CN209767096U - Novel heat dissipation bus duct - Google Patents

Abstract

The utility model discloses a novel heat dissipation bus duct, which comprises a bottom plate, a mounting plate, a first heat dissipation device, a dustproof device and a heat conduction device; a bottom plate: the cross section of the heat conduction plate is U-shaped, heat conduction plates are uniformly arranged at the bottom of an inner cavity of the bottom plate, a wiring channel is formed between every two adjacent heat conduction plates, rectangular clamping grooves are symmetrically formed in the upper end of the inner side surface of the bottom plate, I-shaped sliding grooves are formed in the surfaces of the two sides of the bottom plate, I-shaped sliding blocks are arranged in the I-shaped sliding grooves in a sliding mode, and mounting plates are fixed to the upper ends of the I-shaped; the first heat dissipation device: it includes heating panel, phase transition heat absorption piece and first louvre, and the heating panel passes through the fixture block joint of both sides inside the bottom plate, and the first louvre of vertically arranging is evenly seted up on the surface of heating panel, and the inside inlaying of heating panel that is located between the first louvre has the phase transition heat absorption piece. This novel heat dissipation bus duct has good radiating effect to can effectively avoid the dust to enter into inside the bus duct when the heat dissipation.

Description

Novel heat dissipation bus duct

Technical Field

The utility model relates to a bus duct technical field specifically is a novel heat dissipation bus duct.

Background

the bus duct is a closed metal device formed from copper and aluminium bus posts, and is used for distributing large power for every element of dispersion system. Wire and cable have been replaced more and more in indoor low pressure electric power transmission main line engineering project, but current bus duct can produce a large amount of heats in its use because of its inside is provided with a plurality of conductive element to only dispel the heat through simple louvre, heat dispersion is poor, also can not play fine dustproof effect at the heat dissipation in-process, leads to the life of device to reduce, for this reason, we propose a novel heat dissipation bus duct.

SUMMERY OF THE UTILITY MODEL

the to-be-solved technical problem of the utility model is to overcome current defect, provide a novel heat dissipation bus duct, have good radiating effect to can effectively avoid the dust to enter into the bus duct inside radiating, convenient to use can effectively solve the problem in the background art.

in order to achieve the above object, the utility model provides a following technical scheme: a novel heat dissipation bus duct comprises a bottom plate, a mounting plate, a first heat dissipation device, a dustproof device and a heat conduction device;

A bottom plate: the cross section of the heat conduction plate is U-shaped, heat conduction plates are uniformly arranged at the bottom of an inner cavity of the bottom plate, a wiring channel is formed between every two adjacent heat conduction plates, rectangular clamping grooves are symmetrically formed in the upper end of the inner side surface of the bottom plate, I-shaped sliding grooves are formed in the surfaces of the two sides of the bottom plate, I-shaped sliding blocks are arranged in the I-shaped sliding grooves in a sliding mode, and mounting plates are fixed to the upper ends of the I-shaped sliding;

The first heat dissipation device: the phase-change heat-absorbing plate comprises a heat-absorbing plate, phase-change heat-absorbing blocks and first heat-radiating holes, wherein the heat-absorbing plate is clamped inside a bottom plate through clamping blocks on two sides, the first heat-radiating holes which are longitudinally distributed are uniformly formed in the surface of the heat-absorbing plate, and the phase-change heat-absorbing blocks are embedded inside the heat-absorbing plate between the first heat-radiating holes;

The heat conduction device comprises a middle shell fixed on the inner side of the mounting plate, and a guide plate is arranged in the middle of the middle shell through a bracket;

a dustproof device: the heat dissipation structure comprises a shell and second heat dissipation holes, wherein the shell and the second heat dissipation holes are fixed on the outer side of a mounting plate;

Wherein, the shell is located the outside of mesochite, and the upper end and the contact of heating panel lower extreme of heat-conducting plate are favorable to the heat dissipation.

as a preferred technical scheme of the utility model, the phase transition heat absorption piece of heating panel is corresponding with the position of heat-conducting plate, wiring passageway is corresponding with first radiating hole position, the phase transition heat absorption piece is polyethylene PE piece or polypropylene PP piece, utilizes phase change material heat absorption to reach radiating purpose.

as an optimal technical scheme of the utility model, the guide plate is arc and its arc towards the mesochite direction, has electrostatic precipitator paper in the laminating of the arc upper surface of guide plate, and electrostatic precipitator paper can adsorb partial dust.

