CN213596449U - Electroplating bath with adjustable distance between cathode and anode - Google Patents

Electroplating bath with adjustable distance between cathode and anode Download PDF

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Publication number
CN213596449U
CN213596449U CN202022494234.XU CN202022494234U CN213596449U CN 213596449 U CN213596449 U CN 213596449U CN 202022494234 U CN202022494234 U CN 202022494234U CN 213596449 U CN213596449 U CN 213596449U
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anode
cathode
moving
distance
flat
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CN202022494234.XU
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董光义
刘建
王芳
王兴平
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Alent Enthone Chemistry Shanghai Co Ltd
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Cookson Enthone Chemistry Shanghai Co Ltd
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Abstract

The utility model provides a negative pole and positive pole apart from adjustable plating bath, this plating bath have upper end open-ended main part to this plating bath includes that two positive poles that are used for installing the positive pole are flat, be used for the installation to treat the negative pole of electroplating the product, be used for removing two flat positive poles of two above-mentioned positive poles and remove lead screw and positive pole removal motor, wherein two above-mentioned positive poles are flat and above-mentioned negative pole is located the opening top of plating bath main part. The electroplating bath of the utility model can realize the adjustable distance between the cathode and the anode, and realize the distance requirement between the cathode and the anode for different electroplating processes of different products to be electroplated.

