CN213583743U

CN213583743U - Insulating substrate with direct water cooling

Info

Publication number: CN213583743U
Application number: CN202022592828.4U
Authority: CN
Inventors: 张斌; 麻长胜; 赵善麒
Original assignee: Macmic Science and Technology Co Ltd
Current assignee: Macmic Science and Technology Co Ltd
Priority date: 2020-11-11
Filing date: 2020-11-11
Publication date: 2021-06-29
Anticipated expiration: 2030-11-11

Abstract

The utility model relates to a power module heat dissipation technical field, in particular to direct water-cooled insulation substrate includes copper foil layer, insulating layer and metal substrate layer down in proper order from last, copper foil layer, insulating layer and metal substrate layer pass through hot pressing and combine, metal substrate layer bottom integration has heat radiation structure, heat radiation structure is needle type structure or wing type structure or fan type structure or turbine type structure. The utility model integrates the insulating substrate and the heat dissipation structure into a whole, so that the module manufacturing process is reduced by one-time welding, the production process is simplified, the process difficulty is reduced, the working hours are reduced, the production efficiency is improved, the product rejection rate is reduced, and the heat dissipation structure can be directly installed on a water channel and is generally suitable for a vehicle module; the substrate becomes small in the welding process, cavities are not easy to generate, and welding holes are reduced.

Description

Insulating substrate with direct water cooling

Technical Field

The utility model relates to a power module heat dissipation technical field, in particular to direct water-cooled insulating substrate.

Background

In a traditional power module, a chip is required to be welded on a copper-clad ceramic substrate (DBC), insulation is realized through middle-layer ceramic of the DBC, and then the DBC welded with the chip is welded on a copper base plate, generally, a flat copper plate is locked on a radiator, or the copper base plate is provided with a water cooling structure, so that two purposes of heat dissipation and electricity are realized. This solution has the following drawbacks and disadvantages: firstly, with the improvement of the power level of a module, particularly a module applied to a new energy vehicle, the size of a chip is continuously increased, and the size of a corresponding DBC is also continuously increased, so that a cavity is more easily formed when the DBC is welded to a copper plate; secondly, the processes in the prior art are relatively more, and the production cost is increased.

SUMMERY OF THE UTILITY MODEL

The utility model solves the problems of relatively more heat dissipation procedures and increased production cost of power modules in the related technology, provides a direct water-cooled insulating substrate, integrates the insulating substrate and a heat dissipation structure into a whole, reduces one-time welding in the module manufacturing process, simplifies the production procedures, reduces the process difficulty, reduces the working hours, improves the production efficiency, reduces the product rejection rate, can be directly installed on a water channel, and is generally suitable for vehicle modules; the substrate is small in shape in the welding process, a cavity is not easy to generate, and welding cavities are reduced; the front copper foil pattern etching operability becomes strong. The design of the copper foil circuit is more flexible due to the fact that the limitation of the design range of a single DBC is eliminated, occupation of edge area is reduced, and the miniaturization development trend of electronic devices of modules is met.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme: the utility model provides a direct water-cooled insulating substrate, includes copper foil layer, insulating layer and metal substrate layer from last to extremely down in proper order, copper foil layer, insulating layer and metal substrate layer pass through hot-pressing bonding, metal substrate layer bottom integrated into one piece has heat radiation structure, heat radiation structure is needle type structure or wing type structure or fan type structure or turbine type structure.

Preferably, the copper foil layer is formed into different patterns by etching.

Preferably, the insulating layer is boron nitride, beryllium oxide, aluminum oxide or epoxy resin.

Preferably, the metal substrate layer is a copper-based alloy.

Preferably, the metal substrate layer and the heat dissipation structure are formed by cold forging of a copper-based alloy block and are integrally formed, and the heat dissipation structure dissipates heat through water cooling.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model integrates the insulating substrate and the heat dissipation structure into a whole, so that the module manufacturing process is reduced by one-time welding, the production process is simplified, the process difficulty is reduced, the working hours are reduced, the production efficiency is improved, the product rejection rate is reduced, and the heat dissipation structure can be directly installed on a water channel and is generally suitable for a vehicle module; the substrate is small in shape in the welding process, a cavity is not easy to generate, and welding cavities are reduced; the operability of etching the front copper foil graph is enhanced, and the limitation of the design range of a single DBC is eliminated, so that the design of a copper foil circuit is more flexible, the occupation of the edge area is reduced, and the miniaturization development trend of an electronic device of a module is met; the manufacturing precision is improved without the drifting of DBC welding.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is an exploded schematic view of the present invention;

fig. 3 is a schematic view of a heat dissipation structure of a turbine type according to the present invention.

In the figure:

1. metal substrate layer, 2, insulating layer, 3, copper foil layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.

As shown in fig. 1 to 3, a direct water-cooled insulating substrate sequentially includes, from top to bottom, a copper foil layer 3, an insulating layer 2, and a metal substrate layer 1, wherein the copper foil layer 3, the insulating layer 2, and the metal substrate layer 1 are all bonded by hot pressing, and a heat dissipation structure is integrally formed at the bottom of the metal substrate layer 1, wherein the heat dissipation structure is a needle-shaped structure, a fin-shaped structure, a fan-shaped structure, or a turbine-shaped structure.

In one embodiment, the copper foil layer 3 forms different patterns through corrosion, the operability is strong, the limitation of the design range of a single DBC is eliminated, the design of a copper foil circuit is more flexible, the occupation of edge area is reduced, and the miniaturization development trend of electronic devices of modules is met.

In one embodiment, the insulating layer 2 is boron nitride, beryllium oxide, aluminum oxide, or epoxy.

In one embodiment, the metal substrate layer 1 is a copper-based alloy.

In one embodiment, the metal substrate layer 1 and the heat dissipation structure are formed by cold forging of a copper-based alloy block and are integrally formed, so that one-time welding is reduced in the module manufacturing process, the production process is simplified, the process difficulty is reduced, the working hours are reduced, the production efficiency is improved, the product rejection rate is reduced, the metal substrate layer and the heat dissipation structure can be directly installed on a water channel, and the metal substrate layer and the heat dissipation structure are generally suitable for vehicle modules; wherein, the heat radiation structure radiates heat through water cooling.

The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.

Claims

1. A direct water-cooled insulating substrate is characterized in that: include copper foil layer (3), insulating layer (2) and metal substrate layer (1) from last to extremely down in proper order, copper foil layer (3), insulating layer (2) and metal substrate layer (1) are through hot-pressing bonding, metal substrate layer (1) bottom integrated into one piece has heat radiation structure, heat radiation structure is needle type structure or fin type structure or fan type structure or turbine type structure.

2. The insulating substrate of claim 1, wherein: the copper foil layer (3) is etched to form different patterns.

3. The insulating substrate of claim 1, wherein: the insulating layer (2) is made of boron nitride, beryllium oxide, aluminum oxide or epoxy resin.

4. The insulating substrate of claim 1, wherein: the metal substrate layer (1) is copper-based alloy.

5. The insulating substrate of claim 1, wherein: the metal substrate layer (1) and the heat dissipation structure are formed by cold forging of copper-based alloy blocks and are integrally formed, and the heat dissipation structure dissipates heat through water cooling.