As an optimized technical scheme of the utility model, two heat dissipation through grooves have been seted up on the surface of mesochite, and the position of heat dissipation through groove is corresponding with the position of guide plate.

as the utility model discloses an optimized technical scheme, mesochite and shell are the arc casing, and vacuole formation is the heat dissipation chamber between mesochite and shell, and the heat can be through the second louvre effluvium, has further increased its heat dispersion.

Compared with the prior art, the beneficial effects of the utility model are that: the novel heat dissipation bus duct has the advantages that the bottom plate is separated into wiring channels through the heat conduction plate, the heat conduction plate with the maximized heat can be led out, and the heat can be dissipated out or conducted to the heat dissipation plate, the phase change heat absorption block of the heat dissipation plate absorbs partial heat to achieve the purpose of cooling, partial heat is dissipated through the first heat dissipation holes, hot air rises due to low density of hot air, the hot air is guided upwards through the arc-shaped flow guide plate and enters between the middle shell and the shell through the heat dissipation through grooves, at the moment, the second heat dissipation holes of the shell dissipate the heat through multiple heat dissipation, the heat dissipation effect is good, and the electrostatic dust removal paper on the flow guide plate can absorb part of dust entering between the shell and the middle shell through the heat dissipation through grooves, so that the novel heat dissipation bus duct has good heat dissipation effect, and can effectively prevent the dust from entering the bus duct, is convenient to use.

drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention with the outer shell removed;

Fig. 3 is an enlarged view of the structure at a position of the present invention.

in the figure: the heat dissipation device comprises a base plate 1, a clamping groove 101, a heat conduction plate 2, a wiring channel 3, a heat dissipation plate 4, a clamping block 401, a phase change heat absorption block 5, a first heat dissipation hole 6, a sliding groove 7, a mounting plate 8, a sliding block 9, a middle shell 10, a heat dissipation through groove 11, a shell 12, a second heat dissipation hole 13, a support 14, a guide plate 15 and electrostatic dust removal paper 16.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a novel heat dissipation bus duct comprises a bottom plate 1, a mounting plate 8, a first heat dissipation device, a dustproof device and a heat conduction device;

Bottom plate 1: the section of the heat conduction plate is U-shaped, the heat conduction plates 2 are uniformly arranged at the bottom of the inner cavity of the bottom plate 1, the heat conduction plates 2 are copper plates or iron plates, a layer of insulating paint is sprayed on the surfaces of the copper plates or the iron plates, the heat conductivity of the copper plates and the iron plates is good, wiring channels 3 are formed between the adjacent heat conduction plates 2, when a circuit generates heat between the wiring channels 3, the two adjacent heat conduction plates 2 can conduct heat to the maximum extent, rectangular clamping grooves 101 are symmetrically formed in the upper end of the inner side surface of the bottom plate 1, I-shaped sliding grooves 7 are formed in the surfaces of the two sides of the bottom plate 1, I-shaped sliding blocks 9 are arranged in the I-shaped sliding grooves 7;

The first heat dissipation device: the heat dissipation plate comprises a heat dissipation plate 4, phase change heat absorption blocks 5 and first heat dissipation holes 6, wherein the heat dissipation plate 4 is clamped inside a bottom plate 1 through clamping blocks 401 on two sides, the heat dissipation plate 4 is made of an iron plate, the first heat dissipation holes 6 which are longitudinally distributed are uniformly formed in the surface of the heat dissipation plate 4, the phase change heat absorption blocks 5 are embedded inside the heat dissipation plate 4 between the first heat dissipation holes 6, the phase change heat absorption blocks 5 of the heat dissipation plate 4 correspond to the heat conduction plate 2, a wiring channel 3 corresponds to the first heat dissipation holes, the phase change heat absorption blocks 5 are Polyethylene (PE) blocks or polypropylene (PP) blocks, when the temperature rises, the phase change heat absorption blocks 5 can absorb part of heat, and part of the;

The heat conduction device comprises a middle shell 10 fixed on the inner side of the mounting plate 8, a guide plate 15 is mounted in the middle of the middle shell 10 through a support 14, the guide plate 15 is an arc-shaped plate, the arc of the guide plate faces the direction of the middle shell 10, two heat dissipation through grooves 11 are formed in the surface of the middle shell 10, the positions of the heat dissipation through grooves 11 correspond to the positions of the guide plate 15, hot air rises due to low density of hot air, is guided upwards through the arc-shaped guide plate, enters the space between the middle shell 10 and the shell 12 through the heat dissipation through grooves 11, at the moment, second heat dissipation holes 13 of the shell 12 dissipate heat, electrostatic dust removal paper 16 is attached to the arc-shaped upper surface of the guide plate 15, and can absorb part of dust entering the space between the shell 12 and the middle shell 10 through the second;

