CN214165940U - Transfer device for polished silicon wafers - Google Patents
Transfer device for polished silicon wafers Download PDFInfo
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- CN214165940U CN214165940U CN202022878514.0U CN202022878514U CN214165940U CN 214165940 U CN214165940 U CN 214165940U CN 202022878514 U CN202022878514 U CN 202022878514U CN 214165940 U CN214165940 U CN 214165940U
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- Prior art keywords
- silicon wafer
- transfer device
- placing groove
- silicon
- polishing
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 135
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 135
- 239000010703 silicon Substances 0.000 title claims abstract description 135
- 235000012431 wafers Nutrition 0.000 title claims abstract description 125
- 239000007788 liquid Substances 0.000 claims abstract description 61
- 238000005498 polishing Methods 0.000 claims abstract description 37
- 238000005507 spraying Methods 0.000 claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000969 carrier Substances 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A transfer device for polished silicon wafers comprises a placing groove loaded with water liquid, and a bearing assembly and a liquid spraying assembly, wherein the bearing assembly is used for supporting the silicon wafers, and the liquid spraying assembly is used for spraying liquid to the single side surfaces of the silicon wafers; the bearing component is arranged on the inner side of the placing groove and enables the silicon wafer to be suspended, and the bearing component drives the silicon wafer to adjust the position along the height direction of the silicon wafer; the liquid spraying assembly penetrates through the placing groove and is arranged in a circumscribed circle of the graph formed by the surrounding of the bearing assembly; the bearing component is in contact with the outer wall surface of the silicon wafer and enables the plane of one side, close to the placing groove, of the silicon wafer to be located at the position of the water level in the placing groove, and the bearing component supports the silicon wafer to rise so as to leave the transfer device. The utility model is mainly used for transferring and temporarily storing polished silicon wafers, can stably place the silicon wafers and adjust the placing positions of the silicon wafers, and can also reduce the contact of liquid flow to the plane of the silicon wafers close to one side of the placing groove; meanwhile, the polished silicon wafer can be continuously circulated and temporarily stored, and the linkage of polishing and cleaning and the production efficiency are improved.
Description
Technical Field
The utility model belongs to the technical field of silicon chip polishing equipment, especially, relate to a silicon chip polishes back and uses transfer device.
Background
After polishing, the silicon wafer needs to be independently placed in a device for temporary storage, and meanwhile, the front surface of the silicon wafer needs to be ensured in a humid environment, and the operation of a mechanical arm on the silicon wafer is not influenced, so that the silicon wafer is quickly taken away and transferred to a cleaning process in the next process. How to design a transfer device that makes the silicon chip place steadily, the sustainable circulation is kept in temporary storage, and the positive contact of hydrojet to the silicon chip is makeed to the minimum simultaneously to avoid the energy extravagant, improve polishing and abluent linkage, be high-quality, the low-cost key of processing semiconductor silicon chip.
SUMMERY OF THE UTILITY MODEL
The utility model provides a use transfer device after silicon chip polishing especially is applicable to the temporary storage to the silicon chip after the polishing, has solved the silicon chip and has placed unstable, unable sustainable ground circulation when the polishing is downloaded and keep in, and the polishing and rinse the technical problem that linkage nature is low.
In order to solve the technical problem, the utility model discloses a technical scheme is:
the utility model provides a silicon chip uses transfer device after polishing, including the standing groove that carries water liquid and be equipped with on the standing groove:
the bearing assembly is used for supporting the silicon wafer;
and a liquid spraying assembly for spraying liquid to the single side of the silicon wafer;
the bearing assembly is arranged on the inner side of the placing groove and enables the silicon wafer to be arranged in a suspended mode, and the bearing assembly drives the silicon wafer to adjust the position along the height direction of the silicon wafer;
the liquid spraying assembly penetrates through the placing groove and is arranged in a circumscribed circle of the graph formed by the surrounding of the bearing assembly;
the bearing component is in contact with the outer wall surface of the silicon wafer, the plane of one side, close to the placing groove, of the silicon wafer is located at the position of the water level in the placing groove, and the bearing component supports the silicon wafer to ascend so as to leave the transfer device.
