CN213680959U - Electroplating device for printed circuit board - Google Patents
Electroplating device for printed circuit board Download PDFInfo
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- CN213680959U CN213680959U CN202022798122.3U CN202022798122U CN213680959U CN 213680959 U CN213680959 U CN 213680959U CN 202022798122 U CN202022798122 U CN 202022798122U CN 213680959 U CN213680959 U CN 213680959U
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- electroplating
- circuit board
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- motor
- printed circuit
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Abstract
An electroplating device for a printed circuit board comprises a machine body, wherein a workbench is arranged in the middle of the inner side of the machine body, an electroplating pool is arranged on the workbench, plating metal is arranged in the electroplating pool, a partition plate is arranged on the side surface of the plating metal, a second motor is arranged at the bottom of the electroplating pool, which is far away from the plating metal, of the partition plate, and the output end of the second motor penetrates through the bottom of the electroplating pool and is fixedly connected with a stirring blade; the washing pond is located electroplating bath one side, be equipped with a plurality of water jet on the washing pond inner wall, wash the pond outer wall be equipped with the water tank of the corresponding setting of water jet, the inside of ventilation pipe is close to the fixed heating wire that is equipped with of organism inside side, and the inside of ventilation pipe keeps away from organism inside side and is equipped with the fan, the fan is fixed through support and ventilation pipe inside wall. The utility model discloses a can realize high-efficient, the even electroplating to the circuit board, and can spray washing and fast drying to the circuit board after electroplating the completion, save the water resource, improve production efficiency.
Description
Technical Field
The utility model relates to a circuit board preparation technical field, more specifically say, relate to an electroplating device for printed circuit board.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like. During electroplating, plating metal or other insoluble materials are used as an anode, a workpiece to be plated is used as a cathode, and cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer. In order to eliminate the interference of other cations and make the coating uniform and firm, a solution containing the metal cations of the coating is used as an electroplating solution to keep the concentration of the metal cations of the coating constant.
Application number 201922380153.4 discloses an electroplating device with shelter from plating solution function, shelter from the glass cover including plating bath, arc bracing piece and toper, be provided with the cavity intermediate layer in the casing of plating bath, one side of plating bath is provided with the semiconductor refrigeration piece through the spacing groove, the internal surface layer of plating bath is provided with micro arc oxidation ceramic layer, the top of plating bath is provided with the mounting groove, the mounting groove intussuseption is filled with the PP stopper, there is the toper through the mounting screw on the PP stopper and shelters from the glass cover, the top that the toper sheltered from the glass cover is provided with the dog-house, be provided with sealed picture peg on the dog-house, the arc bracing piece is installed through the stopper to.
This technical scheme can't realize the even electroplating to the circuit board, and can't wash and the stoving operation to the circuit board after electroplating.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a simple structure can be to circuit board high efficiency, evenly electroplate, and can spray washing and fast drying to the circuit board after electroplating the completion, saves the water resource, improves production efficiency's an electroplating device for printed circuit board.
The utility model provides an electroplating device for printed circuit board, includes the organism, its characterized in that: a workbench is arranged in the middle of the inner side of the machine body, an electroplating pool is arranged on the workbench, plating metal is arranged in the electroplating pool, a partition plate is arranged on the side surface of the plating metal, a second motor is arranged at the bottom of the electroplating pool, which is far away from the plating metal, of the partition plate, and the output end of the second motor penetrates through the bottom of the electroplating pool and is fixedly connected with a stirring blade; the cleaning device is characterized in that a cleaning pool is further arranged on the workbench and is arranged on one side of the electroplating pool, a plurality of water spraying ports are formed in the inner wall of the cleaning pool, a water tank corresponding to the water spraying ports is arranged on the outer wall of the cleaning pool, a stop block is arranged at the bottom of the inner side wall of the cleaning pool, and a filter plate is arranged on the stop block; a drying device is arranged on the side wall of the machine body above the cleaning pool, the drying device comprises a ventilating pipe, a support, a fan and an electric heating wire, the ventilating pipe is arranged on the inner side wall of the machine body, the electric heating wire is fixedly arranged in the ventilating pipe close to the inner side of the machine body, the fan is arranged in the ventilating pipe far away from the inner side of the machine body, and the fan is fixed with the inner side wall of the ventilating pipe through the support; two groups of telescopic devices are symmetrically arranged below the workbench, one group of telescopic devices is provided with one side of the electroplating pool, the other group of telescopic devices is arranged on one side of the cleaning pool, and the telescopic devices consist of a first threaded rod, a threaded sleeve, a first connecting block, a telescopic rod and a connecting box; first threaded rod one end is rotated with the workstation bottom and is connected, and the other end is connected with the output of the first motor of locating the inboard bottom of organism, be equipped with the thread bush on the first threaded rod, thread bush one side is connected with first linkage block, and first linkage block top is equipped with the telescopic link, the workstation is passed at the telescopic link top and is connected with the connecting box, link to each other through the second threaded rod between two sets of connecting boxes, be equipped with on the second threaded rod and remove the seat, it is equipped with driving motor to remove the seat upper end, it is equipped with the second connecting block to remove the seat bottom.
