CN213583776U - Bridge rectifier for improving EMC - Google Patents
Bridge rectifier for improving EMC Download PDFInfo
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- CN213583776U CN213583776U CN202023092722.4U CN202023092722U CN213583776U CN 213583776 U CN213583776 U CN 213583776U CN 202023092722 U CN202023092722 U CN 202023092722U CN 213583776 U CN213583776 U CN 213583776U
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- lead frame
- bridge rectifier
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- emc
- solder
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Abstract
The utility model discloses an improve EMC's bridge rectifier relates to electronic component technical field, including the rectification chip, the plastic-sealed body of encapsulation rectification chip, the internal lead frame that is equipped with of plastic-sealed, the lead frame includes first lead frame, the second lead frame, third lead frame and fourth lead frame, first lead frame, the second lead frame, the one end of third lead frame and fourth lead frame all is connected with the pin, pin one end stretches out in the plastic-sealed body, first lead frame, the second lead frame, the soldering lug has connected gradually on third lead frame and the fourth lead frame, the soldering lug encapsulates in the plastic-sealed body, and be connected with the rectification chip. The utility model discloses a soft recovery bridge rectifier, bridge rectifier's reverse recovery time (Trr) are 100 ~ 350 nanoseconds, have shortened bridge rectifier's reverse recovery time (Trr) greatly, have improved EMC (electro Magnetic compatibility), guarantee bridge rectifier's anti-interference effect.
Description
Technical Field
The utility model relates to an electronic component technical field specifically is an improve EMC's bridge rectifier.
Background
The bridge rectifier is formed by bridge connection of four rectifier silicon chips and external insulation plastic packaging, and a zinc metal shell is added outside an insulation layer to encapsulate the high-power bridge rectifier so as to enhance heat dissipation.
The diodes in the bridge rectifier are required to withstand high reverse voltage and reverse current during reverse recovery. The reverse recovery time (Trr) of the conventional diode is relatively long. During the reverse recovery process, the diode generates high frequency noise and power dissipation, which affect the electromagnetic compatibility emc (electro Magnetic compatibility) effect.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an improve bridge rectifier of EMC, have the soft recovery characteristic that improves bridge rectifier's reverse recovery time (Trr) greatly, improved EMC, reduced the consumption, more energy-conserving beneficial effect to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides an improve EMC's bridge rectifier, including the rectification chip, the plastic-sealed body of encapsulation rectification chip, be equipped with the lead frame in the plastic-sealed body, the lead frame includes first lead frame, the second lead frame, third lead frame and fourth lead frame, first lead frame, the second lead frame, third lead frame and fourth lead frame set gradually, first lead frame, the second lead frame, the one end of third lead frame and fourth lead frame all is connected with the pin, pin one end stretches out in the plastic-sealed body, first lead frame, the second lead frame, the soldering lug has connected gradually on third lead frame and the fourth lead frame, the soldering lug is packaged in the plastic-sealed body, and be connected with the rectification chip.
As a further aspect of the present invention: the reverse recovery time (Trr) of the bridge rectifier is 100-350 nanoseconds, and the soft recovery characteristic of EMC is improved.
As a further aspect of the present invention: one end of the soldering lug is welded with the lead frame through solder, the other end of the soldering lug is welded with the rectifier chip through solder, the lead frame is welded with the pin through solder, and the lead frame, the pin and the solder are connected into a whole.
As a further aspect of the present invention: the middle part of the plastic package body is provided with two mounting through holes.
As a further aspect of the present invention: the quantity of the lead frame, the pins and the soldering lug corresponds to that of the lead frame, and the quantity of the lead frame, the pins and the soldering lug is 4, and the lead frame, the pins and the soldering lug are all made of copper.
As a further aspect of the present invention: the solder is lead, tin or silver.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a bridge rectifier with soft recovery characteristic, bridge rectifier's reverse recovery time (Trr) is 100 ~ 350 nanoseconds, improves bridge rectifier's reverse recovery time (Trr)'s soft recovery characteristic greatly, has improved EMC, guarantees bridge rectifier's interference killing feature.
Drawings
Fig. 1 is a schematic structural diagram of the bridge rectifier of the present invention.
Fig. 2 is a schematic diagram of the reverse recovery effect of the bridge rectifier of the present invention.