Furthermore, the bearing component is perpendicular to the bottom surface of the placing groove, and comprises a plurality of bearing parts arranged at intervals, fixing parts which are arranged by the bearing parts in a penetrating mode and used for fixing the bearing parts, and an outer circle which is connected with the bearing parts and is encircled into a graph is arranged concentrically with the placing groove.
Further, the carrier comprises an upper section and a lower section which are integrally connected, and at least the upper section is a cone, and the large-diameter surface of the upper section is connected with the lower section.
Furthermore, the distance between the top ends of the upper sections is greater than the diameter of the silicon wafer, and the distance between the inner side walls of the lower end surfaces of the upper sections is less than the diameter of the silicon wafer.
Preferably, the lower section part is a cylinder, and the upper end surface of the cylinder is matched with the lower end surface of the upper section part.
Preferably, the fixing piece is of a circular structure and is detachably connected with the placing groove.
Further, the bearing component comprises at least three bearing parts.
Preferably, the bearing assembly comprises six bearing pieces which are symmetrically arranged on two sides of the diameter of the placing groove in two groups; and the two outer carriers in each set are symmetrically arranged with respect to the middle carrier.
Furthermore, the liquid spraying assembly at least comprises a liquid spraying hole positioned below the circle center of the silicon wafer.
Further, the liquid spraying assembly also comprises the liquid spraying hole which is arranged at one side close to the outer edge of the silicon wafer; the outermost side of the bearing piece is provided with the liquid spraying hole in a staggered manner; and all the liquid spraying holes are positioned on the same radius or diameter of the silicon wafer.
Compared with the prior art, the transfer device designed by the utility model is mainly used for transferring and temporarily storing the polished silicon wafers, so that the silicon wafers can be stably placed, the front surfaces of the polished silicon wafers, namely the silicon wafer planes close to one side of the placing groove, are not contacted by any bearing piece, and the placing positions of the silicon wafers can be adjusted to be suitable for height setting with different requirements; meanwhile, the contact of liquid flow to the silicon wafer plane close to one side of the placing groove is reduced to the maximum extent; the polished silicon wafer can be continuously circulated and temporarily stored, energy waste is avoided, linkage of polishing and cleaning is improved, and production efficiency is improved.
Drawings
Fig. 1 is a schematic structural view of a transfer device for use after polishing a silicon wafer according to a first embodiment of the present invention;
FIG. 2 is a top view of a transfer device for use after polishing silicon wafers according to a first embodiment of the present invention;
FIG. 3 is a top view of a transfer device for use after polishing silicon wafers according to a second embodiment of the present invention;
FIG. 4 is a top view of a transfer device for use after polishing silicon wafers according to a third embodiment of the present invention;
fig. 5 is a top view of a transfer device for use after polishing silicon wafers according to a fourth embodiment of the present invention.
