CN213506583U - Substrate thinning device - Google Patents

Abstract

The utility model relates to a liquid crystal display technology field discloses a base plate attenuate device. The substrate thinning device comprises a reaction tank, a basket tool, a spraying assembly and a liquid supply assembly, wherein an etching medium is contained in the reaction tank, the basket tool is used for supporting the substrate to be in a vertical posture, the basket tool is contained in the reaction tank, the substrate is immersed in the etching medium, the spraying assembly is arranged on each of two sides of the substrate, the liquid supply assembly is communicated with the spraying assembly, and the spraying assembly is used for spraying a liquid column towards the substrate opposite to the spraying assembly so as to enable the substrate to be in the vertical posture. The utility model discloses a base plate thinning device, base plate after the attenuate becomes soft, the liquid column that the spray assembly sprays of its both sides can make the base plate keep balance to support the base plate in the horizontal direction, make the base plate keep vertical gesture in order to continue to attenuate to thinner size; the two sides of the substrate are thinned simultaneously, so that the thinning efficiency is high; the thinning process does not need to carry out other operations on the substrate, the substrate is not easy to be damaged, and the product yield is high.

Description

Substrate thinning device

Technical Field

The utility model relates to a liquid crystal display technology field especially relates to a base plate attenuate device.

Background

The glass substrate is a basic component constituting the liquid crystal display panel, and the thickness of the glass substrate is required to be thinner and thinner as the liquid crystal display technology is developed.

The dipping method has the advantages of simple device, good uniformity of the thinned glass substrate and the like, and is widely applied to industrial production. The dipping method is used for supporting the glass substrate through the basket, so that the glass substrate can be soaked in a container filled with etching media in a vertical posture, and the etching media etch the surfaces of two sides of the glass substrate, thereby realizing the thinning of the glass substrate. However, as the thickness of the glass substrate becomes thinner, the texture becomes softer and softer, so that the glass substrate cannot be vertically supported in the basket, and therefore, the thickness limit of the product thinned by the above thinning method can only reach 0.25mm, and a thinner product cannot be obtained. In order to obtain a thinner glass substrate, the prior art adopts a method that a film is coated on the surface of one side of the glass substrate, the film coated surface of the glass substrate is attached to a support member, then the support member and the glass substrate are soaked in an etching medium to thin the single surface, and after the single surface is thinned, the other surface of the glass substrate is thinned in the same way, so that an ultrathin product meeting the requirement is produced. However, in the thinning mode, the glass substrate is easily damaged in the operation process, so that the product yield is low, the thinning cost is high, and the efficiency is low.

Therefore, it is desirable to provide a substrate thinning apparatus to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a base plate attenuate device, it can attenuate the product that becomes thinner, and production efficiency is high, the product yield is high.

To achieve the purpose, the utility model adopts the following technical proposal:

a substrate thinning apparatus comprising:

the reaction tank is filled with etching media;

the basket tool supports the substrate to be in a vertical posture, the basket tool is accommodated in the reaction tank, and the substrate is immersed in the etching medium;

the spraying components are arranged on two sides of the substrate; and

and the liquid supply assembly is communicated with the spraying assembly, and the spraying assembly sprays liquid columns towards the substrate opposite to the spraying assembly so as to keep the substrate in a vertical posture.

Preferably, the spray assembly comprises:

the wall body is internally provided with a plurality of liquid spraying pipe orifices and mounting cavities, one end of each liquid spraying pipe orifice is communicated with the mounting cavity, and the other end of each liquid spraying pipe orifice faces the substrate;

the communicating pipes are arranged in the mounting cavity, and one ends of the communicating pipes are connected with the corresponding liquid spraying pipe orifices;

and the input end of the driving assembly is communicated with the liquid supply assembly, and the output end of the driving assembly is communicated with the other end of the communicating pipe.

Preferably, the spray assembly further comprises a plurality of flow regulating members, one flow regulating member being connected to each of the liquid ejection pipe openings.

Preferably, the spraying assembly further comprises a circulating pump, an inlet of the circulating pump is arranged at the upper end of the reaction tank, and an outlet of the circulating pump is communicated with the liquid supply assembly.

Preferably, along the vertical direction, one side of the wall facing the substrate is provided with a plurality of rows of liquid spraying nozzle sets, each liquid spraying nozzle set comprises a plurality of liquid spraying nozzles arranged along the horizontal direction, and the liquid spraying nozzles are arranged obliquely upwards to spray liquid columns obliquely upwards towards the substrate.

Preferably, only one spraying assembly is arranged between two adjacent substrates, and the two sides of each spraying assembly are provided with the liquid spraying pipe orifices.

Preferably, the basket utensil is gone up parallel interval and is provided with a plurality of support positions, every support position supports one the base plate, adjacent two be provided with between the support position and dodge the hole, the cross-section of dodging the hole is greater than the cross-section of wall body.

Preferably, the substrate thinning apparatus further comprises a turnover mechanism, the turnover mechanism comprising:

a support assembly;

the grabbing component is arranged on the supporting component and used for grabbing the basket tool;

and the turnover driving component drives the supporting component to move along the vertical direction.

Preferably, the epicyclic mechanism further comprises:

a plurality of auxiliary assemblies of taking out are connected the supporting component orientation a side of base plate, every it includes two parallel arrangement in the auxiliary wall of the both sides of base plate to take out auxiliary assembly, two the distance between the auxiliary wall is adjustable.

Preferably, the epicyclic mechanism further comprises:

the washing assembly is arranged between the two auxiliary walls and positioned above the substrate, and is used for spraying cleaning liquid to the substrate;

and the liquid receiving disc is arranged below the basket tool when the grabbing assembly takes the basket tool out of the reaction tank.

The utility model discloses beneficial effect does:

the utility model discloses a base plate attenuate device puts into the reaction tank with vertical gesture through the basket utensil, and makes the base plate submerge in the sculpture medium, and the sculpture medium can carry out the sculpture attenuate to the both sides of base plate simultaneously, and production efficiency is high; meanwhile, the spraying assemblies positioned on the two sides of the substrate simultaneously spray liquid columns to the substrate, the liquid columns generate certain horizontal force on the substrate, the force of the liquid columns on the two sides of the substrate on the substrate can balance the stress of the substrate, and the substrate can be supported in the horizontal direction, so that after the substrate is thinned and softened, the vertical posture can be still kept for continuous thinning, and thinner products can be thinned; in addition, after the substrate is placed in the reaction tank, other operations such as film coating or sticking are not carried out on the substrate, the substrate is not easy to damage, and therefore the yield of thinned products is high.

Drawings

Fig. 1 is a schematic view of a partial structure of a substrate thinning apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of the effect of the spray assembly on the substrate according to an embodiment of the present invention;

FIG. 3 is a schematic structural view of a basket of a substrate thinning apparatus according to an embodiment of the present invention when the basket is located in a reaction tank;

fig. 4 is a schematic structural view of the turnover mechanism of the substrate thinning apparatus provided in the embodiment of the present invention when the basket is taken out.

In the figure:

100-a substrate;

1-a reaction tank;

2-a basket tool; 21-a support position; 22-avoidance hole

31-a spray assembly; 311-wall body; 312-a spray nozzle; 313-a mounting cavity; 314-a flow regulating member; 32-a liquid supply assembly; 33-a circulation pump;

4-a turnover mechanism; 41-a support assembly; 411-a support bar; 412-a support plate; 42-a grasping assembly; 43-an auxiliary wall; 44-a flushing assembly; 45-liquid receiving disc.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The embodiment provides a substrate thinning device which can be used for thinning a substrate. The substrate may be a glass substrate used for producing a liquid crystal display panel, or may be a silicon wafer or a substrate made of other materials. In this embodiment, the substrate thinning apparatus is used to thin a glass substrate.

Fig. 1 is a schematic view of a partial structure of a substrate thinning apparatus according to this embodiment, as shown in fig. 1, the substrate thinning apparatus includes a reaction tank 1, a basket 2, a spray assembly 31 and a liquid supply assembly 32, wherein an etching medium is contained in the reaction tank 1, the etching medium is an acidic liquid containing HF acid, the basket 2 is used for supporting a substrate 100 in a vertical posture, after the basket 2 carrying the substrate 100 is placed in the reaction tank 1, the substrate 100 is immersed in the etching medium, the spray assembly 31 is disposed in the reaction tank 1 and is communicated with the liquid supply assembly 32, the spray assembly 31 is disposed on both sides of the substrate 100, and the spray assembly 31 is used for spraying a liquid column toward the substrate 100 facing thereto, so as to keep the substrate 100 in the vertical posture.

According to the substrate thinning device, the etching medium in the reaction tank 1 can etch and thin the two sides of the substrate 100 at the same time, so that the production efficiency is high; the liquid columns generate horizontal force to the substrate 100, the force of the liquid columns on two sides of the substrate 100 to the substrate 100 can balance the stress of the substrate 100, and can play a role of horizontal support to the substrate 100, so that after the substrate 100 is thinned and softened, the vertical posture can be still maintained to continue thinning, and thinner products can be thinned; in addition, after the substrate 100 is placed in the reaction tank 1, other operations such as coating or pasting are not performed on the substrate 100, and the substrate 100 is not easily damaged, so that the yield of thinned products is high.

Specifically, in this embodiment, the reaction tank 1 is a tank body with only an upper side opening, and the size of the reaction tank 1 is slightly larger than that of the basket 2, and the spray assembly 31 is disposed on the bottom plate of the reaction tank 1. Preferably, the shower assemblies 31 are symmetrically disposed on both sides of the substrate 100, so as to calculate the parameters of the liquid column injection, thereby balancing the stress on the substrate 100. Alternatively, the basket 2 may hold either or both the sides and bottom of the substrate 100 so that both sides of the substrate 100 are exposed to be sufficiently in contact with the etching medium.

Optionally, as shown in fig. 1, the liquid supply assembly 32 includes a closable receiving groove (not shown in the figure), the receiving groove contains an etching medium, the spraying assembly 31 is communicated with the receiving groove, and the liquid spray provided by the liquid supply assembly 32 for the spraying assembly 31 is the etching medium, so that the concentration and the composition of the etching medium in the reaction tank 1 are kept unchanged during the process of spraying the liquid column by the spraying assembly 31, thereby ensuring the stability of the etching and thinning process of the substrate 100. Preferably, the liquid supply assembly 32 is arranged below the reaction tank 1, on one hand, a top plate of the accommodating groove of the liquid supply assembly 32 and a bottom plate of the reaction tank 1 can share one plate, so that the cost is saved; on the other hand, the communication between the spray assembly 31 and the liquid supply assembly 32 is facilitated.

With the spraying of the spraying assembly 31, the etching medium in the reaction tank 1 is increased continuously, and the etching medium in the liquid supply assembly 32 is decreased continuously, in order to enable the substrate thinning apparatus to operate continuously, as shown in fig. 1, the spraying assembly 31 further includes a circulating pump 33, an inlet of the circulating pump 33 is disposed at the upper end of the reaction tank 1, and an outlet of the circulating pump 33 is communicated with the liquid supply assembly 32. When the liquid level of the etching medium in the reaction tank 1 reaches a certain height, namely, the liquid level reaches the inlet position of the circulating pump 33, the circulating pump 33 pumps the etching medium in the reaction tank 1 into the liquid supply assembly 32, so that the proper liquid level height of the etching medium in the reaction tank 1 is ensured, and the liquid supply assembly 32 can continuously supply liquid. Specifically, in the present embodiment, an infusion tube is connected to the outlet of the circulation pump 33, and the other end of the infusion tube communicates with the housing tank of the liquid supply unit 32.

Fig. 2 is a schematic diagram of the effect of the spray assembly of the substrate thinning apparatus of this embodiment on the substrate, as shown in fig. 2, the spray assembly 31 includes a wall 311, a plurality of communicating pipes (not labeled in the figure) and a driving assembly (not shown in the figure), wherein, a plurality of spray nozzles 312 and a mounting cavity 313 are provided in the wall 311, one end of each spray nozzle 312 is communicated with the mounting cavity 313, the other end faces the substrate 100, the communicating pipes are provided in the mounting cavity 313, one end of each communicating pipe is connected with the corresponding spray nozzle 312, the input end of the driving assembly is communicated with the liquid supply assembly 32, and the output end of the driving assembly is communicated with the other end of each communicating. That is, the drive assembly pumps the etching medium in the liquid supply assembly 32 into the nozzle 312 so that the nozzle 312 can eject liquid onto the substrate. In particular, in this embodiment, the drive assembly may be a pump assembly. Alternatively, the driving assembly may be disposed in the receiving groove of the liquid supply assembly 32, or may be disposed outside the reaction tank 1.

Preferably, as shown in fig. 2, the spray assembly 31 further includes a plurality of flow regulators 314, one flow regulator 314 being connected to each spray nozzle 312. The flow regulator 314 controls the force of the ejected liquid column on the substrate 100 by regulating the flow of the nozzle 312, so that the substrate 100 can be balanced. In this embodiment, the flow regulating member 314 may be a flow valve.

Preferably, as shown in fig. 1 and 2, a side of the wall 311 facing the substrate 100 in the vertical direction is provided with a plurality of rows of liquid ejecting nozzle sets, each of the liquid ejecting nozzle sets includes a plurality of liquid ejecting nozzles 312 arranged in the horizontal direction, and the liquid ejecting nozzles 312 are arranged obliquely upward to eject liquid columns obliquely upward toward the substrate 100. On one hand, the plurality of liquid spraying nozzles 312 spray liquid columns toward the substrate 100 at the same time, so that the stress at each position of the substrate 100 is balanced and the substrate is not easy to deform; on the other hand, compared with the case where the liquid column vertically irradiates on the substrate 100, the liquid column obliquely strikes on the substrate 100 with less impact on the substrate 100, and thus the substrate 100 is prevented from being damaged by the liquid column. Specifically, in this embodiment, the flow rates of the nozzle 312 at the same height are the same on both sides of the substrate 100, and the flow rates of the nozzle 312 at different heights can be set according to practical situations as long as the substrate 100 is ensured to maintain the vertical posture.

In order to thin a plurality of substrates 100 simultaneously, as shown in fig. 1 and 2, the substrate thinning apparatus includes a plurality of shower assemblies 31 arranged in parallel and at intervals, only one shower assembly 31 is arranged between two adjacent substrates 100, and both sides of the shower assembly 31 are provided with liquid spray nozzles 312. The plurality of spraying assemblies 31 are arranged, so that the substrate thinning device can simultaneously thin a plurality of substrates 100, thereby further improving the production efficiency; in addition, one spraying assembly 31 can spray liquid columns to the substrates 100 positioned on two sides of the spraying assembly, so that the cost is reduced, and the structure of the whole substrate thinning device is more compact.

Correspondingly, in order to enable the basket 2 to simultaneously support a plurality of substrates 100 and to be placed in cooperation with a plurality of spraying assemblies 31, as shown in fig. 1, a plurality of supporting positions 21 are arranged on the basket 2 at intervals in parallel, each supporting position 21 is used for supporting one substrate 100, an avoiding hole 22 is arranged between two adjacent supporting positions 21, and the cross section of the avoiding hole 22 is larger than the cross section of the wall 311. When the basket 2 is placed in the reaction tank 1, the plurality of avoiding holes 22 are respectively aligned with the plurality of spraying assemblies 31, and the avoiding holes 22 penetrate through the spraying assemblies 31 and are finally placed on the bottom plate of the reaction tank 1, so that each substrate 100 is positioned between two adjacent spraying assemblies 31. Specifically, in the present embodiment, the basket 2 has a rectangular parallelepiped frame structure, and the supporting portion 21 includes a clamping portion disposed on the bottom surface of the basket 2 and a clamping portion (not shown) disposed on the side surface of the basket 2, and the clamping portions of the bottom surface and the side surface support the substrate 100 together. Alternatively, the clamping portion may be a clamping groove adapted to the thickness of the substrate 100, or may have another structure, which is not limited in this embodiment.

Fig. 3 is a schematic structural diagram of the basket of the substrate thinning apparatus when the basket is located in the reaction tank, as shown in fig. 3, the substrate thinning apparatus further includes a turnover mechanism 4, the turnover mechanism 4 includes a supporting component 41, a grabbing component 42 and a turnover driving component (not shown in the figure), wherein the grabbing component 42 is disposed on the supporting component 41, the grabbing component 42 is used for grabbing the basket 2, and the turnover driving component can drive the supporting component 41 to move along the vertical direction. After the gripping assembly 42 grips the basket 2, the revolving driving assembly drives the supporting assembly 41 to ascend, thereby taking the basket 2 and the substrate 100 thereon out of the reaction tank 1.

Specifically, in the present embodiment, the supporting assembly 41 includes a supporting rod 411 and a supporting plate 412, wherein the supporting plate 412 is connected below the supporting rod 411, and the output end of the epicyclic driving assembly is connected with the supporting rod 411. Optionally, the turnover driving assembly may be a linear driving source such as an air cylinder and an oil cylinder, or may be a motor that cooperates with the screw nut structure to achieve driving in the vertical direction, which is not limited herein. Further optionally, the grabbing assembly 42 comprises two sets of linear guides and two hooks, wherein the two sets of linear guides are disposed at two ends of the supporting rod 411, and the hooks are slidably disposed on the linear guides. In the process of taking out the basket tool 2, the lifting hook is located at the avoiding position on the linear guide rail, when the turnover driving component drives the supporting component 41 to descend to a proper height from the basket tool 2, the lifting hook slides for a proper distance along the linear guide rail, at the moment, the turnover driving component drives the supporting component 41 to ascend, and the two lifting hooks hook the frame of the basket tool 2 to realize grabbing. The sliding of the lifting hook on the linear guide rail can be manual operation, and the lifting hook can also be driven by arranging a corresponding driving source. In other embodiments, the grasping assembly 42 may be a robot or other structure.

When the substrate 100 is thinned to a desired thickness, if the substrate 100 is directly taken out, the substrate 100 is easily inclined and deformed after losing the support of the liquid column sprayed by the spray assembly 31, and to solve this problem, as shown in fig. 3, the turnover mechanism 4 further includes a plurality of take-out auxiliary assemblies, the take-out auxiliary assemblies are connected below the support assemblies 41, each take-out auxiliary assembly includes two auxiliary walls 43 arranged in parallel on both sides of the substrate 100, and the distance between the two auxiliary walls 43 is adjustable. After the substrate 100 is thinned to a required thickness, the grabbing assembly 42 grabs the basket 2, the two auxiliary walls 43 are located at two sides of one substrate 100, and the distance between the two auxiliary walls 43 is adjusted to enable the two auxiliary walls 43 to be respectively attached to two side surfaces of the substrate 100 or respectively leave a small gap with the two side surfaces of the substrate 100, so that the substrate 100 can be supported, and the substrate 100 is ensured not to deform in the taking-out process.

Specifically, in the present embodiment, a plurality of sets of the auxiliary removing assemblies are disposed and are all connected to a side surface of the supporting plate 412 facing the substrate 100, and each set of the auxiliary removing assemblies is used for supporting one substrate 100. The removal assistance assembly further comprises a linear guide rail disposed below the support plate 412 and two linear driving sources, wherein the two auxiliary walls 43 are slidably disposed on the linear guide rail, and the two linear driving sources can respectively drive the two auxiliary walls 43 to slide along the linear guide rail, so as to adjust the distance between the two auxiliary walls 43. In other embodiments, the distance between the two auxiliary walls 43 can be adjusted by other structures.

When the substrate 100 is taken out from the reaction tank 1, a part of the etching medium may be retained on the substrate 100, and if the retained etching medium is not removed in time, the substrate 100 may be thinned unevenly. To solve the problem, fig. 4 is a schematic structural diagram of the turnover mechanism of the substrate thinning apparatus in this embodiment when taking out the basket, as shown in fig. 4, the turnover mechanism 4 further includes a rinsing assembly 44, the rinsing assembly 44 is disposed between the two auxiliary walls 43 and above the substrate 100, and the rinsing assembly 44 is used for spraying a cleaning solution onto the substrate 100, so as to remove the etching medium retained on the substrate 100 and ensure the uniformity of thinning the substrate 100. In this embodiment, the cleaning liquid is water.

Further, turnover mechanism 4 still includes liquid receiving disc 45, when snatching subassembly 42 and take out basket utensil 2 from reaction tank 1, liquid receiving disc 45 sets up in the below of basket utensil 2, and liquid receiving disc 45 can collect the washing liquid that the cleaning subassembly sprayed to avoid flowing down from base plate 100 and mix the washing liquid of etching medium and fall into reaction tank 1 and pollute the etching medium, perhaps fall in other places polluted environment.

Specifically, in the present embodiment, the revolving mechanism 4 further includes a rotation driving source and a link (not shown in the figure), wherein the rotation driving source is disposed at one end of the support rod 411, an axis of an output shaft of the rotation driving source is parallel to the support rod 411, one end of the link is connected to an output end of the rotation driving source, and the other end of the link is connected to the liquid receiving plate 45. When the grabbing component 42 is to grab the basket tool 2 from the reaction tank 1, the rotary driving source drives the connecting rod to rotate in a plane perpendicular to the supporting rod 411 so as to drive the liquid receiving tray 45 to rotate from a horizontal posture (a posture shown in fig. 4) below the supporting component 41 to a vertical posture at one side of the supporting component 41, so as to avoid a position below the supporting component 41, and enable the grabbing component 42 to extend into the reaction tank 1 to grab the basket tool 2; after the turnover driving component drives the grabbing component 42 to take the basket tool 2 out of the reaction tank 1, the rotary driving source drives the connecting rod to rotate in the vertical plane again, so that the liquid receiving disc 45 rotates from the vertical posture at one side of the supporting component 41 to the horizontal posture below the basket tool 2, and the cleaning liquid flowing down from the substrate 100 can be collected. In other embodiments, the liquid receiving tray 45 may be driven by other structures or be manually taken and placed.

Obviously, the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and for those skilled in the art, there are variations on the specific embodiments and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. A substrate thinning apparatus, comprising:

the reaction tank (1) is filled with an etching medium;

the basket (2) supports the substrate (100) to be in a vertical posture, the basket (2) is accommodated in the reaction tank (1), and the substrate (100) is immersed in the etching medium;

the spraying assemblies (31) are arranged on two sides of the substrate (100); and

the liquid supply assembly (32) is communicated with the spraying assembly (31), and the spraying assembly (31) sprays liquid columns towards the substrate (100) opposite to the spraying assembly (31) so as to keep the substrate (100) in a vertical posture.

2. The substrate thinning apparatus according to claim 1, wherein the shower assembly (31) comprises:

the liquid spraying device comprises a wall body (311), wherein a plurality of liquid spraying nozzles (312) and an installation cavity (313) are arranged in the wall body (311), one end of each liquid spraying nozzle (312) is communicated with the installation cavity (313), and the other end of each liquid spraying nozzle faces towards the substrate (100);

the communication pipes are arranged in the mounting cavity (313), and one ends of the communication pipes are connected with the corresponding liquid spray nozzles (312);

and the input end of the driving assembly is communicated with the liquid supply assembly (32), and the output end of the driving assembly is communicated with the other end of the communicating pipe.

3. The substrate thinning apparatus according to claim 2, wherein said shower assembly (31) further comprises a plurality of flow regulators (314), one of said flow regulators (314) being connected to each of said liquid spray nozzles (312).

4. The substrate thinning apparatus according to claim 2, wherein the shower assembly (31) further comprises a circulation pump (33), an inlet of the circulation pump (33) is disposed at an upper end of the reaction tank (1), and an outlet of the circulation pump (33) is communicated with the liquid supply assembly (32).

5. The substrate thinning apparatus according to claim 2, wherein a plurality of rows of liquid ejection nozzle sets are provided on a side of said wall body (311) facing said substrate (100) in a vertical direction, said liquid ejection nozzle sets including a plurality of said liquid ejection nozzles (312) arranged in a horizontal direction, said liquid ejection nozzles (312) being arranged obliquely upward to eject liquid columns obliquely upward toward said substrate (100).

6. The substrate thinning apparatus according to claim 2, wherein only one of said shower assemblies (31) is disposed between two adjacent substrates (100), and said spray nozzles (312) are disposed on both sides of said shower assembly (31).

7. The substrate thinning apparatus according to claim 2, wherein a plurality of supporting positions (21) are arranged on the basket (2) in parallel at intervals, each supporting position (21) supports one substrate (100), an avoiding hole (22) is arranged between two adjacent supporting positions (21), and the section of the avoiding hole (22) is larger than the cross section of the wall (311).

8. The substrate thinning apparatus according to any one of claims 1 to 7, further comprising a turnaround mechanism (4), wherein the turnaround mechanism (4) comprises:

a support assembly (41);

a grabbing component (42) arranged on the supporting component (41), wherein the grabbing component (42) grabs the basket (2);

an epicyclic drive assembly driving the support assembly (41) in a vertical direction.

9. The substrate thinning apparatus according to claim 8, wherein said turnaround mechanism (4) further comprises:

the plurality of taking-out auxiliary assemblies are connected to one side face, facing the base plate (100), of the supporting assembly (41), each taking-out auxiliary assembly comprises two auxiliary walls (43) which are arranged on two sides of the base plate (100) in parallel, and the distance between the two auxiliary walls (43) is adjustable.

10. The substrate thinning apparatus according to claim 9, wherein the turnaround mechanism (4) further comprises:

a rinsing assembly (44) disposed between the two auxiliary walls (43) and above the substrate (100), the rinsing assembly (44) spraying a cleaning solution onto the substrate (100);

the liquid receiving disc (45) is arranged below the basket tool (2) when the grabbing component (42) takes the basket tool (2) out of the reaction tank (1).

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