CN213691965U - Semiconductor die bonding pressing claw and packaging device - Google Patents
Semiconductor die bonding pressing claw and packaging device Download PDFInfo
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- CN213691965U CN213691965U CN202022292308.1U CN202022292308U CN213691965U CN 213691965 U CN213691965 U CN 213691965U CN 202022292308 U CN202022292308 U CN 202022292308U CN 213691965 U CN213691965 U CN 213691965U
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Abstract
The utility model discloses a semiconductor die bonding pressing claw and a packaging device, wherein the die bonding pressing claw comprises an installation arm connected with a pressing driving mechanism and a pressing seat used for pressing a frame, the pressing seat is fixedly arranged at the bottom of an installation handle, and the pressing seat is of a single-side open structure; the bottom of the pressing seat is provided with a pressing part; the pressing seat is provided with an avoiding surface used for avoiding a mechanism which carries out paster work, the avoiding surface is positioned above the pressing part, and the avoiding surface inclines towards the direction far away from the mechanism which carries out paster work. The utility model discloses a get rid of peripheral structure, adopt unilateral fixed knot to construct, not only avoided chip Pad position identification's error, improved production efficiency, and far away from the chip position, the effect of pressing is unanimous, effectively stops the product and hinders extravagant phenomenon because of pressing.
Description
Technical Field
The utility model relates to a semiconductor packaging hardware, concretely relates to solid brilliant pressure claw of semiconductor and packaging hardware.
Background
In a semiconductor packaging process, a die bonding process refers to fixing a die on a frame. The chip area of the power device is large, so that soldering tin is adopted for pasting, a certain amount of soldering tin is melted on the frame in a high-temperature sealing track at 300 ℃, then the point-shaped soldering tin is flatly pressed by the film pressing head, and then the chip is grabbed by the welding head and stably pasted at the position where the soldering tin is scattered.
Above-mentioned paster in-process, all need use the pressure claw to press the frame is stable at some soldering tin position, pressure welding tin position and subsides chip position to guarantee the paster effect. The conventional fixed pressing claw generally adopts a closed open pore structure, and referring to fig. 1 (a in the figure represents a pressing claw), the fixed pressing claw with the closed open pore structure can press the frame, but has the following defects:
1. the peripheral structure edges and corners of the existing fixed pressing claw are more, the heights of the edges and corners are different, and the pressing claw structures used for point soldering, pressing soldering and chip pasting are different, so that the structure is complex and the cost is higher.
2. The peripheral frame of closed trompil formula pressure claw can influence the illumination of the discernment light above the equipment, easily produces the shadow, and the shadow part can cause the error of frame Pad position discernment, influences production efficiency.
3. The peripheral structure of closed trompil formula pressure claw presses the inoperative to the frame, and is nearer apart from the chip position, has the risk of crushing the chip, causes the product of batch to scrap easily.
Disclosure of Invention
An object of the utility model is to overcome the problem that above-mentioned exists, provide a solid brilliant pressure claw of semiconductor, should press the claw admittedly through getting rid of peripheral structure, adopt unilateral fixed knot structure, not only avoided chip Pad position identification's error, improve production efficiency, and far away apart from the chip position, the effect of pressing is unanimous, effectively stops the product and hinders extravagant phenomenon because of pressing.
Another object of the present invention is to provide a semiconductor package device.
The purpose of the utility model is realized through the following technical scheme:
a semiconductor die bonding pressing claw comprises a mounting arm connected with a pressing driving mechanism and a pressing seat used for pressing a frame, wherein the pressing seat is fixedly arranged at the bottom of a mounting handle and is of a single-side open structure;
the bottom of the pressing seat is provided with a pressing part; the pressing seat is provided with an avoiding surface used for avoiding a mechanism which carries out paster work, the avoiding surface is positioned above the pressing part, and the avoiding surface inclines towards the direction far away from the mechanism which carries out paster work.
The working principle of the semiconductor die bonding pressing claw is as follows:
during operation, the pressing claw is firstly conveyed to a point soldering tin position through a conveying rail, in the point soldering tin station, the pressing claw is fixed on the point soldering tin mechanism through the mounting arm, mechanical action is conducted through the mechanical motor, the pressing claw is enabled to stably press the pad position of the frame, and the pressing part is pressed on the frame. The point soldering mechanism melts the soldering wire with 3.5 percent of silver content into two soldering balls at the corresponding positions of the frame in a high-temperature track at 300 ℃.
The frame that has some finished soldering tin conveys to the pressure soldering tin position through carrying the track, and in some soldering tin stations, this pressure claw is fixed on pressing soldering tin mechanism through the installation arm, and mechanical motor conduction mechanical action makes the pressure claw press the frame pad position firmly, presses the portion of pressing and presses on the frame. The film pressing head at 380 ℃ of the pressure welding tin mechanism presses the molten tin solder balls into an irregular quadrilateral.
