CN213396249U

CN213396249U - Silicon wafer drying device and texturing machine

Info

Publication number: CN213396249U
Application number: CN202022258377.0U
Authority: CN
Inventors: 周华军; 孙贤
Original assignee: CSI Cells Co Ltd; Atlas Sunshine Power Group Co Ltd
Current assignee: Canadian Solar Inc; CSI Cells Co Ltd
Priority date: 2020-10-12
Filing date: 2020-10-12
Publication date: 2021-06-08
Anticipated expiration: 2030-10-12

Abstract

The utility model relates to a solar cell makes technical field, discloses a silicon chip drying device and texturing machine. The silicon wafer drying device comprises a mounting beam, an air blowing pipe and a moving assembly, wherein an air blowing channel is arranged on the mounting beam and is communicated with an air supply device; the air blowing pipe is arranged on the mounting cross beam and is communicated with the air blowing channel, and an air blowing hole communicated with the air blowing channel is formed in the air blowing pipe; the moving assembly is connected with the mounting beam and can drive the air blowing pipe to move, so that the air blowing hole can blow air to the surface of the silicon wafer. The utility model discloses a set up silicon chip drying device, make before the burst blow dry earlier the water on the silicon chip, be favorable to the burst sucking disc to the absorption of silicon chip, be favorable to reducing the adsorption affinity of burst sucking disc to the silicon chip simultaneously, avoided the damage of silicon chip effectively, increased the yield in the silicon chip production process, reduce manufacturing cost.

Description

Silicon wafer drying device and texturing machine

Technical Field

The utility model relates to a solar cell makes technical field, especially relates to a silicon chip drying device and texturing machine.

Background

In the photovoltaic cell technology, the single-sided texturing mode for the groove-type texturing machine is widely applied, and in the production process, silicon wafers on the flower basket need to be sliced on a slicing machine through a slicing sucker and then are sequentially placed in corresponding caching devices.

In the prior art, the surface of the silicon wafer is provided with water, so that the adsorption force of the slicing sucker on the surface of the silicon wafer is too strong, a certain amount of fragments are generated in the sucking process, and the yield of products is influenced.

Therefore, a silicon wafer drying apparatus is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

Based on above, an object of the utility model is to provide a silicon chip drying device and flocking machine can dry the silicon chip effectively, is convenient for carry out follow-up operation to the silicon chip.

In order to achieve the purpose, the utility model adopts the following technical proposal:

a silicon wafer drying apparatus comprising:

the mounting cross beam is provided with an air blowing channel, and the air blowing channel is communicated with an air supply device;

the air blowing pipe is arranged on the mounting cross beam and is communicated with the air blowing channel, and an air blowing hole communicated with the air blowing channel is formed in the air blowing pipe;

and the moving assembly is connected with the mounting beam and can drive the air blowing pipe to move, so that the air blowing hole can blow air to the surface of the silicon wafer.

As a preferable scheme of the silicon wafer drying device, a plurality of air blowing pipes are arranged on the mounting beam at intervals in parallel.

As a preferable scheme of the silicon wafer drying device, the moving assembly can drive the air blowing pipes to extend into the space between two adjacent silicon wafers, and the air blowing holes penetrate through the air blowing pipes.

As a preferred scheme of the silicon wafer drying device, a plurality of air blowing holes are arranged on the air blowing pipe along the axial direction of the air blowing pipe.

As a preferred scheme of the silicon wafer drying device, the diameter of the air blowing pipe is 1.8mm-2.2mm, and the diameter of the air blowing hole is 0.8mm-1.2 mm.

As a preferable scheme of the silicon wafer drying device, an electromagnetic valve is arranged between the air blowing channel and the air supply device.

As a preferable aspect of the silicon wafer drying apparatus, the moving assembly includes:

the mounting cross beam is arranged on the first moving block;

the first driving piece can drive the first moving block to move along the extending direction of the air blowing pipe.

As a preferable aspect of the silicon wafer drying apparatus, the moving assembly further includes:

the first driving piece is arranged on the second moving block;

the second driving piece can drive the second moving block to move along a first direction;

the second driving piece is arranged on the third moving block;

the third driving piece can drive the third moving block to move along a second direction;

the first direction and the second direction are two directions which are arranged in a horizontal plane at an included angle.

As a preferable mode of the silicon wafer drying apparatus, the first direction is perpendicular to the second direction.

A texturing machine comprising the silicon wafer drying device of any one of the above aspects.

The utility model has the advantages that: through setting up silicon chip drying device, make it blow dry earlier the water on the silicon chip before the burst, be favorable to burst sucking disc to the absorption of silicon chip, be favorable to reducing the adsorption affinity of burst sucking disc to the silicon chip simultaneously, avoided the damage of silicon chip effectively, increased the yield in the silicon chip production process, reduction in manufacturing cost. Specifically, the mounting beam can introduce gas into the gas blowing holes in the plurality of gas blowing pipes, and the moving assembly can move the gas blowing holes to the surface opposite to the silicon wafer, so that the gas passing through the gas outlet holes can effectively dry the surface of the silicon wafer, and the subsequent slicing operation of the silicon wafer is facilitated.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.

