CN213601844U

CN213601844U - Automatic coating and cleaning device for wafer carrier ring

Info

Publication number: CN213601844U
Application number: CN202120040770.4U
Authority: CN
Inventors: 王辉
Original assignee: Jinglong Technology Suzhou Co ltd
Current assignee: Jinglong Technology Suzhou Co ltd
Priority date: 2021-01-08
Filing date: 2021-01-08
Publication date: 2021-07-02
Anticipated expiration: 2031-01-08
Also published as: TWM611844U

Abstract

The application discloses an automatic coating and cleaning device for a wafer carrier ring, which comprises a lifting platform, a transfer unit and a coating and cleaning unit, wherein the transfer unit is respectively arranged adjacent to the lifting platform and the coating and cleaning unit; the lifting platform is responsible for bearing the wafer boat box to lift; the transferring unit comprises a multi-axial picking and placing arm and a transverse clamping mechanism, the transverse clamping mechanism can move a single wafer carrier ring out of the wafer cassette to a certain point, a wafer is fixed on the wafer carrier ring, and the multi-axial picking and placing arm absorbs the wafer carrier ring and transfers the wafer carrier ring to the coating cleaning unit; the coating and cleaning unit comprises a coating nozzle and a cleaning nozzle, wherein the coating nozzle can firstly spray coating liquid on the wafer, and then the cleaning nozzle sprays cleaning liquid to remove the coating liquid on the surface of the wafer so as to change the tension of the surface layer of the wafer.

Description

Automatic coating and cleaning device for wafer carrier ring

Technical Field

The application belongs to the technical field of automatic coating and cleaning devices of wafer carrier rings, and particularly relates to an automatic coating and cleaning device which can clean the surface of a wafer and change the tension of the surface layer.

Background

Before the semiconductor wafer is packaged, the wafer is fixed by the wafer ring, and then the wafer is cut by the cutting device, before the cutting, a layer of coating liquid is generally coated on the surface of the wafer, and then the coating liquid is removed by a cleaning liquid, so that the conditions of the surface layer of the wafer, such as cleanliness, tension, adhesion and the like, can be changed, and the subsequent cutting operation can be smoothly performed. At present, most of the devices respectively belong to two independently operating machines for wafer coating operation and cleaning operation, and wafers which are coated are firstly collected in a wafer cassette, and then taken out from the wafer cassette and moved to a cleaning machine for cleaning operation. The process is complicated and needs to be carried out between the machines, and the efficiency is not good.

Therefore, there is a need for an automatic coating and cleaning apparatus for wafer carrier ring.

SUMMERY OF THE UTILITY MODEL

An object of the present application is to provide an automatic coating and cleaning device for a wafer carrier ring, which can sequentially perform coating and cleaning operations in a single machine, so as to improve the efficiency of wafer cleaning operations, thereby reducing the production cost, effectively improving the tension of the wafer surface layer, and facilitating the subsequent packaging process.

In order to achieve the above object, an embodiment of the present application provides the following technical solutions:

in one embodiment, an automatic coating and cleaning device for a wafer carrier ring is provided, which comprises a lifting platform, a transfer unit and a coating and cleaning unit; the lifting platform is responsible for bearing the wafer boat box to lift; the transferring unit comprises a multi-axial taking and placing arm and a transverse clamping mechanism, the transferring unit is respectively arranged adjacent to the lifting platform and the coating cleaning unit, the transverse clamping mechanism can move a single wafer carrier ring out of the wafer carrier box to a certain point, a wafer is fixed on the wafer carrier ring, and the multi-axial taking and placing arm is responsible for adsorbing the wafer carrier ring and transferring the wafer carrier ring to the coating cleaning unit; the coating and cleaning unit comprises at least one coating nozzle and at least one cleaning nozzle, the coating nozzle can firstly spray coating liquid on the wafer, and then the cleaning nozzle sprays cleaning liquid to remove the coating liquid on the surface of the wafer, so that the tension of the surface layer of the wafer is changed.

As one of the preferred embodiments, the elevating platform is responsible for carrying the wafer cassette to move up and down, so that the position of the wafer ring to be moved out of the cassette is aligned with the lateral clamping mechanism.

