CN213367904U - Photosensitive circuit assembly, camera module and electronic equipment - Google Patents
Photosensitive circuit assembly, camera module and electronic equipment Download PDFInfo
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- CN213367904U CN213367904U CN202021448605.4U CN202021448605U CN213367904U CN 213367904 U CN213367904 U CN 213367904U CN 202021448605 U CN202021448605 U CN 202021448605U CN 213367904 U CN213367904 U CN 213367904U
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Abstract
The application discloses photosensitive circuit subassembly, camera module and electronic equipment, photosensitive circuit subassembly include photosensitive circuit, circuit board, support and the subassembly that discolours. The color-changing assembly is used for receiving light to be sensed, the color-changing assembly is also suitable for being driven by applied voltage to change colors, so that the color-changing assembly is switched between a light blocking state and a light passing state, at least part of light is blocked off from the light to be sensed through the color-changing assembly to protect the photosensitive circuit in the light blocking state, and the light to be sensed irradiates the photosensitive circuit after passing through the color-changing assembly to enable the photosensitive circuit to output light sensing signals in the light passing state. The color-changing assembly can effectively prevent the camera from being damaged by the photosensitive circuit after being directly irradiated by strong light, and has a good protection effect on the photosensitive circuit.
Description
Technical Field
The application relates to the technical field of electronic equipment, especially, relate to a photosensitive circuit subassembly, camera module and electronic equipment.
Background
For example, when the photosensitive chip is applied to a camera module, the photosensitive chip is an imaging element of the camera module, the camera is inevitably irradiated by strong light, and the photosensitive chip is also a very fragile element, and at least part of pixels on the photosensitive chip are burned out unintentionally due to the direct irradiation of the strong light, so that how to avoid the damage of the photosensitive chip caused by the direct irradiation of the strong light becomes a problem to be solved urgently.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a photosensitive circuit assembly, camera module and electronic equipment, and it can avoid the camera to be damaged by sensitization chip after the highlight penetrates directly effectively, plays good guard action to sensitization chip.
In a first aspect, embodiments of the present application provide a photosensitive circuit assembly; the photosensitive circuit assembly includes: a photosensitive circuit, a support, a circuit board with a bearing surface, a circuit board with a light-sensitive circuit, a support located at one side of the photosensitive circuit, a circuit board with a bearing surface, a light-sensitive circuit and a light-sensitive circuit, or the photosensitive circuit and the circuit board are arranged at intervals and positioned at one side of the bracket close to the circuit board, the color-changing assembly is arranged at one side of the photosensitive circuit, which is far away from the circuit board, the color-changing component is electrically connected with the circuit board through the bracket, the color-changing component is used for receiving light to be sensed, the color-changing component is also suitable for being driven by applied voltage to change color, so that the color-changing component is switched between a light blocking state and a light passing state, wherein, in the light-blocking state, the light to be sensed is blocked from at least partial light through the color-changing component so as to protect the photosensitive circuit, in the light-transmitting state, the light to be sensed passes through the color-changing assembly and then irradiates the photosensitive circuit so that the photosensitive circuit outputs a light sensing signal.
Based on the light sensing circuit assembly in the embodiment of the present application, the color change assembly changes color after being driven by the applied voltage, and in a light blocking state (which can also be understood as an inoperative state), when the light sensing circuit is irradiated directly by the light to be sensed unintentionally, no matter what color the color change assembly presents, the color change assembly is an opaque body, for the opaque body, the color depends on the reflection and absorption conditions of various colored lights with different wavelengths, and the color of the opaque body is determined by the colored light reflected by the opaque body, so that the light to be sensed can be at least partially blocked after passing through the color change assembly, where "blocked" should be understood as the effect of reflection plus absorption, in reflection, that is, the light to be sensed can at least reflect the same color as the color change assembly after passing through the color change assembly, and in absorption, the light can not be completely absorbed after passing through any object, most of the light except the light with the same color as the light to be sensed can be absorbed after passing through the color changing assembly, so that the effect of weakening the light to be sensed to a greater extent is achieved to protect the photosensitive circuit. In the light-transmitting state (which can be understood as the working state), the color-changing component is in a colorless transparent state, the color-changing component is a transparent body at the moment, and the color of the transparent body is determined by the color light transmitted by the color-changing component, so that all the light to be sensed can transmit the color-changing component to reach the photosensitive circuit after passing through the color-changing component, so that the photosensitive circuit can normally output light sensing signals. In summary, the color-changing element can be switched between a light-blocking state representing a certain color and a light-transmitting state representing a transparent colorless state by applying voltage drive, so as to weaken the light to be sensed to a greater extent and achieve the effect of protecting the photosensitive circuit.
In some of these embodiments, the color changing assembly comprises, in a stacked arrangement: an electrochromic layer adapted to be driven by an applied voltage to undergo a change in color; the first base material layer is arranged on the surface of one side of the electrochromic layer, and at least part of the surface of the first base material layer, which is far away from the electrochromic layer, extends towards the direction close to the electrochromic layer to form a first groove; the second base material layer is arranged on the surface, away from the first base material layer, of the electrochromic layer, and at least part of the surface, away from the electrochromic layer, of the second base material layer extends towards the direction close to the electrochromic layer to form a second groove; the first groove at least extends to the surface of the electrochromic layer, which is far away from the second base material layer, a first conductive element is arranged in the first groove, one end of the first conductive element is electrically connected with the electrochromic layer, and the other end of the first conductive element is electrically connected with the circuit board; the second groove at least extends to the surface of the electrochromic layer, which deviates from the first base material layer, a second conductive element is arranged in the second groove, one end of the second conductive element is electrically connected with the electrochromic layer, and the other end of the second conductive element is electrically connected with the circuit board.
Based on the above embodiment, the electrochromic layer is the color-changing element, it is suitable for being exerted voltage drive so as to take place the change of colour thereby reach the effect of weakening or separation waiting to sense light, first substrate layer and second substrate layer are as the support component of electrochromic layer, on the one hand can strengthen the structural strength of electrochromic layer, on the other hand can also play the effect of electrical insulation, and through offering first recess on first substrate layer, offer the second recess on the second substrate layer, make two relative surfaces of electrochromic layer expose, and realize the electric connection between electrochromic layer and the circuit board through first conductive element and second conductive element.
In some of these embodiments, the electrochromic layer comprises, in sequential stacked arrangement: the first transparent conducting layer is connected with the first substrate layer and is electrically connected with the first conducting element, the ion storage layer, the electrolyte layer, the electrochromic filter layer and the second transparent conducting layer are connected with the second substrate layer and are electrically connected with the second conducting element.
