CN213766123U - Semiconductor chip cutting waste collection device - Google Patents
Semiconductor chip cutting waste collection device Download PDFInfo
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- CN213766123U CN213766123U CN202022495786.2U CN202022495786U CN213766123U CN 213766123 U CN213766123 U CN 213766123U CN 202022495786 U CN202022495786 U CN 202022495786U CN 213766123 U CN213766123 U CN 213766123U
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Abstract
The utility model belongs to the technical field of the semiconductor chip, especially, be a semiconductor chip cutting garbage collection device, the power distribution box comprises a box body, the top of box is provided with the water tank, the inside of box is provided with the conveyer belt, the one end of conveyer belt is provided with the drive roll. This semiconductor chip cutting garbage collection device, the waste material that produces among the hourglass bits hole that sees through the conveyer belt surface through the suction hood will cut the in-process inhales first collection bits box, make the conveyer belt surface keep clean and tidy, it keeps moist to collect in the waste material in-process and make in the box through vaporific shower nozzle, can play the dust fall effect, prevent that the piece from flying upward, improve the garbage collection efficiency, reduce environmental pollution, make things convenient for next time cutting, can clean the semiconductor chip surface waste material after the cutting through cleaning the structure, improve semiconductor chip's quality, because vaporific shower nozzle sprays the clear water and can moisten semiconductor chip surface, dry it through the electrical heating wire pipe, damage is prevented.
Description
Technical Field
The utility model belongs to the technical field of semiconductor chip, concretely relates to semiconductor chip cutting garbage collection device.
Background
Semiconductor chips are manufactured by etching, wiring and forming a semiconductor device capable of realizing a certain function on a semiconductor wafer, in order to meet the requirements of mass production, the electrical property of the semiconductor must be predictable and stable, so the purity of dopants and the quality of the semiconductor crystal lattice structure must be strictly required, common quality problems include that the dislocation, twin face or stacking fault of the crystal lattice can affect the characteristics of the semiconductor material, for a semiconductor device, the defect (crystal defect) of the material crystal lattice is usually the main factor affecting the performance of the element, the most common method for growing high-purity single crystal semiconductor material at present is called the chailasso method (common working method of steel and iron fields), the process puts the seed crystal of a single crystal into the dissolved liquid of the same material, and then slowly pulls up in a rotating manner, when the seed crystal is pulled up, the solute will solidify along the interface of the solid and liquid, and the rotation will make the temperature of the solute uniform.
Semiconductor chip manufacturing procedure is various, need cut into the length of wanting after the processing is accomplished, then use after polishing, can produce a lot of piece waste materials in the cutting process, and current semiconductor chip cutting device is not good enough to the collection effect of waste material, and some garrulous waste materials remain and influence cutting device's performance on the workstation surface.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a semiconductor chip cutting garbage collection device has solved current semiconductor chip cutting device and has had a collection effect to the waste material good enough, and some garrulous waste materials remain and influence cutting device's performance's problem on the workstation surface.
In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor chip cutting waste collecting device comprises a box body, wherein a water tank is arranged at the top of the box body, a conveying belt is arranged inside the box body, a driving roller is arranged at one end of the conveying belt, a material collecting box is arranged at one side of the conveying belt, a box door is arranged at one side of the material collecting box, a first motor is arranged on the front surface of the material collecting box, an output shaft of the first motor is connected with a driving wheel, the driving wheel is connected with the driving roller through a chain, a filter plate is arranged inside the material collecting box, mist nozzles are uniformly arranged at the top of the inner wall of the box body, a third electric slide rail is arranged at one side of the inner wall of the box body, the box body is movably connected with a first cutting structure through the third electric slide rail, a second cutting structure is arranged at one side of the first cutting structure, a dust hood is arranged below the conveying belt, and a first chip collecting box is arranged at one end of the dust hood, the top of conveyer belt is provided with the backup pad, the surface of backup pad is provided with first electronic slide rail, the backup pad has through first electronic slide rail swing joint and cleans the structure.
Preferably, the first cutting structure comprises a movable plate, a second electric slide rail is arranged on the surface of the movable plate, the movable plate is movably connected with a slide block through the second electric slide rail, a third motor is arranged at one end of the slide block, an output shaft of the third motor penetrates through the slide block to be connected with a threaded rod, a fourth motor is in threaded connection with the surface of the threaded rod, a cutting knife is connected to an output shaft of the fourth motor, an electric telescopic rod is arranged at the bottom of the slide block, a pressing block is arranged at one end of the electric telescopic rod, and the second cutting structure is identical to the first cutting structure in structure.