The frame with pressed soldering tin is conveyed to a chip mounting position through a conveying rail, in a chip mounting station, the pressing claw is fixed on a chip mounting mechanism through a mounting arm, a mechanical motor conducts mechanical action, the pressing claw is enabled to stably press the pad position of the frame, and the pressing part is pressed on the frame. The chip is grabbed and attached to the upper portion of the molten soldering tin by the chip attaching mechanism, and the chip attachment is completed.
The utility model discloses a preferred scheme, wherein, press the claw to establish ties by two L shape structures and constitute, press the bottom that the seat is located two L shape structures. Through setting up above-mentioned two L shape structures, can effectively improve the rigidity of pressing the claw for press the claw non-deformable or fracture when fixed frame.
Preferably, the mounting arm is formed by an upper L-shaped structure in a double L-shaped structure, a straight notch is formed in the top of the mounting arm, and the pressing claw is fixedly mounted through the straight notch by a fastening screw.
The utility model discloses a preferred scheme, wherein, be equipped with U type groove on the pressing seat, the bottom surface in this U type groove extends to the bottom of dodging the face. Through above-mentioned structure, under the prerequisite of guaranteeing the structural rigidity of pressing the claw, set up U type groove on pressing the seat, can avoid blockking the mechanism that is carrying out paster work, can dodge the bonding tool for example and reciprocate.
The utility model discloses a preferred scheme, wherein, pressing the splenium and being equipped with rectangle edges and corners, this bottom surface shape of pressing the splenium is the rectangle, can fully contact with the frame when pressing like this, guarantees to press the effect.
The utility model discloses a preferred scheme, wherein, dodge and constitute between two relative lateral walls of face and dodge the space, when the pressing claw compresses tightly the frame, the mechanism (for example bonding tool) that is carrying out paster work can get into and dodge and work in the space.
Preferably, the avoiding space is communicated with a U-shaped groove on the pressing seat.
A semiconductor packaging device comprises the die bonding pressing claw.
Compared with the prior art, the utility model following beneficial effect has:
1. the utility model provides a solid brilliant pressure claw adopts unilateral fixed knot structure through getting rid of peripheral structure, has avoided chip Pad position recognition's error and unusual, improves production efficiency.
2. The utility model provides a solid crystal pressure claw is far away apart from the chip position, and the effect of pressing is unanimous, effectively stops the product and hinders extravagant phenomenon because of pressing.
3. The pressing claw with the unilateral opening structure has good pressing effect, simple structure, simple and convenient production and manufacture and lower purchase cost; the pressing claws at the positions of point soldering tin, pressing soldering tin and chip pasting have a unified structure, so that the abnormal use errors can be avoided basically.
Drawings
Fig. 1 is a schematic perspective view of a pressing claw in the prior art.
Fig. 2 is a schematic perspective view of a semiconductor die bonding pressing claw according to the present invention.
Fig. 3 is a side view of the semiconductor die bonding pressing claw according to the present invention.
Fig. 4-6 are schematic diagrams of the three-dimensional structure of the semiconductor die bonding pressing claw of the present invention performing different operations, wherein fig. 4 is a schematic diagram of point soldering tin, fig. 5 is a schematic diagram of pressing soldering tin, and fig. 6 is a schematic diagram of chip mounting.
Detailed Description
In order to make those skilled in the art understand the technical solution of the present invention well, the present invention will be further described below with reference to the following examples and drawings, but the embodiments of the present invention are not limited thereto.
Referring to fig. 2 to 6, the semiconductor packaging apparatus in this embodiment includes a die bonding pressing claw, a spot soldering mechanism, a pressure soldering mechanism, and a die bonding mechanism, where the die bonding pressing claw includes a mounting arm 1 connected to a pressing driving mechanism and a pressing base 2 for pressing a frame, the pressing base 2 is fixedly disposed at the bottom of a mounting handle, and the pressing base 2 is a single-side open structure; the bottom of the pressing seat 2 is provided with a pressing part 2-1; the pressing seat 2 is provided with an avoiding surface 2-2 used for avoiding a mechanism which carries out patch work, the avoiding surface 2-2 is positioned above the pressing part 2-1, and the avoiding surface 2-2 inclines towards a direction far away from the mechanism which carries out patch work.
Referring to fig. 2-6, the pressing claw is formed by connecting double-L-shaped structures in series, and the pressing seat 2 is positioned at the bottom of the double-L-shaped structures. Through setting up above-mentioned two L shape structures, can effectively improve the rigidity of pressing the claw for press the claw non-deformable or fracture when fixed frame.
Further, the mounting arm 1 is composed of an upper L-shaped structure in a double L-shaped structure, a straight notch 1-1 is formed in the top of the mounting arm 1, and the pressing claw is fixedly mounted through the straight notch 1-1 by fastening screws.
