CN213357742U - Chemical vapor deposition device convenient to remove - Google Patents
Chemical vapor deposition device convenient to remove Download PDFInfo
- Publication number
- CN213357742U CN213357742U CN202022389338.4U CN202022389338U CN213357742U CN 213357742 U CN213357742 U CN 213357742U CN 202022389338 U CN202022389338 U CN 202022389338U CN 213357742 U CN213357742 U CN 213357742U
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- Prior art keywords
- cylinder
- uniform distribution
- piece
- gas
- clamping arm
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- 238000005229 chemical vapour deposition Methods 0.000 title claims abstract description 22
- 238000009827 uniform distribution Methods 0.000 claims abstract description 42
- 238000004062 sedimentation Methods 0.000 claims abstract description 26
- 238000000151 deposition Methods 0.000 claims abstract description 10
- 230000008021 deposition Effects 0.000 claims abstract description 10
- 238000009826 distribution Methods 0.000 claims abstract description 5
- 235000012431 wafers Nutrition 0.000 claims description 55
- 238000001556 precipitation Methods 0.000 claims description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- 230000033001 locomotion Effects 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 239000013049 sediment Substances 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 53
- 239000012495 reaction gas Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 239000000376 reactant Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002902 organometallic compounds Chemical group 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Chemical Vapour Deposition (AREA)
Abstract
The utility model discloses a chemical vapor deposition device convenient to move, which comprises a deposition cylinder, a gas uniform distribution piece and a wafer distribution piece; the bottom of the sedimentation cylinder is provided with a base; the bottom of the base is provided with four rollers; the periphery of the base is provided with a supporting stud respectively; the periphery of the base is respectively provided with a threaded hole which penetrates through the top surface and the bottom surface of the base; the support stud is in threaded connection with the threaded hole; the bottom end of the supporting stud is rotatably connected with the supporting seat. The utility model is provided with the roller and the support studs, when the sedimentation device is required to be moved, the four support studs are respectively rotated to enable the support studs to move upwards until the roller contacts the ground, and the sedimentation device is moved by the roller; when the sedimentation device needs to be fixed, the support stud is rotated reversely to move downwards until the support base contacts with the support surface to play a supporting role; therefore, this application sediment device both is convenient for remove, can realize again supporting fixed action.
Description
Technical Field
The utility model belongs to the technical field of vapor deposition equipment, concretely relates to chemical vapor deposition device convenient to remove.
Background
The chemical vapor deposition of metal organic compound is one new kind of vapor phase epitaxial production technology developed based on vapor phase epitaxial growth. Currently, a general vapor deposition apparatus includes a heating system, a cooling system, a gas transport system, a vapor deposition system, etc., in which a reaction gas after a previous series of processes enters a deposition chamber and diffuses to a surface of a wafer in the deposition chamber, and a thin film is formed in a reaction region near the surface of the wafer. Usually, the settling chambers of a gas settling system are placed in the cell of a gas phase settling apparatus, wherein the respective settling chamber needs to be moved when assembling with other systems or when changing over the cell.
At present, the movement of the sedimentation cavity is carried by manpower, and the consumed labor intensity is high.
Therefore, it is desirable to design a chemical vapor deposition apparatus that is easy to move.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the defects of the prior art and providing a chemical vapor deposition device convenient to move.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a chemical vapor deposition device convenient to move comprises a deposition cylinder, a gas uniform distribution piece and a wafer distribution piece;
the sedimentation cylinder is of a cylindrical structure with two ends blocked;
the gas uniform distribution piece is of a cylindrical structure, and an annular uniform distribution cavity extending along the axial direction of the cylinder is arranged in the side wall of the cylinder of the gas uniform distribution piece; a plurality of gas uniform distribution holes communicated with the annular uniform distribution cavity are uniformly formed in the inner side wall of the cylinder of the gas uniform distribution piece; a gas inlet pipe communicated with the annular uniform distribution cavity is arranged on the outer side wall of the cylinder of the gas uniform distribution piece;
the wafer arrangement piece is of a cylindrical structure, and a plurality of clamping cylinders for mounting wafers are uniformly arranged on the side wall of the wafer arrangement piece;
the clamping cylinder comprises an upper clamping arm and a lower clamping arm, wherein the upper clamping arm and the lower clamping arm are arranged in an up-down symmetrical mode and are of arc structures;
the upper clamping arm is fixedly arranged on the outer side wall of the wafer arrangement piece, and the central axis of the upper clamping arm is vertically intersected with the central axis of the wafer arrangement piece;
the lower clamping arm is in up-and-down sliding connection with the wafer arrangement piece, and the central axis of the lower clamping arm is vertically intersected with the central axis of the wafer arrangement piece; the lower wall surface of the lower clamping arm is connected with an adjusting screw rod;
a control seat is arranged on the wafer arranging piece below the lower clamping arm, and an adjusting nut is rotationally connected in the control seat;
the adjusting screw rod is in threaded connection with the adjusting nut;
the gas uniform distribution piece is coaxially arranged inside the precipitation cylinder, and the side wall of the precipitation cylinder is provided with a through hole for a gas inlet pipe to pass through;
the wafer arrangement piece is coaxially arranged inside the gas uniform distribution piece, and the bottom end of the wafer arrangement piece is fixedly connected with the bottom end of the inner side of the precipitation cylinder;
the bottom of the sedimentation cylinder is provided with a base; the bottom of the base is provided with four rollers;
the periphery of the base is provided with a supporting stud respectively;
the periphery of the base is provided with a threaded hole which penetrates through the top surface and the bottom surface of the base; the support stud is in threaded connection with the threaded hole;
the bottom end of the supporting stud is rotatably connected with the supporting seat through a bearing.