Based on the above embodiment, the first transparent conductive layer corresponds to one of the electrodes of the electrochromic layer, the second transparent conductive layer corresponds to the other electrode of the electrochromic layer, and the material of the electrochromic filter layer may be nickel oxide (NiO)x) The color change principle of the electrochromic layer: nickel oxide (NiO) in an initial state when no voltage is applied to both ends of the first and second transparent conductive layersx) The electrochromic filter layer can be dark brown, and at the moment, the electrochromic layer can block at least part of light rays in the light rays to be sensed to protect the photosensitive circuit; when a voltage is applied to the two ends of the first transparent conductive layer and the second transparent conductive layer (i.e. under the condition of electrification), Li is obtained according to the chemical equation++NiOx＝＝LiNiOxLi ions in the ion storage layer are injected into nickel oxide (NiO) through the electrolyte layer under the action of an electric fieldx) LiNiO is formed in the lattice space of the electrochromic filter layerxChanging the valence of Ni element, when X is 2, the Ni element is selected from Ni4+Conversion to Ni3+The transition generating electrons absorbs photons to change from a dark brown state to a transparent state, at which time all of the light in the light to be sensedThe wires can pass through the electrochromic layer to the light sensing circuit so that the light sensing circuit normally outputs light sensing signals.
In some embodiments, the first groove extends up to a surface of the first transparent conductive layer near the ion storage layer, and the second groove extends up to a surface of the second transparent conductive layer near the electrochromic filter layer.
Based on the above embodiment, the first transparent conductive layer and the second transparent conductive layer are equivalent to two electrodes of the electrochromic layer, and along the thickness direction of the electrochromic layer, the first transparent conductive layer and the second transparent conductive layer have a certain thickness dimension, in order to prevent the first groove and the second groove from penetrating through the electrochromic layer after extending towards the direction close to the electrochromic layer, the first groove extends to the surface of the first transparent conductive layer away from the ion storage layer at most, the second groove extends to the surface of the second transparent conductive layer away from the electrochromic filter layer at most, that is, the depth dimension of the first groove is equal to the thickness dimension of the first substrate layer plus the thickness dimension of the first transparent conductive layer, and the depth dimension of the second groove is equal to the thickness dimension of the second substrate layer plus the thickness dimension of the second transparent conductive layer.
In some embodiments, the color changing assembly further includes an infrared filter layer disposed on a surface of the first substrate layer away from the electrochromic layer, the infrared filter layer is used for filtering infrared light in the light to be sensed, and the anti-reflection layer is disposed on a surface of the second substrate layer away from the electrochromic filter layer.
Based on the above embodiment, when the color changing assembly includes the first substrate layer, the electrochromic layer and the second substrate layer, which are sequentially stacked, the first substrate layer and the second substrate layer may both adopt transparent optical glass to increase the rigidity of the electrochromic layer, that is, the color changing assembly may be regarded as an electrochromic film layer having a certain rigidity, the color changing assembly has no effect on the light to be sensed when in the light-transmitting state, and by designing the infrared filter layer and the anti-reflection layer, the infrared filter layer can filter out infrared light from the light to be sensed, the anti-reflection layer can enhance the transmittance of the light to be sensed, at this time, the color changing assembly may be regarded as a combined component in which the electrochromic layer is clamped in the optical filter, the color changing assembly is equivalent to an optical filter when in the light-transmitting state, the color changing assembly can filter out infrared light from the light to be sensed, and can enhance the transmittance of light of other colors in the light to be sensed, so that the light sensing circuit outputs the light sensing signal.
In some embodiments, the bracket comprises a side plate, the side plate is arranged along the periphery of the bearing surface, at least part of the side plate extends inwards along the direction perpendicular to the thickness direction of the circuit board to form a bearing part, the bearing part is spaced from the circuit board, the color-changing assembly is arranged on the bearing part, one end of the bearing part, which is far away from the side plate, is surrounded to form a light through opening, and the photosensitive circuit is located below the light through opening.
Based on the above embodiment, the bearing portion of the bracket serves as a supporting component of the color changing assembly, the bearing portion and the side plate of the bracket are used for realizing electrical connection between the color changing assembly and the circuit board, the wire grooves can be designed in the bearing portion and the side plate, and wires are distributed in the wire grooves, so that the color changing assembly, the first conductive elements and the wires in the wire grooves are communicated with the circuit board, or the color changing assembly, the second conductive elements and the wires in the wire grooves are communicated with the circuit board, and therefore an effective current loop is formed. Simultaneously the curb plate is arranged along the periphery of loading end, and the bearing part that extends makes the support have logical light mouth, whole support has first opening and second opening promptly, first opening is exactly logical light mouth, the second opening is exactly the opening that the curb plate encloses and establishes and is close to circuit board one side, and lead to the light mouth and sheltered from by the color changing assembly, the second opening is sheltered from by the circuit board, treat that sensing light is sealed in the accommodating space that support and circuit board enclose and establish, can avoid the interference of other light effectively on the one hand, on the other hand can also be waterproof dustproof.
In some embodiments, at least a portion of the surface of the side plate facing away from the circuit board extends towards the direction close to the circuit board to form a third groove, a first terminal electrically connected with the circuit board is arranged at the bottom of the third groove, at least a portion of the surface of the bearing part facing away from the circuit board extends towards the direction close to the circuit board to form a fourth groove, and a second terminal electrically connected with the circuit board is arranged at the bottom of the fourth groove, wherein when the color-changing assembly is mounted on the bearing part, the second groove and the fourth groove are arranged oppositely, when the first groove extends to the surface of the electrochromic layer facing away from the second substrate layer, one end of the first conductive element is electrically connected with the bottom of the first groove, or when the first groove extends to the surface of the first transparent conductive layer close to the ion storage layer, one end of the first conductive element is electrically connected with the groove side wall of the first groove, the other end of the first conductive element is electrically connected with the first wiring terminal, when the second groove extends to the surface of the electrochromic layer, which is far away from the first substrate layer, one end of the second conductive element is electrically connected with the groove bottom of the second groove, or when the second groove extends to the surface of the second transparent conductive layer, which is close to the ion storage layer, one end of the second conductive element is electrically connected with the groove side wall of the second groove, and the other end of the second conductive element is electrically connected with the second wiring terminal.
Based on the above embodiment, the first terminal is equivalent to one of the external pins of the circuit board, and similarly, the second terminal is equivalent to the other external pin of the circuit board, and the third groove is formed in the side plate of the bracket and the fourth groove is formed in the bearing portion, so that the first terminal is as close to the first groove as possible, and the second terminal is as close to the second groove as possible.