FIG. 1 is a schematic view of a silicon wafer drying apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic view of a portion of a silicon wafer drying apparatus according to an embodiment of the present invention;

fig. 3 is a partially enlarged schematic view at a in fig. 2.

In the figure:

100. a silicon wafer; 110. a flower basket;

1. mounting a cross beam; 11. an air blowing channel;

2. an air blowing pipe; 21. a gas blowing hole;

31. a first moving block; 32. a second moving block; 33. a third moving block.

Detailed Description

In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1-3, the present embodiment provides a silicon wafer drying device for a texturing machine, the silicon wafer drying device comprises a mounting beam 1, an air blowing pipe 2 and a moving assembly, an air blowing channel 11 is arranged on the mounting beam 1, and the air blowing channel 11 is communicated with an air supply device; the air blowing pipe 2 is arranged on the mounting beam 1, the air blowing pipe 2 is communicated with the air blowing channel 11, and an air blowing hole 21 communicated with the air blowing channel 11 is formed in the air blowing pipe 2; the moving assembly is connected with the mounting beam 1 and can drive the air blowing pipe 2 to move, so that the air blowing holes 21 can blow air to the surface of the silicon wafer 100.

Through the arrangement of the silicon wafer drying device, water on the silicon wafer 100 is blown dry before slicing, absorption of the slicing sucker to the silicon wafer 100 is facilitated, meanwhile, the absorption force of the slicing sucker to the silicon wafer 100 is facilitated to be reduced, damage to the silicon wafer 100 is effectively avoided, the yield of the silicon wafer 100 in the production process is increased, and the manufacturing cost is reduced. Specifically, the mounting beam 1 can introduce air into the air blowing holes 21 of the air blowing pipes 2, and the moving assembly can move the air blowing holes 21 to the surface of the silicon wafer 100, so that the air passing through the air blowing holes 21 can effectively dry the surface of the silicon wafer 100, and the subsequent slicing operation of the silicon wafer 100 is facilitated.

It is worth to say that, the silicon wafer 100 to be dried is vertically placed on the basket 110, and the silicon wafers 100 on the basket 110 are arranged in parallel at intervals, and adaptively, a plurality of air blowing pipes 2 are arranged, and the plurality of air blowing pipes 2 are arranged on the mounting beam 1 in parallel at intervals, so that each air blowing pipe 2 can be driven by the moving assembly to enter between two adjacent silicon wafers 100 in a one-to-one correspondence manner, and the silicon wafers 100 are dried.

Preferably, in order to enable one air blowing pipe 2 to simultaneously dry two adjacent silicon wafers 100, the air blowing holes 21 penetrate through the air blowing pipe 2, the moving assembly can drive the air blowing pipe 2 to extend into the space between the two adjacent silicon wafers, so that the air blowing holes 21 penetrating through the air blowing pipe 2 can be respectively opposite to the two silicon wafers 100, when the air passing through the air blowing channel 11 enters the air blowing pipe 2, the air can be blown through both ends of the air blowing holes 21, and the drying efficiency is improved.

Optionally, the blowing pipe 2 is provided with a plurality of blowing holes 21 along the axial direction thereof to increase the drying area of the silicon wafer 100, so that the sucking range of the slicing sucker is larger, and the sucking success rate is increased.

In this embodiment, the mounting beam 1 is provided with 50 blowing pipes 2, the distance between two adjacent blowing pipes 2 is 4.5mm-5mm, the diameter of the blowing pipe 2 is 1.8mm-2.2mm, the diameter of the blowing hole 21 is 0.8mm-1.2mm, two blowing holes 21 are arranged along the axial direction of the blowing pipes 2, and the distance between the two blowing holes 21 is 20 mm. In other embodiments, the skilled person can design the above parameters according to the size and placement of the silicon wafer 100 to be dried, and the details are not limited specifically.

Preferably, an electromagnetic valve is further arranged between the air blowing channel 11 and the air supply device, and is used for controlling the connection and disconnection between the air blowing channel 11 and the air supply device, so that air can be supplied to the air blowing holes 21 at proper time, and the utilization rate of air is improved.

Specifically, the moving assembly comprises a first moving block 31 and a first driving member, and the mounting beam 1 is arranged on the first moving block 31; the first driving part can drive the first moving block 31 to move, and further drive the mounting beam 1 and the air blowing pipe 2 on the first moving block 31 to move along the extending direction of the air blowing pipe 2, so that the air blowing holes 21 of the air blowing pipe 2 can be just opposite to the surface of the silicon wafer 100.

