrate low stress GaN film has solved prior art because SiC substrate and GaN crystal lattice mismatch lead to the not good problem of epitaxial wafer stress control effect.
The purpose of the utility model is realized through the following technical scheme:
a large-size SiC substrate low-stress GaN film sequentially comprises a substrate, an AlN nucleating layer, a buffer layer and an undoped GaN film from bottom to top; the buffer layer is InxAl1-xN buffer layer or InxAl1-xN/In0.18Al0.82And an N buffer layer.
The AlN nucleating layer is a low-temperature AlN nucleating layer and a high-temperature AlN nucleating layer, and the thickness is 20-220 nm.
The buffer layer is InxAl1-xThe N buffer layer has a thickness of 0.1 to 1 μm. Wherein, InxAl1-xX in N is 0.5 to 0.1.
The large-size SiC substrate low-stress GaN film also comprises In0.18Al0.82N buffer layer; in0.18Al0.82The N buffer layer is arranged InxAl1-xAnd an N buffer layer. At this time, In0.18Al0.82N buffer layer and InxAl1-xThe thickness of the N buffer layer is 0.1-1 μm. InxAl1-xX in N is 0.5 to 0.1.
The thickness of the undoped GaN is 1-5 mu m.
The substrate adopts a SiC substrate of 6 inches or more or a high-resistance SiC substrate of 6 inches or more.
The epitaxial growth method of the large-size SiC substrate low-stress GaN film comprises the following steps:
1) growing a nucleating layer on the SiC substrate by metal organic chemical vapor deposition; pre-laying a layer of metal aluminum on a substrate, growing AlN at a low temperature, and growing AlN at a high temperature;the low temperature conditions: the pressure is 50-100 torr, the temperature of the substrate is 750-900 ℃, the flow rate of the Al source is 10-300 sccm, the introduction time is 10-180 s, and the flow rate of the nitrogen source is 10-7000 sccm; the high temperature condition is as follows: the pressure is 50-100 torr, the temperature of the substrate is 1000-1250 ℃, the flow of the Al source is 10-300 sccm, the flow of the nitrogen source is 5000-7000/1500-2500 sccm, the flow is changed cyclically at intervals of 3-20 min; TMAl as Al source and NH as N source3(ii) a Pre-paving a layer of metal aluminum refers to pre-baking a substrate at 1000-1200 ℃, and then introducing an Al source for deposition under the conditions of 700-900 ℃ and 100-200 torr, wherein the Al source is methyl aluminum TMAl, the flow rate is 10-300 sccm, and the introduction time is 10-180 s; the pre-drying time is 200-400 s;
2) growing In on the nucleation layer by metal organic chemical vapor depositionxAl1-xN buffer layer or InxAl1-xN buffer layer and In0.18Al0.82N buffer layer; the growth conditions were: the flow rate of the Al source is 12-30 sccm, the flow rate of the In source is 80-120 sccm, and the flow rate of the N source is 1000-3000 sccm; the Al source is carried in by carrier gas, the flow rate of the carrier gas is 800-1000 sccm, and the carrier gas is hydrogen; the In source is carried In by a carrier gas, the flow rate of the carrier gas is 700-900 sccm, and the carrier gas is nitrogen; the In source is TMIn, the Al source is methyl aluminum TMAl, and the N source is NH3；
The growth temperature is 700-820 ℃; during growth, the pressure of the reaction chamber is 50-200 torr;
3) and growing an undoped GaN film on the buffer layer.
Growing the undoped GaN film in the plasma enhanced molecular beam epitaxy equipment in the step 3), wherein the thickness is 1-5 μm.
Buffer layer (In) In the utility modelxAl1-xN buffer layer, InxAl1-xN buffer layer and In0.18Al0.82N buffer layer) has better stress transfer and coordinated release effects than the existing stress buffer layer technology, and the overall epitaxial structure is more suitable for the preparation of electronic devices. The concrete embodiment is as follows: selecting InxAl1-xN can be regulated and controlled by In componentInxAl1-xThe N and the GaN form a lattice constant matching relation and can be used as a lattice mismatch stress release layer, so that low stress, no crack and no bending in the GaN layer are realized. The low-temperature AlN nucleating layer is selected, so that the reflow etching of the GaN material can be prevented, and the growth of the GaN layer is facilitated.
The utility model has the advantages that: the utility model discloses an epitaxial wafer has not only improved jumbo size SiC substrate and GaN material lattice mismatch problem, and effective control epitaxial wafer stress promotes the effect obviously to device wholeness ability and yields. The method is a foundation for the preparation of large-size silicon-based gallium nitride devices and is suitable for application and market popularization.
