CN213803960U - Evaporation plating device - Google Patents
Evaporation plating device Download PDFInfo
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- CN213803960U CN213803960U CN202022714235.0U CN202022714235U CN213803960U CN 213803960 U CN213803960 U CN 213803960U CN 202022714235 U CN202022714235 U CN 202022714235U CN 213803960 U CN213803960 U CN 213803960U
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Abstract
The utility model relates to an evaporation coating technique field discloses an evaporation coating device. The evaporation device comprises a cavity, a first source baffle and a second source baffle, wherein a plurality of crucibles and film thickness probes arranged on one side of each crucible are arranged in the cavity, an evaporation channel is formed between each crucible and a substrate to be evaporated, and a detection channel is formed between each crucible and the film thickness probe; the first source baffle is arranged between the crucible and the substrate and can selectively shield the evaporation channel; the second source baffle is arranged between the crucible and the film thickness probe and can selectively shield the detection channel and the evaporation channel. The utility model is provided with a plurality of crucibles, and can preheat one crucible when another crucible is evaporated, so as to realize continuous evaporation; the first source baffle can shield an evaporation channel between another crucible and the substrate while one crucible is subjected to evaporation, so that evaporation materials in the crucible are effectively prevented from overflowing out of the crucible when being pre-evaporated to the evaporation rate, and the evaporation quality is ensured.
Description
Technical Field
The utility model relates to an evaporation plating technical field especially relates to an evaporation plating device.
Background
Organic thin film electroluminescent display devices (OLEDs), which are an emerging technology for organic semiconductor materials to emit light under the action of an electric field, have been rapidly developed in recent years. The OLED lighting product has the advantages of low energy consumption, environmental protection, ultrathin property, high color saturation, surface light source and the like, so that the OLED lighting product becomes one of the mainstream trends of the development of future lighting products. At present, OLED lighting devices are mainly prepared by an evaporation coating method, in large evaporation equipment, a metal anode is deposited on a substrate by evaporating metals such as Ag, Mg, Al and the like through a large point source to form an anode pattern, and the metal film layer deposited by the anode is generally required to be thicker.
In the prior art, in order to improve the evaporation efficiency on an evaporation production line, when one crucible is evaporated, other crucibles are pre-evaporated, and continuous evaporation can be performed after the pre-evaporation reaches the evaporation rate. In the process of pre-evaporation of the crucible, the evaporation material in the crucible overflows, and the overflowing evaporation material is deposited on the substrate and mixed with the evaporation material to influence the evaporation quality; in addition, impurities in the crucible can also affect the evaporation quality.
Therefore, a vapor deposition apparatus is needed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
Based on above, an object of the utility model is to provide an evaporation plating device can effectively guarantee the better evaporation plating effect of substrate at continuous evaporation plating in-process.
In order to achieve the purpose, the utility model adopts the following technical proposal:
an evaporation apparatus comprising:
the device comprises a cavity, a plurality of crucibles and film thickness probes arranged on one side of each crucible, wherein an evaporation channel is formed between each crucible and a substrate to be evaporated, and a detection channel is formed between each crucible and the film thickness probe;
the first source baffle is arranged between the crucible and the substrate and can selectively shield the evaporation channel;
and the second source baffle is arranged between the crucible and the film thickness probe and can selectively shield the detection channel and the evaporation channel.
As a preferable embodiment of the evaporation apparatus, a water cooling tube is provided on the first source baffle and/or the second source baffle.
As a preferable scheme of the evaporation device, the first source baffle can rotate relative to the crucible to selectively shield the evaporation channel; the second source baffle can rotate relative to the crucible to selectively shield the detection channel and the evaporation channel.
As a preferable embodiment of the evaporation apparatus, the first source baffle and the second source baffle are both disposed close to the crucible.
As a preferred scheme of the evaporation device, the evaporation device further comprises a main baffle, wherein the main baffle can selectively shield the evaporation channel, and the main baffle is arranged close to the substrate.
As a preferable mode of the evaporation device, the main baffle plate can rotate relative to the substrate to shield the evaporation channel.