Description

Electroplating bath with adjustable distance between cathode and anode
Technical Field
The utility model belongs to the technical field of the electro-coppering, specifically speaking relates to a negative pole and positive pole apart from adjustable plating bath.
Background
The electro-coppering is widely applied to Printed Circuit Boards (PCBs), hardware, plastic decorating parts and the like; copper plating is an important constituent of the copper/nickel/chromium system of protective and decorative coatings. The copper plating is also used for local anti-carburizing, printing plate hole metallization and as a surface layer of the printing roller. The electroplating copper of the printed circuit board comprises whole board copper plating, pattern circuit copper plating, micropore manufacturing copper plating and the like, and the acid sulfate plating solution is commonly used at present.
With the miniaturization and multi-functionalization of electronic products, the electroplated copper of the PCB becomes more and more refined, the quality control of the electroplated copper becomes more and more severe, the previous large and thick electroplated copper process can not meet the existing process requirements, the electroplating additive suppliers need to perform experiments more finely, and the multi-functionalized products can meet the requirements of different processes.
The distance between the cathode and the anode of the conventional electroplating bath is fixed or the small-range change of the distance between the cathode and the anode is realized only by cathode swing, so that the distance between the cathode and the anode cannot be accurately controlled, and therefore, the electroplating bath with the accurately controllable distance between the cathode and the anode is required.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a negative pole and positive pole apart from adjustable plating bath, the distance between the negative pole of this plating bath and the positive pole is accurate controllable, can satisfy the demand that printed circuit board electroplates separately.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
a cathode and anode distance adjustable electroplating bath is provided with a main body with an opening at the upper end, and the electroplating bath comprises two anode flat plates for installing an anode, a cathode rod for installing a printed circuit board, two anode moving screw rods for moving the two anode flat plates and an anode moving motor, wherein the two anode flat plates and the cathode rod are positioned above the opening of the main body.
Preferably, the main body is rectangular or square, and the two anode moving screws and the anode moving motor are respectively located at the side of the main body.
Preferably, two ends of the anode flat are respectively connected with the anode moving screw rod through the anode moving seat.
Preferably, the plating tank further comprises a scale which is positioned below the anode moving screw and is used for enabling a user to observe the distance between the anode flat and the cathode rod.
Preferably, the number of the scales is two.
Preferably, the plating tank further comprises an anode moving gearbox, and the anode moving gearbox is used for controlling or regulating the rotating speed of the anode moving screw rod.
Preferably, the number of the anode moving gear boxes is two.
Preferably, the two anode moving gearboxes are located on the same side of the body as the anode moving motor.
The distance between the cathode and the anode of the electroplating bath of the utility model is adjustable, which can meet the distance requirement between the cathode and the anode of different electroplating processes of different products to be electroplated. For example, the distance between the cathode and the anode of the electroplating bath of the utility model can satisfy different electroplating test requirements of a common Printed Circuit Board (PCB), a carrier board (IC Substrate), a class carrier board (SLP), an improved semi-additive board (MSAP), a screen panel, etc.
Drawings
In order to illustrate the embodiments of the invention more clearly, reference will now be made briefly to the attached drawings of embodiments, it being understood that the drawings described below are only examples of some embodiments of the invention, and that other drawings may be derived from these drawings by a person skilled in the art without the inventive step in the forerunner.
Fig. 1 is a schematic perspective view of an electroplating bath with adjustable cathode-anode distance according to an embodiment of the present invention.
FIG. 2 is a top view of the plating cell shown in FIG. 1.
FIG. 3 is a side view of the plating cell shown in FIG. 1.
FIG. 4 is a schematic perspective view of the plating cell of FIG. 1 with an anode suspended flat on the anode and a product to be plated suspended on the cathode rod.
Detailed Description
In the description of the utility model, the material for preparing the plating bath main body can be PP or PVC.
In the context of the present invention, the anode may be a commercially available product commonly used in the art, such as an anode titanium basket or mesh.
In the description of the present invention, the products to be electroplated include, but are not limited to, Printed Circuit Board (PCB), carrier board (IC Substrate), class carrier board (SLP), modified semi-additive board (MSAP), and screen panel.
In order to make the technical means, creation features, achievement purposes and effects of the present invention easy to understand and understand, the present invention is further explained below with reference to the accompanying drawings.
As shown in fig. 1 to 3, in one embodiment of the present invention, the cathode-anode distance adjustable plating bath 1 includes a rectangular main body 10, a first anode flat 11 and a second anode flat 11 ', a cathode rod 12, a first anode moving screw 13, a second anode moving screw 13', and an anode moving motor 14. Wherein the upper end of the body 10 is open. The first anode flat 11, the second anode flat 11 'and the cathode rod 12 are all disposed above the opening of the main body 10, and the first anode flat 11 and the second anode flat 11' are respectively located at both sides of the cathode rod 12. The plating cell 1 further comprises four anode moving seats for converting the rotation of the anode moving screw into the vertical movement of the anode flat relative to the cathode rod 12. The left end and the right end of the first anode flat 11 are respectively and fixedly installed on the first anode moving seat 111 and the second anode moving seat 112, and the left end and the right end of the second anode flat 11' are respectively and fixedly installed on the third anode moving seat 113 and the fourth anode moving seat 114. Both ends of the first anode moving screw 13 are respectively connected to the first anode moving base 111 and the third anode moving base 113. The two ends of the second anode moving screw 13' are respectively connected to the second anode moving base 112 and the fourth anode moving base 114. The four anode moving seats and the two anode moving screw rods are respectively positioned on two opposite side surfaces of the rectangular main body 1.
The cathode and anode distance adjustable plating bath 1 as shown in fig. 1-3 further comprises a first scale 15, the scale 15 is positioned below the first anode moving screw 15, and is used for allowing a user to observe the moving positions of the first anode flat 11 and the second anode flat 11' so as to determine the distance between the first anode flat 11 and the cathode rod 12.
The cathode and anode distance-adjustable plating cell 1 as described in FIGS. 1-3 further comprises a first anode moving gearbox 16 and a second anode moving gearbox 16'. The first anode moving gearbox 16 is connected to the first anode moving screw 13 and the driving shaft of the anode moving motor 14, respectively, and is used for adjusting the rotating speed of the first anode moving screw 13 to change the moving speed of the first anode flat 11 relative to the cathode rod 12. A second anode moving gearbox 16 'is connected to the second anode moving screw 13' and the driving shaft of the anode moving motor 14, respectively, for adjusting the rotation speed of the second anode moving screw 13 'to change the moving speed of the second anode flat 11' relative to the cathode rod 12. The first anode moving gearbox 16, the second anode moving gearbox 16' and the anode moving motor 14 are located on the same side of the rectangular body 1.
In use, as shown in fig. 4, two anode titanium meshes 20 and 20 'are respectively hung on the first anode flat 11 and the second anode flat 11', and a product 30 to be electroplated is hung on the cathode rod 12. When the electroplating process is finished, the anode moving motor 14 is turned on, the first anode moving screw rod 13 and the second anode moving screw rod 13 ' start to synchronously rotate, and the first anode flat 11 and the second anode flat 11 ' move relative to the cathode rod 12 under the synchronous rotation drive of the first anode moving screw rod 13 and the second anode moving screw rod 13 '. In the process of rotating the first anode moving screw 13 and the second anode moving screw 13 ', a user can adjust the speed of the first anode moving gearbox 16 and the second anode moving gearbox 16' as required to change the rotating speed of the first anode moving screw 13 and the second anode moving screw 13 ', so as to change the moving speed of the two anode titanium nets 20 and 20' relative to the product 30 to be electroplated. The user can also determine the distance between the first anode flat 11 and the second anode flat 11 'and the cathode rod 12, i.e. the distance between the two anode titanium meshes 20 and 20' and the product 30 to be electroplated, according to the ruler 15.
From the above description, it can be seen that the distance between the cathode and the anode of the electroplating bath of the present invention is adjustable, so that the electroplating bath can satisfy the requirements of different electroplating processes for different samples to be plated on the distance between the cathode and the anode.
The foregoing shows and describes the general principles, essential features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (8)