Drawings
FIG. 1 is a schematic structural diagram of a large-size SiC substrate low-stress GaN film, i.e., an epitaxial wafer, according to the present invention; 1-substrate, 2-AlN nucleating layer, 3-buffer layer and 4-undoped GaN film;
FIG. 2 shows the buffer layer is InxAl1-xN/In0.18Al0.82When N buffer layer, the structure of the epitaxial wafer of the utility model is shown schematically; 1-substrate, 2-AlN nucleation layer, 31-InxAl1-xN buffer layer, 32-In0.18Al0.82N buffer layer, 4-undoped GaN film.
Detailed Description
The present invention will be further described with reference to the following specific examples, but the embodiments of the present invention are not limited thereto.
The structural schematic diagram of the large-size SiC substrate low-stress GaN film, i.e. the epitaxial wafer, is shown in FIG. 1. The utility model discloses a jumbo size SiC substrate low stress GaN film includes substrate 1, AlN nucleation layer 2, In from bottom to top In proper orderxAl1-xAn N buffer layer 3 and an undoped GaN film 4; the buffer layer is InxAl1-xN buffer layer or InxAl1-xN/In0.18Al0.82And an N buffer layer.
The AlN nucleating layer is a low-temperature AlN nucleating layer and a high-temperature AlN nucleating layer, and the thickness is 20-220 nm. A low-temperature AlN nucleation layer is disposed on the substrate.
The buffer layer is InxAl1-xAnd the thickness of the N buffer layer is 0.1-1 mu m. Wherein, InxAl1-xX in N is 0.5-0.1.
The large-size SiC substrate low-stress GaN film comprises In0.18Al0.82N buffer layer; in0.18Al0.82The N buffer layer is arranged InxAl1-xAnd an N buffer layer. At this time, In0.18Al0.82N buffer layer and InxAl1-xThe thickness of the N buffer layer is 0.1-1 μm. InxAl1-xX in N is 0.5-0.1.
The thickness of the undoped GaN is 1-5 mu m.
The substrate adopts a SiC substrate of 6 inches or more or a high-resistance SiC substrate of 6 inches or more.
The buffer layer is InxAl1-xN/In0.18Al0.82During the N buffer layer, the structure schematic diagram of the epitaxial wafer of the present invention is shown in fig. 2. The epitaxial wafer of the utility model comprises a substrate 1, an AlN nucleation layer 2 and In from bottom to top In sequencexAl1-x N buffer layer 31, In0.18Al0.82An N buffer layer 32, and an undoped GaN thin film 4.
Example 1
The epitaxial wafer of the present embodiment includes, from bottom to top, a substrate, an AlN nucleation layer (low-temperature AlN/high-temperature AlN nucleation layer), InxAl1-xN buffer layer and In0.18Al0.82N buffer layer, undoped GaN film.
The preparation method of the epitaxial wafer of the embodiment includes the following steps:
1. growing materials by adopting a Metal Organic Chemical Vapor Deposition (MOCVD) epitaxial growth system, wherein the substrate is a 6-inch large-size SiC substrate; the growth atmosphere is that trimethyl gallium (TMGa), trimethyl aluminum (TMAl) and ammonia gas (NH3) are respectively used as Ga, Al and N sources, and nitrogen gas (N) is used as N source2) Hydrogen (H)2) Is a carrier gas.
2. Growing a high-low temperature AlN nucleating layer on a substrate: firstly, placing the SiC substrate in a 1050 ℃ reaction chamber for 200s for prebaking, cooling to 700 ℃, introducing 300sccm TMAl for depositing for 40s under the condition that the pressure of the reaction chamber is 100torr, and pre-laying a layer of metalAluminum; then, under the condition that the pressure of the reaction chamber is 100torr, 300sccm TMAl and 5000sccm NH are introduced3Controlling the substrate temperature at 750 ℃, and growing AlN at low temperature to obtain a low-temperature AlN layer of about 20 nm; then the substrate temperature is raised to 1050 ℃, the pressure in the reaction chamber is 100Torr, 300sccm TMAl, NH are introduced3The flow rate was varied cyclically from 6500/2000sccm at 10 minute intervals to obtain a high temperature AlN layer having a thickness of about 200 nm.
3. Growing In0.5Al0.5N/In0.18Al0.82N buffer layer: adjusting the pressure of the reaction chamber to 200torr, keeping the pressure stable, controlling the temperature of the graphite base to be stable at 700 ℃, and controlling the temperature to be H2TMAl as Al source is taken in by carrier gas, N2TMIn is taken In as an In source by the carrier gas, and ammonia gas is simultaneously introduced as an N source. Specifically, the hydrogen flow rate was 800sccm, the nitrogen flow rate was 700sccm, the ammonia flow rate, the TMAl flow rate, and the TMIn flow rate were adjusted, and In was grown In sequence0.5Al0.5N/In0.18Al0.82N buffer layer; such as: the flow rate of ammonia gas was 1000sccm, the flow rate of TMAl was 12sccm, the flow rate of TMIn was 80sccm, and the growth thickness was 0.1. mu.m.