In some embodiments, after the color-changing assembly is mounted on the bearing part, the peripheral edge of the color-changing assembly and the side plate form a filling space at intervals, and an adhesive layer for connecting the color-changing assembly and the bearing part is arranged in the filling space.
Based on above-mentioned embodiment, because the size of the subassembly that discolours along its thickness direction is not big, perhaps in the in-process of installing the subassembly that discolours on the bearing part, for avoiding the periphery extrusion subassembly that discolours of curb plate and lead to the subassembly that discolours to lose efficacy, so the subassembly that discolours is installed on the bearing part after, the peripheral edge and the curb plate interval of the subassembly that discolours, produce certain redundant quantity promptly, and this redundant quantity forms the filling space, through set up the adhesive linkage in filling the space in order to realize the fixed connection between subassembly that discolours and the bearing part.
In some of these embodiments, the color changing assembly is configured to exhibit different colors depending on the application of different voltages.
Based on the above embodiment: the two ends of the color-changing component are applied with different voltages to show different colors, wherein the expression of "showing different colors" refers to that the color of the color-changing component changes from dark to light or from light to dark in a gradual change manner (for example, light blue to dark blue), rather than a sudden color change (e.g., from red to yellow) of the color changing element, the light to be sensed passes through the color changing element, the light with the same color as the color-changing component is reflected, the most of the rest light is absorbed by the color-changing component, and the darker the color of the color-changing component, the stronger the absorption capacity of the light, that is, the less the part of the light to be sensed can not be reflected by the color-changing component and can not be absorbed by the color-changing component, the possibility that the light to be sensed directly penetrates through the color-changing component and irradiates on the photosensitive circuit is reduced, and therefore the light to be sensed is further weakened, and the effect of protecting the photosensitive circuit is achieved.
In some embodiments, when the color-changing assembly is in the power-off state, the color-changing assembly is in the light-blocking state, and when the color-changing assembly is in the power-on state and a preset voltage is applied to the color-changing assembly, the color-changing assembly is in the light-on state.
Based on the above embodiment, as long as the color change component can generate color change to block at least part of the light in the light to be sensed, the color change component can be in a light blocking state in a power-on state, and correspondingly the color change component is in a light-on state in a power-off state.
In a second aspect, an embodiment of the present application provides a camera module; this camera module includes: the above-mentioned light-sensing circuit assembly and the lens assembly are used for receiving the object side light and providing the light to be sensed to the light-sensing circuit assembly.
Based on the camera module in this application embodiment, have the camera module of above-mentioned photosensitive circuit subassembly, at the module normal during operation that makes a video recording, the light that is reflected by the object of shooing can be normal pass the chameleon subassembly and reach photosensitive circuit, at the module abnormal during operation that makes a video recording, if make a video recording the module by the highlight directly penetrate unintentionally, at this moment, thereby the chameleon subassembly can weaken effectively and treat the effect that sensing light reaches protection photosensitive circuit.
In a third aspect, an embodiment of the present application provides an electronic device; the electronic equipment comprises the camera module.
Based on electronic equipment in this application embodiment, the electronic equipment that has above-mentioned photosensitive circuit subassembly, when electronic equipment normally worked, the light that is reflected by the object of shooing can be normal pass the color-changing subassembly and reach photosensitive circuit, and when electronic equipment normally worked, if electronic equipment's camera was penetrated directly by the highlight accidentally, at this moment, the color-changing subassembly can weaken effectively and wait to detect the effect that light reaches protection photosensitive circuit.
Based on the light sensing circuit assembly, the camera module and the electronic device of the embodiment of the application, the color change assembly is driven by the applied voltage to change the color, when the light sensing circuit is directly irradiated by the light to be sensed in a light blocking state (which can be understood as a non-working state), no matter what color the color change assembly presents, the color change assembly is an opaque body at the moment, for the opaque body, the color depends on the reflection and absorption conditions of various color lights with different wavelengths, and the color of the opaque body is determined by the color light reflected by the opaque body, so the light to be sensed can be at least partially blocked after passing through the color change assembly, the 'blocked' is understood as the effect of reflection plus absorption, on reflection, namely, the light to be sensed can at least reflect the same color as the color of the color change assembly after passing through the color change assembly, and on absorption, the light can not be completely absorbed after passing through any object, namely most of the light except the light with the same color as the light to be sensed can be absorbed after passing through the color changing assembly, so that the effect of weakening the light to be sensed to a greater extent is achieved to protect the photosensitive circuit. In the light-transmitting state (which can be understood as the working state), the color-changing component is in a colorless transparent state, the color-changing component is a transparent body at the moment, and the color of the transparent body is determined by the color light transmitted by the color-changing component, so that all the light to be sensed can transmit the color-changing component to reach the photosensitive circuit after passing through the color-changing component, so that the photosensitive circuit can normally output light sensing signals. In summary, the color-changing element can be switched between a light-blocking state representing a certain color and a light-transmitting state representing a transparent colorless state by applying voltage drive, so as to weaken the light to be sensed to a greater extent and achieve the effect of protecting the photosensitive circuit.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram of a prior art sensor chip;
FIG. 2 is a schematic structural diagram of a light sensing circuit assembly according to an embodiment of the present disclosure;
FIG. 3 is a schematic cross-sectional view of a light sensing circuit assembly according to an embodiment of the present disclosure;
FIG. 4 is a schematic cross-sectional view of a photosensitive circuit assembly according to another embodiment of the present application;
FIG. 5 is an enlarged view of the structure at A in FIG. 4;
FIG. 6 is a schematic structural diagram of a color changing assembly in one embodiment of the present application;
FIG. 7 is an enlarged view of the structure at B in FIG. 6;
FIG. 8 is a schematic cross-sectional view of a color changing assembly according to an embodiment of the present disclosure;
FIG. 9 is a schematic structural view of a stent in an embodiment of the present application;
FIG. 10 is a schematic view of a stent according to an embodiment of the present application.
Reference numerals: 10. a photosensitive chip; 101. speckle; 100. a photosensitive circuit component; 110. a light sensing circuit; 120. a circuit board; 130. a support; 1301. an outer wall surface; 131. a side plate; 132. a bearing part; 133. filling the space; 134. an adhesive layer; 135. a third groove; 136. a first connection end; 1361. a wire slot; 1362. connecting a lead; 137. a fourth groove; 138. a second connection end; 139a, a light through port; 139b, a second opening; 140. a color changing assembly; 141. an electrochromic layer; 1411. a first transparent conductive layer; 1412. an ion storage layer; 1413. an electrolyte layer; 1414. an electrochromic filter layer; 1415. a second transparent conductive layer; 142. A first base material layer; 1421. a first groove; 1422. a first conductive element; 143. a second substrate layer; 1431. A second groove; 1432. a second conductive element; 144. an infrared filter layer; 145. and an anti-reflection layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The photosensitive chip 10 is a component for converting an optical signal into an electrical signal, for example, when the photosensitive chip 10 is applied to a camera module, the photosensitive chip 10 serves as an imaging component of the camera module.