Referring to fig. 2-3, a U-shaped groove is formed in the pressing base 2, and the bottom surface of the U-shaped groove extends to the bottom of the avoiding surface 2-2. Through the structure, on the premise of ensuring the structural rigidity of the pressing claw, the pressing base 2 is provided with the U-shaped groove, so that a mechanism which is used for pasting the chip can be prevented from being blocked, and for example, a welding head can be avoided to move up and down.
Referring to fig. 2-3, the pressing portion 2-1 is provided with rectangular corners, and the bottom surface of the pressing portion 2-1 is rectangular, so that the pressing portion can be fully contacted with the frame during pressing, and the pressing effect is ensured.
Referring to fig. 2-3, an avoidance space is formed between two opposite side walls of the avoidance surface 2-2, and a mechanism (such as a welding head) which is performing the pasting work can enter the avoidance space to work when the pressing claw presses the frame.
Further, the avoiding space is communicated with a U-shaped groove in the pressing seat 2.
Referring to fig. 2 to 6, the working principle of the semiconductor die bonding pressing claw in the embodiment is as follows:
when the pressing claw works, the pressing claw is firstly conveyed to a spot soldering position through a conveying rail, in the spot soldering station, the pressing claw is fixed on a spot soldering mechanism through the mounting arm 1, a mechanical motor conducts mechanical action, so that the pressing claw can stably press the pad position of the frame, and the pressing part 2-1 is pressed on the frame. The point soldering mechanism melts the solder wire with 3.5% silver content into two solder balls at the corresponding positions of the frame in a high-temperature track at 300 ℃, as shown in figure 4.
The frame with the dispensed soldering tin is conveyed to a soldering tin pressing position through a conveying rail, in a soldering tin dispensing station, the pressing claw is fixed on a soldering tin pressing mechanism through a mounting arm 1, a mechanical motor conducts mechanical action, the pressing claw is enabled to stably press the pad position of the frame, and the pressing part 2-1 is pressed on the frame. The film pressing head at 380 ℃ of the pressure welding tin mechanism presses the molten solder ball into an irregular quadrilateral, as shown in figure 5.
The frame pressed with the soldering tin is conveyed to a chip mounting position through a conveying rail, in a chip mounting position, the pressing claw is fixed on a chip mounting mechanism through the mounting arm 1, a mechanical motor conducts mechanical action, the pressing claw is enabled to stably press the pad position of the frame, and the pressing part 2-1 is pressed on the frame. The chip is grabbed and attached to the upper portion of the molten soldering tin by the chip attaching mechanism, and the chip attaching is completed, as shown in fig. 6.
The above is the preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be equivalent replacement modes, and all are included in the scope of the present invention.
Claims (8)
1. The semiconductor die bonding pressing claw is characterized by comprising a mounting arm connected with a pressing driving mechanism and a pressing seat used for pressing a frame, wherein the pressing seat is fixedly arranged at the bottom of a mounting handle and is of a single-side open structure;
the bottom of the pressing seat is provided with a pressing part; the pressing seat is provided with an avoiding surface used for avoiding a mechanism which carries out paster work, the avoiding surface is positioned above the pressing part, and the avoiding surface inclines towards the direction far away from the mechanism which carries out paster work.
2. The semiconductor die bonding press claw according to claim 1, wherein the press claw is formed by connecting double-L-shaped structures in series, and the pressing base is positioned at the bottom of the double-L-shaped structures.
3. The semiconductor die bonding press jaw of claim 2, wherein the mounting arm is formed by an upper L-shaped structure of a double L-shaped structure, and the top of the mounting arm is provided with a straight notch through which the press jaw is fixedly mounted by a fastening screw.
4. The semiconductor die bonding pressing claw according to claim 1, wherein a U-shaped groove is formed in the pressing base, and a bottom surface of the U-shaped groove extends to a bottom of the relief surface.
5. The semiconductor die bonding pressure claw according to claim 1, wherein the pressing portion has a rectangular corner, and the bottom surface of the pressing portion has a rectangular shape.
6. The semiconductor die bonding pressure claw according to claim 1, wherein a relief space is formed between two opposite side walls of the relief surface.
7. The semiconductor die bonding pressing claw according to claim 6, wherein the avoiding space is communicated with a U-shaped groove on the pressing base.
8. A semiconductor package device comprising the die bonding jig according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022292308.1U CN213691965U (en) | 2020-10-14 | 2020-10-14 | Semiconductor die bonding pressing claw and packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022292308.1U CN213691965U (en) | 2020-10-14 | 2020-10-14 | Semiconductor die bonding pressing claw and packaging device |
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| Publication Number | Publication Date |
|---|---|
| CN213691965U true CN213691965U (en) | 2021-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022292308.1U Active CN213691965U (en) | 2020-10-14 | 2020-10-14 | Semiconductor die bonding pressing claw and packaging device |
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|---|---|
| CN (1) | CN213691965U (en) |
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- 2020-10-14 CN CN202022292308.1U patent/CN213691965U/en active Active
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