Preferably, the cleaning structure comprises a second motor, an output shaft of the second motor is connected with a cleaning roller, and brushes are uniformly arranged on the surface of the cleaning roller.
Preferably, chip leakage holes are formed in the surfaces of the conveying belt and the filter plate, and the diameter of each chip leakage hole is one centimeter.
Preferably, one side of the water tank is provided with a water inlet pipe, a water pump is arranged in the water tank, and one end of the water pump is connected with the mist spray head through a water delivery pipe.
Preferably, the surface of the inner wall of the material receiving box is uniformly provided with an electric heating wire tube, and a second scrap collecting box is arranged below the filter plate.
Compared with the prior art, the beneficial effects of the utility model are that:
this semiconductor chip cutting garbage collection device, the waste material that produces among the hourglass bits hole that sees through the conveyer belt surface through the suction hood will cut the in-process inhales first collection bits box, make the conveyer belt surface keep clean and tidy, it keeps moist to collect in the waste material in-process and make in the box through vaporific shower nozzle, can play the dust fall effect, prevent that the piece from flying upward, improve the garbage collection efficiency, reduce environmental pollution, make things convenient for next time cutting, can clean the semiconductor chip surface waste material after the cutting through cleaning the structure, improve semiconductor chip's quality, because vaporific shower nozzle sprays the clear water and can moisten semiconductor chip surface, dry it through the electrical heating wire pipe, damage is prevented.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a first three-dimensional structure diagram of the present invention;
FIG. 2 is a second perspective structural view of the present invention;
fig. 3 is a cross-sectional view of a first three-dimensional structure of the present invention;
fig. 4 is a front sectional view of the present invention;
fig. 5 is a sectional view of a second three-dimensional structure of the present invention;
fig. 6 is a cross-sectional view of the water tank of the present invention.
In the figure: 1, a box body; 2, conveying a belt; 3, a water tank; 4, collecting a material box; 5 a first chip collecting box; 6, supporting plates; 7 a first electric slide rail; 8, cleaning rollers; 9 a box door; 10 a second chip collecting box; 11 a first motor; 12 a driving wheel; 13 a second motor; 14 electrically heating the wire tube; 15 chip leakage holes; 16 moving the board; 17 a slide block; 18 a third motor; 19 a threaded rod; 20 a fourth motor; 21 a cutter knife; 22 a dust hood; 23 a filter plate; 24 water outlet; 25 water pump; 26 a second motorized slide rail; 27 a third motorized slide rail; 28, an electric telescopic rod; and 29, briquetting.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides the following technical solutions: a semiconductor chip cutting waste collecting device comprises a box body 1, a water tank 3 is arranged at the top of the box body 1, a conveying belt 2 is arranged inside the box body 1, a driving roller is arranged at one end of the conveying belt 2, a material receiving box 4 is arranged at one side of the conveying belt 2, a box door 9 is arranged at one side of the material receiving box 4, a first motor 11 is arranged on the front surface of the material receiving box 4, an output shaft of the first motor 11 is connected with a driving wheel 12, the driving wheel 12 is connected with the driving roller through a chain, the driving wheel 12 is driven to rotate through the first motor 11, the driving roller is driven to rotate through the chain by the driving wheel 12, so that the conveying belt 2 rotates to convey semiconductor chips, manpower is saved, a filtering plate 23 is arranged inside the material receiving box 4, waste on the surface of a semiconductor chip is filtered through the filtering plate 23, the surface of the semiconductor chip is kept clean, mist spray nozzles 24 are uniformly arranged at the top of the inner wall of the box body 1, the inside of the box body 1 is moistened by the mist spray nozzle 24 in the cutting process, the dust falling effect can be achieved, fragments are prevented from flying, the waste collection efficiency is improved, the environmental pollution is reduced, the next cutting is facilitated, the third electric slide rail 27 is arranged on one side of the inner wall of the box body 1, the box body 1 is movably connected with the first cutting structure through the third electric slide rail 27, the second cutting structure is arranged on one side of the first cutting structure, the height position of the first cutting structure is convenient to adjust through the third electric slide rail 27, the dust hood 22 is arranged below the conveyor belt 2, the first scrap collecting box 5 is arranged at one end of the dust hood 22, the generated wastes are sucked into the first scrap collecting box 5 through the dust hood 22 in the cutting process, the surface of the conveyor belt 2 is kept clean, the support plate 6 is arranged above the conveyor belt 2, the first electric slide rail 7 is arranged on the surface of the support plate 6, and the cleaning structure is movably connected with the first electric slide rail 7 through the support plate 6, the height position of the cleaning structure is convenient to adjust through the first electric slide rail 7.