4. GaN was epitaxially grown at 1000 ℃ for 1.5h with a thickness of 1 μm by unintentional carbon doping with PE-MBE.
Example 2
The epitaxial wafer of the present embodiment includes, from bottom to top, a substrate, an AlN nucleation layer (low-temperature AlN/high-temperature AlN nucleation layer), InxAl1-xN buffer layer and In0.18Al0.82N buffer layer, undoped GaN film.
The preparation method of the epitaxial wafer of the embodiment includes the following steps:
1. growing materials by using a Metal Organic Chemical Vapor Deposition (MOCVD) epitaxial growth system, wherein the substrate is a large-size SiC substrate of 6 inches or more; the growth atmosphere is that trimethyl gallium (TMGa), trimethyl aluminum (TMAl) and ammonia gas (NH3) are respectively used as Ga, Al and N sources, and nitrogen gas (N) is used as N source2) Hydrogen (H2) was the carrier gas.
2. Growing a high-low temperature AlN nucleating layer on a substrate: firstly, placing the SiC substrate in a 1200 ℃ reaction chamber for 400s for prebaking, cooling to 900 ℃, and reactingIntroducing 300sccm TMAl under the condition of chamber pressure of 200torr, and pre-laying a layer of metal aluminum; then, 300sccm TMAl and 6000sccm NH were introduced into the reaction chamber under a pressure of 50torr3Controlling the substrate temperature to 750 ℃ to grow AlN to obtain a low-temperature AlN layer of about 20 nm; subsequently, the substrate temperature was raised to 1050 ℃ and the pressure in the reaction chamber was 50Torr, 300sccm TMAl, NH3The flow rate was varied cyclically from 6500/2000sccm at 10 minute intervals to obtain a high temperature AlN layer having a thickness of about 200 nm.
3. Growing In0.4Al0.6N/In0.18Al0.82N buffer layer: adjusting the pressure of the reaction chamber to 200torr, keeping the pressure stable, controlling the temperature of the graphite base to be stable at 820 ℃, and controlling the temperature to be H2TMAl as Al source is taken in by carrier gas, N2TMIn is taken In as an In source by the carrier gas, and ammonia gas is simultaneously introduced as an N source. Specifically, the hydrogen flow rate was 1000sccm, the nitrogen flow rate was 900sccm, the ammonia flow rate, the TMAl flow rate, and the TMIn flow rate were adjusted, and In was grown In sequence0.4Al0.6N/In0.18Al0.82N buffer layer; such as: the flow rate of ammonia gas was 3000sccm, TMAl was 30sccm, TMIn was 120sccm, and the growth thickness was 1 μm.
4. Undoped GaN film growth was carried out in PE-MBE to a thickness of 600 nm.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.
Claims (4)
1. A large-size SiC substrate low-stress GaN film is characterized in that: the GaN-based light-emitting diode sequentially comprises a substrate, an AlN nucleating layer, a buffer layer and an undoped GaN film from bottom to top; the buffer layer is InxAl1-xN buffer layer or InxAl1-xN/In0.18Al0.82And an N buffer layer.
2. The large-size SiC substrate low-stress GaN film of claim 1, wherein: the AlN nucleating layer is a low-temperature AlN nucleating layer and a high-temperature AlN nucleating layer;
said InxAl1-xX in N is 0.5 to 0.1.
3. The large-size SiC substrate low-stress GaN film of claim 1, wherein: the AlN nucleation layer is 20-220 nm thick; the thickness of the buffer layer is 0.1-1 μm;
the thickness of the undoped GaN is 1-5 mu m.
4. The large-size SiC substrate low-stress GaN film of claim 1, wherein: the substrate adopts a SiC substrate of 6 inches or more or a high-resistance SiC substrate of 6 inches or more.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112687527A (en) * | 2020-12-31 | 2021-04-20 | 华南理工大学 | Large-size SiC substrate low-stress GaN film and epitaxial growth method thereof |
| CN115287751A (en) * | 2022-06-22 | 2022-11-04 | 西安电子科技大学 | Low-radio-frequency-loss silicon-based GaN film based on AlPN nucleation layer and preparation method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112687527A (en) * | 2020-12-31 | 2021-04-20 | 华南理工大学 | Large-size SiC substrate low-stress GaN film and epitaxial growth method thereof |
| CN115287751A (en) * | 2022-06-22 | 2022-11-04 | 西安电子科技大学 | Low-radio-frequency-loss silicon-based GaN film based on AlPN nucleation layer and preparation method |
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