CN213889547U - Transfer device for silicon wafer before polishing - Google Patents
Transfer device for silicon wafer before polishing Download PDFInfo
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- CN213889547U CN213889547U CN202022878530.XU CN202022878530U CN213889547U CN 213889547 U CN213889547 U CN 213889547U CN 202022878530 U CN202022878530 U CN 202022878530U CN 213889547 U CN213889547 U CN 213889547U
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- silicon wafer
- transfer device
- liquid
- before polishing
- silicon
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 137
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 137
- 239000010703 silicon Substances 0.000 title claims abstract description 137
- 238000005498 polishing Methods 0.000 title claims abstract description 36
- 239000007788 liquid Substances 0.000 claims abstract description 95
- 238000005507 spraying Methods 0.000 claims abstract description 43
- 235000012431 wafers Nutrition 0.000 claims description 105
- 230000005855 radiation Effects 0.000 claims description 6
- 239000000969 carrier Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000007921 spray Substances 0.000 abstract description 7
- 238000003860 storage Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model provides a transfer device used before polishing a silicon wafer, which comprises a placing table, wherein a bearing component used for supporting the silicon wafer and a liquid spraying component used for spraying liquid to the single side surface of the silicon wafer are arranged on the placing table; the bearing assembly enables the silicon wafer to be arranged on one side of the placing table in a suspending mode; the liquid flow sprayed out of the liquid spraying assembly can be fully covered on the plane of one side, close to the placing table, of the silicon wafer. The utility model discloses transfer device not only can stably place the silicon chip, can be to being close to the silicon chip plane of placing platform one side comprehensive spray rinsing moreover to can guarantee to be close to the silicon chip plane of placing platform one side and fully infiltrated.
Description
Technical Field
The utility model belongs to the technical field of silicon chip polishing equipment, especially, relate to a use transfer device before silicon chip polishing.
Background
In the existing semiconductor silicon wafer polishing process, polishing machine equipment can pause once abnormal, so that a product being processed can pause immediately, and the polishing of the silicon wafer is chemical mechanical processing, so that the product quality is abnormal due to any time pause in the polishing process, the cost is lost, and the product quality risk is increased. Meanwhile, due to the characteristics of polishing and cleaning linkage processing, if the processing is stopped midway, the product cannot be circulated continuously, and the productivity is wasted due to the re-processing. Before polishing, the silicon wafer needs to be independently placed in a device for temporary storage, meanwhile, the front side of the silicon wafer needs to be fully soaked by water liquid, and the operation of a mechanical arm on the silicon wafer is not influenced, so that the silicon wafer is quickly taken away and placed in a polishing unit of a polishing machine. How to design an uploading transfer device for stably placing the silicon wafer so as to ensure that the front surface of the silicon wafer is not exposed in the air and can be fully infiltrated, and energy waste can be avoided, so that the uploading transfer device is the key for ensuring the polishing quality of the silicon wafer, improving the polishing efficiency and reducing the production cost.
SUMMERY OF THE UTILITY MODEL
The utility model provides a use transfer device before silicon chip polishing especially is applicable to the temporary storage to the silicon chip before the polishing, has solved the silicon chip and has placed unstable, the silicon chip openly can expose in the air and can't guarantee the technical problem of silicon chip polishing quality when the polishing is uploaded.
In order to solve the technical problem, the utility model discloses a technical scheme is:
a transfer device used before polishing of a silicon wafer comprises a placing table, wherein a bearing assembly used for supporting the silicon wafer and a liquid spraying assembly used for spraying liquid to the single side surface of the silicon wafer are arranged on the placing table; the bearing assembly enables the silicon wafer to be arranged on one side of the placing table in a suspending mode; the liquid flow sprayed out of the liquid spraying assembly can be fully covered on the plane of one side, close to the placing table, of the silicon wafer.
Further, the bearing assembly is arranged on the upper end face of the placing table and comprises a plurality of bearing pieces, and the patterns obtained by connecting the bearing pieces are connected with the diameter circle of the silicon wafer in an inner mode.
Further, the liquid spraying assembly comprises a plurality of liquid spraying holes penetrating through the thickness of the placing table, the liquid spraying holes are arranged right below the silicon wafer, and the liquid spraying holes are at least arranged at the circle center of the silicon wafer.
Preferably, the other liquid spraying holes are distributed in a manner of outward diffusion in the same direction and in a circular arc shape by taking the center of the circle of the silicon wafer as the center.
Preferably, the other liquid spraying holes are distributed in a multi-layer radiation manner along the center of the silicon wafer towards the side far away from the center of the silicon wafer.
Preferably, the pattern formed by the liquid spraying holes distributed in a multi-layer radiation manner along the center of the silicon wafer gradually to the side far away from the center of the silicon wafer is a plurality of concentric circles.
