CN213459659U - Automatic powder coating machine for glass passivation wafer - Google Patents

Abstract

The utility model provides an automatic powdering machine for a glass passivation wafer, which belongs to the technical field of semiconductor element manufacturing equipment and comprises an automatic transmission system, an automatic powdering system, a material recovery system and a vacuum and exhaust system, wherein the automatic transmission system is used for transmitting the wafer; the automatic powder wiping system is arranged on a part of a transmission path of the automatic transmission system, the wafer passes through the automatic powder wiping system in the transmission process, the automatic powder wiping system comprises a powder wiping bin and a powder wiping mechanism, the powder wiping mechanism comprises a planetary gear set and a strong magnet, and the strong magnet is arranged on the lower end face of the planetary gear set; the vacuum and exhaust system is arranged on the whole transmission path of the automatic transmission system; the material recovery system is mechanically connected with the vacuum and exhaust system; the planetary gear set is used as a transmission mechanism, and the lower end face of the planetary gear set is provided with the strong magnet used for being connected with the special filter paper for powder wiping, so that the existing part of the special filter paper for powder wiping can revolve around the center, and meanwhile, the other part of the special filter paper for powder wiping can rotate around the center of the special filter paper, and the powder wiping effect is better.

Description

Automatic powder coating machine for glass passivation wafer

Technical Field

The application relates to the technical field of semiconductor element manufacturing equipment, in particular to an automatic powder coating machine for a glass passivation wafer.

Background

GPP (glass Passivation parts) diode chip, namely glass Passivation diode chip, is to sinter a layer of glass around the P/N junction surface of the die to be divided on the basis of the existing ordinary silicon rectifying and diffusing sheet, so that the P/N junction can be protected optimally, the P/N junction can be prevented from being invaded by the external environment, the stability of the diode chip can be improved, the GPP diode chip needs to be passivated after sintering a layer of glass on the P/N junction surface, the glass powder on the surface of the glass needs to be erased before the Passivation, otherwise, the Passivation effect of the glass can be seriously influenced, and the performance of the diode chip is deteriorated.

At present, the powder wiping operation before the passivation of the GPP diode chip glass is manual powder wiping, for example, as described in chinese patent application CN201611183968.8, the glass powder is wiped lightly and flatly by using an eraser, but the manual powder wiping is achieved by using hands, the powder wiping object is fragile products such as glass, the powder wiping strength of each worker in the operation process is different, correspondingly, the powder wiping cleanliness of the glass also has differences, so that the yield of the product cannot be well controlled, and the manual powder wiping operation also easily leads to the increase of the rejection rate of the diode chip production. In addition, the manual powder wiping operation is inefficient, which cannot meet the increasing demand of the GPP diode chip, and the manual powder wiping procedure also causes the production cost of the GPP diode chip to increase, which ultimately reduces the price advantage of the GPP diode chip. In addition, the manual powder wiping operation requires a plurality of materials, the treatment steps are complex, the protection measures are simple and crude, the sealing performance of the operation space cannot be realized by one hundred percent, glass dust is easy to float and diffuse outwards, the surrounding environment is polluted by dust, the dust pollution can cause health hidden troubles to operators, and the dust pollution can enter diode chip production equipment to influence the normal work of the equipment; dust floating can also bring explosion and fire safety hazards to the operation workshop.

There are also a few devices for applying mechanical device to polish GPP diode chip, such as chinese utility model patent application CN201821527443.6, an automatic powder polishing machine for GPP diode chip glass passivation, which avoids manual powder polishing and reduces the rejection rate of chips.

SUMMERY OF THE UTILITY MODEL

An object of the application is to provide an automatic powder coating machine of glass passivation class wafer, it adopts planetary gear set as drive mechanism to terminal surface sets up the strong magnet that is used for connecting the special filter paper of powder coating under planetary gear set, makes the existing part of the special filter paper of powder coating realize revolving around the center, also has the part to realize around the center rotation of self simultaneously, makes the powder coating effect better.