In the figure:
10. placing groove 20, bearing component 21 and bearing piece
22. Fixing member 30, liquid ejecting unit 31, and liquid ejecting hole
40. Silicon wafer
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
The embodiment provides a transfer device for polishing a silicon wafer, as shown in fig. 1, comprising a placing tank 10 loaded with water liquid for storing water to keep the polishing surface of the silicon wafer 40 wet when placed in a water liquid environment; a bearing assembly 20 for supporting the silicon wafer 40 and a liquid spraying assembly 30 for spraying liquid to a single side of the silicon wafer 40 are also arranged on the placing groove 10; the bearing component 20 is arranged at the inner side of the placing groove 10 and enables the silicon wafer 40 to be suspended, and the bearing component 20 drives the silicon wafer 40 to adjust the position along the height direction; the liquid spraying assembly 30 penetrates through the placing groove 10 and is arranged in a circumscribed circle of a figure enclosed by the bearing assembly 20; the bearing component 20 is contacted with the outer wall surface of the silicon wafer 40, and the plane of the silicon wafer 40 close to one side of the placing groove 10 is positioned at the water liquid level in the placing groove 10, and the bearing component 20 supports the silicon wafer 40 to ascend so as to leave the transfer device. Meanwhile, the liquid stream ejected from the liquid ejection assembly 30 overflows toward a portion of the silicon wafer 40 near the flat surface of the side of the placement groove 10. In operation, the polishing manipulator always adsorbs the back of the silicon wafer and enables the front of the silicon wafer 40 to face downwards and be suspended right above the polishing machine, so that the front of the silicon wafer 40 is polished, the polished silicon wafer 40 is directly placed on the bearing component 20 on the placing groove 10 by the polishing manipulator, so that the silicon wafer 40 is suspended and temporarily stored in a downloading and transferring device provided with water liquid for temporary storage, and the manipulator in the next working procedure takes away the silicon wafer 40 for cleaning; and meanwhile, the polishing manipulator returns to continue to operate the next group of silicon wafers 40 to be polished for polishing. In the process that the polished silicon wafer 40 is placed in the transfer device loaded with water liquid, the height of the silicon wafer 40 can be adjusted by controlling the height of the bearing component 20, so that the polished surface of the silicon wafer 40 is always in a wet environment of the water liquid and isolated from the outside air, and meanwhile, the requirements of different required silicon wafer heights can be met; meanwhile, the liquid flow from the liquid spraying component 30 can be reduced to the maximum extent to contact the silicon chip plane close to one side of the placing groove; and the polished silicon wafer 40 can continuously flow, rotate and temporarily store, thereby avoiding the waste of energy sources such as water, electricity and the like, simultaneously improving the linkage of polishing and cleaning machines and improving the generation efficiency.
Specifically, in the present embodiment, the placing groove 10 is a groove body with a circular structure, and the upper end of the groove body is provided with an opening for storing water so that the polished surface of the silicon wafer 40 is placed in the water tank; which has a diameter greater than the diameter of the silicon wafer 40. The bearing component 20 is perpendicular to the bottom surface of the placing groove 10, and comprises a plurality of bearing parts 21 arranged at intervals and fixing parts 22 which are arranged by the bearing parts 21 in a penetrating manner and used for fixing the bearing parts 21, wherein the outer circle which is connected with the bearing parts 21 and forms a figure is concentric with the placing groove 10, and the outer circle and the placed silicon wafer 40 are concentric, so that the structure is simple, and the processing is easy.
Further, the carrier 21 includes an upper section and a lower section integrally connected to each other, at least the upper section is a cone, and a large diameter surface of the upper section is connected to the lower section. The distance between the top ends of the two upper sections is greater than the diameter of the silicon wafer 40, and the distance between the inner side walls of the lower end surfaces of the two corresponding upper sections is less than the diameter of the silicon wafer 40. Therefore, the silicon wafer 40 is arranged in the upper section in a covered mode, namely the side wall surface of the silicon wafer 40 is in contact with the inner side wall of the upper section of each bearing piece 21, namely the silicon wafer is arranged on the circumscribed circle of the figure surrounded by the bearing pieces 21 in a suspended mode, the front surface of the stock 40 to be polished is not in contact with any bearing piece 21, the front surface polishing surface is not polluted by the outside, the polishing quality is guaranteed, the temporarily-arranged silicon wafer 40 is rapidly moved into the next cleaning procedure, and the linkage of polishing and cleaning is improved.
Preferably, the lower section of the carrier 21 is a cylinder, and the upper end surface of the cylinder is matched with the lower end surface of the upper section. Of course, the supporting member 21 may also have other structures, such as a truncated cone or a polygonal column, and no matter the lower section has any structure, the area of the upper end surface needs to be smaller than or equal to the area of the lower end surface, so as to improve the placing stability of the supporting member 21, and the upper end surface of the lower section is integrally connected with the lower end surface of the upper section.