Preferably, the number of the liquid ejecting holes placed on the inner side of the concentric circle is smaller than the number of the liquid ejecting holes placed on the outer side of the concentric circle.
Preferably, the liquid spray holes arranged on the concentric circles are uniformly distributed along the circumference of the circle on which the liquid spray holes are arranged.
Preferably, the number of concentric circles is at least two.
Preferably, all the liquid ejecting holes have the same structure and are circular, triangular or polygonal.
Compared with the prior art, adopt the utility model discloses a transfer device is applicable to and takes out the silicon chip to the temporary storage before polishing from the piece basket that carries the silicon chip, not only can stably place the silicon chip, can be to being close to the silicon chip plane of placing platform one side overall spray rinsing moreover to can guarantee to be close to the silicon chip plane of placing platform one side and fully soaked.
Drawings
FIG. 1 is a schematic structural view of a transfer device used before polishing a silicon wafer according to an embodiment of the present invention
FIG. 2 is a top view of a transfer device for use before polishing silicon wafers according to a first embodiment of the present invention;
fig. 3 is a top view of a transfer device for use before polishing silicon wafers according to a second embodiment of the present invention.
In the figure:
10. placing table 20, bearing assembly 21 and bearing piece
30. Liquid spray assembly 31, liquid spray hole 32, concentric circles
40. Silicon wafer
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
The embodiment provides a transfer device for silicon wafer before polishing, as shown in fig. 1, comprising a placing table 10, wherein a bearing assembly 20 for supporting a silicon wafer 40 and a liquid spraying assembly 30 for spraying liquid to a single side of the silicon wafer 40 are arranged on the placing table 10; the placing table 10 is horizontally arranged, and the structure of the placing table 10 can be square, rectangular or circular, but the minimum width of the placing table 10 is greater than the maximum width of the pattern surrounded by the bearing assemblies 20 for supporting the silicon wafer 40; the bearing component 20 enables the silicon chip 40 to be arranged on one side of the placing platform 10 in a suspending way; the liquid stream ejected from the liquid ejection assembly 30 may entirely cover a side plane of the silicon wafer 40 adjacent to the placing stage 10. In the actual operation process, the manipulator places the front surface of the silicon wafer 40 towards the position of one side of the placing table 10, so that the front surface of the silicon wafer 40 is completely covered by liquid flow sprayed from the liquid spraying assembly 30, thereby ensuring that the front surface of the silicon wafer 40 is fully infiltrated, and being beneficial to polishing and removing particle impurities on the front surface of the silicon wafer 40 in the next step; meanwhile, the front surface of the silicon wafer 40 surrounded by the liquid flow is also isolated from the outside air, thereby preventing the front surface of the silicon wafer 40 from being oxidized, and thus ensuring the surface quality of the polished silicon wafer 40.
Further, the bearing component 20 is arranged on the upper end surface of the placing table 10, preferably, the bearing component 20 is located at the central position of the placing table 10, and comprises a plurality of bearing pieces 21, and the pattern obtained by connecting the bearing pieces 21 is inscribed on the diameter circle of the placed silicon wafer 40; that is, the silicon wafer 40 is placed on the inner side wall of the upper end of the carrier 21 and is suspended, and the carriers 21 are all disposed perpendicular to the upper end surface of the placing table 10.
The bearing part 21 can be a cylindrical structure, but a tapered boss is arranged on the upper end face of the bearing part 21 and used for setting the silicon wafer 40 in a protruding manner, namely the outer edge of the silicon wafer 40 is in contact with the inner side wall of the tapered boss at the upper end part of the cylindrical bearing part 21, so that the silicon wafer 40 is suspended and arranged right above the placing table 10, the front contact between the bearing part 21 and the silicon wafer 40 is zero, the contact area of the liquid spraying hole 31 arranged below the front surface of the silicon wafer 40 and the silicon wafer 40 can be maximized, meanwhile, the silicon wafer 40 can be stably placed on the bearing component 20, and even if the silicon wafer 40 is impacted by liquid flow sprayed from the liquid spraying component 30 from bottom to top, the silicon wafer cannot shake. Of course, the supporting member 21 may also be a truncated cone-shaped structure, the upper end surface of which is a small diameter surface, and the surface connected to the placing table 10 is a large diameter surface, so as to increase the stability of the supporting member 21, and a tapered boss for covering the silicon wafer 40 and contacting with the outer side wall of the silicon wafer 40 is also provided on the upper end surface of the truncated cone-shaped supporting member 21, which has the same principle as the silicon wafer 40, and is omitted here. In the present embodiment, the number of the supporting members 21 is at least three, and the supporting members are uniformly distributed on the circumference where the supporting members are located, which is not particularly required.