In a real life, a case that the photosensitive chip 10 is damaged too much occurs, as shown in fig. 1, a purple irregular spot 101 appears on a viewfinder of a mobile phone of a user, and the spot 101 is enlarged along with a digital zoom enlarged picture, and it is found through analysis that the phenomenon is caused by that the user is accidentally directly irradiated by strong light to a camera when using the mobile phone, where "unintentionally" refers to that when the camera of the mobile phone is in an unopened state, the user carelessly aligns the camera with the strong light, and it can be understood that when the camera of the mobile phone is in an opened state, the user can also intentionally avoid the camera from being directly aligned with the strong light as much as possible. The photosensitive chip 10 is also a very fragile element, and inadvertently, at least a part of the pixels on the photosensitive chip are burned out due to the direct irradiation of the strong light, thereby affecting the later imaging.
In order to solve the above technical problem, please refer to fig. 2-10, a first aspect of the present application provides a photosensitive circuit assembly 100, wherein the photosensitive circuit assembly 100 can effectively weaken light to be sensed so as to protect a photosensitive circuit 110.
The photosensitive circuit assembly 100 may include a photosensitive circuit 110, a circuit board 120, a bracket 130, and a color changing assembly 140.
Referring to fig. 2, the light sensing circuit 110 serves as a receiving element for the light to be sensed, where the light to be sensed is understood to be light emitted by the object to be photographed when the camera is in an operating state, or light emitted by a light emitting source when the camera is in a non-operating state, and the light is strong light, for example, the light emitting source may be a laser emitter. The photosensitive circuit 110 is used for converting an optical signal of light to be sensed into an electrical signal, and may be a photosensitive chip, the photosensitive chip is an important component of the digital camera, and may be divided into a CCD (charge coupled device) and a CMOS (metal oxide semiconductor) according to different components, and since at least part of pixels on the photosensitive chip will be burned out after the photosensitive chip is directly irradiated by strong light, which is a common property of the photosensitive chip, the specific model of the photosensitive chip is not limited herein, and the performance of the photosensitive chip of different models is described in detail in the existing product specification, and is not described herein again.
Referring to fig. 6 and 7, the color-changing element 140 is used as a protection component of the photosensitive circuit 110, and is suitable for being driven by a voltage to change a color, that is, the color-changing element 140 is in a state of a certain color before being powered on, and in a state of another color after being powered on. Absorption, reflection, and transmission may occur when light is irradiated on an object. In terms of the effect of the object on light, the light can be broadly divided into two categories, i.e., transparent and opaque, which are generally called transparent and non-transparent. The color of the opaque body depends on the reflection and absorption of the various colored lights of different wavelengths, i.e., the color of the opaque body is determined by the colored lights that it reflects, and the color of the transparent body depends on the transmission and absorption of the various colored lights of different wavelengths, i.e., the color of the transparent body is determined by the colored lights that it transmits. And it is understood that: in order to enable the light emitted by the object to be photographed to normally pass through the color changing assembly 140 and project on the photosensitive circuit 110 to enable the photosensitive circuit 110 to output the light sensing signal when the camera is in the operating state, the color changing assembly 140 should be in a colorless transparent state (i.e., colorless transparent body) in this case, and similarly, in order to enable the light emitted by the light emitting source to hardly pass through the color changing assembly 140 to achieve the effect of protecting the photosensitive circuit 110 when the camera is in the non-operating state, the color changing assembly 140 should be in a colored non-transparent state (i.e., colored non-transparent body) in this case.
Referring to fig. 8, the color-changing element 140 is driven by the applied voltage to change the color, so that the color-changing element 140 is switched between a light-blocking state and a light-transmitting state. In the light blocking state, at least part of the light to be sensed is blocked by the color changing assembly 140 to protect the light sensing circuit 110; in the light-transmitting state, the light to be sensed passes through the color-changing element 140 and then irradiates the light-sensing circuit 110, so that the light-sensing circuit 110 outputs a sensing light signal. It can be understood that: when the color changing element 140 is in the light blocking state, the color changing element 140 is non-transparent, so the term "blocked" should be understood as the effect of absorption added to reflection, that is, the light to be sensed can reflect at least the light with the same color as the color changing element 140 after passing through the color changing element 140, and in terms of absorption, the light can not be completely absorbed after passing through any object, that is, the light to be sensed can be absorbed by the color changing element 140 except most of the light with the same color as the light to be sensed, and possibly a small part of the remaining light can be directly projected onto the light sensing circuit 110 through the color changing element 140, so as to achieve the effect of weakening the light to be sensed to a greater extent to protect the light sensing circuit 110. The same can be understood: when the color changing assembly 140 is in a light-transmitting state, the color changing assembly 140 is a colorless transparent body, and the color of the transparent body is determined by the color light transmitted by the color changing assembly 140, and the color changing assembly 140 is colorless, which means that all the light to be sensed can reach the light sensing circuit 110 through the color changing assembly 140 to enable the light sensing circuit 110 to normally output the light sensing signal.
The color-changing component 140 is configured to exhibit different colors according to different applied voltages, where "different voltages" can be understood as voltages having different magnitudes, and "exhibiting different colors" refers to a color change of the color-changing component 140 from dark to light or from light to dark in a gradual manner (e.g., light blue to dark blue), rather than a color change of the color-changing component 140 in a stepwise manner (e.g., from red to yellow). Therefore, after the light to be sensed passes through the color changing assembly 140, the light with the same color as the color changing assembly 140 is reflected, most of the remaining light is absorbed by the color changing assembly 140, and the deeper the color of the color changing assembly 140 is, the stronger the light absorption capability is, that is, the less the light which cannot be reflected by the color changing assembly 140 nor absorbed by the color changing assembly 140 is, the less the possibility that the light to be sensed directly penetrates through the color changing assembly 140 and irradiates on the photosensitive circuit 110 is reduced, thereby further weakening the light to be sensed and protecting the photosensitive circuit 110.
