CN213595352U - Silicon wafer loading attachment - Google Patents

Abstract

The utility model discloses a silicon chip loading attachment, include: a base; the baffle plates are arranged on the base and surround to form an assembly area with an opening at the upper end; the two sliding grooves are respectively arranged on two opposite side surfaces of the assembly area; the sliding unit is arranged on the base and matched with the sliding groove; and the driving unit is arranged in the assembly area and is connected with the sliding unit to drive the sliding unit to move back and forth along the sliding groove. The utility model provides a technical problem that silicon chip machining efficiency is not high among the prior art.

Description

Silicon wafer loading attachment

Technical Field

The utility model relates to a silicon chip processing production technical field especially relates to a silicon chip loading attachment.

Background

Before the silicon chip is processed, the electrical property of the silicon chip needs to be detected, a traditional mode is that a silicon chip is placed through manual work, then the silicon chip is detected through equipment, after the detection is finished, the equipment reminds an alarm party to place another silicon chip, and the silicon chip is taken away manually, so that the time cost is high, and the working efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a silicon chip loading attachment has solved the not high technical problem of silicon chip machining efficiency among the prior art.

The embodiment of the application discloses silicon wafer loading attachment includes:

a base;

the baffle plates are arranged on the base and surround an assembly area with an opening at the upper end;

the two sliding grooves are respectively arranged on two opposite side surfaces of the assembling area;

the sliding unit is arranged on the base and matched with the sliding groove;

and the driving unit is arranged in the assembly area and is connected with the sliding unit to drive the sliding unit to move back and forth along the sliding groove.

The embodiment of the application drives the sliding unit to move back and forth through the driving unit, so that the loading and discharging actions are completed simultaneously, and the working efficiency is improved.

On the basis of the technical scheme, the embodiment of the application can be further improved as follows:

further, the slide unit includes:

the two sides of the supporting plate are respectively arranged in the sliding groove;

two U type material racks, U type material rack installs respectively in the relative both sides of backup pad, adopts this step's beneficial effect to be able to accomplish material loading, blowing action through U type material rack.

Further, the driving unit includes:

the driving motor is arranged below the supporting plate;

the driving gear is arranged at the output end of the driving motor;

the two racks are arranged on the base at intervals;

the driven gear is arranged below the supporting plate and meshed with the driving gear;

the transmission shaft penetrates through the driven gear;

the transmission gear is respectively arranged at two ends of the transmission shaft and meshed with the rack, and the step has the advantage that the driving motor provides power to drive the sliding unit to move back and forth.

Further, the rack and the sliding groove are parallel to each other.

Further, still include two flourishing material units, flourishing material unit is located inside the assembly area, and flourishing material unit installs the base both ends.

Further, the material containing unit comprises:

the telescopic hydraulic cylinder is arranged in the base, and a piston rod of the telescopic hydraulic cylinder extends out of the surface of the base;

the lifting plate is arranged at the output end of the telescopic hydraulic cylinder;

the material rack is installed on the lifting plate, and one material containing unit is used as an unprocessed silicon wafer and the other material containing unit is used as a processed silicon wafer.

One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

1. the unit that slides in this application embodiment has two U type material racks, can realize getting the process of material and blowing respectively, can improve work efficiency like this, and flourishing material unit can drive the lifter plate up-and-down motion to supplementary silicon chip get the blowing of material, can replace manual operation like this, improve work efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a top view of a silicon wafer loading apparatus according to an embodiment of the present invention;

reference numerals:

1-a base; 2-a baffle plate; 3-an assembly zone; 4-a sliding groove; 5-a gliding unit; 6-a drive unit; 7-material containing unit;

501-a support plate; 502-U-shaped material taking frame;

601-a drive motor; 602-a drive gear; 603-a rack; 604-a driven gear; 605-a drive shaft; 606-a drive gear;

701-a telescopic hydraulic cylinder; 702-a lifter plate; 703-material rest.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.

In the description of the present application, it is to be understood that the terms "upper", "lower", "inner", "outer", "top", "bottom", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The silicon wafer loading device provided by the embodiment of the application solves the technical problem of low silicon wafer processing efficiency in the prior art.

The general idea of the embodiment of the application is as follows: this application embodiment drives the silicon chip through sliding the unit and moves towards silicon chip processingequipment direction, treat to process after silicon chip processingequipment adsorbs the silicon chip, sliding the unit and reseing, make the U type work or material rest that slides unit one side corresponding with the silicon chip work or material rest, the U type work or material rest of opposite side corresponds with the silicon chip of processing, treat the silicon chip processing completion back, the silicon chip falls into on the U type work or material rest of opposite side, sliding the unit motion, send unprocessed silicon chip to processingequipment department, the silicon chip of the processing completion of opposite side is sent to the work or material rest of tip on.

In order to better understand the technical solutions, the technical solutions will be described in detail below with reference to the drawings and the detailed description.

