CN213694637U

CN213694637U - Circuit board that radiating effect is good

Info

Publication number: CN213694637U
Application number: CN202022547055.8U
Authority: CN
Inventors: 段明发
Original assignee: Qingdao Chuangxin Zhuoshi Photoelectric Technology Co ltd
Current assignee: Qingdao Chuangxin Zhuoshi Photoelectric Technology Co ltd
Priority date: 2020-11-06
Filing date: 2020-11-06
Publication date: 2021-07-13
Anticipated expiration: 2030-11-06

Abstract

The utility model discloses a circuit board that radiating effect is good, including the circuit board body, the equal fixedly connected with heat conduction piece in both sides of circuit board body, the outside fixedly connected with fin of heat conduction piece, the circuit board body includes PCB base plate, heating panel, welding locating plate and surface protection layer, the top fixedly connected with PCB base plate of heating panel, the top fixedly connected with welding locating plate of PCB base plate, welding locating plate's top fixedly connected with surface protection layer. The utility model discloses a set up heat conduction piece and fin, can increase the contact surface of device and air, effectively promoted the radiating effect of device, through setting up the welding locating plate, can make the device reach the effect of being convenient for weld electronic component, effectively promoted the practicality of device, through setting up the surface protection layer, can protect the surface of circuit board body, promoted the weatherability of device, effectively promoted the life of device.

Description

Circuit board that radiating effect is good

Technical Field

The utility model relates to a circuit board technical field specifically is a circuit board that radiating effect is good.

Background

The circuit board generally includes non-conductive substrate and the metal layer that forms on non-conductive substrate surface, chemical plating technique is widely used for forming the metal layer on non-conductive substrate surface because of having low priced nature and normal atmospheric temperature maneuverability to obtain the circuit board, because chemical plating layer only can grow on active center, therefore, in chemical plating, the key step is to seed active center on non-metallic material, current circuit board mostly only carries out the heat dissipation through electronic component self, will cause the radiating effect poor like this, circuit board and electronic component high temperature influence the life of circuit board and electronic component, the incident appears even.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a circuit board that radiating effect is good, it is good to possess the radiating effect, long service life, and the poor problem of current circuit board radiating effect has been solved to the advantage of the installation of being convenient for, is difficult to effectual problem with the heat effluvium.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a circuit board that radiating effect is good, includes the circuit board body, the equal fixedly connected with heat conduction piece in both sides of circuit board body, the outside fixedly connected with fin of heat conduction piece, the circuit board body includes PCB base plate, heating panel, welding locating plate and surface protection layer, the top fixedly connected with PCB base plate of heating panel, the top fixedly connected with welding locating plate of PCB base plate, the top fixedly connected with surface protection layer of welding locating plate, the surface protection layer includes solder mask printing ink, graphite alkene coating and PE protection film.

Preferably, the top of the solder mask ink is fixedly connected with a graphene coating, and the top of the graphene coating is fixedly connected with a PE protective film.

Preferably, the thickness of the solder mask ink is 0.05mm, the thickness of the graphene coating is 0.06mm, and the thickness of the PE protective film is 0.15 mm.

Preferably, the top and the bottom of the heat conduction block are fixedly connected with mounting bars, and one end of each mounting bar, which is far away from the heat conduction block, is fixedly connected with a limit buckle.

Preferably, the surface of the heat dissipation plate is provided with heat dissipation holes, and the aperture of each heat dissipation hole is 0.06-0.09 mm.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a set up heat conduction piece and fin, can increase the contact surface of device and air, effectively promoted the radiating effect of device, through setting up the welding locating plate, can make the device reach the effect of being convenient for weld electronic component, effectively promoted the practicality of device, through setting up the surface protection layer, can protect the surface of circuit board body, promoted the weatherability of device, effectively promoted the life of device.

2. The utility model discloses a solder mask printing ink's use, can effectively avoid the part not to walk the phenomenon that the junction of line appears the non-tin short circuit of eating, security when having promoted the device use, use through graphite alkene coating, can avoid the device surface to receive corrosive wear etc. and cause the damage, the corrosion resistance and the abrasion resistance of device have effectively been promoted, use through the PE protection film, can protect the surface of circuit board body, effectively reduce the ageing rate of device under the high temperature condition, through setting up mounting bar and spacing knot, can make the device reach the fixed effect of installation of being convenient for, the convenience of device installation has effectively been promoted, through setting up the louvre, can promote the heat-sinking capability of device bottom, the radiating effect of device has further been promoted.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a top cross-sectional view of the circuit board body of the present invention;

fig. 3 is a cross-sectional view of the surface protection layer of the present invention.

In the figure: 1. a circuit board body; 2. a heat conducting block; 3. mounting a bar; 4. a PCB substrate; 5. a heat dissipation plate; 6. welding a positioning plate; 7. a surface protective layer; 8. a heat sink; 9. solder mask ink; 10. a graphene coating; 11. and (3) a PE protective film.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model discloses a circuit board body 1, heat conduction piece 2, mounting bar 3, PCB base plate 4, heating panel 5, welding position board 6, surface protection layer 7, fin 8, solder mask printing ink 9,

graphite alkene coating

10, 11 parts of PE protection film are the parts that universal standard spare or technical personnel in the field know, and its structure and principle all are this technical personnel all can learn through the technical manual or learn through conventional experimental method.