The embodiment of the utility model discloses a realize through following technical scheme:

an automatic powder coating machine for a glass passivation type wafer comprises an automatic transmission system, an automatic powder coating system, a material recovery system and a vacuum and exhaust system, wherein the automatic transmission system is used for transmitting the wafer;

the automatic powder wiping system is arranged on a part of a transmission path of the automatic transmission system, the wafer penetrates through the automatic powder wiping system in the transmission process, the automatic powder wiping system performs powder wiping treatment on the wafer, the automatic powder wiping system comprises a powder wiping bin and a powder wiping mechanism arranged in the powder wiping bin, the powder wiping mechanism comprises a planetary gear set and a strong magnet used for connecting special filter paper for powder wiping, and the strong magnet is arranged on the lower end face of the planetary gear set;

the vacuum and exhaust system is arranged on the whole transmission path of the automatic transmission system and can adsorb and collect powder generated after the powder wiping treatment is carried out on the wafer;

the material recovery system is mechanically connected with the vacuum and exhaust system, and the material recovery system is used for recovering the powder obtained after the vacuum and exhaust system adsorbs and collects.

Furthermore, the automatic conveying system comprises a conveying belt and a conveying motor, wherein a fixing component for fixing a plurality of wafers is arranged on the conveying belt, and the conveying motor is used for driving the conveying belt to operate so as to convey the wafers along the conveying direction from the upstream to the downstream.

Furthermore, the planetary gear set comprises a top plate, a bottom plate, a driving gear and a plurality of planetary sets which are sequentially sleeved, the driving gear can be rotatably arranged between the top plate and the bottom plate around a self central shaft, the planetary sets comprise a plurality of planetary gears and gear rings, the plurality of planetary gears are meshed with the driving gear or the gear rings and are uniformly distributed, the planetary gears can be rotatably arranged between the top plate and the bottom plate around the self central shaft, the gear rings can be rotatably arranged on the top plate around the self central shaft, the bottom plate comprises a plurality of bottom plate bodies, and the bottom plate bodies are arranged between the gear rings and are movably connected with the gear rings; the strong magnet is arranged at the lower ends of the driving gear rotating shaft, the planetary gear rotating shaft and the gear ring.

Furthermore, the rotating shaft of the driving gear and the planetary gear is provided with a blowing through hole which is communicated with a blowing mechanism for blowing dust.

Furthermore, the powder rubbing machine further comprises a rotating mechanism, wherein the rotating mechanism comprises a rotating shaft and a connecting frame, the connecting frame is specified and arranged at the upper end of the top plate, the lower end of the rotating shaft is connected with the connecting frame, and the upper end of the rotating shaft is rotatably arranged in the powder rubbing bin and used for driving the planetary gear set to rotate.

Furthermore, the chalk powder eraser further comprises a moving mechanism used for moving the planetary gear set, the moving mechanism comprises a gear and a rack which are meshed with each other, the gear is sleeved on the rotating shaft, and the rack is installed on the chalk powder erasing bin.

Further, the rack can be far away from or close to the sliding installation of the gear in the powder wiping bin to realize intermittent movement of the planetary gear set.

Furthermore, the rotating shaft is designed in a sectional mode, and an elastic mechanism is arranged between every two adjacent sections.

Furthermore, the vacuum and exhaust system comprises a vacuum bin and a vacuum pumping component which are arranged below the automatic transmission system, and the vacuum pumping component can automatically adjust the vacuum degree inside the vacuum bin so as to realize that the powder is adsorbed into the vacuum bin.

Further, the material recovery system comprises a first material recovery bin arranged below the corresponding transmission path of the automatic powdering system and a second material recovery bin arranged below the corresponding transmission path at the upstream of the automatic powdering system, the first material recovery bin and the second material recovery bin both have conical cavity structures, and the first material recovery bin and the second material recovery bin are communicated with each other; the first material recovery bin is funnel-shaped, the upper end opening of the first material recovery bin is connected with the automatic powder wiping system in a closed mode, and the lower end opening of the first material recovery bin is a material recovery opening.