As one preferred embodiment, the multi-axial pick-and-place arm is capable of at least two axial movements to transfer the wafer carrier ring to the coating and cleaning unit.

As a preferred embodiment, the coating and cleaning unit includes a tank, a rotary platform, and a sprayer, the coating nozzle and the cleaning nozzle are mounted on the sprayer, the rotary platform is responsible for carrying the wafer carrier ring to rotate in the tank, the sprayer extends from the side of the tank to above the rotary platform, and a space is provided between the sprayer and the rotary platform, so that the sprayer can spray the coating liquid and the cleaning liquid from above the rotary platform in sequence.

In a preferred embodiment, the sprayer is a group of swinging cantilevers, and the coating nozzle and the cleaning nozzle are installed on the sprayer downwards and can spray liquid during the swinging of the sprayer.

As one of the preferred embodiments, the coating and cleaning unit includes a tank, a rotary platform, and a sprayer, the coating nozzle and the cleaning nozzle are mounted on the sprayer, the rotary platform is responsible for bearing the wafer carrier ring to rotate in the tank, wherein the direction of the mounted coating nozzle and cleaning nozzle towards the rotary platform is fixed.

Compared with the prior art, the automatic coating and cleaning device for the wafer carrying ring has the following specific effects:

1. the design of the application can sequentially carry out coating and cleaning operations in a single machine, can improve the production efficiency and reduce the production cost;

2. the automatic coating and cleaning device comprises a coating nozzle, a cleaning nozzle, a coating liquid spraying nozzle, a cleaning liquid spraying nozzle and a control device, wherein the coating liquid is sprayed out of the coating nozzle to the wafer, and then the cleaning liquid is sprayed out of the cleaning nozzle to remove the coating liquid on the surface of the wafer, so that the tension of the surface layer of the wafer is;

3. the sprayer can adopt a fixed or swinging spraying mode, achieves different coating or cleaning effects, and meets different requirements of users.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a perspective view of an automated coating and cleaning apparatus for a wafer carrier ring according to the present application;

FIG. 2 is a perspective view of another angle of the automated coating and cleaning apparatus for a wafer carrier ring of the present application;

FIG. 3 is a diagram illustrating a first embodiment of a showerhead of an automatic coating and cleaning apparatus for a wafer carrier ring according to the present invention;

FIG. 4 is a diagram illustrating a second embodiment of a showerhead of an automatic coating and cleaning apparatus for a wafer carrier ring according to the present invention;

fig. 5 is a flow chart illustrating the operation of the automatic coating and cleaning apparatus for wafer carrier rings according to the present invention.

The reference numbers illustrate:

1-a lifting platform; 2-a transfer unit; 21-a multi-axial pick-and-place arm; 211-a suction head; 22-a transverse gripping mechanism; 3-coating and cleaning unit; 31-a trough body; 32-a rotating platform; 33-a sprinkler; 331-a coating nozzle; 332-cleaning the spray head; 4-a wafer boat; 5-wafer ring; 6-a wafer; 501-504-step.

Detailed Description

The present application will be described in detail below with reference to embodiments shown in the drawings. The embodiments are not limited to the embodiments, and structural, methodological, or functional changes made by those skilled in the art according to the embodiments are included in the scope of the present disclosure.

Referring to fig. 1 and 2, perspective views of different angles of an automatic coating and cleaning apparatus for a wafer carrier ring according to an embodiment of the present invention are shown. The automatic coating and cleaning device comprises a lifting platform 1, a transferring unit 2 and a coating and cleaning unit 3, wherein the transferring unit 2 is respectively adjacent to the lifting platform 1 and the cleaning unit 3. The elevating platform 1 is responsible for elevating the wafer boat 4. The transfer unit 2 includes a multi-axis pick-and-place arm 21 and a lateral gripping mechanism 22. The lateral clamp mechanism 22 is capable of holding a wafer carrier ring 5 for removal from the cassette 4. The wafer ring 5 holds a wafer 6. The wafer carrier ring 5 is then sucked by the multi-axis pick-and-place arm 21 and transferred to the coating and cleaning unit 3. The coating and cleaning unit 3 includes a tank 31, a rotary platform 32, and a sprayer 33, the rotary platform 32 being disposed in the tank 31, and the sprayer 33 being disposed at a side of the tank 31. As shown in fig. 3, the sprayer 33 has at least one coating nozzle 331 and at least one cleaning nozzle 332, the rotary platform 32 can rotate with the wafer ring 5, the coating nozzle 331 will spray the coating liquid on the wafer ring 5, and then the cleaning nozzle 332 will spray the cleaning liquid to remove the coating liquid on the surface of the wafer 6, so as to change the tension of the wafer surface layer.