Preferably, the fixing member 22 has a circular structure and is detachably coupled to the standing groove 10. The diameter of the fixing frame 22 is larger than that of the carrier 21, and the fixing frame 22 and the carrier 21 are coaxially arranged. The fixing frame 22 further stabilizes the stability of the bearing member 21 and improves the strength of the connection between the bearing assembly 20 and the placement groove 10. The fixing member 22 is fixed on the placing groove 10, and the bearing member 21 penetrates through the fixing member 22 under the control of an external force and can move up and down along the thickness of the fixing frame 22, so as to adjust the height position of the suspended silicon wafer 40 to meet the requirements of placing at different heights.
Further, the carrier assembly 20 comprises at least three carriers 21, which are uniformly arranged, as shown in fig. 2. The carrier 21 is arranged to form a regular triangle with a stable structure, and the silicon wafers 40 are respectively contacted with the upper section of the carrier 21, so that the silicon wafers 40 are stably suspended.
Further, as shown in fig. 3, another structure of the carrying assembly 20 includes six carrying members 21, and the six carrying members 21 are divided into two groups and symmetrically disposed on both sides of the diameter of the placing slot 10; and the two outer carriers 21 of each group are arranged symmetrically with respect to the centrally located carrier 21. Each point of the structure contacting the silicon wafer 40 is symmetrically arranged relative to the diameter of the placing groove 10, that is, two groups of reserved operating spaces are symmetrically arranged with a certain gap between the two groups along the two sides of the diameter of the placing groove 10, so that the subsequent cleaning manipulator can take away the silicon wafer 40.
Further, as shown in fig. 4, the liquid ejecting assembly 30 includes a liquid ejecting hole 31, the liquid ejecting hole 31 is disposed right under the silicon wafer 40, and the liquid ejecting hole 31 is disposed at a center of the silicon wafer 40. The solution overflowing from the centrally-arranged liquid spraying hole 31 can keep the front surface of the silicon wafer 40 wet, even if the front surface of the silicon wafer 40 is still in the humid air, which is convenient for the subsequent cleaning of the polished front surface of the silicon wafer 40.
Further, the liquid ejection assembly 30 further includes a liquid ejection hole 31 provided near the outer edge of the silicon wafer 40, that is, a liquid ejection hole 31 may also be provided near the outer end of the radius, as shown in fig. 5; or two liquid spray holes 31 are arranged near the two ends of the diameter, as shown in fig. 2 and 3; the outermost liquid spray holes 31 are arranged in a staggered manner with the bearing member 21; and the liquid spray holes 31 are all located on a radius of the silicon wafer 40. If there are other locations for the liquid ejection holes 31, it is preferable that all of the liquid ejection holes 31 are located on the same diameter or radius of the wafer 40. Not only is the processing facilitated, but also all overflowing liquid flow can be diffused to the two sides in the same direction from the same side, so that the front surface, namely the polishing surface, of the silicon wafer 40 is always in a humid environment, and the front surface of the silicon wafer 40 is kept humid.
Preferably, in this embodiment, all the liquid ejecting holes 31 have the same structure, and may be circular, triangular, or polygonal, so that all the liquid streams ejected from the liquid ejecting holes 31 have the same speed and size, so as to ensure that the front surface of the silicon wafer 40 is surrounded by the humid air, and to minimize the contact between the front surface of the silicon wafer 40 and the liquid streams.
