CN213561898U

CN213561898U - Polishing pad and polishing system

Info

Publication number: CN213561898U
Application number: CN202021930262.5U
Authority: CN
Inventors: 姜继铭
Original assignee: IV Technologies Co Ltd
Current assignee: IV Technologies Co Ltd
Priority date: 2019-09-11
Filing date: 2020-09-07
Publication date: 2021-06-29
Anticipated expiration: 2030-09-07
Also published as: TW202110585A; TWI718663B

Abstract

The utility model discloses embodiment provides a grinding pad and grinding system. The polishing pad has a polishing liquid communication region, a polishing surface and a back surface opposite to each other, and comprises a plurality of through holes and at least one connecting groove. The through holes are positioned in the grinding fluid communication area and respectively penetrate through the grinding surface and the back surface. At least one connecting groove is arranged in the back surface and positioned in the grinding fluid communication area, and the at least one connecting groove is connected with the through holes. The slurry communication zone is located in a central region within 20% to 50% of the radius of the polishing pad. The polishing pad and the polishing system enable the polishing liquid to have special flow field distribution.

Description

Polishing pad and polishing system

Technical Field

The present invention relates to a polishing pad, a polishing system and a polishing method, and more particularly to a polishing pad, a polishing system and a polishing method with a special flow field distribution.

Background

In the manufacturing process of industrial devices, polishing is a technique commonly used today to planarize the surface of an object to be polished. Generally, the polishing process is performed by chemical action of a polishing liquid supplied between the surface of the article and the polishing pad, and by mechanical friction generated by relative motion of the article and the polishing pad. The corresponding distribution of the polishing fluid flow field can be obtained by adjusting the parameters of the polishing process or designing the grooves of the polishing pad. However, as the industry has developed, the slurry flow field distribution required for various polishing process applications has varied. Therefore, there is still a need to provide a slurry having a specific flow field distribution for industry selection.

SUMMERY OF THE UTILITY MODEL

The utility model provides a grinding pad, grinding system and grinding method, it makes lapping liquid have special flow field and distributes.

The utility model discloses a grinding pad has relative lapping surface and back each other, has the lapping liquid intercommunication region, and includes a plurality of perforation and at least one connection slot. The through holes are positioned in the grinding fluid communication area, wherein the through holes respectively penetrate through the grinding surface and the back surface. At least one connecting groove is arranged in the back surface and positioned in the grinding fluid communication area, wherein the at least one connecting groove is connected with the plurality of through holes, and the grinding fluid communication area is positioned in the central area within 20-50% of the radius of the grinding pad.

In an embodiment of the present invention, the extending direction of the at least one connecting groove is a radial direction of the polishing pad.

In an embodiment of the present invention, the distribution shape of the at least one connection groove includes a shape like a Chinese character ' mi ', a shape like a Y ', a cross, or a line.

In an embodiment of the present invention, the at least one connecting groove has a connecting groove depth from the back surface, and the connecting groove depth is between 5% and 50% relative to the thickness of the polishing pad.

In an embodiment of the present invention, the plurality of through holes include an inner hole and an outer hole, wherein an aperture of the inner hole is smaller than an aperture of the outer hole.

In an embodiment of the invention, the plurality of perforations comprises a central perforation, wherein the central perforation has a smallest aperture among the plurality of perforations.

In an embodiment of the present invention, the rotation axis of the polishing pad overlaps with the center of the polishing liquid communication region.

In an embodiment of the present invention, the rotation axis of the polishing pad overlaps one of the plurality of through holes.

In an embodiment of the present invention, the polishing apparatus further includes at least one polishing groove disposed in the polishing surface.

In an embodiment of the present invention, the plurality of through holes connect the at least one polishing groove.

In an embodiment of the present invention, the at least one polishing groove is spaced from the polishing surface by a polishing groove depth, and the polishing groove depth is between 10% and 80% relative to the thickness of the polishing pad.

The utility model discloses a grinding pad is applicable to the grinding article, and grinding pad has the constant orbit region that corresponds to the article and encircles the regional circulation orbit region of constant orbit, and grinding pad is including relative lapping surface and the back each other, a plurality of perforation and at least one connection slot. The plurality of through holes respectively penetrate through the grinding surface and the back surface. The at least one connecting groove is arranged in the back surface and is connected with the plurality of through holes, wherein the plurality of through holes and the at least one connecting groove are arranged in the constant track area.

In an embodiment of the present invention, the area of the circular track region is larger than the area of the constant track region.

In an embodiment of the present invention, the constant track region is located in a central region within a radius of 20% to 50% of the polishing pad.

In an embodiment of the present invention, the rotation axis of the polishing pad overlaps with the center of the constant track region.

