CN213858777U

CN213858777U - Automatic cooling device of engraving machine

Info

Publication number: CN213858777U
Application number: CN202022371625.2U
Authority: CN
Inventors: 谢树宏
Original assignee: Dongguan Muma Intelligent Equipment Co ltd
Current assignee: Dongguan Muma Intelligent Equipment Co ltd
Priority date: 2020-10-22
Filing date: 2020-10-22
Publication date: 2021-08-03
Anticipated expiration: 2030-10-22

Abstract

The utility model relates to an engraver technical field specifically is automatic cooling device of engraver, including the coolant liquid case, the inside center department of coolant liquid case is provided with the baffle, and the horizontal welding of one side center department of baffle has the baffle, other trilateral and the inner wall welding of coolant liquid case of baffle, the top equidistance of baffle is arranged and is had the cold plate that looses, and is equipped with between the bottom of baffle and coolant liquid case and holds the chamber, it installs the semiconductor refrigeration piece to hold the intracavity, the inside of coolant liquid case and the opposite side that is located the baffle are provided with the overflow plate. This device is at first inside utilizing baffle and overflow plate etc. to cut apart into a plurality of spaces with the box at the bin of coolant liquid, then prevents in the box that the semiconductor refrigeration piece from cooling off the coolant liquid, can block the higher coolant liquid of temperature and the low-temperature coolant liquid mixture through the overflow plate, and the coolant liquid after the while heat absorption can utilize the fan to carry out preliminary cooling through the capillary region.

Description

Automatic cooling device of engraving machine

Technical Field

The utility model relates to an engraver technical field specifically is automatic cooling device of engraver.

Background

The engraving machine is widely applicable to industries such as machinery, electronics, light industry, advertisement and the like, for example, the engraving machine is used for engraving metal parts, can engrave any figure, image and character on the surfaces of materials such as steel, aluminum, copper, gold, silver and the like, and has the characteristics of being clear, flat and smooth; but is applied in the advertising industry as follows: processing a chest card, cutting a crystal character, carving a three-dimensional character, processing a lamp box assembly, carving characters and patterns and the like. These gravers require high-speed numerical control systems and excellent servo motor characteristics, otherwise the smoothness and clarity of the engraving are affected.

Meanwhile, when the carving knife is used for grinding and carving, due to the fact that the knife rotates at a high speed, friction temperature rises quickly, the service life and the service performance of the knife are affected due to the fact that the temperature is too high, the knife needs to be subjected to water cooling treatment, the temperature of the knife is reduced, and the service life and the performance of the knife are guaranteed. Accordingly, those skilled in the art have provided an automatic cooling device of an engraver to solve the problems set forth in the background art described above.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an automatic cooling device of engraver to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: automatic cooling device of engraver, including the coolant liquid case, the inside center department of coolant liquid case is provided with the baffle, and the horizontal welding of one side center department of baffle has the baffle, other trilateral and the inner wall welding of coolant liquid case of baffle, the top equidistance of baffle is arranged and is had scattered cold plate, and is equipped with between the bottom of baffle and coolant liquid case and holds the chamber, it installs semiconductor refrigeration piece to hold the intracavity, the inside of coolant liquid case and the opposite side that is located the baffle are provided with the overflow plate, and the top of overflow plate and the top of coolant liquid case are on same straight line, the outside laminating of coolant liquid case has the heat dissipation case, and the outside of heat dissipation case has seted up the through-hole, the through-hole department in the heat dissipation case outside is equipped with the fan, and the fan coats and has the dustcoat.

As a further aspect of the present invention: the heat dissipation box is internally provided with a group of capillary tubes, the capillary tubes are connected end to end, the top of each capillary tube is connected with a liquid inlet tube, and the bottom of each capillary tube is provided with a communicating tube.

As a further aspect of the present invention: the top gomphosis of coolant liquid case has sealed lid, and the bottom equidistance that holds the chamber of coolant liquid incasement portion has seted up the louvre, coolant liquid incasement surface bottom both sides are equipped with the pad foot.

As a further aspect of the present invention: the height of overflow plate equals with the height of baffle, and the distance between overflow plate and the baffle is not less than the twice of overflow plate self thickness, it is the copper component to scatter cold piece, and it has heat conduction silica gel to fill between cold piece and the baffle to scatter.

As a further aspect of the present invention: the tip and the engraver main shaft intercommunication of feed liquor pipe, and the tip of communicating pipe runs through the front end outer wall of coolant liquid case and extends to on the baffle.

As a further aspect of the present invention: the water pump is installed to the opposite side of coolant liquid case, and the output of water pump is connected with the drain pipe, the tip of drain pipe and the other end intercommunication of engraver main shaft.

