CN213845224U

CN213845224U - Chip testing seat

Info

Publication number: CN213845224U
Application number: CN202022739923.2U
Authority: CN
Inventors: 闵哲
Original assignee: Suzhou Langzhirui Electronic Technology Co ltd
Current assignee: Suzhou Langzhirui Electronic Technology Co ltd
Priority date: 2020-11-24
Filing date: 2020-11-24
Publication date: 2021-07-30
Anticipated expiration: 2030-11-24

Abstract

The utility model relates to a chip test seat, which comprises a supporting block, wherein a PCB (printed circuit board) is arranged on the supporting block, and a test seat main body is arranged on the PCB; a cover plate is covered above the test seat main body, and a through hole is formed in the cover plate; the test seat main body comprises a lower panel, and a lower spacer is arranged on the lower panel; two lower test groups which are symmetrically arranged are arranged on the lower spacer; the lower spacer is provided with an upper spacer; two upper test groups are symmetrically arranged on the upper spacer, and the upper test groups and the lower test groups are arranged up and down correspondingly; a positioning plate is arranged above the upper test group; a limiting groove for limiting the chip is arranged in the positioning plate and is positioned in the through hole of the cover plate; go up the test group and test the one end of group and pass down the panel down and contact with the pad on the PCB, go up the test group and test the other end of group down and pass the spacing groove and contact with the chip, the utility model provides the high reliability of test group and test group contact down on chip has improved the positioning accuracy of last test group and chip down simultaneously, improves the measuring accuracy.

Description

Chip testing seat

Technical Field

The utility model relates to an electrical property detection device especially relates to a chip test seat.

Background

The test seat has the advantages that various performance tests are required in the large-scale research and development and production processes of semiconductor chips, the chip test seat is a key part in testing, the test seat has the function of positioning the chips and then transmitting electronic signal current between circuit boards, so that the test effect is achieved, and the quality and the matching degree of the test seat directly influence the test judgment accuracy.

Present common test seat product location is ordinary suction nozzle automatic correction counterpoint location and presss from both sides and grabs the location, and the test piece is installed and is milled heavy groove through the spacer and put into the test piece and fix in the spacer, but discovers after long-time production that such production mode has following shortcoming:

1. the spacing installation of sink groove is milled through spacer (nonmetal) after the test piece installation, and sink the easy wearing and tearing of groove and influence positioning accuracy, the test piece takes place the skew with the product contact and produces the test badly.

2. The angle of the test piece is pressed and displaced after the product contacts the test piece, the contact surface deviates, and the test effect is worse and worse along with the aggravation of the abrasion.

3. During testing, metal and plastic waste residues are produced, the product is in long-time high-speed contact with a test piece, and the test piece is heated, so that the testing performance and quality are directly influenced.

4. The material jamming phenomenon caused by the burrs of the product and other reasons can be caused during the test.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the purpose is in order to overcome prior art not enough and provide a contact reliability of going up test piece and chip high, and the location is accurate to guarantee that the measuring accuracy is high, can in time clear up the waste material simultaneously, the stable chip test seat of equipment operation.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a chip test socket comprises a supporting block, wherein a PCB is arranged on the supporting block, and a test socket main body is arranged on the PCB; a cover plate is covered above the test seat main body, and a through hole is formed in the cover plate; the test seat main body comprises a lower panel, and a lower spacer is arranged on the lower panel; two symmetrically arranged lower test groups are clamped on the lower spacer, and each lower test group consists of a plurality of lower test pieces; an upper spacer is arranged on the lower spacer; the upper spacer is provided with two upper test groups which are symmetrically arranged in a clamping manner, each upper test group consists of a plurality of upper test pieces, and the upper test pieces and the lower test pieces are arranged in a corresponding manner from top to bottom; a positioning plate is arranged above the upper test group; a bump 37 is arranged on the positioning plate 35; a limiting groove for limiting the chip is arranged in the bump 37, the limiting groove penetrates through the positioning plate, and the limiting groove is positioned in the through hole of the cover plate; one ends of the upper test set and the lower test set penetrate through the lower panel to be in contact with the bonding pads on the PCB, and the other ends of the upper test set and the lower test set penetrate through the limiting grooves to be in contact with the chips.