1. The electroplating bath is characterized in that the electroplating bath is provided with a main body with an upper end opening, and the electroplating bath comprises two anode flat plates for installing anodes, a cathode rod for installing products to be electroplated, two anode moving screw rods for moving the two anode flat plates and an anode moving motor, wherein the two anode flat plates and the cathode rod are positioned above the opening of the main body.
2. The cathode and anode distance-adjustable plating cell of claim 1, wherein the body is rectangular or square, and the two anode moving screws and the anode moving motor are respectively located at the side of the body.
3. The electroplating bath with the adjustable distance between the cathode and the anode as claimed in claim 1 or 2, wherein two ends of the anode flat are respectively connected with the anode moving screw rod through an anode moving seat.
4. The cathode and anode distance adjustable plating cell of claim 1 or 2, further comprising a scale positioned below the anode moving screw for enabling a user to view the distance between the anode flat and the cathode rod.
5. The cathode and anode distance-adjustable plating bath according to claim 4, wherein the number of the scales is two.
6. The plating cell of claim 1 or 2, wherein the plating cell further comprises an anode movement gearbox for controlling or adjusting the rotation speed of the anode movement screw.
7. The plating cell with adjustable cathode and anode distances as recited in claim 6, wherein the number of the anode shift gearboxes is two.
8. The cathode and anode distance-adjustable plating cell of claim 7, wherein the two anode-moving gearboxes are located on the same side of the body as the anode-moving motor.
CN202022494234.XU 2020-11-02 2020-11-02 Electroplating bath with adjustable distance between cathode and anode Active CN213596449U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022494234.XU CN213596449U (en) 2020-11-02 2020-11-02 Electroplating bath with adjustable distance between cathode and anode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022494234.XU CN213596449U (en) 2020-11-02 2020-11-02 Electroplating bath with adjustable distance between cathode and anode

Publications (1)

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CN213596449U true CN213596449U (en) 2021-07-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113638022A (en) * 2021-10-14 2021-11-12 常州欣盛半导体技术股份有限公司 Device for adjusting distance between carrier tape and anode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113638022A (en) * 2021-10-14 2021-11-12 常州欣盛半导体技术股份有限公司 Device for adjusting distance between carrier tape and anode
CN113638022B (en) * 2021-10-14 2022-01-04 常州欣盛半导体技术股份有限公司 Device for adjusting distance between carrier tape and anode

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