The utility model discloses a grinding system is applicable to and grinds the processing procedure, and includes grinding pad and article. The polishing pad has a polishing surface and a back surface opposite to each other, has a polishing liquid communication region, and includes a plurality of through holes and at least one connecting groove. The through holes are positioned in the grinding fluid communication area, wherein the through holes respectively penetrate through the grinding surface and the back surface. At least one connecting groove is arranged in the back surface and positioned in the grinding fluid communication area, wherein the at least one connecting groove is connected with the plurality of through holes, and the grinding fluid communication area is positioned in the central area within 20-50% of the radius of the grinding pad.

In an embodiment of the present invention, the polishing pad further includes at least one polishing groove disposed in the polishing surface.

In an embodiment of the present invention, the polishing pad further includes a carrier having a polishing liquid supply port, wherein the polishing pad is fixed on the carrier.

The utility model discloses a grinding system is applicable to and grinds the processing procedure, and includes article and grinding pad. The polishing pad is used for polishing an object, and comprises a constant track area corresponding to the object and a circulating track area surrounding the constant track area, a polishing surface and a back surface which are opposite to each other, a plurality of through holes and at least one connecting groove. The plurality of through holes respectively penetrate through the grinding surface and the back surface. The at least one connecting groove is arranged in the back surface and connected with the plurality of through holes, wherein the plurality of through holes and the at least one connecting groove are arranged in the constant track area, and the object is positioned on the grinding surface of the grinding pad.

The grinding method of the utility model comprises the following steps. Providing a polishing pad, wherein the polishing pad is as described above. Pressure is applied to the article to press against the polishing surface of the polishing pad. Providing relative motion between the object and the polishing pad to perform the polishing process.

In view of the above, the polishing pad of the present invention is provided with a plurality of through holes respectively penetrating through the polishing surface and the back surface and at least one connecting groove located in the back surface and connecting the plurality of through holes in the specific central region, so that the polishing pad can have a specific distribution of the polishing fluid flow field when the polishing pad is used to polish an object to perform a polishing process.

In order to make the aforementioned and other features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

FIG. 1 is a schematic front view of a polishing pad and polishing system according to one embodiment of the present invention;

FIG. 2 is a schematic back view of a polishing pad and polishing system according to one embodiment of the present invention;

FIG. 3 is an enlarged partial schematic view of the polishing pad of FIG. 2;

FIG. 4 is a schematic sectional view taken along the section line I-I' in FIG. 3;

fig. 5 is a partially enlarged schematic view of a polishing pad according to another embodiment of the present invention;

fig. 6 is a partially enlarged schematic view of a polishing pad according to another embodiment of the present invention;

fig. 7 is a partially enlarged schematic view of a polishing pad according to another embodiment of the present invention;

fig. 8 is a flow chart of a grinding method according to an embodiment of the present invention.

Description of the reference numerals

100a, 100b, 100c, 100 d: polishing pad

200: article

1000: grinding system

BS: back side of the panel

C1: rotating axle center

C2: center of a ship

CD: depth of connecting groove

CG: connecting groove

SO: grinding fluid supply port

SR: abrasive fluid communication zone

CR: constant track area

d1, d 2: distance between two adjacent plates

H. H1, H2, H3: perforation

P: bearing platform

PD: grinding the depth of the groove

PG: grinding the grooves

PS: abrasive surface

RR: region of circular track

T: thickness of

x: first coordinate direction

y: second coordinate direction

Detailed Description

As used herein, "about", "approximately", "essentially", or "substantially" includes the stated value and the average value within an acceptable range of deviation of the specified value as determined by one of ordinary skill in the art, taking into account the measurement in question and the specified amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within, for example, ± 30%, ± 20%, ± 15%, ± 10%, ± 5%. Further, as used herein, "about", "approximately", "essentially", or "substantially" may be selected with respect to measured properties, cutting properties, or other properties, to select a more acceptable range of deviation or standard deviation, and not to apply one standard deviation to all properties.

Fig. 1 is a schematic front view of a polishing pad and a polishing system according to an embodiment of the present invention. Fig. 2 is a schematic back view of a polishing pad and a polishing system according to an embodiment of the present invention. Fig. 3 is a partially enlarged schematic view of the polishing pad of fig. 2. Fig. 4 is a schematic sectional view taken along the sectional line I-I' in fig. 3.