Since the color-changing element 140 can change the color to block at least a part of the light to be sensed, the color-changing element 140 can be in a light-blocking state in the power-on state, and correspondingly, the color-changing element 140 is in a light-passing state in the power-off state. In order to reduce power consumption, in the present embodiment, when the color-changing assembly 140 is in the power-off state, the color-changing assembly 140 is correspondingly in the light-blocking state; when the color-changing assembly 140 is in the power-on state and a preset voltage is applied, the color-changing assembly 140 is correspondingly in the light-on state. The "preset voltage" here can be understood as a voltage to be applied to both ends of the color-changing member 140 when it assumes a colorless transparent state.
Referring to fig. 3 and 4, the circuit board 120 is an integrated component of a circuit, which may be one of an FPC board (flexible circuit board 120), a PCB board (rigid circuit board 120) and an FPCB board (flexible-rigid circuit board 120), and considering that the circuit board 120 may have a connection relationship with other components (such as the bracket 130) in the photosensitive circuit assembly 100, in this embodiment, the circuit board 120 is a PCB board, and the circuit board 120 has a carrying surface. When the circuit board 120 is a single board, the carrying surface of the circuit board 120 may be understood as a surface for carrying electronic components, where the "electronic components" may be one or more of capacitors, resistors, inductors, and the like. The photosensitive circuit 110 is electrically connected to the circuit board 120, so that when the camera is in a working state, light (i.e., sensing light) emitted by a photographed object passes through the color changing assembly 140 and is projected onto the photosensitive circuit 110, and the photosensitive circuit 110 outputs a light sensing signal through related processing, where the "related processing" can be understood as a process of converting a light signal into an electrical signal, which can be known by those skilled in the art according to the prior art and is not described herein. The color-changing element 140 is electrically connected to the circuit board 120, so that when the camera is in a working state, after a preset voltage is applied to two ends of the color-changing element 140 to present a colorless and transparent state, light (i.e., sensing light) emitted by a photographed object can be projected on the light-sensing circuit 110 normally after passing through the color-changing element 140.
Referring to fig. 9 and 10, the bracket 130 may be used as a bearing part 132 of the color-changing assembly 140, and may be a plastic bracket 130 or a bracket 130 made of a non-metallic material such as a ceramic bracket 130, and the material of the bracket 130 is not limited herein. Because the circuit board 120 is a PCB and has a certain rigidity strength to bear other components in the photochromic component 140, where "certain rigidity strength" indicates that the circuit board 120 does not have a "failure phenomenon" (i.e., cracks or fractures) at least when all the other components in the photochromic component 140 are disposed on the bearing surface of the circuit board 120, in this embodiment, the bracket 130 is located at one side of the photosensitive circuit 110, and the bracket 130 is directly mounted on the bearing surface of the circuit board 120, the bracket 130 is electrically connected to the circuit board 120, specifically, a slot 1361 (as shown in fig. 5) may be formed inside the bracket 130, two ends of the slot 1361 penetrate through an outer wall surface 1301 of the bracket 130, a wire 1362 may be inserted into the slot 1361, and one end of the wire 1362 is connected to the circuit board 120.
It can be understood that, referring to fig. 3, the photosensitive circuit 110 may be directly mounted on the bracket 130, that is, the photosensitive circuit 110 and the circuit board 120 are spaced apart and located on one side of the bracket 130 close to the circuit board 120, at this time, in order to achieve the electrical connection between the photosensitive circuit 110 and the circuit board 120, a wire casing 1361 may be provided inside the bracket 130, a connecting wire 1362 is inserted into the wire casing, one end of the connecting wire 1362 is connected to the photosensitive circuit 110, and the other end of the connecting wire 1362 is connected to the circuit board 120. Similarly, the bracket 130 can be used to carry the color-changing assembly 140, and the color-changing assembly 140 is located on a side of the photosensitive circuit 110 away from the circuit board 120, that is, the color-changing assembly 140 is disposed on a side of the bracket 130 away from the circuit board 120, in order to realize the electrical connection between the color-changing assembly 140 and the circuit board 120, a wire slot 1361 can be disposed inside the bracket 130, a connecting wire 1362 is disposed in the wire slot 1361 in a penetrating manner, one end of the connecting wire 1362 is connected with the color-changing assembly 140, and the other end of the connecting wire 1362 is connected with the circuit board 120. Since the difficulty of forming the slot 1361 in the bracket 130 is high, in this embodiment, as shown in fig. 4, the photosensitive circuit 110 is directly mounted on the carrying surface of the circuit board 120, so that the step of forming the slot 1361 in the bracket 130 to electrically connect the photosensitive circuit 110 and the circuit board 120 can be reduced, and the processing difficulty is reduced.
Referring to fig. 6 and 7, the color changing assembly 140 includes an electrochromic layer 141, a first substrate layer 142, and a second substrate layer 143, which are stacked.
The electrochromic layer 141 is adapted to be driven by an applied voltage to undergo a color change, in other words, the color change of the color changing member 140 is mainly dependent on the color change of the electrochromic layer 141.
The first base material layer 142 and the second base material layer 143 may both serve as a support member of the electrochromic layer 141, and the first base material layer 142 and the second base material layer 143 are disposed on both sides of the electrochromic layer 141, that is, the electrochromic layer 141 is interposed between the first base material layer 142 and the second base material layer 143. The first base material layer 142 and the second base material layer 143 can enhance the structural strength of the electrochromic layer 141 and can also function as electrical insulation. The materials of the first substrate layer 142 and the second substrate layer 143 are not limited herein, and the first substrate layer 142 and the second substrate layer 143 only need to be colorless and transparent to allow the light to be sensed to completely transmit, for example, the materials of the first substrate layer 142 and the second substrate layer 143 may be transparent resins. In consideration of optical imaging, in the present embodiment, the materials of the first substrate layer 142 and the second substrate layer 143 are both optical glass.
As shown in fig. 8, the electrochromic layer 141 includes a first transparent conductive layer 1411, an ion storage layer 1412, an electrolyte layer 1413, an electrochromic filter layer 1414 and a second transparent conductive layer 1415, which are sequentially stacked. The first transparent conductive layer 1411 is connected to the first base material layer 142, and the second transparent conductive layer 1415 is connected to the second base material layer 143.
The first transparent conductive layer 1411 and the second transparent conductive layer 1415 are equivalent to two electrodes of the electrochromic layer 141 and are used for electrically connecting with the circuit board 120, and since the first transparent conductive layer 1411 and the second transparent conductive layer 1415 cannot absorb or reflect light to be sensed except for the electrical connection, in this embodiment, the first transparent conductive layer 1411 and the second transparent conductive layer 1415 are transparent ITO films.
