CN205741262U - A kind of electroplanting device - Google Patents
A kind of electroplanting device Download PDFInfo
- Publication number
- CN205741262U CN205741262U CN201620621211.1U CN201620621211U CN205741262U CN 205741262 U CN205741262 U CN 205741262U CN 201620621211 U CN201620621211 U CN 201620621211U CN 205741262 U CN205741262 U CN 205741262U
- Authority
- CN
- China
- Prior art keywords
- electroplated
- installing rack
- rotary shaft
- plate
- electroplanting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a kind of electroplanting device, including a rotary shaft and at least one installing rack, described installing rack is fixed with plate to be electroplated, described installing rack has two linking arms, and two described linking arms are connected to described rotating shaft terminal.During plating, described rotary shaft rotates, and drives the plate to be electroplated on installing rack to rotate, and in rotary course, plate all directions to be electroplated can be electroplated and be put in place, solves plate top half copper to be electroplated thicker than thickness, the problem that the copper thickness ununiformity of the latter half copper thickness is even.Plate to be electroplated rotates with rotary shaft, when it walks to top, expose liquid level, so can alleviate product be immersed in liquid medicine always, the water-laid situation of medicine, avoid if owing to once enter electroplate liquid and bubble, enter the problem that impurity is not easy to discharge in hole, provide repeatedly back into the chance of electroplate liquid to product.
Description
Technical field
This utility model belongs to printed circuit board electroplating technology field, relates to a kind of electroplanting device, relates in particular to one
Plant windmill-shaped electroplanting device.
Background technology
Plating is one important procedure in printed circuit board (PCB) production process, be by electrolytic method on base material
The process of the formation of deposits coat of metal, generally using coated metal as anode, pcb board to be plated, as negative electrode, is exchanged by ion
Complete electroplating process.During plating, negative electrode, anode are electroplated vertically into electroplate liquid, but in electroplating process, often deposit
The problem not plating metal at hole inwall, to this end, electroplating process would generally assist the operation to vibrate, to wave at present, to ensure
In hole, bubble is discharged, and hole inwall is effectively electroplated.
Existing electroplating device is vertical hanging due to pcb board to be plated, and in electroplating process, the clip of conduction electric current is positioned at product
Above product, if cation distribution is uneven, electric current is preferentially conducted to above plate to be plated in addition, the most easily produces coating above plank
The problem thicker than lower section coating, affects electroplating evenness, makes troubles to follow-up graphic making.The most this vertical hanging side
Formula, during such as thickness of slab and the bore dia ratio ＞ 8:1 of fruit product, is easy in hole conceal foaming, even if not concealing foaming, and electricity in hole
Plating liquid medicine is also not easy exchange, can produce the problems such as Kong Wutong, hole wall copper are thin.
Utility model content
To this end, this utility model is just intended to solve above-mentioned technical problem, thus proposes that a kind of electroplating evenness is good, will not go out
Existing Kong Wutong, the electroplanting device of the thin problem of hole wall copper.
For solving above-mentioned technical problem, the technical solution of the utility model is:
This utility model provides a kind of electroplanting device, and it includes a rotary shaft and at least one installing rack, described installing rack
On be fixed with plate to be electroplated；Described installing rack has two linking arms, and two described linking arms are connected to described rotating shaft terminal.
As preferably, described installing rack is at least 2, is uniformly distributed in the circumference of described rotary shaft.
As preferably, described installing rack includes two linking arms and two clamping limbs being connected with described linking arm, described folder
The fixture for clamping plate to be electroplated it is provided with in gripping arm.
As preferably, by the connection the most vertical with described linking arm and clamping limb between described linking arm with described clamping limb
Bar connects.
As preferably, between two described linking arms, it is provided with bracing piece.
As preferably, also include the driving means driving described rotary shaft to rotate, described driving means and described rotary shaft
Electrical connection.
As preferably, described installing rack is provided with the vibrating device making panel vibration to be electroplated.
As preferably, described vibrating device is vibrating motor, and described vibrating motor electrically connects with described clamping limb.
Technique scheme of the present utility model has the advantage that compared to existing technology
(1) electroplanting device described in the utility model, including a rotary shaft and at least one installing rack, on described installing rack
Being fixed with plate to be electroplated, described installing rack has two linking arms, and two described linking arms are connected to described rotating shaft terminal.Plating
Time, described rotary shaft rotates, and drives the plate to be electroplated on installing rack to rotate, described in be fixed with the installing rack of band electroplate and form wind
" blade " structure of car, when electroplating under the drive of rotary shaft, all directions can be electroplated and be put in place, solve plate upper half to be electroplated
Part copper thicker than thickness, the problem that the copper thickness ununiformity of the latter half copper thickness is even.Plate to be plated rotates with rotary shaft, and it walks to top
Time, expose liquid level, so can alleviate product be immersed in liquid medicine always, the water-laid situation of medicine, it is to avoid if owing to
Once enter electroplate liquid to bubble, enter the problem that impurity is not easy to discharge in hole, provide repeatedly back into plating to product
The chance of liquid.