The utility model discloses technical scheme has following advantage and beneficial effect at least:

the utility model relates to a rationally, simple structure adopt planetary gear set as drive mechanism to terminal surface setting is used for connecting the strong magnet of the special filter paper of powdering under planetary gear set, makes the existing part of the special filter paper of powdering realize revolving around the center, also has the part to realize the central rotation around self simultaneously, makes the powder effect of powdering better.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural view of a powdering machine provided in embodiment 1 of the present invention;

fig. 2 is a schematic structural view of a planetary gear set provided in embodiment 1 of the present invention;

fig. 3 is a schematic structural view of a powder wiping mechanism provided in embodiment 1 of the present invention;

fig. 4 is a schematic structural view of a chalk dust bin provided in embodiment 1 of the present invention;

icon: 1-powder wiping mechanism, 11-planetary gear set, 111-top plate, 112-bottom plate, 113-driving gear, 114-planetary gear set, 114 a-planetary gear, 114 b-gear ring, 12-blowing through hole, 13-rotating mechanism, 131-rotating shaft, 132-connecting frame, 14-moving mechanism, 141-gear, 142-rack, 2-powder wiping bin, 21-door buckle, 22-observation door, 3-transmission system, 31-belt, 32-motor, 4-control cabinet, 5-wafer recovery tank, 6-material recovery bin, 61-recovered material recovery port and 62-equipment support frame.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship which is usually placed when the product of this application is used, the description is only for convenience of description and simplification, but the indication or suggestion that the device or element to be referred must have a specific orientation, be constructed in a specific orientation and be operated is not to be construed as limiting the present invention.

In the description of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1

As shown in fig. 1 to 4, the present embodiment provides an automatic powder polishing machine for a glass-passivated wafer, which includes an automatic transmission system 3, an automatic powder polishing system, a material recovery system, and a vacuum and exhaust system; the automatic transmission system 3 is used for transmitting the wafer, so that the wafer to be subjected to powder wiping is input into the automatic powder wiping system, and the wafer subjected to powder wiping is output from the automatic powder wiping system; the automatic powder wiping system is used for automatically wiping powder on the wafer to remove glass powder on the surface of the wafer; the material recovery system is used for intensively recovering the glass powder removed from the surface of the wafer so as to recycle the glass powder; the vacuum and exhaust system is used for providing a proper powder wiping environment for the automatic powder wiping system and providing vacuum adsorption force for collecting glass dust for the material recovery system.

Specifically, the automatic transfer system 3 includes a transfer belt and a wafer recovery bin. A placing bin is arranged at the upstream of the conveying direction of the conveying belt and used for containing the wafer to be ground; preferably, the placing bin is used for accommodating the wafer to be ground in a rotating disc mode, so that the capacity of placing the wafer in the placing bin can be improved; correspondingly, the wafer recovery bin is arranged at the downstream of the conveying direction of the conveying belt and is used for recovering the wafer which is subjected to the powder wiping treatment by the automatic powder wiping system; alternatively, the wafer recycling tank 5 may also take the form of a turntable for receiving wafers, and the wafer recycling tank 5 may be, but not limited to, a transfer chamber or a terminal chamber for placing wafers for subsequent processing steps. The transmission belt can adopt a single-row or double-row mode to transmit the wafer, when the transmission belt is in a double-row transmission mode, the transmission belt comprises a transmission belt 31 and a double-row wafer perforated transmission part arranged on the belt 31, and preferably, the thickness of the double-row wafer perforated transmission part can be 5 mm; the double-row perforated wafer transmission component is used for fixing wafers on the transmission belt so as to avoid the position deviation of the wafers in the transmission process, and the double-row perforated wafer transmission component can be used for transmitting wafers with different sizes, so that the automatic powder polishing machine for glass passivation can perform automatic powder polishing operation on wafers with different sizes and specifications; optionally, the double-row perforated wafer conveying component clamps and fixes the wafer by using a clamping element, and the clamping caliber of the clamping element can be adjusted to clamp wafers with different sizes. The automatic transmission system 3 can adopt a double-row parallel mode to place and transmit the wafers and can be suitable for wafers with different sizes, thus greatly improving the transmission capacity of the automatic transmission system 3 and the applicability to powder wiping of different wafers.