Specifically, the first cutting structure comprises a moving plate 16, a second electric slide rail 26 is arranged on the surface of the moving plate 16, the moving plate 16 is movably connected with a slide block 17 through the second electric slide rail 26, a third motor 18 is arranged at one end of the slide block 17, an output shaft of the third motor 18 penetrates through the slide block 17 to be connected with a threaded rod 19, a fourth motor 20 is in threaded connection with the surface of the threaded rod 19, a cutting knife 21 is connected with an output shaft of the fourth motor 20, an electric telescopic rod 28 is arranged at the bottom of the slide block 17, a pressing block 29 is arranged at one end of the electric telescopic rod 28, the second cutting structure is identical to the first cutting structure in structure, the cutting knife 21 is adjusted to a proper position through the second electric slide rail 26 according to the length to be cut, the pressing block 29 is pushed through the electric telescopic rod 28 to fix the position of the semiconductor chip to be cut, and then the fourth motor 20 drives the cutting knife 21 to rotate to cut the semiconductor chip, according to semiconductor chip's width, drive threaded rod 19 through third motor 18 and rotate in the cutting process to drive cutting knife 21 and remove the cutting, first cutting structure and second cutting structure can cut semiconductor chip simultaneously, thereby can improve cutting efficiency.
Specifically, clean the structure and include second motor 13, the output shaft of second motor 13 has cleaning roller 8, cleaning roller 8's surface evenly is provided with the brush, and the back is accomplished in the cutting, carries semiconductor chip to receiving box 4 through conveyer belt 2, drives through second motor 13 in the transportation process and cleans roller 8 and rotate, and the brush that cleans roller 8 surface cleans the waste material on semiconductor chip surface, makes the semiconductor chip surface keep clean and tidy, improves semiconductor chip's quality.
Specifically, chip leakage holes 15 are formed in the surfaces of the conveyor belt 2 and the filter plate 23, the diameter of each chip leakage hole 15 is one centimeter, waste materials generated in the cutting process fall into the first chip collecting box 5 through the chip leakage holes 15 in the surface of the conveyor belt 2, and chips on the surface of a semiconductor chip fall into the second chip collecting box 10 through the chip leakage holes 15 in the surface of the filter plate 23, so that the chips are convenient to collect.
Specifically, one side of the water tank 3 is provided with a water inlet pipe, the inside of the water tank 3 is provided with a water pump 25, one end of the water pump 25 is connected with the mist-shaped spray head 24 through a water delivery pipe, clear water is injected into the water tank 3 through the water inlet pipe, and then water is supplied to the mist-shaped spray head 24 through the water pump 25.
Specifically, the surface of the inner wall of the material receiving box 4 is uniformly provided with an electric heating wire tube 14, the second chip collecting box 10 is arranged below the filter plate 23, and the surface of the semiconductor chip can be wetted by spraying clear water through the mist spray head 24, and the semiconductor chip is dried through the electric heating wire tube 14 to prevent damage.