Furthermore, the lower panel is provided with a positioning pin, and the positioning pin sequentially penetrates through the lower spacer and the upper spacer and positions the lower panel, the lower spacer and the upper spacer.

Furthermore, the upper test piece comprises an upper test piece main body, two ends of the upper test piece main body are respectively provided with a first needle leg and a first needle point, and an accommodating port is arranged above the first needle leg; the upper test piece main body is provided with a body embedding clamping groove and an elastic buckle embedding clamping groove;

the lower test piece comprises a lower test piece main body, a second needle leg and a second needle point are respectively arranged at two ends of the lower test piece main body, and the second needle leg is arranged in the accommodating port; and the lower test piece main body is provided with a body embedding fixture block and an elastic buckle embedding fixture block.

Furthermore, a plurality of needle leg limiting holes are formed in the lower panel, and the needle leg limiting holes are arranged corresponding to the first needle legs and the second needle legs.

Furthermore, the upper spacer and the lower spacer are internally provided with a lower body groove and a clamping groove for embedding the adaptive body into the clamping block and embedding the elastic buckle into the clamping block.

Furthermore, a needle tip positioning groove matched with the first needle tip and the second needle tip is arranged in the limiting groove.

Further, the test socket main body is fixed on the PCB board through a plurality of fasteners on the cover plate.

Furthermore, an air tap is arranged at the top of the cover plate and communicated with an air flow groove in the cover plate, and the air flow groove is communicated with the circulation groove on the bump.

Furthermore, the upper end of the cover plate is provided with a pull groove, two ends of the pull groove are provided with square stacking sensors, and the two square stacking sensors are respectively positioned at two ends of the chip.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

the utility model discloses the chip test seat of scheme, overall structure is compact, will go up the spacer, the spacer is down, go up test piece and test piece whole assembly down and be in the same place, and utilize the spacing pore pair of needle point constant head tank and pin leg to go up test piece and test piece down and carry on spacingly, the positioning accuracy of test piece and chip has also been improved when having improved the reliability of contact, thereby improve whole test accuracy, the cleanness and the constant temperature of air cock to test area have been increased in addition, make the test continuously keep stable the test, install the card material phenomenon that fold material sensor real time monitoring appears when testing additional simultaneously, in time the discovery is in time relieved, keep equipment normal operating, and the production efficiency is improved.

Drawings

The technical scheme of the utility model is further explained by combining the attached drawings as follows:

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is an enlarged view of portion A of FIG. 1;

FIG. 3 is a schematic view of the three-dimensional exploded structure of the present invention;

FIG. 4 is an enlarged view of portion B of FIG. 3;

FIG. 5 is an enlarged view of portion C of FIG. 3;

FIG. 6 is a top view of the present invention;

FIG. 7 is a schematic structural view of a positioning plate;

FIG. 8 is an exploded view of the test socket body;

FIG. 9 is an enlarged view of portion D of FIG. 8;

FIG. 10 is a schematic perspective view of an upper test piece;

FIG. 11 is a schematic perspective view of a lower test piece;

wherein: the test socket comprises a supporting block 1, a PCB (printed Circuit Board) 2, a test socket main body 3, a cover plate 4, a chip 5, a bonding pad 20, a lower panel 30, a lower spacer 31, a lower test piece 32, an upper spacer 33, an upper test piece 34, a positioning plate 35, a positioning pin 36, a bump 37, an air nozzle 41, an air flow groove 42, a pull groove 43, a square stacking sensor 44, a flow groove 45, a body embedding fixture block 80, an elastic buckle embedding fixture block 81, an upper test piece main body 320, a first needle leg 321, a first needle point 322, an accommodating port 323, a lower test piece main body 340, a second needle leg 341, a second needle point 342, a needle leg limiting hole 300, a lower layer body groove 82, a clamping groove 83, a needle point positioning groove 351 and a limiting groove 350.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1-11, the chip testing socket of the present invention includes a supporting block 1, a PCB board 2 is disposed on the supporting block 1, and a testing socket main body 3 is disposed on the PCB board 2; and a cover plate 4 covers the upper part of the test seat main body 3, and a through hole is formed in the cover plate 4.