(2) electroplanting device described in the utility model, described installing rack includes two linking arms and two and described linking arm
The clamping limb being connected, described clamping limb is provided with the fixture for clamping plate to be electroplated.Described linking arm and described clamping limb
Between be connected by the connecting rod the most vertical with described linking arm and clamping limb.Make installing rack in " Z " font to be electroplated
Form bubble in certain angle, beneficially hole when plate enters plating liquid level to discharge with liquid level, solve bubble in hole hinder plating,
Having no copper in the holes or the thin problem of hole wall copper, especially suitable thickness of slab is caused to make with the PCB plating of bore dia ratio ＞ 8:1.
Accompanying drawing explanation
In order to make content of the present utility model be more likely to be clearly understood, it is embodied as below according to of the present utility model
Example also combines accompanying drawing, is described in further detail this utility model, wherein
Fig. 1 is the electroplanting device structural representation described in this utility model embodiment；
Fig. 2 is the electroplanting device working state schematic representation described in this utility model embodiment.
In figure, reference is expressed as: 1-rotary shaft；2-installing rack；21-linking arm；22-clamping limb；23-connecting rod；
24-bracing piece；3-plate to be electroplated；4-electroplating bath.
Detailed description of the invention
Embodiment
The present embodiment provides a kind of electroplanting device, as it is shown in figure 1, it includes rotary shaft 1 and at least one installing rack 2,
Being fixed with plate 3 to be electroplated on described installing rack 2, described installing rack 2 has two linking arms 21, and two described linking arms 21 are connected to
Described rotary shaft 1 two ends, so that installing rack 2 is fixedly installed in rotary shaft.
Further, described installing rack 2 at least 2, it is uniformly distributed in the circumference of described rotary shaft 1, the present embodiment
In, described installing rack 2 is 4, can electroplate 4 plates 3 to be electroplated simultaneously, and four installing racks 2 are connected to rotation by linking arm 21 respectively
Rotating shaft 1 two ends, and it is uniformly distributed in the horizontally and vertically direction of rotary shaft 1, form the windmill structure with four blades, install
Needing the installing rack 2 of electroplate 3 is equivalent to blade, and the rotational band moving vane of rotary shaft 1 moves around described rotary shaft 1.Electroplated
In journey, the rotary motion of plate 3 to be electroplated makes the plate 3 equal electrodepositable of all directions to be electroplated put in place, solves in transmission electro-plating method and treats
Electroplate top half copper is thicker than thick, the uneven thickness problem of the latter half copper thickness, and plate to be electroplated 3 is in rotary course
Can expose liquid level, alleviate product always in liquid medicine, the situation that liquid medicine easily deposits, repeatedly turnover electroplate liquid can fully be arranged
Portal interior bubble, impurity, improves electroplating quality.
Specifically, in the present embodiment, described installing rack 2 includes that two linking arms 21 are connected with described linking arm 21 with two
Clamping limb 22, described clamping limb 22 is used for clamping plate 3 to be electroplated, is provided with the fixture that can clamp plate 3 to be electroplated.Described
Linking arm 21 is connected by the connecting rod 23 the most vertical with described linking arm 21 and described clamping limb 22 with described clamping limb 22, described
Linking arm 21, connecting rod 23 and clamping limb 22 form " Z " character form structure, when this structure makes plate 3 to be electroplated enter electroplate liquid with
Liquid level forms certain angle, and this angle can be controlled in 10-30 °, so that bubble is discharged in hole on plate to be electroplated 3, prevents gas in hole
Bubble hinders plating, causes having no copper in the holes or the thinnest problem of hole copper thickness, is particularly well-suited to thickness of slab and bore dia ratio ＞ 8:1's
PCB electroplates making.
It is additionally provided with bracing piece 24 between two described linking arms 21, plays the effect improving installing rack intensity.
In the present embodiment, described electroplanting device also includes driving described rotary shaft 1 to rotate and then drives plate to be electroplated 3 around rotation
The driving means of rotating shaft 1 motion, described driving means and described rotary shaft 1 Electricity Federation, described driving means is conventional motor.
Further, in the present embodiment, described installing rack 2 is additionally provided with the vibrating device making plate 3 to be electroplated vibrate,
Described vibrating device is vibrating motor, described vibrating motor and described clamping limb 22 Electricity Federation, drives clamping limb 22 vibrate and then make
Plate 3 to be electroplated vibrates, so that electroplate liquid is well in hole, improves electroplating quality in hole further.
Electroplanting device work process described in the present embodiment is as shown in Figure 2:
A, upper plate, be held on plate 3 to be electroplated on described clamping limb 22, assembled with rotary shaft 1 by installing rack 2；
B, the electroplanting device being completed is put into electroplating bath 4, start plating, start driving means and vibrating device, institute
Stating rotary shaft 1 drives installing rack 2 and plate to be electroplated 3 to rotate panel vibration the most to be electroplated；
C, electroplated after take off the pcb board electroplated.
