CN213847121U - Heat dissipation type PCB board - Google Patents

Heat dissipation type PCB board Download PDF

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Publication number
CN213847121U
CN213847121U CN202022997828.2U CN202022997828U CN213847121U CN 213847121 U CN213847121 U CN 213847121U CN 202022997828 U CN202022997828 U CN 202022997828U CN 213847121 U CN213847121 U CN 213847121U
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China
Prior art keywords
heat dissipation
heating panel
fly leaf
plate body
baffle
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CN202022997828.2U
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Chinese (zh)
Inventor
裘杨杰
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Shengzhou Zhongsheng Electronic Technology Co ltd
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Shengzhou Zhongsheng Electronic Technology Co ltd
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Priority to CN202022997828.2U priority Critical patent/CN213847121U/en
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Abstract

The utility model discloses a heat dissipation type PCB board relates to the circuit board, aims at solving the heating panel and need carry out the circuit board that cutting process is used for the different length of adaptation, influences the problem of the production speed of PCB board, and its technical scheme main points are: the package rubbing board body, the lateral wall of plate body is formed with a plurality of lugs, and the bottom surface of plate body can be dismantled and is connected with the heating panel, and a plurality of heat radiation fins of bottom surface fixedly connected with of heating panel, the upwards baffle that forms in heating panel one side, and one side sliding connection who keeps away from the baffle on the heating panel has the fly leaf, all offers a plurality of recesses that are used for holding the lug embedding on baffle and the fly leaf. The utility model discloses a between plate body embedding fly leaf and the baffle, and in the lug embedding recess on the plate body, then under elastic component's effect, fly leaf and baffle centre gripping plate body to fixed heat radiation fins and plate body make installation convenient and fast.