Referring to fig. 1 and 2, the polishing pad 100a includes a plurality of through holes H disposed in the slurry communication region SR and respectively penetrating the polishing surface PS and the back surface BS, and the polishing pad 100a further includes at least one connecting groove CG (as shown in fig. 2) disposed on the back surface BS and also disposed in the slurry communication region SR, wherein the connecting groove CG connects the plurality of through holes H, so that the polishing slurries can be communicated with each other in the slurry communication region SR. When the polishing pad 100a is used in a polishing process, the slurry communication region SR can maintain a portion of the slurry distributed in the central region of the polishing pad 100a, so as to avoid the problem that the slurry is distributed too little in the central region of the polishing pad 100a due to the centrifugal force generated by the rotation of the polishing pad 100 a. In detail, if the polishing liquid is distributed too little in the central region of the polishing pad, the friction force may be too large, and the problem of the polishing pad being deformed by being pushed may occur. In the present embodiment, the slurry communication region SR is located in the central region within 20% to 50% of the radius of the polishing pad 100a (e.g., within 25% to 45% or within 30% to 40% of the radius of the polishing pad 100 a) to balance the amount of the slurry distributed in the central region and the peripheral region of the polishing pad 100 a. In other words, the polishing pad 100a does not have the through hole H and the communication groove CG in the region other than the polishing liquid communication region SR. That is, the polishing liquid communication region SR occupies only a part of the polishing pad 100 a. If the location occupied by the slurry communication region SR is smaller than the area within 20% of the radius of the polishing pad 100a, the amount of the slurry distributed in the central region of the polishing pad 100a is too small; if the slurry communicating region SR occupies a position larger than the area within 50% of the radius of the polishing pad 100a, the amount of the slurry distributed to the peripheral region of the polishing pad 100a is too small.

In the present embodiment, the connecting grooves CG extend in the radial direction of the polishing pad 100a and are connected to the plurality of through holes H. That is, the connecting groove CG has a straight line shape, but the present invention is not limited thereto. In other embodiments, the connecting groove CG may have a shape selected from an arc, a circle, an ellipse, a spiral, an irregular shape, or a combination thereof, and is connected to the plurality of through holes H. As shown in fig. 2, the at least one connecting groove CG is exemplified by four connecting grooves CG. However, the present invention is not limited to the number of the connecting grooves CG, and may be adjusted according to actual needs. Similarly, although the distribution shape of the connecting grooves CG is shown as a cross shape in the embodiment of fig. 2, the present invention is not limited thereto, and the connecting grooves CG may be replaced with other shapes according to actual requirements, and no matter what distribution shape the connecting grooves CG have, the plurality of through holes H are connected to each other.

Referring to fig. 3, in the present embodiment, the plurality of through holes H includes a through hole H1, a plurality of through holes H2, and a plurality of through holes H3. In detail, in the distribution of perforations H1, H2, and H3, perforation H1 is located at the center (i.e., perforation H1 may be considered as a center perforation), and perforation H3 is located at the outermost periphery compared to perforation H2. Thus, in this embodiment, for through-holes H1 and H2, through-hole H1 can be considered an inner through-hole and through-hole H2 can be considered an outer through-hole; for through hole H1 and through hole H3, through hole H1 can be considered an inner perimeter through hole and through hole H3 can be considered an outer perimeter through hole; and for perforations H2 and H3, perforation H2 may be considered an inner perimeter perforation and perforation H3 may be considered an outer perimeter perforation. In addition, in the present embodiment, as shown in fig. 3, the aperture of perforation H1 is smaller than the aperture of perforation H2 and the aperture of perforation H3, and the aperture of perforation H2 is smaller than the aperture of perforation H3. In other words, in the present embodiment, the aperture of the inner peripheral perforations is smaller than that of the outer peripheral perforations, and the central perforations (i.e., perforations H1) have the smallest aperture among all the perforations H. Specifically, in one embodiment, the diameters (i.e., diameters) of through-holes H1, H2, and H3 may be between about 0.5mm and about 5mm, respectively, but the present invention is not limited thereto.

Although the embodiment of fig. 1 to 3 discloses 9 perforations H in the slurry communication region SR, the present invention is not limited to the number of perforations H, and may be adjusted according to actual needs, and only needs to be located in the slurry communication region SR. In addition, although the embodiments of fig. 1 to 3 disclose that the hole diameters of the through hole H1, the through hole H2, and the through hole H3 are different, the present invention is not limited thereto. In other embodiments, the apertures of perforations H1, H2, and H3 may be the same as each other. In addition, although the embodiment of fig. 1 to 3 discloses that the aperture of the inner periphery perforation is smaller than that of the outer periphery perforation, the present invention is not limited thereto. In other embodiments, the inner perimeter perforations may have a larger pore size than the outer perimeter perforations.

In the present embodiment, the polishing pad 100a has a rotation axis C1. As shown in fig. 1 to 3, the rotation axis C1 is located at the center of the polishing pad 100 a. Taking the polishing pad 100a shown in fig. 1 as a circle, the center of the polishing pad 100a is the center of the circle, i.e., the rotation axis C1 is located at the center of the polishing pad 100 a. When the polishing pad 100a is used for a polishing process, the polishing pad 100a is fixed on a platen P (the related description will be described later), and the polishing pad 100a is driven by the platen P to rotate along the rotation axis C1. In one embodiment, the polishing pad 100a may rotate counterclockwise relative to the rotational axis C1 of the polishing pad 100a (i.e., the center of the polishing pad 100 a). In another embodiment, the polishing pad 100a may rotate clockwise with respect to the rotational axis C1 of the polishing pad 100a (i.e., the center of the polishing pad 100 a). As shown in fig. 1 to 3, the rotation axis C1 of the polishing pad 100a overlaps the through hole H, but the present invention is not limited thereto. In other embodiments, the rotation axis C1 of the polishing pad 100a may not overlap with the through hole H. In the embodiment shown in fig. 1 to 3, the rotation axis C1 overlaps the center of the polishing liquid communication region SR, but the present invention is not limited thereto. In other embodiments, the rotation axis C1 of the polishing pad 100a may not overlap the center of the polishing fluid communication region SR.