Next, as a description of the structure of each component, a lifting mechanism is provided at the bottom of the lifting platform 1 to precisely control the lifting position of the lifting platform 1. The elevating platform 1 is used for placing a wafer boat 4, a plurality of wafer carrying rings 5 are sequentially stacked in the wafer boat 4, and each wafer carrying ring 5 is mounted and a wafer 6 is fixed at the center. The elevating platform 1 is responsible for carrying the wafer boat 4 to move up and down, and aligning the wafer ring 5 to be moved out of the wafer boat with the transverse clamping mechanism 22.

The transfer unit 2 includes a multi-axis pick-and-place arm 21 and a lateral gripping mechanism 22. The lateral clamp mechanism 22 can horizontally slide back and forth in the direction of the cassette 4, and is mainly used to move out the single wafer ring 5 in the cassette 4 and to position the wafer ring. The multi-axial pick-and-place arm 21 is provided with a pick-and-place head 211, and the pick-and-place head 211 is used for clamping the wafer carrier ring 5. The multi-axis pick-and-place arm 21 can drive the pick-and-place head 211 to perform at least two axial movements, such as up-and-down and left-and-right movements, so as to transfer the wafer carrier ring 5 to the coating and cleaning unit 3.

The coating and cleaning unit 3 includes a tank 31, a rotary table 32, and a sprayer 33. The rotary platform 32 is responsible for bearing the wafer carrier ring 5 to rotate in the tank 31, the sprayer 33 extends from the side edge of the tank 31 to the upper part of the rotary platform 32, a space is formed between the sprayer 33 and the rotary platform 32, the sprayer 33 is positioned above the rotary platform 32 to spray coating liquid and cleaning liquid in sequence, and the coating liquid and the cleaning liquid can be distributed on the surface of the wafer 6 in a large area range by virtue of the design of the space between the sprayer 33 and the rotary platform 32. As shown in fig. 3, in the embodiment, the coating nozzle 331 and the cleaning nozzle 332 are installed on the sprayer 33, the coating nozzle 331 and the cleaning nozzle 332 are installed opposite to the rotary platform 32, the sprayer 33 is a set of cantilevers capable of swinging left and right and is located above the rotary platform 32, for example, the sprayer 33 swings left and right in a mode of axial rotation or linear movement, and then the rotary platform 32 is matched to rotate the wafer 6, so that the coating liquid and the cleaning liquid can be uniformly distributed on the surface of the wafer 6. The coating head 331 first sprays the coating liquid to be uniformly distributed on the surface of the wafer 6, and then the cleaning head 332 cleans the liquid to remove the coating liquid, thereby changing the tension of the wafer surface. Since the sprayer 33 in this embodiment can swing left and right, the amount of the cleaning liquid used is large, so that the dead angle of spraying can be relatively reduced, and the cleaning ability for removing the coating liquid can be enhanced.

Referring to fig. 4, which is another embodiment of the sprayer 33 of the present application, in the present embodiment, the coating nozzle 331 and the cleaning nozzle 332 of the sprayer 33 are fixed, and the coating nozzle 331 and the cleaning nozzle 332 are respectively disposed on the independent sprayer 33, and maintain a fixed angle toward the rotary platform 32. In another embodiment, the coating nozzle 331 and the cleaning nozzle 332 are disposed adjacent to each other on the same sprayer 33, the sprayer 33 is disposed adjacent to the trough 31, or the sprayer 33 extends from the adjacent side of the trough 31 to a position opposite to the rotary platform 32, wherein an included angle between the direction of the coating nozzle 331 and the cleaning nozzle 332 for spraying the coating liquid and the cleaning liquid and the rotary axis of the rotary platform 32 is 0 ° to 90 °. The advantages of this approach are: the amount of the coating liquid used is small, and the uniformity of spraying can be enhanced.