As a preferable mode of the evaporation device, the main baffle plate comprises two baffle plates, at least an overlapped part exists in the two baffle plates, and the overlapped part is located in the evaporation channel.
As a preferable scheme of the evaporation device, the main baffle, the first source baffle and the second source baffle are detachably arranged on the cavity.
As a preferable scheme of the evaporation device, a third shielding plate is arranged on the cavity, the crucible and the substrate are respectively located at two sides of the third shielding plate, and the evaporation channel penetrates through the third shielding plate.
As a preferable embodiment of the vapor deposition apparatus, the film thickness probe is provided on the third shielding plate
The utility model has the advantages that:
the plurality of crucibles are arranged in the cavity, so that one crucible can be preheated when being evaporated, continuous evaporation is realized, the evaporation efficiency is improved, and the film thickness probe is used for detecting the evaporation condition of the crucible; through setting up first source baffle, can shelter from the coating by vaporization passageway between other crucible and the substrate when a crucible carries out the coating by vaporization, avoided the coating by vaporization material in the crucible to overflow the crucible when the coating by vaporization speed in advance effectively, guaranteed the coating by vaporization quality, second source baffle then can be used for guaranteeing the cleanness in the crucible to sheltering from of crucible when not carrying out the coating by vaporization.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
Fig. 1 is a schematic view of a vapor deposition device according to an embodiment of the present invention.
In the figure:
100. a cavity; 110. a crucible; 120. a substrate; 130. an evaporation channel;
1. a main baffle; 11. a baffle mounting bracket;
2. a first source baffle; 21. a first mounting bracket;
3. a second source baffle; 31. a second mounting bracket;
4. a film thickness probe; 41. and a third shielding plate.
Detailed Description
In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1, the present embodiment provides a vapor deposition apparatus including a chamber 100, a first source baffle 2, and a second source baffle 3, a plurality of crucibles 110 and film thickness probes 4 provided on one side of each crucible 110 being provided in the chamber 100, a vapor deposition channel 130 being formed between each crucible 110 and a substrate 120 to be vapor deposited, and a detection channel being formed between each crucible 110 and the film thickness probe 4; the first source baffle 2 is arranged between the crucible 110 and the substrate 120 and can selectively shield the evaporation channel 130; the second source baffle 3 is disposed between the crucible 110 and the film thickness probe 4, and can selectively block the detection channel and the evaporation channel 130.
By arranging a plurality of crucibles 110 in the cavity 100, when one crucible 110 is subjected to evaporation, the other crucible 110 can be preheated so as to realize continuous evaporation and improve the evaporation efficiency, and the film thickness probe 4 is used for detecting the evaporation condition of the crucible 110 on the crucible 110; through setting up first source baffle 2, can shelter from the coating by vaporization passageway 130 between other crucible 110 and the substrate 120 when a crucible 110 carries out the coating by vaporization, avoided effectively that the coating by vaporization material in crucible 110 overflows crucible 110 when evaporating to the coating by vaporization rate in advance, guaranteed the coating by vaporization quality, second source baffle 3 then can be used for guaranteeing the cleanness in the cavity 100 to the sheltering from of crucible 110 when not carrying out the coating by vaporization.
Specifically, the evaporation device further includes a main baffle 1, the main baffle 1 can selectively shield the evaporation channel 130, the main baffle 1 is disposed near the substrate 120, and the main baffle 1 can be used for shielding the substrate 120 in a short distance. When preparing evaporation, firstly opening the second source baffle 3, carrying out pre-evaporation on the corresponding crucible 110, detecting the pre-evaporated crucible 110 by the film thickness probe 4, and closing the first source baffle 2 and the main baffle 1 at the moment, wherein the first source baffle 2 and the main baffle 1 can reduce deposition of evaporation materials on the substrate 120, and meanwhile, the second source baffle 3 can also reduce deposition of the evaporation materials on the main baffle 1; when the crucible 110 is pre-evaporated to the evaporation rate, firstly opening the main baffle 1, then opening the first source baffle 2, and carrying out normal evaporation on the substrate 120; after a substrate 120 is evaporated, firstly closing the first source baffle 2, then closing the main baffle 1, and then performing an operation of replacing the substrate 120 to reduce deposition of evaporation materials on the main baffle 1 and the substrate 120; when the evaporation crucible 110 needs to be replaced, the main baffle 1 does not need to be closed, and the replacement can be realized by operating the first source baffle 2 on the corresponding crucible 110, so that the time is saved, and the efficiency is improved.