In the present embodiment, the polishing pad 100a includes at least one polishing groove PG disposed in the polishing surface PS, and the through hole H in the slurry communication region SR is connected to the at least one polishing groove PG, so that the polishing slurry transmitted through the through hole H can flow along the polishing groove PG to the entire polishing surface PS. However, the present invention is not limited thereto. In another embodiment, the polishing pad 100a optionally has no polishing grooves PG, and the through hole H in the slurry communication region SR is directly connected to the polishing surface PS. In another embodiment, the through hole H in the slurry communication region SR can also be directly connected to the polishing surface PS, or a part of the through hole H is connected to the polishing groove PG and the other part of the through hole H is connected to the polishing surface PS. In addition, although the embodiments of fig. 1 to 3 disclose that the through holes H are disposed corresponding to the intersections of the polishing grooves PG, the present invention is not limited to the arrangement of the through holes H as long as the through holes H can be connected to the polishing grooves PG. As shown in fig. 1, the at least one polishing groove PG is exemplified by a plurality of polishing grooves PG. However, the present invention is not limited to the number of the polishing grooves PG, and the number can be adjusted according to actual needs. As shown in fig. 1, in the present embodiment, the distribution shape of the polishing grooves PG is an XY grid line (XY grid lines shape), but the present invention is not limited thereto. In other embodiments, the distribution shape of the polishing grooves PG may be concentric circles, non-concentric circles, ellipses, parallel lines (parallel lines) or non-parallel lines (non-parallel lines), cross lines (cross-hatched lines), concentric arcs (concentric arcs), non-concentric arcs (concentric arcs), irregular arcs (irregular arcs), radial arcs, or a combination thereof.

Referring to fig. 3 and 4, in the present embodiment, the connecting grooves CG have a connecting groove depth CD from the back surface BS, and the connecting groove depth CD is between about 5% and about 50% relative to the thickness T of the polishing pad 100 a. That is, in the present embodiment, the groove depth CD does not penetrate the polishing pad 100 a. In addition, the polishing grooves PG have a polishing groove depth PD from the polishing surface PS, and the polishing groove depth PD is between about 10% and about 80% with respect to the thickness T of the polishing pad 100 a. That is, in the present embodiment, the polishing grooves PG do not penetrate the polishing pad 100 a.

It should be noted that the polishing pad 100a is provided with a plurality of through holes H respectively penetrating through the polishing surface PS and the back surface BS and at least one connecting groove CG located in the back surface BS and connecting the through holes H in the slurry communication region SR, so that when the polishing pad 100a is used in a polishing process, the amount of slurry distributed to the central region and the peripheral region of the polishing pad 100a can be balanced, so that the polishing pad 100a has a specific slurry flow field distribution.

The polishing pad 100a may be used in any polishing system to polish an object, and the position of the object relative to the polishing pad 100a may depend on the actual polishing process, e.g., the object may be located between the center and the edge of the polishing pad 100 a. Specifically, as shown in fig. 1 and 2, in this particular embodiment, the polishing system 1000 includes a polishing pad 100a and an article 200. In addition, the polishing system 1000 further includes a carrier P on which the polishing pad 100a can be fixed. The carrier P may optionally have a polishing liquid supply port SO, SO that the polishing liquid passes through the polishing pad 100a and is supplied to the polishing surface PS through the polishing liquid supply port SO of the carrier P, but the invention is not limited thereto. In another embodiment, the polishing liquid may be supplied directly to the polishing surface PS of the polishing pad 100a through a separately disposed polishing liquid supply line. The polishing pad 100a is used for polishing the article 200. In other words, the polishing system 1000 is suitable for performing a polishing process. Portions of the polishing pad 100a are described above and thus will not be described in detail.

In the present embodiment, the polishing pad 100a includes a polishing surface PS and a back surface BS facing each other. When the polishing pad 100a is used to polish the article 200 for a polishing process, the article 200 is in contact with the polishing surface PS. It should be noted that fig. 1 is a schematic front view (i.e., viewed from the side of the polishing surface PS) illustrating the polishing pad 100a, and fig. 2 is a schematic back view (i.e., viewed from the side of the back surface BS) illustrating the polishing pad 100 a.