Specifically, the test socket main body 3 comprises a lower panel 30, and a lower spacer 31 is arranged on the lower panel 30; two symmetrically arranged lower test groups are clamped on the lower spacer 31, and each lower test group consists of five lower test pieces 32 arranged in parallel; an upper spacer 33 is arranged on the lower spacer; the upper spacer 33 is clamped with two symmetrically arranged upper test groups, each upper test group consists of five upper test pieces 34, and the upper test pieces 32 and the lower test pieces 34 are sequentially arranged up and down correspondingly; a positioning plate 35 is arranged above the upper test group; a bump 37 is arranged on the positioning plate 35; a limiting groove 350 for limiting the chip is arranged in the bump 37, and the limiting groove 350 penetrates through the positioning plate; the chip is arranged in the limiting groove 350, and the limiting groove 350 is just positioned in the through hole of the cover plate; one end of the upper test set and the lower test set passes through the lower panel 30 to contact with the pads 20 on the PCB 2, and the other end of the upper test set and the lower test set passes through the limiting groove 350 to contact with the chip 5.

As a further preferred embodiment, a positioning pin 36 is provided on the lower panel 30, and the positioning pin 36 sequentially passes through the lower spacer 31 and the upper spacer 33, and positions the lower panel 30, the lower spacer 31, and the upper spacer 33, thereby determining positioning accuracy.

As a further preferred embodiment, the upper test strip 32 comprises an upper test strip body 320, a first pin 321 and a first needle tip 322 are respectively arranged at two ends of the upper test strip body 320, and a receiving port 323 is arranged above the first pin 321; the upper test piece main body 320 is provided with a body embedding fixture block 80 and an elastic buckle embedding fixture block 81.

The lower test strip 34 comprises a lower test strip main body 340, wherein a second pin 341 and a second needle point 342 are respectively arranged at two ends of the lower test strip main body 340, and the second pin 341 is arranged in the accommodating port 313; the lower test piece main body 340 is provided with a body embedding fixture block 80 and an elastic buckle embedding fixture block 81.

As a further preferred embodiment, the lower panel 30 is provided with a plurality of pin leg limiting holes 300, and the pin leg limiting holes 300 are arranged corresponding to the positions of the first pin leg 311 and the second pin leg 341.

As a further preferred embodiment, the upper spacer 31 and the lower spacer 33 are provided with a lower body groove 82 and a locking groove 83 for fitting the body-embedded latch and the elastic snap-embedded latch.

As a further preferred embodiment, a needle tip positioning groove 351 which is matched with the first needle tip 322 and the second needle tip 342 is arranged in the limiting groove 350.

The utility model provides an go up spacer, lower spacer, a plurality of test piece and test piece down and be an assembly body, increase the test piece and the test piece down of the test piece of different quantity and different models according to the test demand.

Wherein, go up the spacer and form for non-metallic material processing with lower spacer, go up test strip and pack into respectively through body embedding fixture block 80 and elasticity buckle embedding fixture block 81 and form the location relation that corresponds each other after lower floor's body groove 82 and the draw-in groove 8 in spacer and the lower spacer, the locating pin on the panel is fixed a position with the test seat main part and is formed whole location relation under the rethread, thereby the precision of the cooperation contact chip that assurance whole cooperation precision can be better has improved the reliability and the validity of test.

In addition, the cover plate and the test seat main body are penetrated and positioned through the pin, so that the upper spacer, the lower spacer, the upper test piece, the lower test piece, the PCB and the support block form an integral positioning relation, a product is placed in the through hole of the cover plate and then arranged in the limiting groove of the positioning plate, and the chip is accurately tested.

The upper test piece and the lower test piece adopt a more reasonable design and are combined with a mechanical structure, the slow wire cutting precision is higher, the accurate positioning and testing alignment precision can be controlled, the accurate positions of the first needle point and the second needle point and the chip are controlled through the needle point positioning groove 351 in the limiting groove, and the effective butt joint precision of the first needle leg and the second needle leg and the bonding pad 20 on the PCB is ensured through the needle leg limiting hole 300.

As a further preferred embodiment, the cover plate 4 fixes the test socket body 3 to the PCB board 2 by means of a plurality of fasteners.