It should be noted that different evaporation materials can be contained in different crucibles 110 for evaporating films with different functional layers. The arrangement of the first source baffle 2 is beneficial to reducing deposition of evaporation materials on the main baffle 1, effectively solves the problems of deformation and the like of the main baffle 1 caused by excessive deposition materials, and further ensures evaporation quality.
Further, the main baffle 1, the first source baffle 2 and the second source baffle 3 are detachably disposed on the chamber 100, so that the evaporation materials deposited thereon are easily replaced. Illustratively, the main baffle 1 is mounted on the chamber 100 by a baffle mounting member, the first source baffle 2 is mounted on the chamber 100 by a first mounting frame 21, and the second source baffle 3 is mounted on the chamber 100 by a second mounting frame 31.
The chamber 100 is further provided with a third shielding plate 41, the crucible 110 and the substrate 120 are respectively located at two sides of the third shielding plate 41, and the evaporation channel 130 penetrates through the third shielding plate 41. The third shielding plate 41 is arranged to shield the space between the evaporation channel 130 and the side wall of the chamber 100, and after the main baffle plate 1 is opened, the channel between the main baffle plate 1 and the crucible 110 can be shielded by the third shielding plate 41; when the evaporation operation is performed, the third shielding plate 41 can prevent the evaporation material from being deposited on the main baffle 1, and prevent the main baffle 1 from being deformed due to deposition of too much material, thereby avoiding frequent replacement of the main baffle 1. Meanwhile, the third shielding plate 41 can also be used for installing the film thickness probe 4, and the film thickness probe 4 installed on the third shielding plate 41 is arranged opposite to the crucible 110 to be detected.
Alternatively, to achieve the shielding effect of the main baffle 1, the first source baffle 2 and the second source baffle 3, the first source baffle 2 can rotate relative to the crucible 110 to selectively shield the evaporation channel 130; the second source baffle 3 can rotate relative to the crucible 110 to selectively shield the detection channel and the evaporation channel 130; the main shutter 1 can rotate relative to the substrate 120 to selectively block the evaporation channels 130. In other embodiments, rotation may be used instead of flipping, as long as selective shielding is achieved, and is not specifically limited herein. In addition, the rotating or turning driving member can also act on the corresponding baffle or the mounting rack thereof, and the skilled person can set the baffle or the mounting rack according to actual needs, and the baffle or the mounting rack is not limited in detail.
Further, the main baffle 1 includes two blocking sheets, and at least there are overlapping portions of the two blocking sheets, and the overlapping portions are located in the evaporation channel 130. The arrangement of the two blocking sheets can further protect the substrate 120, and the overlapped part can effectively play a role in sealing, so that deposition of evaporation materials on the substrate 120 is avoided.
Preferably, water cooling tubes are provided on the first source baffle 2 and/or the second source baffle 3 to reduce heat radiation. The water cooling pipes can be arranged in a zigzag shape or a serpentine shape to increase the cooling effect.
In this embodiment, the first source baffle 2 and the second source baffle 3 are both disposed close to the crucible 110, and it can be understood that the shielding effect of the second source baffle 3 disposed close to the crucible 110 on the crucible 110 is better; similarly, the first source baffle 2 arranged closer to the crucible 110 can shield more evaporation materials overflowing from the crucible 110 to be pre-evaporated; in order to enable the film thickness probe 4 to monitor the pre-steamed crucible 110 in real time, the first source baffle 2 only shields the evaporation channel 130 and does not shield the detection channel, so the second source baffle 3 is closer to the crucible 110 than the first source baffle 2.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Claims (10)
1. An evaporation apparatus, comprising:
the evaporation coating device comprises a cavity (100), a plurality of crucibles (110) and a film thickness probe (4) arranged on one side of each crucible (110) are arranged in the cavity, an evaporation channel (130) is formed between each crucible (110) and a substrate (120) to be evaporated, and a detection channel is formed between each crucible (110) and the film thickness probe (4);
a first source baffle (2) arranged between the crucible (110) and the substrate (120) and capable of selectively shielding the evaporation channel (130);
and the second source baffle (3) is arranged between the crucible (110) and the film thickness probe (4) and can selectively shield the detection channel and the evaporation channel (130).