In the embodiment, the automatic powder wiping system comprises a powder wiping bin 2 and a powder wiping mechanism 1 arranged in the powder wiping bin 2, wherein the powder wiping mechanism 1 comprises a planetary gear set 11 and a strong magnet used for being connected with special filter paper for wiping powder, the strong magnet for wiping powder is arranged on the lower end face of the powder wiping planetary gear set 11, the planetary gear set 11 is used as a transmission mechanism, and the strong magnet used for being connected with the special filter paper for wiping powder is arranged on the lower end face of the planetary gear set 11, so that not only part of the special filter paper for wiping powder can revolve around the center, but also part of the special filter paper for wiping powder can rotate around the center of the special filter paper, and the powder wiping effect is better; specifically, the planetary gear set 11 includes a top plate 111, a bottom plate 112, a driving gear 113 and a plurality of planetary sets 114 sequentially sleeved on the top plate 111, the driving gear 113 is rotatably mounted between the top plate 111 and the bottom plate 112 around a central axis thereof, the planetary sets 114 include a plurality of planetary gears 114a and a plurality of ring gears 114b, the plurality of planetary gears 114a are meshed with the driving gear 113 or the ring gears 114b and are uniformly distributed, the planetary gears 114a are rotatably mounted between the top plate 111 and the bottom plate 112 around the central axis thereof, the ring gears 114b are rotatably mounted on the top plate 111 around the central axis thereof, the bottom plate 112 includes a plurality of bottom plate 112 bodies, the bottom plate 112 bodies are mounted between the ring gears 114b and are movably connected to the ring gears 114b, specifically, the connection between the ring gears 114b and the top plate 111 can be a sliding connection, such as a T-, meanwhile, the function of limiting the up-and-down movement of the gear ring 114b is achieved, the bottom plate 112 is divided into a plurality of bottom plate 112 bodies, the bottom plate 112 bodies are arranged between the gear rings 114b and movably connected to the gear rings 114b, the lower end of the gear ring 114b can extend out and can be connected with a strong magnet, and then special filter paper for powder wiping is connected, so that the powder wiping function can be achieved through the revolution of the gear ring 114b, the powder wiping area is effectively increased, and the powder wiping effect is improved.

Regarding the specific position of the strong magnet, in this embodiment, the strong magnet is disposed at the lower ends of the driving gear 113 rotating shaft, the planetary gear 114a rotating shaft and the ring gear 114b, and since the driving gear 113 rotating shaft, the planetary gear 114a rotating shaft and the ring gear 114b are all rotatable components, and the strong magnet is mounted under the strong magnet, it can achieve a good powder-wiping effect by using the special-purpose filter paper for powder wiping, but in other embodiments, the strong magnet can be spread over the lower end surface of the whole planetary gear set 11, including the driving gear 113 rotating shaft, the planetary gear 114a rotating shaft, the ring gear 114b and the bottom plate 112.

Preferably, the rotating shaft of the driving gear 113 and the planetary gear 114a is provided with a blowing through hole 12, and the blowing through hole 12 is communicated with a blowing mechanism for blowing dust. By adopting the design, the assault through hole is matched and adopted on the basis of the special filter paper for powder wiping, dust on the chip can be cleared to a greater extent, and certainly in other embodiments, the structure of the device can still be adopted, but the blowing mechanism is replaced by the negative pressure mechanism, certain suction is generated on the surface of the chip, so that the dust wiped by the special filter paper for powder wiping can be sucked away, and the dust clearing effect is further achieved.

In some embodiments, in order to further increase the powder wiping effect and enable the whole planetary gear set 11 to rotate, the device further includes a rotating mechanism 13, the rotating mechanism 13 includes a rotating shaft 131 and a connecting frame 132, the connecting frame 132 is defined on the upper end of the top plate 111, the lower end of the rotating shaft 131 is connected to the connecting frame 132, and the upper end of the rotating shaft 131 is rotatably mounted on the working platform to drive the planetary gear set 11 to rotate.