Example 1

As shown in fig. 1, the silicon wafer loading apparatus provided in this embodiment includes:

a base 1;

the baffle plates 2 are arranged on the base 1, the baffle plates 2 surround an assembly area 3 with an opening at the upper end, and the baffle plates 2 in the embodiment of the application play a role in protection, separate a processing area and effectively avoid operation danger;

the two sliding grooves 4 are respectively arranged on two opposite side surfaces of the assembling area 3, and the sliding grooves 4 in the embodiment of the application provide sliding tracks to ensure that the sliding units can stably move;

the sliding unit 5 is installed on the base 1, the sliding unit 5 is matched with the sliding groove 4, the sliding unit 5 in the embodiment of the application can finish material taking and placing operations, and the sliding groove 4 is horizontally arranged, so that the sliding unit 5 can horizontally move;

the driving unit 6 is installed in the assembly area 3, the driving unit 6 is connected with the sliding unit 5 to drive the sliding unit 5 to move back and forth along the sliding groove 4, and the driving unit 6 in the embodiment of the application can drive the sliding unit 5 to move back and forth to provide movement power.

Specifically, the sliding unit 5 in the embodiment of the present application includes:

the two sides of the supporting plate 501 are respectively arranged in the sliding slot 4, that is, the supporting plate 501 is matched with the sliding slot 4;

the two U-shaped material taking frames 502 are respectively arranged on two opposite sides of the supporting plate 501; the U-shaped material taking frame 502 in the embodiment of the application has two, wherein one material taking frame is used for taking materials, and the other material taking frame is used for discharging materials after the silicon wafer is processed.

Specifically, the drive unit 6 in the embodiment of the present application includes:

a driving motor 601, wherein the driving motor 601 is installed below the supporting plate 501;

the driving gear 602 is installed at the output end of the driving motor 601;

two racks 603, wherein the racks 603 are mounted on the base 1 at intervals;

a driven gear 604, the driven gear 604 being installed below the support plate 501, and the driven gear 604 being engaged with the driving gear 602;

the transmission shaft 605 is arranged inside the driven gear 604 in a penetrating way;

the two transmission gears 606 are respectively arranged at two ends of the transmission shaft 605, and the transmission gears 606 are meshed with the rack 603; the driving unit 6 of the embodiment of the application is driven by the driving motor 601 to move by the electric driven gear 604, so as to drive the transmission gear 606 to move in cooperation with the rack 603, and thus, the whole sliding unit 5 can be driven to move back and forth.

Specifically, the rack 603 and the sliding groove 4 are parallel to each other, which can ensure the stability of the movement of the sliding unit 5.

Specifically, still include flourishing material unit 7, flourishing material unit 7 is located inside the assembly region 3, and flourishing material unit 7 is installed base 1 both ends, flourishing material unit 7 in this application embodiment is two, and one uses as the material loading, and one uses as the unloading.

Specifically, the containing unit 7 includes:

the telescopic hydraulic cylinder 701 is installed inside the base 1, and a piston rod of the telescopic hydraulic cylinder 701 extends out of the surface of the base 1;

the lifting plate 702 is installed at the output end of the telescopic hydraulic cylinder 701;

the material rack 703 is installed on the lifting plate 702; the material rest 703 in the embodiment of the application is provided with a plurality of shelves at intervals from top to bottom for placing silicon wafers.

The working process of the embodiment of the application is as follows:

firstly, placing silicon wafers on the material rack 703 from top to bottom, starting a driving motor 601, driving the motor 601 to move, enabling one U-shaped material taking rack to reach the interval of the material rack in the material rack 703, starting a telescopic hydraulic cylinder, enabling the material rack 703 to descend, enabling the silicon wafers to fall onto the U-shaped material taking rack, driving the motor 601 to move, and sending the silicon wafers to a processing position; the U-shaped material taking frame on the other side works in an opposite mode and is used for placing processed materials on the material taking frame; the embodiment of the application can simultaneously realize material taking and material placing operations.

In the specification of the present invention, a large number of specific details are explained. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims (6)

1. A silicon wafer loading apparatus, comprising:

a base;

the baffle plates are arranged on the base and surround an assembly area with an opening at the upper end;

the two sliding grooves are respectively arranged on two opposite side surfaces of the assembling area;

the sliding unit is arranged on the base and matched with the sliding groove;

and the driving unit is arranged in the assembly area and is connected with the sliding unit to drive the sliding unit to move back and forth along the sliding groove.

2. The silicon wafer loading apparatus as claimed in claim 1, wherein the slide unit comprises:

the two sides of the supporting plate are respectively arranged in the sliding groove;

the U-shaped material taking frames are respectively arranged on two opposite sides of the supporting plate.

3. The silicon wafer loading apparatus as claimed in claim 2, wherein the driving unit comprises:

the driving motor is arranged below the supporting plate;

the driving gear is arranged at the output end of the driving motor;

the two racks are arranged on the base at intervals;

the driven gear is arranged below the supporting plate and meshed with the driving gear;

the transmission shaft penetrates through the driven gear;

and the two transmission gears are respectively arranged at two ends of the transmission shaft and are meshed with the racks.

4. The silicon wafer loading apparatus as claimed in claim 3, wherein the rack and the sliding groove are parallel to each other.

5. The silicon wafer loading device according to any one of claims 1 to 4, further comprising two loading units, wherein the loading units are located inside the assembly area and are installed at two ends of the base.

6. The silicon wafer loading device according to claim 5, wherein the material containing unit comprises:

the telescopic hydraulic cylinder is arranged in the base, and a piston rod of the telescopic hydraulic cylinder extends out of the surface of the base;

the lifting plate is arranged at the output end of the telescopic hydraulic cylinder;

the material rack is installed on the lifting plate.

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