The material of the electrochromic filter layer 1414 may be tungsten trioxide (WO)3) Iridium dioxide (IrO)2) Or nickel oxide (NiO)x) One of these materials, in this embodiment, the material of the electrochromic filter layer 1414 is nickel oxide (NiO)x)。
The material of the electrochromic filter layer 1414 is nickel oxide (NiO)x) The color change principle of the electrochromic layer 141 is described by way of example: nickel oxide (NiO) in an initial state when no voltage is applied to both ends of the first transparent conductive layer 1411 and the second transparent conductive layer 1415x) The electrochromic filter layer 1414 may be dark brown, and at this time, the electrochromic layer 141 blocks at least one of the light to be sensedPart of the light protects the light sensing circuit 110; when a voltage is applied to the two ends of the first transparent conductive layer 1411 and the second transparent conductive layer 1415 (i.e., under the condition of power-on), Li is generated according to the chemical formula++NiOx＝＝LiNiOxLi ions of the ion storage layer 1412 are injected into nickel oxide (NiO) through the electrolyte layer 1413 under the action of an electric fieldx) LiNiO is formed in the lattice space of the electrochromic filter layer 1414xChanging the valence of Ni element, when X is 2, the Ni element is selected from Ni4+Conversion to Ni3+And the transition of the generated electrons absorbs photons to change from the dark brown state to the transparent state, and at this time, all the light rays in the light rays to be sensed can pass through the electrochromic layer 141 to reach the photosensitive circuit 110 so that the photosensitive circuit 110 normally outputs a photosensitive signal. When the electrochromic filter layer 1414 is tungsten trioxide (WO)3) Iridium dioxide (IrO)2) When the materials are mixed, the color change principle is combined with nickel oxide (NiO)x) Similarly, those skilled in the art can obtain the information according to the prior art, and the detailed description is omitted here.
It is understood that, when the color changing assembly 140 includes the first substrate layer 142, the electrochromic layer 141 and the second substrate layer 143 which are sequentially stacked, and the first substrate layer 142 and the second substrate layer 143 are both transparent optical glass, that is, the color-changing element 140 can be regarded as an electrochromic film having a certain rigidity, the electrochromic layer 141 is electrically connected to the circuit board 120 mainly through the first transparent conductive layer 1411 and the second transparent conductive layer 1415, and in order to facilitate the electrical connection between the color-changing element 140 and the circuit board 120, in the present embodiment, the surface of the first substrate layer 142 facing away from the first transparent conductive layer 1411 at least partially extends towards the direction close to the first transparent conductive layer 1411 to form a first groove 1421, and the first groove 1421 extends at least to the surface of the electrochromic layer 141 facing away from the second substrate layer 143, that is, the surface of the first transparent conductive layer 1411 facing away from the ion storage layer 1412; similarly, at least a portion of a surface of the second substrate layer 143 facing away from the second transparent conductive layer 1415 extends toward a direction close to the second transparent conductive layer 1415 to form a second groove 1431, the second groove 1431 extends at least to a surface of the electrochromic layer 141 facing away from the first substrate layer 142, that is, a surface of the second transparent conductive layer 1415 facing away from the electrochromic filter layer 1414, so that the first transparent conductive layer 1411 and the second transparent conductive layer 1415 are exposed, a first conductive element 1422 for electrically connecting the first transparent conductive layer 1411 and the circuit board 120 is disposed in the first groove 1421, the first conductive element 1422 may be a gold wire (may be a copper wire with good conductivity), one end of the first conductive element 1422 is connected to the first transparent conductive layer 1411, the other end of the first conductive element 1422 is connected to a connecting wire 1362 in the slot 1361 of the bracket 130, and a second conductive element 1362 for electrically connecting the second transparent conductive layer 1415 and the circuit board 120 is disposed in the second groove 1431 1432, the second conductive element 1432 may be a gold wire, one end of the second conductive element 1432 is connected to the second transparent conductive layer 1415, and the other end of the second conductive element 1432 is connected to another connecting wire 1362 in the wire slot 1361 of the bracket 130. Here, the shapes of the first groove 1421 and the second groove 1431 are not limited, for example, the cross-sectional shapes of the first groove 1421 and the second groove 1431 may be circular, and in this embodiment, the cross-sectional shapes of the first groove 1421 and the second groove 1431 are rectangular.
Further, along the thickness direction of the color changing assembly 140, the first transparent conductive layer 1411 and the second transparent conductive layer 1415 have a thickness dimension, the thickness dimension is designed according to the requirement of the designer, the first groove 1421 extends at most to the surface of the first transparent conductive layer 1411 close to the ion storage layer 1412, that is, the surface of the ion storage layer 1412 facing away from the electrolyte layer 1413, and the second groove 1431 extends at most to the surface of the second transparent conductive layer 1415 close to the electrochromic filter layer 1414, that is, the surface of the electrochromic filter layer 1414 facing away from the electrolyte layer 1413, at this time, the first conductive element 1422 may be directly connected to the groove sidewall of the first transparent conductive layer 1411 located on the sidewall of the first groove 1421, and similarly, the second conductive element 1432 may be directly connected to the groove sidewall of the second transparent conductive layer 1415 located on the sidewall of the second groove 1431. In this embodiment, the first groove 1421 directly extends to the surface of the first transparent conductive layer 1411 facing away from the ion storage layer 1412, and the second groove 1431 also directly extends to the surface of the second transparent conductive layer 1415 facing away from the electrochromic filter layer 1414.
As shown in fig. 8, it can be understood that when the color changing assembly 140 includes the first substrate layer 142, the electrochromic layer 141, and the second substrate layer 143, which are sequentially stacked, that is, the color changing assembly 140 may be regarded as an electrochromic film layer having a certain rigidity, and the color changing assembly 140 has no effect on light to be sensed when in a light-transmitting state, but in this embodiment, the color changing assembly 140 may further include an infrared filter layer 144 and an anti-reflection layer 145. The infrared filter layer 144 is disposed on the surface of the first substrate layer 142 away from the electrochromic layer 141, and the anti-reflection layer 145 is disposed on the surface of the second substrate layer 143 away from the electrochromic layer 141. By designing the infrared filter layer 144 and the anti-reflection layer 145, in a light-transmitting state, the infrared filter layer 144 can filter infrared light in light to be sensed, the anti-reflection layer 145 can enhance the transmittance of the light to be sensed, at this time, the color-changing component 140 can be regarded as a combined component in which the electrochromic layer 141 is clamped in an optical filter, the color-changing component 140 is equivalent to an optical filter in the light-transmitting state, and can filter infrared light in the light to be sensed and enhance the transmittance of light of other colors in the light to be sensed, so that the light sensing circuit 110 can output a light sensing signal.