As a further preferred implementation, the top of the cover plate 4 is provided with an air tap 41, the air tap 41 is communicated with an air flow groove 42 inside the cover plate, and the air flow groove 42 is communicated with a flow groove 43 on the

projection

37, 4; in actual use, air is supplied through the air nozzle, and then the air is supplied to the detection core area of the chip through the air flow groove 42 and the circulation groove 43, so that the air flow circularly blows in the area to ensure cleanness and constant temperature, and the test of the chip is kept in a stable state.

As a further preferred embodiment, the upper end of the cover plate 4 is provided with a pull groove 43, two ends of the pull groove 43 are provided with square stacking sensors 44, and the two square stacking sensors 44 are respectively located at two ends 5 of the chip, by additionally arranging the two square stacking sensors 44, the chip can be subjected to opposite light emitting sensation via the two square stacking sensors 44 during each downward pressing test, the material blocking phenomenon during the test is monitored in real time, timely removal is found, normal operation of the device is maintained, and the production efficiency is improved.

The utility model discloses a chip test seat, overall structure is compact, will go up the spacer, the spacer is down, go up test piece and test piece whole assembly down and be in the same place, and utilize the spacing pore pair of needle point constant head tank and pin leg to go up test piece and test piece down and carry on spacingly, the positioning accuracy of test piece and chip has also been improved when having improved the reliability of contact, thereby improve whole measuring accuracy, the cleanness and the constant temperature of air cock to test area have been increased in addition, make the test continuously keep stable the test, install the card material phenomenon that fold material sensor real time monitoring appears when testing additional simultaneously, in time the discovery is in time relieved, keep equipment normal operation, and the production efficiency is improved.

The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.

Claims

1. A chip test socket comprises a supporting block, wherein a PCB is arranged on the supporting block, and a test socket main body is arranged on the PCB; a cover plate is covered above the test seat main body, and a through hole is formed in the cover plate; the method is characterized in that:

the test seat main body comprises a lower panel, and a lower spacer is arranged on the lower panel; two symmetrically arranged lower test groups are clamped on the lower spacer, and each lower test group consists of a plurality of lower test pieces; an upper spacer is arranged on the lower spacer; the upper spacer is provided with two upper test groups which are symmetrically arranged in a clamping manner, each upper test group consists of a plurality of upper test pieces, and the upper test pieces and the lower test pieces are arranged in a corresponding manner from top to bottom; a positioning plate is arranged above the upper test group; the positioning plate is provided with a convex block; a limiting groove for limiting the chip is arranged in the bump, the limiting groove penetrates through the positioning plate, and the limiting groove is positioned in the through hole of the cover plate; one ends of the upper test set and the lower test set penetrate through the lower panel to be in contact with the bonding pads on the PCB, and the other ends of the upper test set and the lower test set penetrate through the limiting grooves to be in contact with the chips.

2. The die test socket according to claim 1, wherein: be equipped with the locating pin on the lower panel, the locating pin passes spacer and last spacer down in proper order to panel, spacer and last spacer down are fixed a position.

3. The die test socket according to claim 1, wherein:

the upper test piece comprises an upper test piece main body, two ends of the upper test piece main body are respectively provided with a first needle leg and a first needle point, and an accommodating port is arranged above the first needle leg; the upper test piece main body is provided with a body embedding clamping groove and an elastic buckle embedding clamping groove;

4. The die test socket according to claim 3, wherein: the lower panel is provided with a plurality of needle leg limiting holes, and the needle leg limiting holes are arranged corresponding to the first needle legs and the second needle legs.

5. The die test socket according to claim 3, wherein: go up spacer and lower spacer and be equipped with lower floor's body groove and draw-in groove of adaptation body embedding fixture block and elasticity buckle embedding fixture block.

6. The die test socket according to claim 1, wherein: and a needle tip positioning groove matched with the first needle tip and the second needle tip is arranged in the limiting groove.

7. The die test socket according to claim 1, wherein: the cover plate fixes the test socket main body on the PCB through a plurality of fasteners.

8. The die test socket according to claim 1, wherein; the top of the cover plate is provided with an air tap which is communicated with an air flow groove in the cover plate, and the air flow groove is communicated with the flow groove on the lug.

9. The die test socket according to claim 1, wherein: the upper end of the cover plate is provided with a pull groove, the two ends of the pull groove are provided with square stacking sensors, and the two square stacking sensors are respectively positioned at the two ends of the chip.