In the present embodiment, the polishing pad 100a may correspond to a two-dimensional orthogonal coordinate system having a first coordinate direction x and a second coordinate direction y. As shown in fig. 1 and 2, the two-dimensional orthogonal coordinate system is a rectangular coordinate system. It will be understood by those skilled in the art that the rectangular coordinate system is defined by a Y-axis and an X-axis, the Y-axis and the X-axis are two vertical lines and two horizontal lines perpendicular to each other at 90 degrees, and the intersection point of the Y-axis and the X-axis is the origin of the rectangular coordinate system. In other words, as shown in fig. 1 and 2, the rotation axis C1 corresponds to the origin of the two-dimensional orthogonal coordinate system. In addition, as will be apparent to those skilled in the art, since the upward direction of the Y axis is a positive direction and the rightward direction of the X axis is a positive direction, the rotation axis C1 is a positive direction to the right and a negative direction to the left in the first coordinate direction X as shown in fig. 1 and 2; and in the second coordinate direction y, the rotation axis C1 is positive upward and negative downward.

As shown in fig. 1, in the first coordinate direction x, the edge of the object 200 has a distance d1 and a distance d2 with respect to the rotation axis C1 of the polishing pad 100a, wherein the distance d1 is smaller than the distance d 2. Although the distance d2 shown in fig. 1 is shown as being equal to the radius of the polishing pad 100a (i.e., the edge of the object 200 is aligned with the edge of the polishing pad 100 a), the present invention is not limited thereto. In other embodiments, the distance d2 may be smaller than the radius of the polishing pad 100a, and even the distance d2 may be slightly larger than the radius of the polishing pad 100 a. As mentioned above, in the first coordinate direction x, the rotation axis C1 is positive to the right and negative to the left, so the distance d1 is positive and the distance d2 is negative. That is, in the present embodiment, the position of the object 200 on the polishing pad 100a crosses the rotation axis C1.

As shown in FIGS. 1 and 2, when the polishing pad 100a is used to polish an object 200 for a polishing process, the polishing pad 100a rotates along the rotation axis C1 such that the polishing pad 100a has a constant track region CR and a circular track region RR corresponding to the polishing track of the object 200, the circular track region RR adjacently surrounds the constant track region CR and the area of the circular track region RR (i.e., π (d 2)²-d1²) For example, is larger than the area of the constant track region CR (i.e., π d1²). During the polishing process, the object 200 continuously contacts the constant track region CR of the polishing pad 100a, and the object 200 cyclically contacts the circular track region RR of the polishing pad 100 a. That is, the constant track region CR is a region where the polishing pad 100a continuously polishes the object 200 during the polishing process, and the circular track region RR is a region where the object 200 is periodically polished. In polishing an article using the polishing pad 100a200, while the polishing pad 100a is rotated about the rotational axis C1, the article 200 is optionally self-rotating about its center C2. In another embodiment of a polishing process for polishing an article 200 using a polishing pad 100a, the article 200 is optionally self-rotating along its center C2 and optionally oscillating back and forth in a radial direction relative to the polishing pad 100a while the polishing pad 100a rotates along the rotational axis C1.

As shown in fig. 1 and 2, the constant track region CR overlaps the slurry communication region SR, that is, the plurality of through holes H and the at least one connecting groove CG are disposed in the constant track region CR, such that the through holes H and the connecting grooves CG in the constant track region CR are covered by the object 200 during the polishing process. In particular, in the present embodiment, the constant track region CR overlaps the polishing liquid communication region SR, so that a large amount of polishing liquid is distributed in the constant track region CR during polishing, and the polishing pad 100a has a particular polishing liquid flow field distribution.

In the case where the platen P is selected to have the polishing liquid supply port SO, the polishing liquid supply port SO may be located at the center of the platen P, and the platen P may be an upper platen (i.e., the polishing pad is disposed below the platen and the object is disposed below the polishing pad) or a lower platen (i.e., the polishing pad is disposed above the platen and the object is disposed above the polishing pad). As shown in fig. 1 and 2, in the present embodiment, the relative position of the slurry supply port SO corresponds to the inside of the slurry communication region SR, and the slurry supply port SO corresponds to one of the through holes H in the slurry communication region SR, but the present invention is not limited thereto. In other embodiments, the slurry supply port SO may be selectively disposed to correspond to the connecting groove CG in the slurry communication region SR. In addition, the polishing pad 100a is fixed on the carrier P, whereby the polishing liquid can be supplied from the back surface BS of the polishing liquid communication region SR of the polishing pad 100a onto the polishing surface PS through the through hole H. Since the constant track region CR of the polishing pad 100a continuously polishes the object 200 during the polishing process of the polishing system 1000, and the constant track region CR and the slurry communication region SR are overlapped with each other, the plurality of through holes H and the at least one connecting groove CG, which are disposed in the slurry communication region SR and connected to each other, can transmit the slurry to the polishing surface PS in the entire constant track region CR, so that the constant track region CR continuously polishing the object 200 can have a sufficient and uniformly distributed slurry therein. Therefore, the polishing pad 100a can have a particular slurry flow field distribution when the polishing pad 100a is used to polish the article 200.

It should be noted that if the area occupied by the slurry communicating region SR is much smaller than the area of the constant track region CR, the friction force may be too large due to too small distribution of the slurry, and the polishing pad may be deformed due to pushing. For example, if the slurry communication region SR occupies an area within about 15% of the radius of the polishing pad 100a and the constant track region CR occupies an area within about 30% of the radius of the polishing pad 100a, the slurry communication region SR has an area of only 25% of the area of the constant track region CR. Under the above-mentioned structure, only 25% of the central portion (i.e., the location occupied by the slurry communication region SR) of the constant track region CR for continuously polishing the object can have the slurry sufficiently and uniformly distributed therein, while 75% of the peripheral portion of the area of the remaining constant track region CR cannot have the slurry sufficiently and uniformly distributed therein. In this case, the friction force may be too large due to too small distribution of the polishing liquid in the peripheral portion, and the polishing pad may be deformed due to pushing.

On the other hand, if the area occupied by the slurry communication region SR is larger than the area of the constant track region CR, i.e., the distribution of the slurry communication region SR extends to the circulation track region RR, the usage rate of the slurry will be poor, and the cost of the polishing process will be increased. For example, if the distribution of the slurry communication region SR occupies the entire area of the polishing pad 100a, a portion of the slurry communication region SR is not covered by the article 200. Under the above structure, the polishing liquid in the polishing liquid communication region SR has a smaller flow resistance in the region not covered by the article 200, so that the polishing liquid can easily flow out of the polishing pad 100a from the region not covered by the article 200. Moreover, when the platen P is an overhead platen, the polishing liquid is more likely to flow out of the polishing pad 100a from the region not covered by the object 200 due to gravity. Therefore, the usage rate of the polishing slurry is not good, and the cost of the polishing process is increased.

As described above, the distribution shape of the connecting grooves CG is not limited to the m-shape, and other modifications will be described in detail below with reference to fig. 5 to 7.

Fig. 5 is a partially enlarged schematic view of a polishing pad according to another embodiment of the present invention. Referring to fig. 5 and 3, the polishing pad 100b of fig. 5 is similar to the polishing pad 100a of fig. 3, and therefore the same or similar elements are denoted by the same or similar symbols, and the description thereof is omitted. Hereinafter, a description will be given of the main difference between the polishing pad 100b and the polishing pad 100 a.

Referring to fig. 5, in the present embodiment, the distribution shape of the connecting grooves CG is a Y-shape. From another point of view, as shown in fig. 5, the at least one connecting groove CG is exemplified by three connecting grooves CG. In addition, in the present embodiment, neither the through hole H2 nor the through hole H3 is disposed at the intersection of the polishing grooves PG.

As can be seen from the above description of fig. 1 to 4, in the present embodiment, the polishing pad 100b has a specific slurry flow field distribution when the polishing pad 100b is used to polish an object 200 to perform a polishing process by providing a plurality of through holes H respectively penetrating through the polishing surface PS and the back surface BS and at least one connecting groove CG in the back surface BS and connecting the plurality of through holes H in the slurry communication region SR.

Fig. 6 is a partially enlarged schematic view of a polishing pad according to another embodiment of the present invention. Referring to fig. 6 and 3, the polishing pad 100c of fig. 6 is similar to the polishing pad 100a of fig. 3, and therefore the same or similar elements are denoted by the same or similar symbols, and the description thereof is omitted. Hereinafter, a description will be given of the main difference between the polishing pad 100c and the polishing pad 100 a.

Referring to fig. 6, in the present embodiment, the distribution shape of the connecting grooves CG is a cross shape. From another point of view, as shown in fig. 6, the at least one connecting groove CG is exemplified by two connecting grooves CG.

As can be seen from the above description of fig. 1 to 4, in the present embodiment, the polishing pad 100c has a specific slurry flow field distribution when the polishing pad 100c is used to polish the object 200 for the polishing process by providing a plurality of through holes H1-H3 respectively penetrating through the polishing surface PS and the back surface BS and at least one connecting groove CG in the back surface BS and connecting the plurality of through holes H1-H3 in the slurry communication region SR.

Fig. 7 is a partially enlarged schematic view of a polishing pad according to another embodiment of the present invention. Referring to fig. 7 and 3, the polishing pad 100d of fig. 7 is similar to the polishing pad 100a of fig. 3, and therefore the same or similar elements are denoted by the same or similar symbols, and the description thereof is omitted. Hereinafter, a description will be given of the main difference between the polishing pad 100d and the polishing pad 100 a.

Referring to fig. 7, in the present embodiment, the distribution shape of the connecting grooves CG is a straight line. From another point of view, as shown in fig. 7, at least one connecting groove CG exemplifies one connecting groove CG.

As can be seen from the above description of fig. 1 to 4, in the present embodiment, the polishing pad 100d has a specific slurry flow field distribution when the polishing pad 100d is used to polish the object 200 for the polishing process by providing a plurality of through holes H1-H3 respectively penetrating through the polishing surface PS and the back surface BS and at least one connecting groove CG in the back surface BS and connecting the plurality of through holes H1-H3 in the slurry communication region SR.

Fig. 8 is a flowchart of a polishing method according to an embodiment of the present invention. The polishing method is suitable for polishing an object. In detail, the polishing method can be applied to a polishing process for manufacturing industrial devices, such as devices applied in the electronic industry, which can include semiconductor, integrated circuit, micro-electro-mechanical system, energy conversion, communication, optical, storage disk, display, etc., and the articles used for manufacturing these devices can include semiconductor wafer, group iii v wafer, storage device carrier, ceramic substrate, polymer substrate, glass substrate, etc., but the scope of the invention is not limited thereto.

Referring to fig. 8, first, step S10 is performed to provide a polishing pad. In detail, in the present embodiment, the polishing pad may be any of the polishing pads described in the foregoing embodiments, for example, the

polishing pads

100a, 100b, 100c, and 100 d. The description of the

polishing pads

100a, 100b, 100c, 100d is not repeated herein since it is described in detail above.

Then, step S12 is performed to apply pressure to the object. Thus, the object is pressed on the polishing pad and contacts with the polishing pad. In detail, in the present embodiment, the object may be the object 200 described in the foregoing embodiment, and the description of the object 200 is described in detail above, so that no further description is provided herein. In addition, as described above, the object is in contact with the polishing surface PS of the

polishing pads

100a, 100b, 100c, 100 d. In addition, the pressure is applied to the object, for example, by using a carrier capable of holding the object.

Then, step S14 is performed to provide relative motion between the object and the polishing pad so as to polish the object with the polishing pad, thereby achieving the purpose of planarization. As mentioned above, the method of providing relative motion between the object and the polishing pad is, for example: the bearing table rotates to drive the grinding pad fixed on the bearing table to rotate.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. A polishing pad having a polishing surface and a back surface opposed to each other, having a polishing liquid communication region, comprising:

a plurality of through holes located in the polishing liquid communication area, wherein the through holes respectively penetrate through the polishing surface and the back surface; and

at least one connecting groove disposed in the back surface and located within the slurry communication region, wherein the at least one connecting groove connects the plurality of through holes, wherein the slurry communication region is located in a central region within 20% to 50% of a radius of the polishing pad.

2. The polishing pad of claim 1, wherein the at least one connecting groove extends in a radial direction of the polishing pad.

3. The polishing pad of claim 1, wherein the at least one connecting groove has a shape selected from the group consisting of a chevron, a Y-shaped, a cross, and a straight line.

4. The polishing pad of claim 1, wherein the at least one connecting groove has a connecting groove depth from the back surface, the connecting groove depth being between 5% and 50% relative to the thickness of the polishing pad.

5. The polishing pad of claim 1, wherein the plurality of perforations comprise inner and outer perforations, wherein the inner perforations have a smaller pore size than the outer perforations.

6. The polishing pad of claim 1, wherein the plurality of perforations comprise a central perforation, wherein the central perforation has a smallest pore size among the plurality of perforations.

7. The polishing pad of claim 1, wherein a rotation axis of the polishing pad overlaps with a center of the polishing liquid communication region.

8. The polishing pad of claim 1, wherein a rotational axis of the polishing pad overlaps one of the plurality of through holes.

9. The polishing pad of claim 1, further comprising at least one polishing groove disposed in the polishing surface.

10. The polishing pad of claim 9, wherein the plurality of through holes connect the at least one polishing groove.

11. The polishing pad of claim 9, wherein the at least one polishing groove has a polishing groove depth from the polishing surface, the polishing groove depth being between 10% and 80% relative to the thickness of the polishing pad.

12. A polishing pad adapted to polish an object, the polishing pad having a constant trajectory region corresponding to the object and a circulating trajectory region surrounding the constant trajectory region, and comprising:

a polishing surface and a back surface opposite to each other;

a plurality of through holes respectively penetrating through the grinding surface and the back surface; and

at least one connecting groove disposed in the back surface and connecting the plurality of through holes, wherein the plurality of through holes and the at least one connecting groove are disposed within the constant track area.

13. The polishing pad of claim 12, wherein the area of the circulating track region is greater than the area of the constant track region.

14. The polishing pad of claim 12, wherein the constant trajectory region is located in a central region within 20% to 50% of a radius of the polishing pad.

15. The polishing pad of claim 12, wherein the at least one connecting groove extends in a radial direction of the polishing pad.

16. The polishing pad of claim 12, wherein the at least one connecting groove has a shape selected from the group consisting of a chevron, a Y-shaped, a cross, and a straight line.

17. The polishing pad of claim 12, wherein the at least one connecting groove has a connecting groove depth from the back surface, the connecting groove depth being between 5% and 50% relative to the thickness of the polishing pad.

18. The polishing pad of claim 12, wherein the plurality of perforations comprise inner and outer perforations, wherein the inner perforations have a smaller pore size than the outer perforations.

19. The polishing pad of claim 12, wherein the plurality of perforations comprise a central perforation, wherein the central perforation has a smallest pore size among the plurality of perforations.

20. The polishing pad of claim 12, wherein a rotational axis of the polishing pad overlaps a center of the constant trajectory region.

21. The polishing pad of claim 12, wherein a rotational axis of the polishing pad overlaps one of the plurality of through holes.

22. The polishing pad of claim 12, further comprising at least one polishing groove disposed in the polishing surface.

23. The polishing pad of claim 22, wherein the plurality of through holes connect the at least one polishing groove.

24. The polishing pad of claim 22, wherein the at least one polishing groove has a polishing groove depth from the polishing surface, the polishing groove depth being between 10% and 80% relative to the thickness of the polishing pad.

25. A polishing system adapted to perform a polishing process, comprising:

a polishing pad having a polishing surface and a back surface opposed to each other, having a polishing liquid communication region, and including:

at least one connecting groove disposed in the back surface and located in the slurry communication region, wherein the at least one connecting groove connects the plurality of through holes; and

an article on the polishing surface of the polishing pad, wherein the slurry communication zone is located in a central region within 20% to 50% of the radius of the polishing pad.

26. The polishing system of claim 25, wherein the at least one connecting groove extends in a radial direction of the polishing pad.

27. The polishing system as recited in claim 25, wherein the at least one connecting channel has a distributed shape comprising a chevron, a Y-shaped, a cross, or a straight shape.

28. The polishing system of claim 25, wherein the at least one connecting groove has a connecting groove depth from the back surface, the connecting groove depth being between 5% and 50% relative to the thickness of the polishing pad.

29. The polishing system of claim 25, wherein the plurality of perforations comprise inner perimeter perforations and outer perimeter perforations, wherein the inner perimeter perforations have a smaller pore size than the outer perimeter perforations.

30. The abrading system of claim 25, wherein the plurality of perforations comprise a central perforation, wherein the central perforation has a smallest pore size among the plurality of perforations.

31. The polishing system of claim 25, wherein the polishing pad has a rotational axis that overlaps a center of the slurry communication region.

32. The polishing system of claim 25, wherein the rotational axis of the polishing pad overlaps one of the plurality of perforations.

33. The polishing system of claim 25, wherein the polishing pad further comprises at least one polishing groove disposed in the polishing surface.

34. The polishing system of claim 33, wherein the plurality of perforations connect the at least one polishing groove.

35. The polishing system of claim 33, wherein the at least one polishing groove has a polishing groove depth from the polishing surface, the polishing groove depth being between 10% and 80% relative to the thickness of the polishing pad.

36. The polishing system of claim 25, further comprising a carrier having a slurry supply port, wherein the polishing pad is secured to the carrier.

37. A polishing system adapted to perform a polishing process, comprising:

an object; and

a polishing pad for polishing the object, wherein the polishing pad has a constant trajectory region corresponding to the object and a circular trajectory region surrounding the constant trajectory region, and comprises:

a polishing surface and a back surface opposite to each other;

at least one connecting groove disposed in the back surface and connecting the plurality of through-holes, wherein the plurality of through-holes and the at least one connecting groove are disposed within the constant track area, and the article is located on the polishing surface of the polishing pad.

38. The polishing system of claim 37, wherein the at least one connecting groove extends in a radial direction of the polishing pad.

39. The polishing system as recited in claim 37, wherein the at least one connecting channel has a distributed shape comprising a chevron, a Y-shaped, a cross or a straight shape.

40. The polishing system of claim 37, wherein the at least one connecting groove has a connecting groove depth from the back surface, the connecting groove depth being between 5% and 50% relative to the thickness of the polishing pad.

41. The polishing system of claim 37, wherein the plurality of perforations comprise inner and outer perforations, wherein the inner perforations have a smaller pore size than the outer perforations.

42. The abrading system of claim 37, wherein the plurality of perforations comprise a central perforation, wherein the central perforation has a smallest pore size among the plurality of perforations.

43. The polishing system of claim 37, wherein the rotational axis of the polishing pad overlaps the center of the constant trajectory region.

44. The polishing system of claim 37, wherein the rotational axis of the polishing pad overlaps one of the plurality of perforations.

45. The polishing system of claim 37, wherein the polishing pad further comprises at least one polishing groove disposed in the polishing surface.

46. The polishing system of claim 45, wherein the plurality of perforations connect the at least one polishing groove.

47. The polishing system of claim 45, wherein the at least one polishing groove has a polishing groove depth from the polishing surface, the polishing groove depth being between 10% and 80% relative to the thickness of the polishing pad.

48. The polishing system of claim 37, further comprising a carrier having a slurry supply port, wherein the polishing pad is secured to the carrier.