Referring to fig. 1-3, a circuit board with good heat dissipation effect comprises a circuit board body 1, wherein both sides of the circuit board body 1 are fixedly connected with heat conduction blocks 2, the top and the bottom of each heat conduction block 2 are fixedly connected with a mounting strip 3, one end of the mounting strip 3 far away from the heat conduction block 2 is fixedly connected with a limit buckle, the device can achieve the effect of convenient installation and fixation by arranging the mounting strip 3 and the limit buckle, the convenience of installation of the device is effectively improved, the outer side of the heat conduction block 2 is fixedly connected with a heat dissipation fin 8, the circuit board body 1 comprises a PCB substrate 4, a heat dissipation plate 5, a welding positioning plate 6 and a surface protective layer 7, the surface of the heat dissipation plate 5 is provided with heat dissipation holes, the hole diameter of each heat dissipation hole is 0.06-0.09mm, the heat dissipation capacity at the bottom of the device can be improved by arranging the heat dissipation holes, the heat, the top of the PCB substrate 4 is fixedly connected with a welding positioning plate 6, the top of the welding positioning plate 6 is fixedly connected with a surface protection layer 7, the surface protection layer 7 comprises solder resist ink 9, a graphene coating 10 and a PE protection film 11, the top of the solder resist ink 9 is fixedly connected with the graphene coating 10, the top of the graphene coating 10 is fixedly connected with the PE protection film 11, the thickness of the solder resist ink 9 is 0.05mm, the thickness of the graphene coating 10 is 0.06mm, the thickness of the PE protection film 11 is 0.15mm, through the use of the solder resist ink 9, the phenomenon that the part of the connection part without wires is short-circuited by tin can be effectively avoided, the safety of the device in use is improved, through the use of the graphene coating 10, the damage of the surface of the device caused by corrosion wear and the like can be avoided, the corrosion resistance and wear resistance of the device are effectively improved, through the use of the PE protection film 11, can protect the surface of circuit board body 1, effectively reduce the ageing speed of device under the high temperature condition, through setting up heat conduction piece 2 and fin 8, can increase the contact surface of device and air, the radiating effect of device has effectively been promoted, through setting up welding locating plate 6, can make the device reach the effect of being convenient for weld electronic component, the practicality of device has effectively been promoted, through setting up surface protection layer 7, can protect the surface of circuit board body 1, the weatherability of device has been promoted, the life of device has effectively been promoted.

When in use, the welding positioning plate 6 is arranged, the device can achieve the effect of facilitating the welding of electronic elements, the practicability of the device is effectively improved, the phenomenon of non-tin-eating short circuit at the part of the connection part where wires are not arranged can be effectively avoided through the use of the anti-welding ink 9, the safety of the device in use is improved, the graphene coating 10 is made of graphene, the surface of the device can be prevented from being damaged due to corrosion, abrasion and the like through the use of the graphene coating 10, the corrosion resistance and the abrasion resistance of the device are effectively improved, the PE protective film 11 is made of PE materials, the surface of the circuit board body 1 can be protected through the use of the PE protective film 11, the aging speed of the device under the high-temperature condition is effectively reduced, the device can achieve the advantages of good heat dissipation effect, long service life and convenient installation through the matching of the above structures, is suitable for popularization and application.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a circuit board that radiating effect is good, includes circuit board body (1), its characterized in that: the equal fixedly connected with heat conduction piece (2) in both sides of circuit board body (1), the outside fixedly connected with fin (8) of heat conduction piece (2), circuit board body (1) includes PCB base plate (4), heating panel (5), welding locating plate (6) and surface protection layer (7), the top fixedly connected with PCB base plate (4) of heating panel (5), the top fixedly connected with welding locating plate (6) of PCB base plate (4), the top fixedly connected with surface protection layer (7) of welding locating plate (6), surface protection layer (7) include and prevent welding printing ink (9), graphite alkene coating (10) and PE protection film (11).

2. The circuit board with good heat dissipation effect according to claim 1, wherein: the top fixedly connected with graphite alkene coating (10) of solder mask printing ink (9), the top fixedly connected with PE protection film (11) of graphite alkene coating (10).

3. The circuit board with good heat dissipation effect according to claim 1, wherein: the thickness of the solder mask ink (9) is 0.05mm, the thickness of the graphene coating (10) is 0.06mm, and the thickness of the PE protective film (11) is 0.15 mm.

4. The circuit board with good heat dissipation effect according to claim 1, wherein: the top and the bottom of the heat conducting block (2) are fixedly connected with mounting strips (3), and one end of each mounting strip (3) far away from the heat conducting block (2) is fixedly connected with a limit buckle.

5. The circuit board with good heat dissipation effect according to claim 1, wherein: the surface of the heat dissipation plate (5) is provided with heat dissipation holes, and the aperture of each heat dissipation hole is 0.06-0.09 mm.