It should be noted that, in order to facilitate the first driving member to accurately and smoothly move the air blowing pipes 2 to the two adjacent silicon wafers 100, the extending direction of the air blowing pipes 2 is the same as the placing direction of the silicon wafers 100, in fact, in order to discharge the water in the flower basket 110, the flower basket 110 is generally arranged to form an included angle with the vertical direction, and correspondingly, the silicon wafers 100 are also arranged to form an included angle with the vertical direction, so in this embodiment, the extending direction of the air blowing pipes 2 is arranged to form an included angle with the vertical direction, so as to avoid interference between the air blowing pipes 2 and the silicon wafers 100 when the first driving member can drive the first moving block 31 to move.

Further, in order to move the mounting beam 1 and the gas blowing pipe 2 to the position opposite to the silicon wafer 100, the moving assembly further comprises a second moving block 32, a second driving part, a third moving block 33 and a third driving part, wherein the first driving part is arranged on the second moving block 32, and the second driving part can drive the second moving block 32 to move along the first direction; the second driving piece is arranged on the third moving block 33, and the third driving piece can drive the third moving block 33 to move along the second direction; the first direction and the second direction are two directions which are arranged in a horizontal plane at an included angle.

Preferably, the first direction is arranged perpendicular to the second direction. Through setting up second driving piece and third driving piece to realize the removal in the plane to installation crossbeam 1 and gas blow pipe 2, be favorable to installing crossbeam 1 and gas blow pipe 2 and remove to suitable position and be convenient for first driving piece drive first movable block 31, in order to realize that the gas blow hole 21 of gas blow pipe 2 can just to the surface of silicon chip 100. Meanwhile, the second driving piece and the third driving piece are arranged, so that the dried mounting beam 1 and the dried blowing pipe 2 can be moved to positions far away from the silicon wafer 100, and a larger operation space is provided for subsequent slicing.

For example, the first driving member, the second driving member and the third driving member may be provided as an air cylinder, the first moving block 31 is provided at the driving end of the first driving member, the second moving block 32 is provided at the driving end of the second driving member, and the third moving block 33 is provided at the driving end of the third driving member, so that when the air cylinder extends out or retracts back, the mounting of the cross beam 1 and the movement of the blowing pipe 2 are achieved. In other embodiments, the first driving element, the second driving element and the third driving element may also be configured as motors, as long as the mounting beam 1 and the blowing pipe 2 can move, and are not limited specifically herein.

The embodiment also discloses a texturing machine which comprises the silicon wafer drying device in any one of the above aspects.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Claims

1. A silicon wafer drying apparatus, comprising:

the mounting beam (1) is provided with an air blowing channel (11), and the air blowing channel (11) is communicated with an air supply device;

the air blowing pipe (2) is arranged on the mounting beam (1), the air blowing pipe (2) is communicated with the air blowing channel (11), and an air blowing hole (21) communicated with the air blowing channel (11) is formed in the air blowing pipe (2);

and the moving assembly is connected with the mounting beam (1), and can drive the air blowing pipe (2) to move, so that the air blowing hole (21) can blow air to the surface of the silicon wafer (100).

2. The silicon wafer drying device according to claim 1, wherein a plurality of the gas blowing pipes (2) are arranged, and a plurality of the gas blowing pipes (2) are arranged on the mounting beam (1) in parallel at intervals.

3. The silicon wafer drying device according to claim 1, wherein the moving assembly can drive the air blowing pipe (2) to extend into the space between two adjacent silicon wafers (100), and the air blowing holes (21) are arranged through the air blowing pipe (2).

4. The silicon wafer drying apparatus according to claim 1, wherein a plurality of said blowing holes (21) are provided in said blowing pipe (2) along the axial direction thereof.

5. The silicon wafer drying apparatus according to claim 1, wherein the diameter of the gas blowing pipe (2) is 1.8mm to 2.2mm, and the diameter of the gas blowing hole (21) is 0.8mm to 1.2 mm.

6. The silicon wafer drying apparatus according to claim 1, wherein a solenoid valve is provided between the air blowing channel (11) and the air supply device.

7. The silicon wafer drying apparatus according to claim 1, wherein the moving assembly comprises:

a first moving block (31), the mounting beam (1) being arranged on the first moving block (31);

the first driving piece can drive the first moving block (31) to move along the extending direction of the air blowing pipe (2).

8. The silicon wafer drying apparatus as set forth in claim 7, wherein the moving assembly further comprises:

a second moving block (32), the first driving member being disposed on the second moving block (32);

a second driving member capable of driving the second moving block (32) to move along a first direction;

a third moving block (33), the second driving member being disposed on the third moving block (33);

a third driving member capable of driving the third moving block (33) to move along a second direction;

9. The silicon wafer drying apparatus according to claim 8, wherein the first direction is arranged perpendicular to the second direction.

10. A texturing machine comprising the silicon wafer drying apparatus according to any one of claims 1 to 9.