Description

Heat dissipation type PCB board
Technical Field
The utility model relates to a circuit board, more specifically say, it relates to a heat dissipation type PCB board.
Background
Pcb (printed circuit board), also called printed circuit board, is an important electronic component, which is a support for electronic components and a carrier for electrical connection of electronic components.
The resistance of the resistor of the circuit on the PCB is increased due to the temperature rise, which affects the normal performance of the circuit board, and therefore people often weld the heat dissipation plate on the circuit board.
Because the machines of PCB board installation are different for the length of PCB board differs, thereby make rather than welded heating panel need carry out cutting process, influence the production speed of PCB board.
Therefore, a new solution is needed to solve this problem.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a heat dissipation type PCB board for heating panel installation convenient and fast.
The above technical purpose of the present invention can be achieved by the following technical solutions: the utility model provides a heat dissipation type PCB board, the package rubbing board body, the lateral wall of plate body is formed with a plurality of lugs, the bottom surface of plate body can be dismantled and is connected with the heating panel, a plurality of heat radiation fins of bottom surface fixedly connected with of heating panel, upwards form the baffle on one side of heating panel, one side sliding connection who keeps away from the baffle on the heating panel has the fly leaf, all set up a plurality of recesses that are used for holding the lug embedding on baffle and the fly leaf, be equipped with the elastic component who is used for providing the power of lug embedding recess between fly leaf and the heating panel.
Through adopting above-mentioned technical scheme, when people install the heating panel, the fly leaf slides for between plate body embedding fly leaf and the baffle, and in the lug embedding recess on the plate body, then under elastic component's effect, fly leaf and baffle centre gripping plate body, thereby fixed heat radiation fins and plate body, make installation convenient and fast, heat on the plate body passes through the heat radiation fins conduction on heating panel and the heating panel, thereby reduces the temperature of plate body, and then improves the life of components and parts on the plate body.
The utility model discloses further set up to: the bottom surface fixedly connected with a plurality of sliders of fly leaf, a plurality of spouts with slider sliding connection are seted up to the top surface of heating panel.
Through adopting above-mentioned technical scheme, slide in the spout through the slider to play the guide effect to the fly leaf, conveniently make in the lug embedding groove through the slip fly leaf.
The utility model discloses further set up to: the longitudinal sections of the sliding block and the sliding groove are both T-shaped.
Through adopting above-mentioned technical scheme, be the T type through setting up slider and spout to make the horizontal part of slider inconsistent with the inner wall that leads to groove horizontal part, and then the restriction slider breaks away from the spout, improves the joint strength of slider and spout.
The utility model discloses further set up to: the elastic assembly comprises a fixing plate and a compression spring, the fixing plate is fixedly connected to the heat dissipation plate, and two ends of the compression spring are detachably connected to the fixing plate and the movable plate respectively.
Through adopting above-mentioned technical scheme, when the baffle removed the fly leaf dorsad, compression spring received fly leaf and fixed plate extrusion and takes place deformation to produce and make the fly leaf towards the gliding elasticity of baffle department, the plate body is placed the back, and the movable plate slides towards the baffle under compression spring's effect, makes in the lug embedding recess.
The utility model discloses further set up to: the one side that the fixed plate is close to the fly leaf and the equal fixedly connected with sleeve of one side that the fly leaf is close to the fixed plate, compression spring's both ends are established respectively on two sleeves.
Through adopting above-mentioned technical scheme, because compression spring's both ends cover is established on the sleeve to restriction compression spring removes, and then fixes compression spring and fixed plate and fly leaf.
The utility model discloses further set up to: the radiating fins are provided with a plurality of through grooves distributed in an array mode along the length direction of the radiating fins.
By adopting the technical scheme, the contact area between the radiating fins and the outside is increased by arranging the through grooves, so that the heat transfer efficiency of the radiating fins is improved, and the service life of the PCB is prolonged.
The utility model discloses further set up to: and the top surface of the heat dissipation plate is provided with a heat conduction silicone grease layer which is abutted against the plate body.
Through adopting above-mentioned technical scheme, through setting up heat conduction silicone grease layer, improve the heat transfer efficiency between plate body and the heating panel to improve the radiating efficiency of PCB board, and then be favorable to protecting the components and parts on the PCB board.
The utility model discloses further set up to: the heat dissipation plate is made of copper.
Through adopting above-mentioned technical scheme, the copper has good heat conductivity to add the thermal conduction on the block plate body, and then improve the life of PCB board.
To sum up, the utility model discloses following beneficial effect has: when people install the heating panel, the movable plate is slid, so that the plate body is embedded between the movable plate and the baffle plate, the protruding pieces on the plate body are embedded into the grooves, then under the action of the elastic assembly, the movable plate and the baffle plate are clamped on the plate body, so that the heat dissipation fins and the plate body are fixed, the installation process is convenient and fast, heat on the plate body is conducted through the heating panel and the heat dissipation fins on the heating panel, the temperature of the plate body is reduced, and the service life of components on the plate body is prolonged.
Drawings
FIG. 1 is an exploded view of the present invention;
fig. 2 is an enlarged schematic view of a portion a in fig. 1.
In the figure: 1. a plate body; 2. a tab; 3. a heat dissipation plate; 4. heat dissipation fins; 5. a baffle plate; 6. a movable plate; 7. a groove; 8. a slider; 9. a chute; 10. a fixing plate; 11. a compression spring; 12. a sleeve; 13. a through groove.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and examples.
The utility model provides a heat dissipation type PCB board, as shown in figure 1, the package rubbing board body 1, the lateral wall of plate body 1 is formed with a plurality of lugs 2, the heating panel 3 that is connected with the copper product can be dismantled to the bottom surface of plate body 1, copper has good heat conductivity, thereby add thermal conduction on the block plate body 1, and then improve the life of PCB board, the bottom surface welding of heating panel 3 has a plurality of heat radiation fins 4, set up a plurality of logical groove 13 along its length direction array distribution on the heat radiation fins 4, logical groove 13 is the cuboid form and communicates heat radiation fins 4's lateral wall, 3 one side of heating panel upwards forms baffle 5, there is fly leaf 6 with one side sliding connection that baffle 5 is relative on the heating panel 3, all set up a plurality of recesses 7 that are used for holding lug 2 embedding on baffle 5 and the fly leaf 6, be equipped with the elastic component that is used for keeping lug 2 embedding recesses 7 between fly leaf 6 and the heating panel 3.
As shown in fig. 2, a plurality of sliders 8 with T-shaped longitudinal sections are bonded to the bottom surface of the movable plate 6, a plurality of sliding grooves 9 for accommodating the sliders 8 to slide are formed in the top surface of the heat dissipation plate 3, the longitudinal sections of the sliding grooves 9 are T-shaped, and the transverse portions of the sliders 8 are embedded into the transverse portions of the sliding grooves 9.
As shown in fig. 2, the elastic assembly includes a fixed plate 10 and a compression spring 11, the fixed plate 10 is welded on the side wall of the heat dissipation plate 3, both a side of the fixed plate 10 close to the movable plate 6 and a side of the movable plate 6 close to the fixed plate 10 are welded with cylindrical sleeves 12, and both ends of the compression spring 11 are respectively sleeved on the two sleeves 12.
As shown in fig. 1, the top surface of the heat dissipation plate 3 is coated with heat-conducting silicone grease, so as to form a heat-conducting silicone grease layer which is inconsistent with the bottom surface of the plate body 1, and the heat-conducting silicone grease layer is used for improving the heat transfer efficiency between the plate body 1 and the heat dissipation plate 3, thereby improving the heat dissipation efficiency of the PCB, and further being beneficial to protecting components on the PCB.
When people install the heat dissipation plate 3, the movable plate 6 slides back to the baffle 5, the slide block 8 slides in the chute 9, the slide block 8 and the chute 9 are both in a T shape, so that the transverse part of the slide block 8 is abutted against the inner wall of the transverse part of the chute 9, the slide block 8 is further limited to be separated from the chute 9, the connection strength of the slide block 8 and the chute 9 is improved, the slide block 8 moves to guide the movable plate 6, the compression spring 11 is extruded by the movable plate 6 and the fixed plate 10 to deform, so that elastic force for enabling the movable plate 6 to slide towards the baffle 5 is generated, the two ends of the compression spring 11 are sleeved on the sleeve 12, so that the compression spring 11 is limited to move, then the plate body 1 is embedded between the movable plate 6 and the baffle 5, the lug 2, close to one side of the baffle 5, of the plate body 1 is embedded into the groove 7, and then the movable plate 6 slides towards the baffle 5 under the action of the compression spring 11, so that the lug 2 near one side of the movable plate 6 is embedded into the groove 7, and the movable plate 6 and the baffle 5 clamp the plate body 1, thereby fixing the plate body 1 and the heat dissipation fins 4 and facilitating the installation process.
The heat on the plate body 1 is conducted through the heat dissipation plate 3 and the heat dissipation fins 4 on the heat dissipation plate 3, so that the temperature of the plate body 1 is reduced, the through grooves 13 improve the contact area between the heat dissipation fins 4 and the outside, the heat transfer efficiency of the heat dissipation fins 4 is further improved, the heat dissipation on the plate body 1 is accelerated, and the service life of the PCB is further prolonged.
It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (8)