Further, in order to improve the effect of wetting the front surface of the silicon wafer 40 with the liquid flow, the height of the carrier 21 can be vertically adjusted up and down along the height direction of the placing table 10, so as to adjust the height of the liquid flow sprayed from the liquid spraying assembly 30 to the front surface of the silicon wafer 40, and simultaneously, the carrier 21 can lift the silicon wafer 40 up when being lifted, so that the silicon wafer 40 can be conveniently picked and placed by a manipulator.
Further, the liquid spraying assembly 30 comprises a plurality of liquid spraying holes 31 penetrating through the thickness of the placing table 10, the liquid spraying holes 31 are arranged right below the silicon wafer 40, and the liquid spraying holes 31 are arranged at least at the center of the silicon wafer 40 to ensure that liquid flows overflow from the center of the silicon wafer 40 and the liquid flows are radially flushed from the center of the silicon wafer 40 to the periphery.
Preferably, as shown in fig. 2, the other liquid ejecting holes 31 are distributed in a shape of a concentric circular arc outward spreading around the center of the silicon wafer 40. The arrangement of the structure is easy to enable liquid flow sprayed out of the liquid spraying holes 31 to be in a rotating shape, so that all covering areas are cleaned in a balanced mode, and the consistency and the stability of the overall infiltration of the surface to be polished of the silicon wafer can be further improved. The central part is distributed densely relative to the liquid spraying holes 31 at the edge part, but the liquid spraying holes 31 are uniformly distributed on the arcs at all angles, are distributed gradually from the circle center to the outer edge of the silicon wafer 40 and are dispersed and infiltrated outwards, so that the surface to be polished of the silicon wafer 40 is wrapped and covered by the aqueous solution without leakage, the surface to be polished is completely isolated from air, the infiltration effect of the silicon wafer 40 is ensured, and a foundation is laid for subsequently improving the polishing quality.
Preferably, as shown in fig. 3, the other liquid ejecting holes 31 are distributed in a multi-layer radiation manner along the center of the silicon wafer 40 to the side away from the center position step by step, that is, the pattern formed by the liquid ejecting holes 31 distributed in a multi-layer radiation manner along the center of the silicon wafer 40 to the side away from the center position step by step is a plurality of concentric circles 32. From the center to the outer diameter edge, the liquid spraying holes 31 form a liquid spraying assembly 30 with a concentric circle 32 structure which expands layer by layer, so that liquid flow sprayed from the liquid spraying holes 31 is completely radiated to all positions of the front surface of the silicon wafer 40, the front surface of the silicon wafer 40 is ensured to be isolated from air, and the front surface of the silicon wafer 40 is prevented from being oxidized.
Preferably, the number of the liquid ejecting holes 31 disposed on the inner concentric circle 32 is smaller than that of the liquid ejecting holes 31 disposed on the outer concentric circle 32, and since the circular area from the center to the outer diameter is gradually enlarged, the area of the liquid flow to be overflowed is increased, and more liquid ejecting holes 31 are distributed on the outer concentric circle 32 to complete the overall coverage of the front surface of the silicon wafer 40.
Preferably, the liquid ejecting holes 31 arranged on the concentric circles 32 are uniformly distributed along the circumference of the circle where the liquid ejecting holes are located, so that the force of the liquid jet to rinse the front surfaces of all the silicon wafers 40 is uniform, thereby ensuring that the silicon wafers 40 can be stably placed in the whole rinsing process and ensuring that the front surfaces of the silicon wafers 40 are completely covered by the overflowing liquid flow.
It is preferable that the number of diameters formed by connecting the liquid ejecting holes 31 provided on the inner concentric circle 32 is larger than the number of diameters formed by connecting the liquid ejecting holes 31 provided on the outer concentric circle 32, so that the number of liquid ejecting holes 31 provided on the outer concentric circle 32 is larger than the number of liquid ejecting holes 31 provided on the inner concentric circle 32, and the liquid ejecting holes 31 on both concentric circles 32 are symmetrically provided. The liquid ejecting holes 31 in the inner concentric circle 32 may be arranged side by side with the liquid ejecting holes 31 in the outer concentric circle 32, or may be arranged in a staggered manner.
Preferably, the number of the concentric circles 32 is at least two, and may also be a plurality of concentric circles 32, so as to expand the distribution range of the liquid spraying holes 31 and improve the wetting effect of the liquid spraying holes on the surface to be polished of the silicon wafer 40.
Preferably, in the present embodiment, all the liquid ejecting holes 31 have the same structure, and may be circular, triangular, or polygonal, so as to make all the liquid streams ejected from the liquid ejecting holes 31 have the same speed and size, so as to ensure the uniformity and consistency of the front surface of the silicon wafer 40 that is protected and wetted by the liquid streams.