Referring to fig. 9 and 10, the bracket 130, serving as a supporting component of the color-changing assembly 140, may include a side plate 131, where the side plate 131 is disposed along a periphery of the circuit board 120 to form an annular structure, and may be fixedly connected to the circuit board 120 by an adhesive. At least part of the side plate 131 extends in a direction perpendicular to the thickness direction of the circuit board 120 to form a carrying portion 132, the carrying portion 132 is spaced from the circuit board 120, and the color-changing element 140 is mounted on the carrying portion 132, specifically, one side of the inner side wall surface of the side plate 131, which is away from the carrying surface of the circuit board 120, extends in the direction perpendicular to the thickness direction of the circuit board 120 for a certain stroke to form the carrying portion 132, where the certain stroke is related to the size of the color-changing element 140, the surface of the carrying portion 132, which is close to the carrying surface of the circuit board 120, is spaced from the carrying surface of the circuit board 120, the color-changing element 140 is mounted on the surface of the carrying portion 132, and the infrared filter layer 144 of the color-changing element 140 may be attached to the surface of the carrying portion 132.
The surface of the carrying portion 132 facing away from the side plate 131 is defined to form a light passing opening 139a, and the cross-sectional area of the light passing opening 139a is at least larger than that of the photosensitive circuit 110, so as to ensure that in a light passing state, the light to be sensed can pass through the color changing assembly 140 and smoothly pass through the light passing opening 139a of the bracket 130 to be finally projected onto the photosensitive circuit 110. It can be understood that: whole support 130 has first opening and second opening 139b, and first opening is exactly to lead to light mouth 139a, and second opening 139b is exactly the opening that is close to circuit board 120 one side that curb plate 131 encloses, and leads to light mouth 139a and sheltered from by color-changing component 140, and second opening 139b is sheltered from by circuit board 120, treats that sensing light is sealed in the accommodation space that support 130 and circuit board 120 enclose, can avoid the interference of other light effectively on the one hand, and on the other hand can also be waterproof dustproof.
Further, in order to facilitate the connection between the first conductive element 1422 and the connection wire in the wire slot of the bracket 130, at least a portion of the surface of the side plate 131 of the bracket 130 facing away from the carrying surface of the circuit board 120 extends toward a direction close to the circuit board 120 to form a third groove 135, a groove bottom of the third groove 135 is communicated with the wire slot of the bracket 130, a first connection end 136 (which may be regarded as a structure similar to a pad) is installed at the groove bottom of the third groove 135, one end of the connection wire in the wire slot facing away from the circuit board 120 is connected with the first connection end 136, and one end of the first conductive element 1422 facing away from the first transparent conductive layer 1411 is connected with the first connection end 136, that is, the electrical connection between the first transparent conductive layer 1411 and the. Similarly, to facilitate connection of the second conductive element 1432 with the connection wire in the wire slot therebetween, at least a portion of the surface of the bearing portion 132 of the bracket 130 facing away from the bearing surface of the circuit board 120 extends toward a direction close to the circuit board 120 to form a fourth groove 137, a groove bottom of the fourth groove 137 is communicated with the wire slot of the bracket 130, a second connection terminal 138 (which can also be regarded as a structure similar to a pad) is installed at the groove bottom of the fourth groove 137, and one end of the connection wire in the wire slot facing away from the circuit board 120 is connected with the second connection terminal 138. In order to further reduce the difficulty of electrical connection between the color-changing device 140 and the circuit board 120, after the color-changing device 140 is mounted on the supporting portion 132 of the bracket 130, the first recess 1421 may be disposed opposite to the fourth recess 137, in this embodiment, the second recess 1431 is disposed opposite to the fourth recess 137, and the second conductive element 1432 is a gold ball (a conductor with good conductivity, such as a solder ball), before the color-changing device 140 is mounted on the bracket 130, the gold ball is first placed in the fourth recess 137, and then the color-changing device 140 is placed on the supporting portion 132 of the bracket 130, so that the outer wall surface of the gold ball is respectively contacted with the second transparent conductive layer 1415 and the second pad, that is, the electrical connection between the second transparent conductive layer 1415 and the circuit board 120 is achieved.
Further, in order to enhance the structural stability between the color changing assembly 140 and the bracket 130 to ensure the stability of the electrical connection between the second transparent conductive layer 1415 and the circuit board 120, in this embodiment, after the color changing assembly 140 is mounted on the bearing portion 132 of the bracket 130, the peripheral edge of the color changing assembly 140 and the inner peripheral wall surface of the side plate 131 are spaced to form a filling space 133, the filling space 133 is filled with an adhesive layer 134 for connecting the color changing assembly 140 and the bearing portion 132 to fix the relative position therebetween, the adhesive layer 134 may be a double-sided adhesive, in this embodiment, the adhesive layer 134 is glue, and the filling space 133 is completely poured. It can be understood that: in the process of mounting the color changing assembly 140 on the bearing part 132, the interval between the peripheral edge of the color changing assembly 140 and the inner peripheral wall surface of the side plate 131 can effectively avoid the possibility that the peripheral edge of the side plate 131 presses the color changing assembly 140 to cause the color changing assembly 140 to fail (e.g., break).
A second aspect of the present application provides a camera module, which includes the above-mentioned light-sensing circuit assembly 100, and a lens assembly for receiving object-side light and providing light to be sensed to the light-sensing circuit assembly 100. The camera module with the above-mentioned photosensitive circuit assembly 100, when the camera module normally works, the light that is reflected by the object of shooing can be normal to pass color-changing assembly 140 and reach photosensitive circuit 110, when the camera module normally works, if the camera module is accidentally by the highlight direct irradiation, at this moment, color-changing assembly 140 can weaken effectively and wait to sense the light and thereby reach the effect of protection photosensitive circuit 110.
A third aspect of the present application provides an electronic apparatus including the camera module described above. For example, the electronic device may be a mobile phone, a video camera, a tablet, or the like having a photographing function. When the electronic device with the light sensing circuit assembly 100 works normally, light reflected by a photographed object can normally pass through the color changing assembly 140 and reach the light sensing circuit 110, and when the electronic device works abnormally, if a camera of the electronic device is accidentally directly irradiated by strong light, at the moment, the color changing assembly 140 can effectively weaken the light to be sensed, so that the effect of protecting the light sensing circuit 110 is achieved.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (12)
1. A photosensitive circuit assembly, comprising:
a light sensing circuit;
the bracket is positioned on one side of the photosensitive circuit;
the circuit board is provided with a bearing surface, the support is arranged on the bearing surface and is electrically connected with the circuit board, the bearing surface is used for bearing the photosensitive circuit and is electrically connected with the photosensitive circuit, or the photosensitive circuit and the circuit board are spaced and are positioned on one side of the support, which is close to the circuit board;
the color-changing assembly is arranged on one side, away from the circuit board, of the photosensitive circuit and is electrically connected with the circuit board through the support, the color-changing assembly is used for receiving light to be sensed, and the color-changing assembly is also suitable for being driven by applied voltage to change color, so that the color-changing assembly is switched between a light blocking state and a light passing state;
in the light blocking state, at least part of light rays to be sensed are blocked by the color changing assembly to protect the photosensitive circuit;
in the light-transmitting state, the light to be sensed passes through the color-changing assembly and then irradiates the photosensitive circuit so that the photosensitive circuit outputs a light sensing signal.
2. The photosensitive circuit assembly of claim 1, wherein said color changing assembly comprises, in a stacked arrangement:
an electrochromic layer adapted to be driven by an applied voltage to undergo a change in color;
the first base material layer is arranged on the surface of one side of the electrochromic layer, and at least part of the surface of the first base material layer, which is far away from the electrochromic layer, extends towards the direction close to the electrochromic layer to form a first groove;
the second substrate layer is arranged on the surface, away from the first substrate layer, of the electrochromic layer, and at least part of the surface, away from the electrochromic layer, of the second substrate layer extends towards the direction close to the electrochromic layer to form a second groove;
the first groove at least extends to the surface, away from the second base material layer, of the electrochromic layer, a first conductive element is arranged in the first groove, one end of the first conductive element is electrically connected with the electrochromic layer, and the other end of the first conductive element is electrically connected with the circuit board;
the second groove at least extends to the electrochromic layer deviates from the surface of the first substrate layer, a second conductive element is arranged in the second groove, one end of the second conductive element is electrically connected with the electrochromic layer, and the other end of the second conductive element is electrically connected with the circuit board.
3. The photosensitive circuit assembly of claim 2, wherein said electrochromic layer comprises, in sequential stacked arrangement:
the first transparent conducting layer is connected with the first substrate layer and is electrically connected with the first conducting element;
an ion storage layer;
an electrolyte layer;
an electrochromic filter layer;
and the second transparent conducting layer is connected with the second substrate layer and is electrically connected with the second conducting element.
4. The light sensing circuit assembly of claim 3,
the first groove at most extends to the surface of the first transparent conducting layer close to the ion storage layer;
the second groove at most extends to the surface of the second transparent conductive layer close to the electrochromic filter layer.
5. The photosensitive circuit assembly of claim 2,
the color-changing assembly further comprises an infrared filter layer, the infrared filter layer is arranged on the surface, away from the electrochromic layer, of the first base material layer, and the infrared filter layer is used for filtering infrared light in the light to be sensed;
the color-changing assembly further comprises an anti-reflection layer, and the anti-reflection layer is arranged on the surface, away from the electrochromic layer, of the second substrate layer.
6. The light sensing circuit assembly of claim 3,
the support includes the curb plate, the curb plate is followed the periphery of loading end is arranged, the perpendicular to is followed to at least part of curb plate the thickness direction of circuit board and inwards extend and form the supporting part, the supporting part with the circuit board interval, the subassembly that discolours set up in on the supporting part, just deviating from of supporting part the one end of curb plate is enclosed and is established the formation and lead to the light mouth, photosensitive circuit is located lead to the below of light mouth.
7. The photosensitive circuit assembly of claim 6,
at least part of the surface of the side plate, which is far away from the circuit board, extends towards the direction close to the circuit board to form a third groove, a first wiring terminal electrically connected with the circuit board is arranged at the groove bottom of the third groove, at least part of the surface of the bearing part, which is far away from the circuit board, extends towards the direction close to the circuit board to form a fourth groove, and a second wiring terminal electrically connected with the circuit board is arranged at the groove bottom of the fourth groove;
after the color-changing assembly is arranged on the bearing part, the second groove and the fourth groove are oppositely arranged;
when the first groove extends to the surface of the electrochromic layer away from the second substrate layer, one end of the first conductive element is electrically connected with the groove bottom of the first groove, or when the first groove extends to the surface of the first transparent conductive layer close to the ion storage layer, one end of the first conductive element is electrically connected with the groove side wall of the first groove, and the other end of the first conductive element is electrically connected with the first terminal;
when the second groove extends to the surface of the electrochromic layer deviating from the first substrate layer, one end of the second conductive element is electrically connected with the groove bottom of the second groove, or when the second groove extends to the surface of the second transparent conductive layer close to the ion storage layer, one end of the second conductive element is electrically connected with the groove side wall of the second groove, and the other end of the second conductive element is electrically connected with the second wiring terminal.
8. The photosensitive circuit assembly of claim 6,
the color-changing assembly is arranged on the bearing part, the peripheral edge of the color-changing assembly and the side plates form a filling space at intervals, and an adhesive layer for connecting the color-changing assembly and the bearing part is arranged in the filling space.
9. The photosensitive circuit assembly of claim 1,
the color changing assembly is configured to exhibit different colors in response to application of different voltages.
10. The photosensitive circuit assembly of claim 1,
when the color-changing assembly is in a power-off state, the color-changing assembly is in the light-blocking state;
when the color-changing component is in a power-on state and a preset voltage is applied, the color-changing component is in the light-on state.
11. The utility model provides a camera module which characterized in that includes:
the photosensitive circuit assembly of any one of claims 1 to 10;
the lens assembly is used for receiving the object side light and providing the light to be sensed to the light sensing circuit assembly.
12. An electronic device comprising the camera module of claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021448605.4U CN213367904U (en) | 2020-07-21 | 2020-07-21 | Photosensitive circuit assembly, camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021448605.4U CN213367904U (en) | 2020-07-21 | 2020-07-21 | Photosensitive circuit assembly, camera module and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114422667A (en) * | 2021-12-24 | 2022-04-29 | 江西盛泰精密光学有限公司 | Camera module and imaging control method thereof |
| CN115484416A (en) * | 2021-06-15 | 2022-12-16 | 中移(成都)信息通信科技有限公司 | Protection device and early warning system for camera device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115484416A (en) * | 2021-06-15 | 2022-12-16 | 中移(成都)信息通信科技有限公司 | Protection device and early warning system for camera device |
| CN115484416B (en) * | 2021-06-15 | 2023-10-31 | 中移(成都)信息通信科技有限公司 | Protection device for camera device and early warning system |
| CN114422667A (en) * | 2021-12-24 | 2022-04-29 | 江西盛泰精密光学有限公司 | Camera module and imaging control method thereof |
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