1. The utility model provides a heat dissipation type PCB board which characterized in that: the package rubbing board body (1), the lateral wall of plate body (1) is formed with a plurality of lugs (2), the bottom surface of plate body (1) can be dismantled and is connected with heating panel (3), a plurality of heat radiation fins (4) of the bottom surface fixedly connected with of heating panel (3), upwards form baffle (5) in heating panel (3) one side, one side sliding connection who keeps away from baffle (5) on heating panel (3) has fly leaf (6), all set up a plurality of recesses (7) that are used for holding lug (2) embedding on baffle (5) and fly leaf (6), be equipped with the elastic component who is used for providing the power of lug (2) embedding recess (7) between fly leaf (6) and heating panel (3).
2. The heat dissipation type PCB of claim 1, wherein: the bottom surface fixedly connected with a plurality of sliders (8) of fly leaf (6), a plurality of spout (9) with slider (8) sliding connection are seted up to the top surface of heating panel (3).
3. The heat dissipation type PCB board of claim 2, wherein: the longitudinal sections of the sliding block (8) and the sliding groove (9) are both T-shaped.
4. The heat dissipation type PCB of claim 1, wherein: elastic component includes fixed plate (10) and compression spring (11), fixed plate (10) fixed connection is on heating panel (3), the connection can be dismantled respectively on fixed plate (10) and fly leaf (6) at the both ends of compression spring (11).
5. The heat dissipation type PCB board of claim 4, wherein: the one side that fixed plate (10) are close to fly leaf (6) and fly leaf (6) are close to equal fixedly connected with sleeve (12) of one side of fixed plate (10), the both ends of compression spring (11) are established respectively on two sleeves (12).
6. The heat dissipation type PCB of claim 1, wherein: the radiating fins (4) are provided with a plurality of through grooves (13) distributed in an array manner along the length direction of the radiating fins.
7. The heat dissipation type PCB of claim 1, wherein: the top surface of the heat dissipation plate (3) is provided with a heat conduction silicone grease layer which is abutted against the plate body (1).
8. The heat dissipation type PCB of claim 1, wherein: the heat dissipation plate (3) is made of copper.
CN202022997828.2U 2020-12-14 2020-12-14 Heat dissipation type PCB board Active CN213847121U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022997828.2U CN213847121U (en) 2020-12-14 2020-12-14 Heat dissipation type PCB board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022997828.2U CN213847121U (en) 2020-12-14 2020-12-14 Heat dissipation type PCB board

Publications (1)

Publication Number Publication Date
CN213847121U true CN213847121U (en) 2021-07-30

Family

ID=76998172

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022997828.2U Active CN213847121U (en) 2020-12-14 2020-12-14 Heat dissipation type PCB board

Country Status (1)

Country Link
CN (1) CN213847121U (en)

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