Compared with the prior art, the beneficial effects of the utility model are that: when a general engraving machine is used for cooling, cooling liquid is usually used for cooling, but due to the fact that the storage and the capacity of the cooling liquid are fixed, after the engraving machine works for a long time, the temperature of the cooling liquid can also rise along with the time, and the heat dissipation effect is poor, the cooling liquid is mainly cooled, the box body is firstly divided into a plurality of spaces by using partition plates, overflow plates and the like in the storage box of the cooling liquid, then the cooling liquid is prevented from being cooled by semiconductor refrigerating sheets in the box body, the mixing of the cooling liquid with higher temperature and the cooling liquid with low temperature can be blocked by the overflow plates, meanwhile, the cooling liquid after heat absorption can be primarily cooled by using a fan through a capillary tube area, compared with the cooling liquid of a common engraving machine, natural temperature cooling is achieved, the cooling liquid can be rapidly cooled through the cooling liquid, and therefore the cooling liquid entering the engraving machine can always keep a low temperature state, and then make the cooling effect of engraver better, guaranteed the cutter temperature of engraver to make the life extension of engraver cutter, performance is stable.

Drawings

FIG. 1 is a schematic structural view of an automatic cooling device of an engraving machine;

FIG. 2 is a schematic view showing the internal structure of a coolant tank in the automatic cooling apparatus of the engraving machine;

fig. 3 is a schematic view of the internal structure of a heat dissipation box in the automatic cooling device of the engraving machine.

In the figure: 1. a liquid outlet pipe; 2. a sealing cover; 3. a communicating pipe; 4. a heat dissipation box; 5. a housing; 6. a liquid inlet pipe; 7. a foot pad; 8. a coolant tank; 9. a water pump; 10. an overflow plate; 11. cooling tablets; 12. a partition plate; 13. an accommodating chamber; 14. heat dissipation holes; 15. a semiconductor refrigeration sheet; 16. a baffle plate; 17. a fan; 18. a capillary tube.

Detailed Description

Referring to fig. 1 to 3, in the embodiment of the present invention: automatic cooling device of engraver, including coolant liquid tank 8, the inside center department of coolant liquid tank 8 is provided with baffle 16, and the horizontal welding of one side center department of baffle 16 has baffle 12, other trilateral and the inner wall welding of coolant liquid tank 8 of baffle 12, the top equidistance of baffle 12 is arranged and is had scattered cold plate 11, and be equipped with between the bottom of baffle 12 and coolant liquid tank 8 and hold chamber 13, it installs semiconductor refrigeration piece 15 in the chamber 13 to hold, the inside of coolant liquid tank 8 and the opposite side that is located baffle 16 are provided with overflow plate 10, and the top of overflow plate 10 and the top of coolant liquid tank 8 are on same straight line.

In fig. 2, a sealing cover 2 is embedded on the top of a cooling liquid tank 8, heat dissipation holes 14 are equidistantly formed in the bottom of a containing cavity 13 in the cooling liquid tank 8, pad feet 7 are arranged on two sides of the bottom of the outer surface of the cooling liquid tank 8, the sealing cover 2 is used for opening the cooling liquid tank 8 and adding cooling liquid, the heat dissipation holes 14 are used for dissipating heat generated by the hot end of a semiconductor refrigerating sheet 15, the pad feet 7 can suspend the whole device in the air, so that the heat dissipated by the heat dissipation holes 14 can be quickly volatilized into the surrounding environment, poor heat dissipation effect can not be caused by accumulation, the semiconductor refrigerating sheet 15 is damaged, a heat dissipation tank 4 is attached to the outer side of the cooling liquid tank 8, a through hole is formed in the outer side of the heat dissipation tank 4, a fan 17 is arranged at the through hole in the outer side of the heat dissipation tank 4, an outer cover 5 is covered on the fan 17, a group of capillaries 18 are arranged in the heat dissipation tank 4, the group of capillaries 18 are connected end to end, the top of the outer capillary 18 is connected with a liquid inlet pipe 6, the bottom of the inner capillary 18 is provided with a communicating tube 3.

In fig. 2, the height of the overflow plate 10 is equal to the height of the baffle 16, the distance between the overflow plate 10 and the baffle 16 is not less than twice the thickness of the overflow plate 10, the cooling fins 11 are copper members, and heat-conducting silica gel is filled between the cooling fins 11 and the partition plate 12, the design is mainly to partition the inside of the cooling liquid tank 8, so that the semiconductor cooling fins 15 and the cooling fins 11 are installed, the heat-absorbed cooling liquid can be stored in a specified space, the cooling liquid flows into another space after being cooled by the semiconductor cooling fins 15, and a fall is formed between the overflow plate 10 and the baffle 16, so that the high-temperature cooling liquid and the low-temperature cooling liquid are partitioned.