The transfer device designed by the utility model is mainly used for temporarily storing the polished silicon wafers in the water tank and stably placing the polished silicon wafers, the front surfaces of the polished silicon wafers, namely the silicon wafer planes close to one side of the placing tank, are not contacted by any bearing piece, and the placing positions of the silicon wafers can be adjusted to be suitable for height setting with different requirements; the front surface of the silicon wafer, namely the polishing surface, is always in a moist environment, so that the front surface of the silicon wafer is kept moist, and subsequent cleaning is facilitated; meanwhile, the contact of liquid flow to the silicon wafer plane close to one side of the placing groove is reduced to the maximum extent; the polished silicon wafer can be continuously circulated and temporarily stored, energy waste is avoided, linkage of polishing and cleaning is improved, and production efficiency is improved.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (10)
1. The utility model provides a silicon chip uses transfer device after polishing which characterized in that, including the standing groove that carries water liquid and be equipped with on the standing groove:
the bearing assembly is used for supporting the silicon wafer;
and a liquid spraying assembly for spraying liquid to the single side of the silicon wafer;
the bearing assembly is arranged on the inner side of the placing groove and enables the silicon wafer to be arranged in a suspended mode, and the bearing assembly drives the silicon wafer to adjust the position along the height direction of the silicon wafer;
the liquid spraying assembly penetrates through the placing groove and is arranged in a circumscribed circle of the graph formed by the surrounding of the bearing assembly;
the bearing component is in contact with the outer wall surface of the silicon wafer, the plane of one side, close to the placing groove, of the silicon wafer is located at the position of the water level in the placing groove, and the bearing component supports the silicon wafer to ascend so as to leave the transfer device.
2. The transfer device for polished silicon wafers as claimed in claim 1, wherein the carrier assembly is perpendicular to the bottom surface of the placement groove, and comprises a plurality of carriers arranged at intervals and a fixing member penetrated by the carriers and used for fixing the carriers, and the circumscribed circle connecting the carriers to form a figure is concentric with the placement groove.
3. The transfer device for silicon wafers after polishing as claimed in claim 2, wherein the carrier comprises an upper section and a lower section integrally connected with each other, at least the upper section is a cone and a large diameter surface of the upper section is connected with the lower section.
4. The transfer device for use after silicon wafer polishing as claimed in claim 3, wherein the distance between the top ends of the upper sections is greater than the diameter of the silicon wafer, and the distance between the inner side walls of the lower end surfaces of the upper sections is less than the diameter of the silicon wafer.
5. The silicon wafer polishing intermediate transfer device according to claim 3 or 4, wherein the lower section is a cylinder, and an upper end surface of the cylinder is matched with a lower end surface of the upper section.
6. The transfer device for silicon wafers after polishing as claimed in claim 5, wherein the fixing member has a circular structure and is detachably connected to the placing groove.
7. The silicon wafer polishing post-use transfer device according to any one of claims 2-4 and 6, wherein the carrier assembly comprises at least three carriers.
8. The transfer device for the polished silicon wafers as claimed in claim 7, wherein the carrier assembly comprises six carriers, and the six carriers are symmetrically arranged on two sides of the diameter of the placing groove; and the two outer carriers in each set are symmetrically arranged with respect to the middle carrier.
9. The silicon wafer polishing transfer device as claimed in any one of claims 2-4, 6 and 8, wherein the liquid spraying assembly comprises at least one liquid spraying hole located below the center of the silicon wafer.
10. The transit device for silicon wafers after polishing as claimed in claim 9, wherein the liquid spraying assembly further comprises the liquid spraying holes provided near the outer edge of the silicon wafer; the outermost side of the bearing piece is provided with the liquid spraying hole in a staggered manner; and all the liquid spraying holes are positioned on the same radius or diameter of the silicon wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022878514.0U CN214165940U (en) | 2020-12-05 | 2020-12-05 | Transfer device for polished silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022878514.0U CN214165940U (en) | 2020-12-05 | 2020-12-05 | Transfer device for polished silicon wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214165940U true CN214165940U (en) | 2021-09-10 |
Family
ID=77603734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022878514.0U Active CN214165940U (en) | 2020-12-05 | 2020-12-05 | Transfer device for polished silicon wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214165940U (en) |
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2020
- 2020-12-05 CN CN202022878514.0U patent/CN214165940U/en active Active
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Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: No.12 Haitai East Road, Huayuan Industrial Zone, Binhai New Area, Tianjin Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |