CN213513227U

CN213513227U - Circuit structure of SMD support packaging for LED light-emitting chip

Info

Publication number: CN213513227U
Application number: CN202021728420.9U
Authority: CN
Inventors: 蒋夏静; 楼鸿玮
Original assignee: Migang New Materials Technology Shanghai Co ltd
Current assignee: Migang New Materials Technology Shanghai Co ltd
Priority date: 2020-08-19
Filing date: 2020-08-19
Publication date: 2021-06-22
Anticipated expiration: 2030-08-19

Abstract

The utility model relates to a SMD support technical field especially relates to a circuit structure of SMD support encapsulation for LED luminescence chip, including the SMD support, the overall arrangement has LED chip and circuit structure in the SMD support, circuit structure includes the LED chip of one or more than one gaN base, and this LED chip is integrated in the SMD support through the mode of establishing ties or parallelly connected, the SMD support is external to have drive power supply, and the LED chip can select the chip of different rated power, and drive power supply does the operating current that the LED chip provided is less than or equal to 45% of LED chip rated operating current; the utility model discloses a LED is SMD support package for luminous chip, LED chip can be by external power drive work, and calorific capacity reduces, avoids phosphor powder to produce colour temperature drift simultaneously, and phenomenon such as easy yellowing has effectively solved because of unfavorable phenomenon such as phosphor powder colour temperature drift, and the lower problem of luminous efficacy who causes has improved working life.

Description

Circuit structure of SMD support packaging for LED light-emitting chip

Technical Field

The utility model relates to a SMD support technical field especially relates to a circuit structure of SMD support encapsulation for LED luminescence chip.

Background

The SMD, i.e., the surface mounted device, is one of SMT components. The preparation of the SMD component requires that a chip is attached to a support to form a die bond, and the chip and a support pin are electrically conducted correspondingly through welding.

Generally, a light emitting chip and a related electric circuit are installed in an SMD support, a phosphor colloid is coated on the surface of the SMD support, and then the SMD support is packaged into an LED, a lamp wick has large working current and large power for a long time, and heat generated by using an internal electric circuit becomes high, so that the phosphor generates phenomena of color temperature drift, easy yellowing and the like, and the light emitting efficiency and the service life of the LED are seriously affected.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a circuit structure of SMD support encapsulation for LED luminescence chip to prior art's not enough.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

the utility model provides a circuit structure of LED luminescence chip SMD support encapsulation, includes the SMD support, and the overall arrangement has LED chip and circuit structure in the SMD support, circuit structure includes the LED chip of one or more GaN base, and this LED chip is integrated in the SMD support through the mode of establishing ties or parallelly connected, the SMD support is external to have drive power supply, and drive power supply does the operating current that the LED chip provided is less than or equal to 45% of LED chip rated operating current.

Further: the circuit structure further comprises a constant current control tube, the constant current control tube is connected in series with one end of the LED chip, an S pole of the constant current control tube is LED out to the outer side of the SMD support, a resistor is externally connected to an interface of the S pole, and the LED chip and the constant current control tube are integrated in the SMD support.

Further: the number of the LED chips is 1 or more than 1.

Further: the GaN LED chip can be any one of a GaN-based blue light LED chip, a GaN-based green light LED chip and a GaN-based red light LED chip.

Further: the SMD support outer end is provided with the installing frame of placing external resistance, the installing frame shaping is in SMD support lateral wall.

Further: an opening is formed in one side of the mounting frame, and the opening is hinged with a sealing cover.

The utility model has the advantages that: the utility model discloses a circuit structure of LED luminescence chip SMD support encapsulation, LED chip can select different rated power's chip, and the LED chip can be by external power drive work, and drive power supply does the operating current that the LED chip provided is less than or equal to 45% of LED chip rated operating current, utilizes the characteristic of GaN base's LED chip, and is low very much, when operating current is 20% of chip rated operating current, the light source light efficiency can reach more than 230lm W to the consumption further reduces, calorific capacity reduces, avoid phosphor powder to produce the colour temperature drift simultaneously, phenomenons such as easy yellowing have effectively been solved because of bad phenomena such as phosphor powder colour temperature drift, and the lower problem of luminous efficacy who causes, and working life is prolonged.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic diagram of the bracket and chip connection circuit structure of the present invention.

Fig. 3 is a graph showing the relationship between the light effect and the current.

The reference numerals include:

1-SMD support 11-positive and negative pole connecting end 12-mounting frame 13-opening 14-sealing cover 15-power supply

2-circuit structure 21-LED chip 22-constant current control tube 23-resistance 24-SMD lamp pearl.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 1, a circuit structure for packaging an LED light emitting chip with an SMD holder includes an SMD holder 1, an LED chip 21 and a circuit structure 2 are arranged in the SMD holder 1, the circuit structure 2 includes one or more GaN-based LED chips 21, the LED chips 21 are integrated in the SMD holder 1 in a serial or parallel manner, and the LED chips 21 are driven by a small power supply 15 driver to operate; the utility model discloses a circuit structure of SMD support packaging for LED luminescence chip, LED chip can be by 15 drive works of external power, drive power supply does the operating current that the LED chip provided is less than or equal to 45% of the rated operating current of LED chip, utilize the high-efficient low-consumption characteristic of GaN-based LED chip 21, can be as shown in FIG. 2, in particular, when operating current is below the rated operating current 20% of chip, the light source light efficiency can reach more than 230lm/W, and the consumption further reduces, calorific capacity reduces, avoid phosphor powder to produce the colour temperature drift simultaneously, phenomenons such as easy yellowing have effectively been solved because of bad phenomena such as phosphor powder colour temperature drift, and the lower problem of luminous efficacy who causes, and the working life is prolonged.

Further: the circuit structure 2 further comprises a constant current control tube 22, the constant current control tube 22 is connected in series with one end of the LED chip 21, an S pole of the constant current control tube 22 is LED out to the outer side of the SMD support 1, a resistor 23 is externally connected to an interface of the S pole, the LED chip 21 and the constant current control tube 22 are integrated in the SMD support 1, in the packaging process, the LED chip 21 and a base pin are bonded through a gold thread, and fluorescent powder coating is carried out on the surface of the SMD support 1 to form an SMD lamp bead 24; the utility model discloses a circuit structure of SMD support packaging for LED luminescence chip, through the less resistance 23 of the external resistance of constant current control tube 22, make LED chip 21's operating current stable below the 45% of LED chip 21 rated operating current, the high-efficient low-consumption characteristic of LED chip 21 of reunion GaN, can reach more than 230lm/W with LED chip 21's light efficiency, the light source light efficiency has improved more than 30%, and the consumption reduces, calorific capacity reduces, avoid phosphor powder to produce the colour temperature drift simultaneously, phenomenons such as easy yellowing, effectively solved because of unfavorable phenomena such as phosphor powder colour temperature drift, and the lower problem of luminous efficacy who causes, and working life is improved.

Further: the number of the LED chips 21 is 1 or more than 1.

Further: the GaN LED chip 21 can be any one of a GaN-based blue LED chip, a GaN-based green LED chip and a GaN-based red LED chip, and the LED chips 21 with different colors are selected according to actual use scenes to meet requirements. The utility model discloses a circuit structure of SMD support package for LED luminescence chip, calorific capacity reduces, avoids phosphor powder to produce colour temperature drift simultaneously, and phenomenon such as easy yellowing has effectively solved because of unfavorable phenomenon such as phosphor powder colour temperature drift, and the lower problem of luminous efficacy who causes has improved working life.

Further: the LED chips 21 are connected in series or in parallel, and the LED chips 21 can also be connected in a combination of series connection and parallel connection. The utility model discloses a circuit structure of SMD support package for LED luminescence chip, calorific capacity reduces, avoids phosphor powder to produce colour temperature drift simultaneously, and phenomenon such as easy yellowing has effectively solved because of unfavorable phenomenon such as phosphor powder colour temperature drift, and the lower problem of luminous efficacy who causes has improved working life.

Further: the outer end of the SMD support 1 is provided with a mounting frame 12 for placing an external resistor 23, the mounting frame 12 is formed on the outer side wall of the SMD support 1, the resistors 23 with different resistance values can be replaced, the working current of the LED chip 21 is changed, and the light effect of a light source is changed.

Further: an opening 13 is formed at one end of the mounting frame 12, and the opening 13 is hinged with a sealing cover 14, so that the external resistor 23 can be well protected.

In conclusion, the present invention has the above-mentioned excellent characteristics, so that it can be used to enhance the effectiveness of the prior art and has practicability, and thus it is a product with practical value.

The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.

Claims

1. The utility model provides a circuit structure of SMD support encapsulation for LED luminescence chip, includes the SMD support, and the overall arrangement has LED chip and circuit structure in the SMD support, its characterized in that: the circuit structure comprises one or more GaN-based LED chips, the LED chips are integrated in an SMD support in a series or parallel mode, the SMD support is externally connected with a driving power supply, and the working current provided by the driving power supply for the LED chips is less than or equal to 45% of the rated working current of the LED chips.

2. The circuit structure of the SMD support package for LED light emitting chip as set forth in claim 1, wherein: the circuit structure further comprises a constant current control tube, the constant current control tube is connected in series with one end of the LED chip, an S pole of the constant current control tube is LED out to the outer side of the SMD support, a resistor is externally connected to an interface of the S pole, and the LED chip and the constant current control tube are integrated in the SMD support.

3. The circuit structure of the SMD support package for LED light emitting chip as set forth in claim 1, wherein: the number of the LED chips is 1 or more than 1.

4. The circuit structure of the SMD support package for LED light emitting chip as set forth in claim 1, wherein: the GaN-based LED chip can be any one of a GaN-based blue light LED chip, a GaN-based green light LED chip and a GaN-based red light LED chip.

5. The circuit structure of the SMD holder package for LED light emitting chip as set forth in claim 1 or 2, wherein: the SMD support outer end is provided with the installing frame of placing external resistance, the installing frame shaping is in SMD support lateral wall.

6. The circuit structure of claim 5, wherein the SMD support package comprises: an opening is formed in one side of the mounting frame, and the opening is hinged with a sealing cover.