In the work, the bearing piece 21 is controlled to ascend and stop to the upper limit position, the silicon chip 40 is placed after the stability stop, the front face of the silicon chip is arranged downwards, and then the airflow in the negative pressure hole 22 is controlled to adsorb the silicon chip 40 and the silicon chip 40 is stably placed on the upper end face of the bearing piece 21; the bearing part 21 is controlled to drive the silicon wafer 40 to move downwards to the lower limit position, and the silicon wafer 40 is suspended; controlling the liquid flow to continuously overflow to the front surface of the silicon wafer 40 through the liquid spraying holes 31, enabling the liquid flow to contact the front surface of the silicon wafer 40 and diffuse and infiltrate outwards along the surface of the silicon wafer, enabling the liquid flow to fall to the placing table 10 along with the self gravity of the liquid flow and repeatedly overflow; after the infiltration is finished, the bearing part 21 is controlled to drive the silicon wafer 40 to move upwards to the upper limit position, the negative pressure adsorption in the negative pressure hole 22 is stopped at the moment, and the mechanical arm takes out the silicon wafer 40 and transfers the silicon wafer to the next procedure; while awaiting placement of the next silicon die 40.
The utility model discloses transfer device is applicable to and takes out the silicon chip to the temporary storage before polishing from the piece basket that carries the silicon chip, not only can stably place the silicon chip, can be to being close to the silicon chip plane of placing platform one side comprehensive spray rinsing moreover to can guarantee to be close to the silicon chip plane of placing platform one side and fully soaked.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (10)
1. The transfer device for the silicon wafer before polishing is characterized by comprising a placing table, wherein a bearing assembly for supporting the silicon wafer and a liquid spraying assembly for spraying liquid to the single side surface of the silicon wafer are arranged on the placing table; the bearing assembly enables the silicon wafer to be arranged on one side of the placing table in a suspending mode; the liquid flow sprayed out of the liquid spraying assembly can be fully covered on the plane of one side, close to the placing table, of the silicon wafer.
2. The transfer device for silicon wafers before polishing as claimed in claim 1, wherein the carrier assembly is disposed on the upper end surface of the placing table and comprises a plurality of carriers, and the pattern obtained by connecting the carriers is inscribed in the diameter circle of the silicon wafer.
3. The transfer device for silicon wafers before polishing as claimed in claim 1 or 2, wherein the liquid spraying assembly comprises a plurality of liquid spraying holes penetrating the thickness of the placing table, the liquid spraying holes are arranged right below the silicon wafers, and the liquid spraying holes are arranged at least at the center of the silicon wafers.
4. The transfer device for silicon wafers before polishing as claimed in claim 3, wherein the other liquid spraying holes are distributed in a circular arc shape with the center of the silicon wafer as a center and are diffused outward in the same direction.
5. The transfer device for silicon wafers before polishing as claimed in claim 3, wherein the other liquid spraying holes are distributed in a multi-layer radiation manner along the center of the silicon wafer in a stepwise manner to the side away from the center.
6. The transfer device for silicon wafers before polishing as claimed in claim 4 or 5, wherein the pattern formed by the liquid spraying holes distributed in a multi-layer radiation manner along the center of the silicon wafer gradually towards the side far away from the center is a plurality of concentric circles.
7. The transfer device for silicon wafer before polishing as claimed in claim 6, wherein the number of said liquid ejecting holes provided on the inner side of said concentric circle is smaller than the number of said liquid ejecting holes provided on the outer side of said concentric circle.
8. The transfer device for silicon wafers before polishing as claimed in claim 7, wherein said liquid ejecting holes arranged on said concentric circles are uniformly distributed along the circumference of the circle on which said liquid ejecting holes are arranged.
9. The transfer device for silicon wafers before polishing as set forth in claim 7 or 8, wherein the number of said concentric circles is at least two.
10. The transfer device for silicon wafers before polishing as claimed in claim 9, wherein all the liquid spraying holes have the same structure and are circular, triangular or polygonal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022878530.XU CN213889547U (en) | 2020-12-05 | 2020-12-05 | Transfer device for silicon wafer before polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022878530.XU CN213889547U (en) | 2020-12-05 | 2020-12-05 | Transfer device for silicon wafer before polishing |
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| Publication Number | Publication Date |
|---|---|
| CN213889547U true CN213889547U (en) | 2021-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022878530.XU Active CN213889547U (en) | 2020-12-05 | 2020-12-05 | Transfer device for silicon wafer before polishing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115625619A (en) * | 2022-12-01 | 2023-01-20 | 西安奕斯伟材料科技有限公司 | Intermediate carrier, double-sided polishing system and feeding and discharging method |
-
2020
- 2020-12-05 CN CN202022878530.XU patent/CN213889547U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115625619A (en) * | 2022-12-01 | 2023-01-20 | 西安奕斯伟材料科技有限公司 | Intermediate carrier, double-sided polishing system and feeding and discharging method |
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Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: No.12 Haitai East Road, Huayuan Industrial Zone, Binhai New Area, Tianjin Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |