CN213459660U

CN213459660U - Wafer powder-wiping machine and powder-wiping mechanism thereof

Info

Publication number: CN213459660U
Application number: CN202022379020.8U
Authority: CN
Inventors: 李健儿; 李学良; 马晓洁; 唐毅; 谢雷; 敬毅
Original assignee: Sichuan Hongxinwei Technology Co ltd
Current assignee: Sichuan Hongxinwei Technology Co ltd
Priority date: 2020-10-22
Filing date: 2020-10-22
Publication date: 2021-06-15
Anticipated expiration: 2030-10-22

Abstract

The utility model provides a wafer powder grinding machine's powder mechanism of wiping, semiconductor element manufacture equipment technical field, including planetary gear set with be used for connecting the strong magnet of wiping special filter paper of powder, the strong magnet is located planetary gear set terminal surface down, adopts planetary gear set as drive mechanism to terminal surface setting is used for connecting the strong magnet of wiping special filter paper of powder under planetary gear set, makes the existing part of the special filter paper of wiping powder can realize revolving around the center, also has the part to realize the center rotation around self simultaneously, makes the powder effect of wiping better.

Description

Wafer powder-wiping machine and powder-wiping mechanism thereof

Technical Field

The application relates to the technical field of semiconductor element manufacturing equipment, in particular to a wafer powder coating machine and a powder coating mechanism thereof.

Background

GPP (glass Passivation parts) diode chip, namely glass Passivation diode chip, is to sinter a layer of glass around the P/N junction surface of the die to be divided on the basis of the existing ordinary silicon rectifying and diffusing sheet, so that the P/N junction can be protected optimally, the P/N junction can be prevented from being invaded by the external environment, the stability of the diode chip can be improved, the GPP diode chip needs to be passivated after sintering a layer of glass on the P/N junction surface, the glass powder on the surface of the glass needs to be erased before the Passivation, otherwise, the Passivation effect of the glass can be seriously influenced, and the performance of the diode chip is deteriorated.

At present, the powder wiping operation before the passivation of the GPP diode chip glass is manual powder wiping, for example, as described in chinese patent application CN201611183968.8, the glass powder is wiped lightly and flatly by using an eraser, but the manual powder wiping is achieved by using hands, the powder wiping object is fragile products such as glass, the powder wiping strength of each worker in the operation process is different, correspondingly, the powder wiping cleanliness of the glass also has differences, so that the yield of the product cannot be well controlled, and the manual powder wiping operation also easily leads to the increase of the rejection rate of the diode chip production. In addition, the manual powder wiping operation is inefficient, which cannot meet the increasing demand of the GPP diode chip, and the manual powder wiping procedure also causes the production cost of the GPP diode chip to increase, which ultimately reduces the price advantage of the GPP diode chip. In addition, the manual powder wiping operation requires a plurality of materials, the treatment steps are complex, the protection measures are simple and crude, the sealing performance of the operation space cannot be realized by one hundred percent, glass dust is easy to float and diffuse outwards, the surrounding environment is polluted by dust, the dust pollution can cause health hidden troubles to operators, and the dust pollution can enter diode chip production equipment to influence the normal work of the equipment; dust floating can also bring explosion and fire safety hazards to the operation workshop.

A small amount of mechanical devices are also used to wipe the GPP diode chips, for example, chinese utility model patent application CN201821527443.6, a GPP wafer powder wiping machine, which avoids manual powder wiping and reduces the rejection rate of chips.

SUMMERY OF THE UTILITY MODEL

A first aim at of this application provides a wafer powdering machine and powder mechanism thereof, and it adopts planetary gear set as drive mechanism to terminal surface sets up the strong magnet that is used for connecting the special filter paper of powder of rubbing under planetary gear set, makes the existing part of the special filter paper of powder of rubbing realize revolving around the center, also has the part to realize around the center rotation of self simultaneously, makes the powder effect of rubbing better.

The embodiment of the utility model discloses a realize through following technical scheme:

a powder wiping mechanism of a wafer powder wiping machine comprises a planetary gear set and a strong magnet used for being connected with special filter paper for powder wiping, wherein the strong magnet is arranged on the lower end face of the planetary gear set.

Further, planetary gear set includes roof, bottom plate, driving gear and a plurality of planet group of establishing that overlaps in proper order the driving gear can wind self center pin pivoted and install between roof and bottom plate, planet group includes a plurality of planetary gear and ring gear, a plurality of planetary gear and driving gear or ring gear meshing and evenly distributed, planetary gear can wind self center pin pivoted and install between roof and bottom plate, and the ring gear can wind self center pin pivoted and install in the roof, the bottom plate includes a plurality of bottom plate bodies just swing joint in ring gear between the ring gear is located to the bottom plate body.

Furthermore, the strong magnet is arranged at the lower ends of the driving gear rotating shaft, the planetary gear rotating shaft and the gear ring.

Furthermore, the rotating shaft of the driving gear and the planetary gear is provided with a blowing through hole which is communicated with a blowing mechanism for blowing dust.

Further, still include rotary mechanism, rotary mechanism includes rotatory pivot and link, the link regulation with the roof upper end, the link is connected to rotatory pivot lower extreme, and rotatable the installing in work platform of rotatory pivot upper end is used for driving planetary gear set rotatory.

Further, still include the moving mechanism who is used for moving planetary gear set, moving mechanism includes intermeshing's gear and rack, the gear housing is located rotatory pivot, the rack is installed in work platform.

Further, the rack can be arranged on the working platform far away from or close to the sliding of the gear to realize intermittent movement of the planetary gear set.

Furthermore, the rotating shaft is designed in a sectional mode, and an elastic mechanism is arranged between every two adjacent sections.

The wafer powder grinding machine comprises a powder grinding bin and the powder grinding mechanism of the wafer powder grinding machine, wherein the powder grinding mechanism is installed in the powder grinding bin.

Furthermore, one side of the powder wiping bin is provided with an observation door, a dust collecting groove is arranged below the observation door, and the observation door is buckled with the powder wiping bin through a door buckle.

The utility model discloses technical scheme has following advantage and beneficial effect at least:

the utility model relates to a rationally, simple structure adopt planetary gear set as drive mechanism to terminal surface setting is used for connecting the strong magnet of the special filter paper of powdering under planetary gear set, makes the existing part of the special filter paper of powdering realize revolving around the center, also has the part to realize the central rotation around self simultaneously, makes the powder effect of powdering better.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural view of a planetary gear set provided in embodiment 1 of the present invention;

fig. 2 is a schematic structural view of a powder wiping mechanism provided in embodiment 1 of the present invention;

fig. 3 is a schematic structural view of a chalk powder bin provided in embodiment 1 of the present invention;

icon: 1-powder wiping mechanism, 11-planetary gear set, 111-top plate, 112-bottom plate, 113-driving gear, 114-planetary gear set, 114 a-planetary gear, 114 b-gear ring, 12-blowing through hole, 13-rotating mechanism, 131-rotating shaft, 132-connecting frame, 14-moving mechanism, 141-gear, 142-rack and 2-powder wiping bin.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship which is usually placed when the product of this application is used, the description is only for convenience of description and simplification, but the indication or suggestion that the device or element to be referred must have a specific orientation, be constructed in a specific orientation and be operated is not to be construed as limiting the present invention.

In the description of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1

The embodiment provides a powder wiping mechanism 1 of a wafer powder wiping machine, which comprises a planetary gear set 11 and a strong magnet used for connecting special filter paper for wiping powder, wherein the strong magnet is arranged on the lower end face of the planetary gear set 11; the planetary gear set 11 is used as a transmission mechanism, and the lower end face of the planetary gear set 11 is provided with a strong magnet used for being connected with the special filter paper for powder wiping, so that the existing part of the special filter paper for powder wiping can revolve around the center, and meanwhile, the other part of the special filter paper for powder wiping can rotate around the center of the special filter paper, and the powder wiping effect is better.

In this embodiment, the planetary gear set 11 includes a top plate 111, a bottom plate 112, a driving gear 113 and a plurality of planetary sets 114 sequentially sleeved on the top plate 111, the driving gear 113 is rotatably mounted between the top plate 111 and the bottom plate 112 around a central axis thereof, the planetary sets 114 include a plurality of planetary gears 114a and a plurality of ring gears 114b, the plurality of planetary gears 114a are engaged with the driving gear 113 or the ring gears 114b and are uniformly distributed, the planetary gears 114a are rotatably mounted between the top plate 111 and the bottom plate 112 around the central axis thereof, the ring gears 114b are rotatably mounted on the top plate 111 around the central axis thereof, the bottom plate 112 includes a plurality of bottom plate 112 bodies, the bottom plate 112 bodies are mounted between the ring gears 114b and are movably connected to the ring gears 114b, specifically, the connection between the ring gears 114b and the top plate 111 may be a sliding connection, such as a T, meanwhile, the function of limiting the up-and-down movement of the gear ring 114b is achieved, the bottom plate 112 is divided into a plurality of bottom plate 112 bodies, the bottom plate 112 bodies are arranged between the gear rings 114b and movably connected to the gear rings 114b, the lower end of the gear ring 114b can extend out and can be connected with a strong magnet, and then special filter paper for powder wiping is connected, so that the powder wiping function can be achieved through the revolution of the gear ring 114b, the powder wiping area is effectively increased, and the powder wiping effect is improved.

Regarding the specific position of the strong magnet, in this embodiment, the strong magnet is disposed at the lower ends of the driving gear 113 rotating shaft, the planetary gear 114a rotating shaft and the ring gear 114b, and since the driving gear 113 rotating shaft, the planetary gear 114a rotating shaft and the ring gear 114b are all rotatable components, and the strong magnet is mounted under the strong magnet, it can achieve a good powder-wiping effect by using the special-purpose filter paper for powder wiping, but in other embodiments, the strong magnet can be spread over the lower end surface of the whole planetary gear set 11, including the driving gear 113 rotating shaft, the planetary gear 114a rotating shaft, the ring gear 114b and the bottom plate 112.

Preferably, the rotating shaft of the driving gear 113 and the planetary gear 114a is provided with a blowing through hole 12, and the blowing through hole 12 is communicated with a blowing mechanism for blowing dust. By adopting the design, the assault through hole is matched and adopted on the basis of the special filter paper for powder wiping, dust on the chip can be cleared to a greater extent, and certainly in other embodiments, the structure of the device can still be adopted, but the blowing mechanism is replaced by the negative pressure mechanism, certain suction is generated on the surface of the chip, so that the dust wiped by the special filter paper for powder wiping can be sucked away, and the dust clearing effect is further achieved.

In some embodiments, in order to further increase the powder wiping effect and enable the whole planetary gear set 11 to rotate, the device further includes a rotating mechanism 13, the rotating mechanism 13 includes a rotating shaft 131 and a connecting frame 132, the connecting frame 132 is defined on the upper end of the top plate 111, the lower end of the rotating shaft 131 is connected to the connecting frame 132, and the upper end of the rotating shaft 131 is rotatably mounted on the working platform to drive the planetary gear set 11 to rotate.

The spaces of the chips with different specifications are different, and the planetary gear set 11 and the chips are required to be corresponding to each other for a good powder wiping effect, therefore, the device further comprises a moving mechanism 14 for moving the planetary gear set 11, the moving mechanism 14 comprises a gear 141 and a rack 142 which are meshed with each other, the gear 141 is sleeved on the rotating shaft 131, and the rack 142 is mounted on the working platform, more preferably, the rack 142 can be mounted on the working platform in a sliding manner far away from or close to the gear 141 to realize intermittent movement of the planetary gear set 11. By adopting the design, the planetary gear set 11 is moved by fully utilizing the rotation of the rotating shaft, the addition of an extra power mechanism is effectively reduced, the cost of the device is greatly reduced, the failure rate of the whole device is reduced, and the operation cost is effectively reduced.

In order to avoid the damage of the chip caused by the powder wiping process, in the embodiment, the rotating shaft 131 is designed in a sectional manner, and an elastic mechanism is arranged between two adjacent sections.

Example 2

The embodiment provides a wafer powder polishing machine, which comprises a powder polishing bin 2 and a powder polishing mechanism 1 of the wafer powder polishing machine provided by the embodiment 1, wherein the powder polishing mechanism 1 is installed in the powder polishing bin 2. Particularly, 2 one sides in the powder storehouse of wiping are equipped with the observation door, and the below position of observation door is equipped with the dust collecting vat, and the observation door passes through the knocker and realizes the switch lock with 2 in the powder storehouse of wiping.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A powder wiping mechanism of a wafer powder wiping machine is characterized in that: comprises a planetary gear set and a strong magnet used for connecting special filter paper for powdering; planetary gear set includes roof, bottom plate, driving gear and a plurality of planet group of establishing that overlaps in proper order, the driving gear can wind self center pin pivoted and install between roof and bottom plate, the planet group includes a plurality of planetary gear and ring gear, a plurality of planetary gear and driving gear or ring gear meshing and evenly distributed, planetary gear can wind self center pin pivoted and install between roof and bottom plate, and the ring gear can wind self center pin pivoted and install in the roof, the bottom plate includes a plurality of bottom plate bodies, just swing joint in ring gear between the ring gear is located to the bottom plate body.

2. The powder wiping mechanism of the wafer powder wiping machine as claimed in claim 1, wherein: the strong magnet is arranged at the lower ends of the driving gear rotating shaft, the planetary gear rotating shaft and the gear ring.

3. The powder wiping mechanism of the wafer powder wiping machine as claimed in claim 1, wherein: the rotating shaft of the driving gear and the planetary gear is provided with a blowing through hole which is communicated with a blowing mechanism for blowing dust.

4. The powder wiping mechanism of the wafer powder wiping machine as claimed in claim 1, wherein: the rotary mechanism comprises a rotary rotating shaft and a connecting frame, the connecting frame is specified and arranged at the upper end of the top plate, the connecting frame is connected to the lower end of the rotary rotating shaft, and the upper end of the rotary rotating shaft is rotatably arranged on the working platform and used for driving the planetary gear set to rotate.

5. The powder wiping mechanism of the wafer powder wiping machine as claimed in claim 4, wherein: the planetary gear set moving mechanism comprises a gear and a rack which are meshed with each other, the gear is sleeved on the rotating shaft, and the rack is installed on the working platform.

6. The powder wiping mechanism of the wafer powder wiping machine as claimed in claim 5, wherein: the rack can be far away from or close to the sliding installation of the gear and is used for realizing the intermittent type moving planetary gear set.

7. The powder wiping mechanism of the wafer powder wiping machine as claimed in claim 4, wherein: the rotating shaft is designed in a sectional mode, and an elastic mechanism is arranged between every two adjacent sections.

8. A wafer powder coating machine is characterized in that: a powder wiping mechanism comprising a powder wiping bin and the wafer powder wiping machine as claimed in any one of claims 1 to 7, wherein the powder wiping mechanism is arranged in the powder wiping bin.

9. The wafer polisher of claim 8, wherein: the chalk dust collector is characterized in that an observation door is arranged on one side of the chalk dust bin, a dust collecting groove is formed in the position below the observation door, and the observation door is buckled with the chalk dust bin through a door buckle.