On the basis of the scheme, the bottom of the second connecting block is provided with a clamping device, the clamping device consists of a connecting rod, a spring, a clamping plate, a movable block, a connecting seat and an anti-skid pad, and the spring, the clamping plate, the movable block, the connecting seat and the anti-skid pad are symmetrically arranged; the connecting rod is arranged at the bottom of the connecting block, connecting seats are arranged on two sides of the bottom of the connecting rod and hinged to movable blocks arranged on the clamping plates, springs connected with the connecting rod are arranged on one side, close to the upper end, of each clamping plate, and anti-skidding pads are arranged on one side of the lower end of each clamping plate.
On the basis of the scheme, the dust screen is arranged at the outer side end of the ventilation pipe, so that dust can be prevented from entering the drying box and causing dirt on the surface of the electroplated part, and the partition screen is arranged at the inner measuring end of the ventilation pipe; the drying device is provided with three.
On the basis of the scheme, the output end of the second motor and the bottom contact position of the electroplating pool are provided with the sealing bearing, so that the electroplating liquid is prevented from leaking to influence the second motor.
On the basis of the scheme, the second motor is connected with the bottom of the electroplating pool through the motor bracket.
On the basis of the scheme, the bottom of the machine body is provided with supporting legs.
On the basis of the scheme, a water outlet is formed in the bottom of the cleaning pool, and a valve is arranged on the water outlet.
Has the advantages that:
the isolating plate can intercept the scraps generated in the electroplating process of the circuit board, so that the scraps generated in the electroplating process of the circuit board are prevented from being adsorbed on the plating metal, and the effect of the plating metal on the electrolysis of electroplating solution is improved; thereby set up stirring leaf and second motor and make the plating solution misce bene in the electroplating bath make circuit board electroplating thickness even.
The circuit board after accessible water jet is electroplated is spouted and is washed, can save the water resource again when guaranteeing the cleaning performance.
Through the cooperation of fan and heating wire, blow out hot-blast realization to the quick drying of circuit board in the organism through the ventilation pipe.
Drawings
FIG. 1 is a schematic structural view of an electroplating apparatus for a printed circuit board.
Fig. 2 is a schematic cross-sectional view of a-a in fig. 1.
FIG. 3 is an enlarged view of a clamping device of an electroplating device for a printed circuit board.
In the figure: 1-machine body, 2-telescopic rod, 3-first threaded rod, 4-first connecting block, 5-threaded sleeve, 6-first motor, 7-supporting foot, 8-coating metal, 9-isolation plate, 10-motor support, 11-second motor, 12-stirring blade, 13-electroplating pool, 14-water tank, 15-water spray nozzle, 16-filter plate, 17-valve, 18-water outlet, 19-cleaning pool, 20-stop block, 21-drying device, 22-second threaded rod, 23-moving seat, 24-driving motor, 25-second connecting block, 26-clamping device, 27-connecting box, 28-isolation net, 29-ventilating pipe, 30-support, 31-dustproof net, 32-a fan, 33-an electric heating wire, 34-a connecting rod, 35-a spring, 36-a clamping plate, 37-a movable block, 38-a connecting seat, 39-an anti-skid pad and 40-a workbench.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
An electroplating apparatus for a printed circuit board according to an embodiment of the present invention will be further described with reference to fig. 1 to 3.
The utility model provides an electroplating device for printed circuit board, includes organism 1, 1 inboard middle part of organism is equipped with workstation 40, be equipped with electroplating bath 13 on the workstation 40, electroplating bath 13 inside is provided with cladding material metal 8, cladding material metal 8 side is provided with division board 9, division board 9 is equipped with second motor 11 from electroplating bath 13 bottom of cladding material metal 8 one side, the output of second motor 11 passes electroplating bath 13's bottom and fixedly connected with stirring leaf 12.
Wherein, the contact position of the output end of the second motor 11 and the bottom of the electroplating pool 13 is provided with a sealing bearing to prevent the electroplating solution from leaking to influence the second motor 11.
Wherein, the second motor 11 is connected with the bottom of the electroplating pool 13 through the motor bracket 10.
Wherein, the bottom of the machine body is provided with supporting legs 7.
The isolation plate 9 can intercept the scraps generated in the electroplating process of the circuit board, so that the scraps generated in the electroplating process of the circuit board are prevented from being adsorbed on the plating metal 8, and the effect of the plating metal 8 on the electroplating solution is improved; the stirring blade 12 and the second motor 11 are arranged to uniformly mix the electroplating solution in the electroplating pool 13 so as to ensure that the electroplating thickness of the circuit board is uniform.
Still be equipped with on the workstation 40 and wash pond 19, wash pond 19 and locate electroplating bath 13 one side, be equipped with a plurality of water jets 15 on washing pond 19 inner wall, wash pond 19 outer wall be equipped with the water tank 14 that the water jet 15 corresponds the setting, it is equipped with dog 20 to wash 19 inside wall bottom in the pond, be equipped with filter 16 on the dog 20.
Wherein, the bottom of the cleaning pool 19 is provided with a water outlet 18, and the water outlet 18 is provided with a valve 17.
Above-mentioned, accessible water jet 15 carries out the spray rinsing to the circuit board after electroplating, can save the water resource again when guaranteeing cleaning performance, and the water after the washing is discharged from delivery port 18 after filter plate 16 filters for other uses.
Be equipped with drying device 21 on the organism 1 lateral wall of washing pond 19 top, drying device 21 includes ventilation pipe 29, support 30, fan 32, heating wire 33, ventilation pipe 29 is located on the organism 1 inside wall, the inside of ventilation pipe 29 is close to the fixed heating wire 33 that is equipped with of organism 1 inside side, and the inside of ventilation pipe 29 keeps away from organism 1 inside side and is equipped with fan 32, fan 32 is fixed with the ventilation pipe 29 inside wall through support 30.
The outer side end of the ventilation pipe 29 is provided with a dust screen 31 which can prevent dust from entering the drying box and causing dirt on the surface of an electroplated part, and the inner side end of the ventilation pipe 29 is provided with a separation screen 28.
Wherein, the drying device 21 is provided with three.
The above-mentioned cooperation of the blower 32 and the heating wire 33 can realize the fast drying of the circuit board by blowing hot air into the machine body 1 through the ventilation pipe 29.
Two groups of telescopic devices are symmetrically arranged below the workbench 40, one group is provided with one side of the electroplating pool 13, the other group is arranged on one side of the cleaning pool 19, and the telescopic devices comprise a first threaded rod 3, a threaded sleeve 5, a first connecting block 4, a telescopic rod 2 and a connecting box 27; one end of the first threaded rod 3 is rotatably connected with the bottom of the workbench 40, the other end of the first threaded rod is connected with the output end of a first motor 6 arranged at the bottom of the inner side of the machine body 1, a threaded sleeve 5 is arranged on the first threaded rod 3, one side of the threaded sleeve 5 is connected with a first connecting block 4, a telescopic rod 2 is arranged at the top of the first connecting block 4, the top of the telescopic rod 2 penetrates through the workbench 40 and is connected with a connecting box 27, the two groups of connecting boxes 27 are connected through a second threaded rod 22, a moving seat 23 is arranged on the second threaded rod 22, a driving motor 24 is arranged at the upper end of the moving seat 23, and a second connecting block 25 is arranged at the; the bottom of the second connecting block 25 is provided with a clamping device 26, the clamping device 26 is composed of a connecting rod 34, a spring 35, a clamping plate 36, a movable block 37, a connecting seat 38 and an anti-skid pad 39, wherein the spring 35, the clamping plate 36, the movable block 37, the connecting seat 38 and the anti-skid pad 39 are symmetrically arranged; the connecting rod 34 is arranged at the bottom of the connecting block, connecting seats 38 are arranged on two sides of the bottom of the connecting rod 34, the connecting seats 38 are hinged to movable blocks 37 arranged on the clamping plate 36, a spring 35 connected with the connecting rod 34 is arranged on one side, close to the upper end, of the clamping plate 36, and an anti-skid pad 39 is arranged on one side of the lower end of the clamping plate 36;
the circuit board is placed between the two anti-slip pads 39, and is clamped under the action of the clamping plate 36 and the spring 35; the circuit board can drive the first threaded rod 3 to rotate through the first motor 6 after being clamped tightly, and then drive the threaded sleeve 5 to move up and down, and then drive the telescopic rod 2 to move up and down to adjust the longitudinal position of the clamping device 26, and can drive the movable seat 23 to move along the direction of the second threaded rod 22 through the driving motor 24, and then drive the clamping device 26 to adjust the transverse position, so that the circuit board can be conveyed into the electroplating pool 13 to be electroplated, and then conveyed into the cleaning pool 19 to be cleaned after the electroplating is completed, and after the cleaning is completed, the circuit board is lifted to a series of operations corresponding to the position of the drying device 21 to be dried.
In conclusion, the device can realize high-efficient, evenly electroplating to the circuit board, and can spray washing and fast drying to the circuit board after the completion of electroplating, saves the water resource, improves production efficiency.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (7)
1. The utility model provides an electroplating device for printed circuit board, includes the organism, its characterized in that: a workbench is arranged in the middle of the inner side of the machine body, an electroplating pool is arranged on the workbench, plating metal is arranged in the electroplating pool, a partition plate is arranged on the side surface of the plating metal, a second motor is arranged at the bottom of the electroplating pool, which is far away from the plating metal, of the partition plate, and the output end of the second motor penetrates through the bottom of the electroplating pool and is fixedly connected with a stirring blade; the cleaning device is characterized in that a cleaning pool is further arranged on the workbench and is arranged on one side of the electroplating pool, a plurality of water spraying ports are formed in the inner wall of the cleaning pool, a water tank corresponding to the water spraying ports is arranged on the outer wall of the cleaning pool, a stop block is arranged at the bottom of the inner side wall of the cleaning pool, and a filter plate is arranged on the stop block; a drying device is arranged on the side wall of the machine body above the cleaning pool, the drying device comprises a ventilating pipe, a support, a fan and an electric heating wire, the ventilating pipe is arranged on the inner side wall of the machine body, the electric heating wire is fixedly arranged in the ventilating pipe close to the inner side of the machine body, the fan is arranged in the ventilating pipe far away from the inner side of the machine body, and the fan is fixed with the inner side wall of the ventilating pipe through the support; two groups of telescopic devices are symmetrically arranged below the workbench, one group of telescopic devices is provided with one side of the electroplating pool, the other group of telescopic devices is arranged on one side of the cleaning pool, and the telescopic devices consist of a first threaded rod, a threaded sleeve, a first connecting block, a telescopic rod and a connecting box; first threaded rod one end is rotated with the workstation bottom and is connected, and the other end is connected with the output of the first motor of locating the inboard bottom of organism, be equipped with the thread bush on the first threaded rod, thread bush one side is connected with first linkage block, and first linkage block top is equipped with the telescopic link, the workstation is passed at the telescopic link top and is connected with the connecting box, link to each other through the second threaded rod between two sets of connecting boxes, be equipped with on the second threaded rod and remove the seat, it is equipped with driving motor to remove the seat upper end, it is equipped with the second connecting block to remove the seat bottom.
2. A plating apparatus for a printed circuit board according to claim 1, wherein: the bottom of the second connecting block is provided with a clamping device, the clamping device consists of a connecting rod, a spring, a clamping plate, a movable block, a connecting seat and an anti-skid pad, and the spring, the clamping plate, the movable block, the connecting seat and the anti-skid pad are symmetrically arranged; the connecting rod is arranged at the bottom of the connecting block, connecting seats are arranged on two sides of the bottom of the connecting rod and hinged to movable blocks arranged on the clamping plates, springs connected with the connecting rod are arranged on one side, close to the upper end, of each clamping plate, and anti-skidding pads are arranged on one side of the lower end of each clamping plate.
3. A plating apparatus for a printed circuit board according to claim 1, wherein: the outer side end of the ventilation pipe is provided with a dust screen which can prevent dust from entering the drying box and causing dirt on the surface of the electroplated part, and the inner measuring end of the ventilation pipe is provided with a separation screen; the drying device is provided with three.
4. A plating apparatus for a printed circuit board according to claim 1, wherein: the output of second motor and the bottom contact position of electroplating bath are equipped with sealed bearing, prevent that the plating solution from spilling and cause the influence to the second motor.
5. A plating apparatus for a printed circuit board according to claim 1, wherein: the second motor is connected with the bottom of the electroplating pool through a motor bracket.
6. A plating apparatus for a printed circuit board according to claim 1, wherein: the bottom of the machine body is provided with supporting legs.
7. A plating apparatus for a printed circuit board according to claim 1, wherein: the bottom of the cleaning pool is provided with a water outlet, and a valve is arranged on the water outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022798122.3U CN213680959U (en) | 2020-11-28 | 2020-11-28 | Electroplating device for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022798122.3U CN213680959U (en) | 2020-11-28 | 2020-11-28 | Electroplating device for printed circuit board |
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| CN213680959U true CN213680959U (en) | 2021-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022798122.3U Active CN213680959U (en) | 2020-11-28 | 2020-11-28 | Electroplating device for printed circuit board |
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| CN (1) | CN213680959U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114059121A (en) * | 2021-11-26 | 2022-02-18 | 建湖县特佳液压管件有限公司 | But quick drying's hydraulic machine production is with electroplating device |
| CN114622255A (en) * | 2022-03-12 | 2022-06-14 | 张荣光 | Electroplating equipment for open-circuit short-circuit test board of chip |
| CN116254587A (en) * | 2023-02-02 | 2023-06-13 | 无锡华友微电子有限公司 | Electroplating device of integrated circuit board with equal-thickness plating function |
| CN116397294A (en) * | 2023-03-17 | 2023-07-07 | 广东宏佳工业科技有限公司 | Auxiliary equipment for processing metal faucet heated by hot thick film |
-
2020
- 2020-11-28 CN CN202022798122.3U patent/CN213680959U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114059121A (en) * | 2021-11-26 | 2022-02-18 | 建湖县特佳液压管件有限公司 | But quick drying's hydraulic machine production is with electroplating device |
| CN114622255A (en) * | 2022-03-12 | 2022-06-14 | 张荣光 | Electroplating equipment for open-circuit short-circuit test board of chip |
| CN116254587A (en) * | 2023-02-02 | 2023-06-13 | 无锡华友微电子有限公司 | Electroplating device of integrated circuit board with equal-thickness plating function |
| CN116254587B (en) * | 2023-02-02 | 2024-01-23 | 无锡华友微电子有限公司 | Electroplating device of integrated circuit board with equal-thickness plating function |
| CN116397294A (en) * | 2023-03-17 | 2023-07-07 | 广东宏佳工业科技有限公司 | Auxiliary equipment for processing metal faucet heated by hot thick film |
| CN116397294B (en) * | 2023-03-17 | 2023-11-03 | 广东宏佳工业科技有限公司 | Auxiliary equipment for processing metal faucet heated by hot thick film |
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