A dustproof device: the dust collector comprises a shell 12 and second heat radiating holes 13 which are fixed on the outer side of a mounting plate 8, wherein the second heat radiating holes 13 are uniformly formed in the surface of the shell 12, the shell 12 plays a role in isolating part of dust, and a small part of dust enters between the shell 12 and a middle shell 10 through the second heat radiating holes 13;

wherein, shell 12 is located the outside of mesochite 10, and mesochite 10 and shell 12 are the arc casing, and form the cavity and be the heat dissipation chamber between mesochite 10 and shell 12, and the upper end and the contact of 4 lower extremes of heating panel of heat-conducting plate 2, heat-conducting plate 2 is with heat dissipation or conduct on the heating panel.

when in use: the shell 12 plays the effect of isolated part dust, few part dust enters into between shell 12 and the mesochite 10 through second louvre 13, because hot-air density is less, the hot-air rises, upwards through curved guide plate water conservancy diversion, it enters into between mesochite 10 and shell 12 through heat dissipation through groove 11, the second louvre 13 of shell 12 gives off the heat this moment, the arc upper surface laminating of guide plate 15 has electrostatic precipitator paper 16, can adsorb the part and enter into the dust that gets into through heat dissipation through groove 11 again between shell 12 and mesochite 10 through second louvre 13, when the circuit produces heat between wiring passageway 3, two adjacent heat-conducting plates 2 can maximum heat conduction.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a novel heat dissipation bus duct, its characterized in that: the heat dissipation device comprises a bottom plate (1), a mounting plate (8), a first heat dissipation device, a dustproof device and a heat conduction device;

Base plate (1): the cross section of the heat conduction plate is U-shaped, the heat conduction plates (2) are uniformly arranged at the bottom of an inner cavity of a bottom plate (1), a wiring channel (3) is formed between every two adjacent heat conduction plates (2), rectangular clamping grooves (101) are symmetrically formed in the upper end of the inner side surface of the bottom plate (1), I-shaped sliding grooves (7) are formed in the surfaces of the two sides of the bottom plate (1), I-shaped sliding blocks (9) are arranged in the I-shaped sliding grooves (7) in a sliding mode, and mounting plates (8) are fixed at the upper ends of the I-shaped sliding blocks;

The first heat dissipation device: the phase-change heat sink comprises a heat dissipation plate (4), phase-change heat absorption blocks (5) and first heat dissipation holes (6), wherein the heat dissipation plate (4) is clamped inside a bottom plate (1) through clamping blocks (401) on two sides, the first heat dissipation holes (6) which are longitudinally distributed are uniformly formed in the surface of the heat dissipation plate (4), and the phase-change heat absorption blocks (5) are embedded inside the heat dissipation plate (4) between the first heat dissipation holes (6);

The heat conduction device comprises a middle shell (10) fixed on the inner side of the mounting plate (8), and a guide plate (15) is mounted in the middle of the middle shell (10) through a support (14);

A dustproof device: the heat dissipation structure comprises a shell (12) and second heat dissipation holes (13), wherein the shell (12) and the second heat dissipation holes (13) are fixed on the outer side of a mounting plate (8), and the second heat dissipation holes (13) are uniformly formed in the surface of the shell (12);

wherein, the shell (12) is positioned outside the middle shell (10), and the upper end of the heat conducting plate (2) is contacted with the lower end of the heat radiating plate (4).

2. A novel heat dissipation bus duct of claim 1, characterized in that: the phase change heat absorption block (5) of the heat dissipation plate (4) corresponds to the heat conduction plate (2), the wiring channel (3) corresponds to the first heat dissipation hole, and the phase change heat absorption block (5) is a Polyethylene (PE) block or a polypropylene (PP) block.

3. A novel heat dissipation bus duct of claim 1, characterized in that: the guide plate (15) is an arc-shaped plate, the arc of the guide plate faces the direction of the middle shell (10), and the upper surface of the arc of the guide plate (15) is attached with electrostatic dust removal paper (16).

4. A novel heat dissipation bus duct according to claim 1 or 3, characterized in that: two heat dissipation through grooves (11) are formed in the surface of the middle shell (10), and the positions of the heat dissipation through grooves (11) correspond to the positions of the guide plates (15).

5. A novel heat dissipation bus duct of claim 1, characterized in that: the middle shell (10) and the outer shell (12) are both arc-shaped shells, and a cavity formed between the middle shell (10) and the outer shell (12) is a heat dissipation cavity.