The spaces of the chips with different specifications are different, and the planetary gear set 11 and the chips are required to be corresponding to each other for a good powder wiping effect, therefore, the device further comprises a moving mechanism 14 for moving the planetary gear set 11, the moving mechanism 14 comprises a gear 141 and a rack 142 which are meshed with each other, the gear 141 is sleeved on the rotating shaft 131, and the rack 142 is mounted on the working platform, more preferably, the rack 142 can be mounted on the working platform in a sliding manner far away from or close to the gear 141 to realize intermittent movement of the planetary gear set 11. By adopting the design, the planetary gear set 11 is moved by fully utilizing the rotation of the rotating shaft, the addition of an extra power mechanism is effectively reduced, the cost of the device is greatly reduced, the failure rate of the whole device is reduced, and the operation cost is effectively reduced.

In order to avoid the damage of the chip caused by the powder wiping process, in the embodiment, the rotating shaft 131 is designed in a sectional manner, and an elastic mechanism is arranged between two adjacent sections.

The material recovery system comprises a first material recovery bin 6 and a second material recovery bin 6. The first material recovery bin 6 is arranged at a position corresponding to the lower position of the conveying belt in the powder wiping bin 2 and used for recovering powder generated by powder wiping operation on the wafer; alternatively, the first material recovery bin 6 may have a funnel shape, the larger opening of the upper part of the funnel shape is matched with the conveying belt inside the powder rubbing bin 2 so as to completely collect the powder, the smaller opening of the lower part of the funnel shape is provided with a recovered material recovery port 61, and the recovered material recovery port 61 is used for bagging recovery of the powder; the second material recovery bin 6 is disposed at a position below the corresponding conveying belt at the upstream outside the powdering bin 2, so as to be used for recovering powder falling from the wafer to be subjected to powder scraping due to shaking in the conveying process, optionally, the second material recovery bin 6 may have a conical shape, so as to facilitate the concentrated recovery of the powder; preferably, the second material recycling bin 6 and the first material recycling bin 6 are communicated with each other, so as to further improve the collection efficiency of the powder.

This vacuum and exhaust system includes the transmission band vacuum storehouse, and this transmission band vacuum storehouse sets up the below position department at the whole transmission path of this transmission band. The vacuum and exhaust system is used for providing vacuum adsorption force for the wafer conveying and powder wiping process so as to quickly adsorb powder falling from the wafer due to shaking or powder wiping operation, and accurately collect the powder into the corresponding first material recovery bin 6 or second material recovery bin 6, so that pollution caused by floating and diffusion of the powder around is avoided. Optionally, the conveying belt vacuum bin can automatically adjust its own vacuum degree, and the adjustment mode of the vacuum degree can be adjusted according to the quantity of the powder quantity to be recovered or according to the inherent vacuum degree gear of the conveying belt vacuum bin.

From the embodiment, the automatic powder polishing machine for the glass-passivated wafer can realize the accurate control and adjustment of the powder polishing speed, direction, amplitude and other parameters of the powder polishing treatment on the surface of the wafer through the automatic transmission system 3, the automatic powder polishing system, the material recovery system and the vacuum and exhaust system, so as to ensure that the powder polishing treatment received by each wafer is uniform and consistent; in addition, this automatic powdering machine can also concentrate the recovery from the powder of cleaing away on this wafer through vacuum adsorption's mode, and this not only can prevent effectively that the powder from floating the diffusion and causing the pollution, can also improve the recovery efficiency of powder material in order to reach the effect of sparingly manufacturing cost.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. An automatic powder coating machine for a glass passivation wafer is characterized in that: comprises an automatic transmission system for transmitting a wafer, an automatic powder wiping system, a material recovery system and a vacuum and exhaust system;