2. The vapor deposition apparatus according to claim 1, wherein a water cooling tube is provided on the first source baffle (2) and/or the second source baffle (3).
3. An evaporation device according to claim 1, wherein the first source shutter (2) is rotatable relative to the crucible (110) to selectively block the evaporation channel (130); the second source shutter (3) is rotatable with respect to the crucible (110) to selectively block the detection channel and the evaporation channel (130).
4. The vapor deposition apparatus according to claim 1, wherein the first source shutter (2) and the second source shutter (3) are both disposed close to the crucible (110).
5. The vapor deposition device according to claim 1, further comprising a main baffle plate (1), wherein the main baffle plate (1) can selectively block the vapor deposition channel (130), and the main baffle plate (1) is disposed close to the substrate (120).
6. An evaporation device according to claim 5, wherein the main shutter (1) is rotatable relative to the substrate (120) to block the evaporation channels (130).
7. An evaporation device according to claim 5, wherein the main baffle (1) comprises two pieces of baffle plates, and the two pieces of baffle plates have at least overlapped parts, and the overlapped parts are positioned in the evaporation channel (130).
8. The vapor deposition device according to claim 5, wherein the main baffle (1), the first source baffle (2), and the second source baffle (3) are detachably provided on the chamber (100).
9. The evaporation apparatus according to claim 1, wherein a third shielding plate (41) is disposed on the chamber (100), the crucible (110) and the substrate (120) are respectively disposed on two sides of the third shielding plate (41), and the evaporation channel (130) is disposed through the third shielding plate (41).
10. The vapor deposition device according to claim 9, wherein the film thickness probe (4) is provided on the third shielding plate (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022714235.0U CN213803960U (en) | 2020-11-20 | 2020-11-20 | Evaporation plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022714235.0U CN213803960U (en) | 2020-11-20 | 2020-11-20 | Evaporation plating device |
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| Publication Number | Publication Date |
|---|---|
| CN213803960U true CN213803960U (en) | 2021-07-27 |
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| CN202022714235.0U Active CN213803960U (en) | 2020-11-20 | 2020-11-20 | Evaporation plating device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114150273A (en) * | 2021-12-06 | 2022-03-08 | 深圳市华星光电半导体显示技术有限公司 | Vapor deposition apparatus and vapor deposition method |
| CN114672772A (en) * | 2022-04-18 | 2022-06-28 | 昆山梦显电子科技有限公司 | Evaporation source device and using method thereof |
| CN115287604A (en) * | 2022-08-26 | 2022-11-04 | 中能兴盛(香河)机电设备有限公司 | Continuous evaporation system and use method |
| CN117230412A (en) * | 2023-09-19 | 2023-12-15 | 苏州佑伦真空设备科技有限公司 | Double-source co-evaporation vacuum evaporator |
-
2020
- 2020-11-20 CN CN202022714235.0U patent/CN213803960U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114150273A (en) * | 2021-12-06 | 2022-03-08 | 深圳市华星光电半导体显示技术有限公司 | Vapor deposition apparatus and vapor deposition method |
| CN114672772A (en) * | 2022-04-18 | 2022-06-28 | 昆山梦显电子科技有限公司 | Evaporation source device and using method thereof |
| CN115287604A (en) * | 2022-08-26 | 2022-11-04 | 中能兴盛(香河)机电设备有限公司 | Continuous evaporation system and use method |
| CN117230412A (en) * | 2023-09-19 | 2023-12-15 | 苏州佑伦真空设备科技有限公司 | Double-source co-evaporation vacuum evaporator |
| CN117230412B (en) * | 2023-09-19 | 2024-02-23 | 苏州佑伦真空设备科技有限公司 | Double-source co-evaporation vacuum evaporator |
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