In fig. 3, the outside laminating of coolant liquid case 8 has heat dissipation case 4, and the through-hole has been seted up in the outside of heat dissipation case 4, the through-hole department in the heat dissipation case 4 outside is equipped with fan 17, and fan 17 coats outward and has dustcoat 5, heat dissipation case 4 mainly is that the coolant liquid after the heat absorption carries out preliminary heat dissipation, thereby make semiconductor refrigeration piece 15's effect better, it is favorable to the heat absorption to make the coolant liquid temperature lower, the effect of dustcoat 5 is protecting fan 17, and fan 17 can blow the coolant liquid after the heat absorption and realize preliminary cooling.

In fig. 3, be equipped with a set of capillary 18 in the heat dissipation case 4, and end to end between a set of capillary 18, the top of outside capillary 18 is connected with feed liquor pipe 6, and the bottom of inboard capillary 18 is equipped with communicating pipe 3, and the coolant liquid after the heat absorption can pass through capillary 18 before getting into coolant liquid case 8, and capillary 18 surface area is big, blows through fan 17, can realize tentatively cooling, and the coolant liquid after tentatively cooling enters into coolant liquid case 8 through communicating pipe 3 inside.

In fig. 1, the end of the liquid inlet pipe 6 is communicated with the main shaft of the engraving machine, and the end of the communicating pipe 3 penetrates through the outer wall of the front end of the cooling liquid tank 8 and extends to the upper part of the partition plate 12, so that the device is connected to the main body of the engraving machine, and the cooling circulation is realized.

In fig. 1, a water pump 9 is installed on the other side of the cooling liquid tank 8, the output end of the water pump 9 is connected with a liquid outlet pipe 1, the end part of the liquid outlet pipe 1 is communicated with the other end of the main shaft of the engraving machine, and low-temperature cooling liquid is conveyed into the engraving machine by the water pump 9.

The utility model discloses a theory of operation is: connect this device in the engraver main part, the low-temperature coolant liquid is taken out to water pump 9 (the model is HQB-2000), and carry the engraver main part inside through the transfer line, the coolant liquid can enter into in the radiating box 4 through feed liquor pipe 6 after having absorbed the heat, capillary 18 surface area in the radiating box 4 is big, blow through fan 17, can realize preliminary cooling, coolant liquid after preliminary cooling enters into coolant liquid box 8 inside through communicating pipe 3, semiconductor refrigeration piece 15 (the model is TEC 1-12706) makes air conditioning and gives the coolant liquid through the cold piece 11 transmission that looses, flow into another space after cooling through semiconductor refrigeration piece 15, form the drop between overflow plate 10 and the baffle 16, thereby cut off high temperature coolant liquid and low-temperature coolant liquid.

The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. Automatic cooling device of engraver, including the coolant liquid case, its characterized in that: a baffle is arranged at the center of the interior of the cooling liquid tank, a baffle plate is horizontally welded at the center of one side of the baffle plate, the other three edges of the partition plate are welded with the inner wall of the cooling liquid box, the top of the partition plate is equidistantly provided with cooling fins, and an accommodating cavity is arranged between the partition board and the bottom of the cooling liquid tank, a semiconductor refrigerating sheet is arranged in the accommodating cavity, an overflow plate is arranged in the cooling liquid tank and at the other side of the baffle plate, the top of the overflow plate and the top of the cooling liquid tank are on the same straight line, the outer side of the cooling liquid tank is jointed with a heat dissipation tank, and the outer side of the heat dissipation box is provided with a through hole, the through hole on the outer side of the heat dissipation box is provided with a fan, an outer cover covers the fan, a group of capillary tubes is arranged in the heat dissipation box, and a group of capillaries are connected end to end, the top of the capillary at the outer side is connected with a liquid inlet pipe, and the bottom of the capillary at the inner side is provided with a communicating pipe.

2. The automatic cooling device of claim 1, wherein a sealing cover is embedded in the top of the cooling liquid tank, heat dissipation holes are formed in the bottom of the accommodating cavity inside the cooling liquid tank at equal intervals, and foot pads are arranged on two sides of the bottom of the outer surface of the cooling liquid tank.

3. The automatic cooling device of an engraving machine as claimed in claim 1, wherein the height of the overflow plate is equal to the height of the baffle, the distance between the overflow plate and the baffle is not less than twice the thickness of the overflow plate, the cooling fins are copper members, and heat-conducting silica gel is filled between the cooling fins and the partition plate.

4. The automatic cooling device of an engraving machine as claimed in claim 1, wherein the end of the liquid inlet pipe is communicated with the main shaft of the engraving machine, and the end of the communicating pipe penetrates through the outer wall of the front end of the cooling liquid tank and extends above the partition plate.

5. The automatic cooling device for the engraving machine as claimed in claim 1, wherein a water pump is installed on the other side of the cooling liquid tank, and a liquid outlet pipe is connected to the output end of the water pump, and the end of the liquid outlet pipe is communicated with the other end of the main shaft of the engraving machine.