the automatic powder wiping system is arranged on a part of a transmission path of the automatic transmission system, the wafer passes through the automatic powder wiping system in the transmission process, the automatic powder wiping system performs powder wiping treatment on the wafer, the automatic powder wiping system comprises a powder wiping bin and a powder wiping mechanism arranged in the powder wiping bin, and the powder wiping mechanism comprises a planetary gear set and a strong magnet used for connecting special filter paper for wiping powder; the planetary gear set comprises a top plate, a bottom plate, a driving gear and a plurality of planetary sets which are sequentially sleeved, the driving gear can be arranged between the top plate and the bottom plate in a rotating mode around a self central axis, the planetary sets comprise a plurality of planetary gears and gear rings, the planetary gears are meshed with the driving gear or the gear rings and are uniformly distributed, the planetary gears can be arranged between the top plate and the bottom plate in a rotating mode around the self central axis, the gear rings can be arranged on the top plate in a rotating mode around the self central axis, the bottom plate comprises a plurality of bottom plate bodies, and the bottom plate bodies are arranged between the gear rings;

the vacuum and exhaust system is arranged on the whole transmission path of the automatic transmission system and can adsorb and collect powder generated after the powder wiping treatment is carried out on the wafer;

the material recovery system is mechanically connected with the vacuum and exhaust system, and the material recovery system is used for recovering the powder obtained after the vacuum and exhaust system adsorbs and collects.

2. The automatic powder coating machine for glass-passivated wafer-like wafers according to claim 1, characterized in that: the automatic conveying system comprises a conveying belt and a conveying motor, wherein a fixing component used for fixing a plurality of wafers is arranged on the conveying belt, and the conveying motor is used for driving the conveying belt to operate so as to convey the wafers along the conveying direction from the upstream to the downstream.

3. The automatic powder coating machine for glass-passivated wafer-like wafers according to claim 1, characterized in that: the rotating shaft of the driving gear and the planetary gear is provided with a blowing through hole which is communicated with a blowing mechanism for blowing dust.

4. The automatic powder coating machine for glass-passivated wafer-like wafers according to claim 1, characterized in that: the chalk powder applying device is characterized by further comprising a rotating mechanism, wherein the rotating mechanism comprises a rotating shaft and a connecting frame, the connecting frame is specified and arranged at the upper end of the top plate, the lower end of the rotating shaft is connected with the connecting frame, and the upper end of the rotating shaft is rotatably arranged in the chalk powder applying bin and used for driving the planetary gear set to rotate.

5. The automatic powder coating machine for glass-passivated wafer-like wafers according to claim 4, characterized in that: the powder wiping device is characterized by further comprising a moving mechanism used for moving the planetary gear set, the moving mechanism comprises a gear and a rack which are meshed with each other, the gear is sleeved on the rotating shaft, and the rack is installed on the powder wiping bin.

6. The automatic powder coating machine for glass-passivated wafer-like wafers according to claim 5, characterized in that: the rack can be far away from or close to the sliding installation of the gear in the powder wiping bin to realize intermittent movement of the planetary gear set.

7. The automatic powder coating machine for glass-passivated wafer-like wafers according to claim 4, characterized in that: the rotating shaft is designed in a sectional mode, and an elastic mechanism is arranged between every two adjacent sections.

8. The automatic powder coating machine for glass-passivated wafer-like wafers according to claim 1, characterized in that: the vacuum and exhaust system comprises a vacuum bin and a vacuumizing component, wherein the vacuum bin and the vacuumizing component are arranged below the automatic conveying system, and the vacuumizing component can automatically adjust the vacuum degree inside the vacuum bin so as to realize that the powder is adsorbed into the vacuum bin.

9. The automatic powder coating machine for glass-passivated wafer-like wafers according to claim 1, characterized in that: the material recovery system comprises a first material recovery bin and a second material recovery bin, wherein the first material recovery bin is arranged below a corresponding transmission path of the automatic powdering system, the second material recovery bin is arranged below a corresponding transmission path at the upstream of the automatic powdering system, the first material recovery bin and the second material recovery bin are both provided with conical cavity structures, and the first material recovery bin and the second material recovery bin are communicated with each other; the first material recovery bin is funnel-shaped, the upper end opening of the first material recovery bin is connected with the automatic powder wiping system in a closed mode, and the lower end opening of the first material recovery bin is a material recovery opening.

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