Next, a cleaning process of the present application is described, as shown in fig. 5, the cleaning process of the present application for an automatic coating and cleaning apparatus for wafer carrier rings includes the steps of:

step 501: placing the wafer ring 5 on a rotary platform 32 in the tank 31;

step 502: the rotary platform 32 rotates the wafer carrying ring 5 and the coating nozzle 331 sprays the coating liquid on the wafer;

step 503: the rotary platform 32 rotates at a high speed to enable the coating liquid to uniformly cover the surface of the wafer 6;

step 504: the rotary table 32 rotates the wafer carrier ring 5 and the cleaning head 332 sprays the cleaning liquid onto the wafer 6 to remove the coating liquid on the surface of the wafer 6.

In summary, the automatic coating and cleaning device for the wafer carrier ring of the present application can spray the coating liquid and the cleaning liquid on a single device, so that when the wafer carrier ring with the wafer fixed thereon is transferred to the rotating platform, the coating liquid can be sequentially sprayed on the surface of the wafer, and after waiting for a predetermined time, the cleaning liquid is sprayed to remove the coating liquid, so that the tension of the surface of the wafer can be changed, thereby facilitating the subsequent packaging process operation, increasing the cleaning efficiency, reducing the production cost, and meeting the requirements of the patent application.

It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. An automatic coating and cleaning device for a wafer carrier ring is characterized by comprising a lifting platform, a transfer unit and a coating and cleaning unit, wherein the transfer unit is respectively arranged adjacent to the lifting platform and the coating and cleaning unit; the lifting platform is responsible for lifting the wafer boat box; the transfer unit comprises a multi-axial pick-and-place arm and a transverse clamping mechanism, the transverse clamping mechanism can move a single wafer carrier ring out of the wafer cassette to a certain point, a wafer is fixed on the wafer carrier ring, and the multi-axial pick-and-place arm is responsible for adsorbing the wafer carrier ring and transferring the wafer carrier ring to the coating cleaning unit; the coating and cleaning unit comprises at least one coating nozzle and at least one cleaning nozzle, wherein the coating nozzle can firstly spray coating liquid on the wafer, and then the cleaning nozzle sprays cleaning liquid to remove the coating liquid on the surface of the wafer, so that the tension of the surface layer of the wafer is changed.

2. The apparatus as claimed in claim 1, wherein the lift platform is adapted to move the cassette up and down and align the wafer ring to be removed from the cassette with the lateral pick-up mechanism.

3. The automated coating and cleaning apparatus for wafer carrier rings of claim 1, wherein the multi-axial pick-and-place arm is capable of at least two axial movements to transfer the wafer carrier ring to the coating and cleaning unit.

4. The automatic coating and cleaning device for the wafer carrier ring as claimed in claim 1, wherein the coating and cleaning unit comprises a tank body, a rotary platform and a sprayer, the coating sprayer and the cleaning sprayer are mounted on the sprayer, the rotary platform is responsible for carrying the wafer carrier ring to rotate in the tank body, the sprayer extends from the side edge of the tank body to the upper part of the rotary platform, and a gap is formed between the sprayer and the rotary platform, so that the sprayer can spray the coating liquid and the cleaning liquid from the upper part of the rotary platform in sequence.

5. The automatic coating and cleaning device for wafer carrier rings according to claim 4, characterized in that the sprayer is a set of swingable cantilevers, the coating head and the cleaning head are mounted downward on the sprayer, and liquid can be sprayed during the swing of the sprayer.

6. The automatic coating and cleaning device for wafer carrier rings according to claim 1, wherein the coating and cleaning unit comprises a tank, a rotary platform and a sprayer, the coating and cleaning nozzles are mounted on the sprayer, the rotary platform is responsible for carrying the wafer carrier rings to rotate in the tank, and the directions of the coating and cleaning nozzles towards the rotary platform are fixed.