The utility model discloses a theory of operation and use flow: after the utility model is installed, the device is placed at a proper position, then the water tank 3 is filled with clean water through the water inlet pipe, the semiconductor chip is placed on the surface of the conveyor belt 2, the first motor 11 drives the driving wheel 12 to rotate, the driving wheel 12 drives the driving roller to rotate through the chain, thereby the conveyor belt 2 rotates to convey the semiconductor chip into the box body 1, after the semiconductor chip is conveyed to a proper position, the first cutting structure and the second cutting structure are adjusted to proper heights through the third electric slide rail 27, then the semiconductor chip can be cut simultaneously through the first cutting structure and the second cutting structure, the waste material generated in the cutting process is sucked into the first scrap collecting box 5 through the dust hood 22, the box body 1 is wetted through the mist spray nozzle 24, then the cut semiconductor chip is conveyed to the material collecting box 4 through the conveyor belt 2, the waste material on the surface of the semiconductor chip is cleaned through the cleaning structure in the conveying process, after cleaning, the chips are conveyed to the material receiving box 4, the chips on the surface of the semiconductor chip fall into the second chip collecting box 10 through the chip leakage holes 15 on the surface of the filter plate 23, the surfaces of the semiconductor chip can be wetted by spraying clear water through the mist spray head 24, the semiconductor chip is dried through the electric heating wire tube 14, the damage is prevented, and the box door 9 is opened to take the materials.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a semiconductor chip cutting garbage collection device, includes box (1), its characterized in that: the box body is characterized in that a water tank (3) is arranged at the top of the box body (1), a conveyor belt (2) is arranged inside the box body (1), a driving roller is arranged at one end of the conveyor belt (2), a material receiving box (4) is arranged at one side of the conveyor belt (2), a box door (9) is arranged at one side of the material receiving box (4), a first motor (11) is arranged on the front side of the material receiving box (4), an output shaft of the first motor (11) is connected with a driving wheel (12), the driving wheel (12) is connected with the driving roller through a chain, a filter plate (23) is arranged inside the material receiving box (4), mist spray nozzles (24) are uniformly arranged at the top of the inner wall of the box body (1), a third electric slide rail (27) is arranged at one side of the inner wall of the box body (1), and the box body (1) is movably connected with a first cutting structure through the third electric slide rail (27), one side of first cutting structure is provided with second cutting structure, the below of conveyer belt (2) is provided with suction hood (22), the one end of suction hood (22) is provided with first collection bits box (5), the top of conveyer belt (2) is provided with backup pad (6), the surface of backup pad (6) is provided with first electronic slide rail (7), backup pad (6) have through first electronic slide rail (7) swing joint and clean the structure.
2. The semiconductor chip dicing scrap collecting apparatus according to claim 1, wherein: the first cutting structure comprises a moving plate (16), a second electric sliding rail (26) is arranged on the surface of the moving plate (16), the moving plate (16) is movably connected with a sliding block (17) through the second electric sliding rail (26), a third motor (18) is arranged at one end of the sliding block (17), an output shaft of the third motor (18) penetrates through the sliding block (17) to be connected with a threaded rod (19), a fourth motor (20) is connected to the surface of the threaded rod (19) in a threaded manner, a cutting knife (21) is connected to an output shaft of the fourth motor (20), an electric telescopic rod (28) is arranged at the bottom of the sliding block (17), a pressing block (29) is arranged at one end of the electric telescopic rod (28), and the second cutting structure is completely the same as the first cutting structure.
3. The semiconductor chip dicing scrap collecting apparatus according to claim 1, wherein: the cleaning structure comprises a second motor (13), an output shaft of the second motor (13) is connected with a cleaning roller (8), and brushes are uniformly arranged on the surface of the cleaning roller (8).
4. The semiconductor chip dicing scrap collecting apparatus according to claim 1, wherein: the chip leakage device is characterized in that chip leakage holes (15) are formed in the surfaces of the conveyor belt (2) and the filter plate (23), and the diameter of each chip leakage hole (15) is one centimeter.
5. The semiconductor chip dicing scrap collecting apparatus according to claim 1, wherein: a water inlet pipe is arranged on one side of the water tank (3), a water pump (25) is arranged inside the water tank (3), and one end of the water pump (25) is connected with the mist spray head (24) through a water delivery pipe.
6. The semiconductor chip dicing scrap collecting apparatus according to claim 1, wherein: the surface of the inner wall of the material collecting box (4) is uniformly provided with electric heating wire pipes (14), and a second scrap collecting box (10) is arranged below the filter plate (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022495786.2U CN213766123U (en) | 2020-11-02 | 2020-11-02 | Semiconductor chip cutting waste collection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022495786.2U CN213766123U (en) | 2020-11-02 | 2020-11-02 | Semiconductor chip cutting waste collection device |
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| Publication Number | Publication Date |
|---|---|
| CN213766123U true CN213766123U (en) | 2021-07-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202022495786.2U Active CN213766123U (en) | 2020-11-02 | 2020-11-02 | Semiconductor chip cutting waste collection device |
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| CN (1) | CN213766123U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116844984A (en) * | 2023-08-29 | 2023-10-03 | 山东睿芯半导体科技有限公司 | Flip chip laminating machine |
-
2020
- 2020-11-02 CN CN202022495786.2U patent/CN213766123U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116844984A (en) * | 2023-08-29 | 2023-10-03 | 山东睿芯半导体科技有限公司 | Flip chip laminating machine |
| CN116844984B (en) * | 2023-08-29 | 2023-12-29 | 山东睿芯半导体科技有限公司 | Flip chip laminating machine |
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