The labels in the figure are:
10. a rectifying chip; 11. molding the body; 12. a first lead frame; 13. a second lead frame; 14. a third lead frame; 15. a fourth lead frame; 16. a pin; 17. and (7) soldering lugs.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, in an embodiment of the present invention, a bridge rectifier for improving EMC includes a rectifier chip 10, a plastic package body 11 for packaging the rectifier chip 10, a lead frame disposed in the plastic package body 11, and two mounting through holes disposed in the middle of the plastic package body 11; the lead frame comprises a first lead frame 12, a second lead frame 13, a third lead frame 14 and a fourth lead frame 15, the first lead frame 12, the second lead frame 13, the third lead frame 14 and the fourth lead frame 15 are sequentially arranged, one ends of the first lead frame 12, the second lead frame 13, the third lead frame 14 and the fourth lead frame 15 are respectively connected with a pin 16, one end of each pin 16 extends out of the plastic package body 11, soldering lugs 17 are sequentially connected onto the first lead frame 12, the second lead frame 13, the third lead frame 14 and the fourth lead frame 15, and the soldering lugs 17 are packaged in the plastic package body 11 and are connected with the rectifying chip 10. Referring to fig. 2, the present invention employs a soft recovery bridge rectifier, the reverse recovery time (Trr) of the bridge rectifier is Δ t, Δ t is smaller than the reverse recovery time (Trr) of the common diode, and the voltage waveform is smoother, the reverse recovery time (Trr) of the bridge rectifier is 100-350 ns, the soft recovery characteristic of the reverse recovery time (Trr) of the bridge rectifier is greatly improved, EMC is improved, and the anti-interference capability of the bridge rectifier is ensured.
The utility model discloses in the embodiment of a preferred, soldering lug 17 one end is passed through solder and lead frame welding, and the other end passes through solder and rectifier chip 10 welding, and the lead frame passes through solder welding with pin 16, and lead frame, pin 16, solder are even as an organic whole, and furtherly, the solder is plumbous, tin or silver.
The utility model discloses in the embodiment of a preferred, the quantity of lead frame, pin 16, soldering lug 17 is corresponding with the lead frame, is 4, and the material of lead frame, pin 16, soldering lug 17 is copper.
The utility model discloses a soft recovery bridge rectifier, bridge rectifier's reverse recovery time (Trr) are 100 ~ 350 nanoseconds, improve bridge rectifier's reverse recovery time (Trr)'s soft recovery characteristic greatly, have improved EMC, guarantee bridge rectifier's interference killing feature.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides an improve EMC's bridge rectifier, its characterized in that, includes the rectification chip, encapsulates the plastic-sealed body of rectification chip, the internal lead frame that is equipped with of plastic-sealed, the lead frame includes first lead frame, second lead frame, third lead frame and fourth lead frame, first lead frame, second lead frame, third lead frame and fourth lead frame set gradually, the one end of first lead frame, second lead frame, third lead frame and fourth lead frame all is connected with the pin, pin one end stretch out in the plastic-sealed body, the soldering lug has connected gradually on first lead frame, second lead frame, third lead frame and the fourth lead frame, the soldering lug encapsulate in the plastic-sealed body to be connected with the rectification chip.
2. An EMC improved bridge rectifier as claimed in claim 1, wherein the reverse recovery time (Trr) of said bridge rectifier is 100-350 nanoseconds.
3. An EMC improved bridge rectifier as claimed in claim 1, wherein said solder tab is soldered at one end to a lead frame by solder and at the other end to the rectifier chip by solder, said lead frame and said leads are soldered by solder, and said lead frame, leads and solder are joined together.
4. An EMC improved bridge rectifier as claimed in claim 1, wherein said plastic package body has two mounting through holes in the middle.
5. A bridge rectifier for improving EMC as claimed in claim 1, wherein the number of said lead frame, pins and soldering lugs is 4 corresponding to that of said lead frame, and the materials of said lead frame, pins and soldering lugs are all copper.
6. An EMC improved bridge rectifier as claimed in claim 3, wherein said solder is lead, tin or silver.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202023092722.4U CN213583776U (en) | 2020-12-21 | 2020-12-21 | Bridge rectifier for improving EMC |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202023092722.4U CN213583776U (en) | 2020-12-21 | 2020-12-21 | Bridge rectifier for improving EMC |
Publications (1)
Publication Number | Publication Date |
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CN213583776U true CN213583776U (en) | 2021-06-29 |
Family
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Family Applications (1)
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CN202023092722.4U Active CN213583776U (en) | 2020-12-21 | 2020-12-21 | Bridge rectifier for improving EMC |
Country Status (1)
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CN (1) | CN213583776U (en) |
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2020
- 2020-12-21 CN CN202023092722.4U patent/CN213583776U/en active Active
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