Wherein, described rotary shaft 1 and installing rack 2 be can conductive material, turn on cathode traces by rotary shaft 1, with
Electroplate liquid forms the loop of an electrolysis plating, completes electroplating process, and the rotating speed of rotary shaft 1 is unsuitable too fast, and general control is 1-
10°/min。
Obviously, above-described embodiment is only for clearly demonstrating example, and not restriction to embodiment.Right
For those of ordinary skill in the field, can also make on the basis of the above description other multi-form change or
Variation.Here without also cannot all of embodiment be given exhaustive.And the obvious change thus extended out or
Change among the protection domain still in this utility model creation.
Claims (8)
1. an electroplanting device, it is characterised in that include a rotary shaft and at least one installing rack, described installing rack is fixed with
Plate to be electroplated；Described installing rack has two linking arms, and two described linking arms are connected to described rotating shaft terminal.
Electroplanting device the most according to claim 1, it is characterised in that described installing rack is at least 2, is uniformly distributed in institute
State the circumference of rotary shaft.
Electroplanting device the most according to claim 2, it is characterised in that described installing rack includes two linking arms and two and institute
State the clamping limb that linking arm is connected, described clamping limb is provided with the fixture for clamping plate to be electroplated.
Electroplanting device the most according to claim 3, it is characterised in that between described linking arm and described clamping limb by with institute
State linking arm and the most vertical connecting rod of clamping limb connects.
Electroplanting device the most according to claim 4, it is characterised in that be provided with bracing piece between two described linking arms.
Electroplanting device the most according to claim 5, it is characterised in that also include the driving dress driving described rotary shaft to rotate
Putting, described driving means electrically connects with described rotary shaft.
Electroplanting device the most according to claim 6, it is characterised in that be provided with on described installing rack and make panel vibration to be electroplated
Vibrating device.
Electroplanting device the most according to claim 7, it is characterised in that described vibrating device is vibrating motor, described vibration
Motor electrically connects with described clamping limb.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620621211.1U CN205741262U (en) | 2016-06-22 | 2016-06-22 | A kind of electroplanting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620621211.1U CN205741262U (en) | 2016-06-22 | 2016-06-22 | A kind of electroplanting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205741262U true CN205741262U (en) | 2016-11-30 |
Family
ID=57384197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620621211.1U Expired - Fee Related CN205741262U (en) | 2016-06-22 | 2016-06-22 | A kind of electroplanting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205741262U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110983304A (en) * | 2019-12-31 | 2020-04-10 | 广州兴森快捷电路科技有限公司 | Chemical plating equipment and surface treatment system |
-
2016
- 2016-06-22 CN CN201620621211.1U patent/CN205741262U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110983304A (en) * | 2019-12-31 | 2020-04-10 | 广州兴森快捷电路科技有限公司 | Chemical plating equipment and surface treatment system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109819598B (en) | PCB circuit board electroplating device | |
| CN206783808U (en) | The hanging gold-plated equipment of plating | |
| TW201825720A (en) | Electroplating apparatus for small components | |
| CN107059103B (en) | A kind of three-dimensional rocking equipment of electroplating parts | |
| CN205741262U (en) | A kind of electroplanting device | |
| CN102534733B (en) | Electroplanting device and electro-plating method | |
| WO2016023162A1 (en) | Electroplating tank and electroplating device | |
| CN108649183A (en) | A kind of preparation method of negative electrode of lithium ion battery collector micropore copper foil | |
| CN101974771B (en) | Rotary plating device | |
| CN103215622B (en) | A kind of method of electric wire copper conductor eleetrotinplate | |
| CN207347689U (en) | A kind of nickel plating apparatus of electronics hardware products | |
| CN204370033U (en) | A kind of without conductor wire barrel plating machine | |
| CN108486640B (en) | Device for electroplating electronic product | |
| CN205556834U (en) | Plated item hanger transversely rocks device | |
| CN213596449U (en) | Electroplating bath with adjustable distance between cathode and anode | |
| US20070144896A1 (en) | Plating process enhanced by squeegee roller apparatus | |
| CN205616970U (en) | Electroplating device of pipe fitting | |
| CN208218984U (en) | The liftable electroplanting device of station | |
| CN206680603U (en) | The electroplating device that a kind of achievable electroplate liquid recycles | |
| CN208218985U (en) | Rotary cylinder-block electroplanting device | |
| CN204491016U (en) | Plating line copper ball feeding device | |
| CN204550770U (en) | A kind of Electropolating hangers with high conduction performance | |
| CN211689259U (en) | Molten salt electrolysis device | |
| CN207987349U (en) | A kind of coating efficient electroplanting device comprehensively | |
| CN201648553U (en) | Fixing structure of secondary hanger for plating PCB (Printed Circuit Board) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20200622 |