Preferably, the wafer arrangement piece is provided with a plurality of limiting sliding chutes extending along the axial direction along the circumferential direction;
and the end part of the lower clamping arm is provided with a limiting slide block which is in sliding fit with the corresponding sliding groove.
Preferably, the limiting sliding block is a T-shaped sliding block, and the limiting sliding groove is a T-shaped sliding groove.
Preferably, the adjusting nut is provided with an adjusting handle.
Preferably, the sedimentation cylinder comprises an upper sedimentation cylinder and a lower sedimentation cylinder which are arranged in an up-and-down symmetrical manner;
the bottom end of the upper settling cylinder is provided with an upper connecting flange; the top end of the lower sedimentation cylinder is provided with a lower connecting flange;
the upper connecting flange and the lower connecting flange are connected through bolts.
Preferably, the middle part of the outer side wall of the gas uniform distribution piece is provided with an annular mounting plate; a plurality of connecting holes are uniformly formed in the annular mounting plate along the circumferential direction;
the annular mounting plate is positioned between the upper connecting flange and the lower connecting flange;
the upper connecting flange, the annular mounting plate and the lower connecting flange are connected through bolts.
Preferably, an inlet valve is arranged on the gas inlet pipe.
Preferably, the gas inlet pipe at the front end of the inlet valve is provided with a filter member for filtering gas.
Preferably, the filter element comprises a cylindrical filter cartridge, and a plurality of layers of steel wire filter screens are uniformly embedded in the inner side surface of the filter cartridge along the axial direction;
and two ends of the filter cylinder are connected with the gas inlet pipe through flanges.
The utility model has the advantages that:
(1) the utility model is provided with the roller and the support studs, when the sedimentation device is required to be moved, the four support studs are respectively rotated to enable the support studs to move upwards until the roller contacts the ground, and the sedimentation device is moved by the roller; when the sedimentation device needs to be fixed, the support stud is rotated reversely to move downwards until the support base contacts with the support surface to play a supporting role; therefore, this application sediment device both is convenient for remove, can realize again supporting fixed action.
(2) The utility model discloses well structure setting of pressing from both sides a section of thick bamboo, under the screw-thread fit of spacing spout and spacing slider's slip spacing cooperation, accommodate the lead screw and adjusting nut, when rotating adjusting nut, accommodate the lead screw can realize the up-and-down motion to the centre gripping arm is close to last centre gripping arm or keeps away from last centre gripping arm under the drive, thereby can the different thickness size's of centre gripping wafer of centre gripping between the messenger last centre gripping arm and the lower centre gripping arm, has increased the suitability.
(3) The utility model is provided with the gas uniform distribution piece, and the arrangement of the annular uniform distribution cavity reduces the flow velocity of the incoming gas in the gas inlet pipe, so as to prevent the reaction gas from being sprayed onto the wafer at a higher speed to influence the generation of the film; second, as a containment and buffer space for the reactant gases; third, the annular design and the design of the gas uniform distribution holes uniformly distributed on the inner side of the annular design enable reaction gas to be diffused to the positions of all wafers from all directions of the circumference of the wafer arrangement piece 3, the diffusion uniformity of the reaction gas is greatly improved, and the consistency of the thickness of the generated film is ensured.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application.
FIG. 1 is a schematic perspective view of the mobile chemical vapor deposition apparatus of the present invention;
FIG. 2 is an axial cross-sectional view of the chemical vapor deposition apparatus of the present invention, which is easy to move;
FIG. 3 is a radial cross-sectional view of the chemical vapor deposition apparatus of the present invention, which is easy to move;
FIG. 4 is a schematic perspective view of the gas distributor of the present invention;
FIG. 5 is an axial cross-sectional view of the gas distributor of the present invention;
FIG. 6 is a radial cross-sectional view of the gas distributor of the present invention;
fig. 7 is a schematic perspective view of a wafer arrangement according to the present invention;
wherein,
1-a precipitation cylinder, 11-an upper precipitation cylinder, 12-a lower precipitation cylinder, 13-an upper connecting flange and 14-a lower connecting flange;
2-gas uniform distribution piece, 21-annular uniform distribution cavity, 22-gas uniform distribution hole, 23-gas inlet pipe, 231-inlet valve and 24-annular mounting plate;
3-wafer arrangement part, 31-clamping cylinder, 311-upper clamping arm, 312-lower clamping arm, 313-adjusting screw rod, 314-control seat, 315-adjusting nut, 316-limiting slide block, 317-adjusting handle and 32-limiting sliding groove;
4-filter element, 41-filter cartridge, 42-steel wire filter screen;
5-base, 51-roller, 52-support stud, 521-support adjusting handle and 53-support seat.
Detailed Description
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
In the present invention, the terms such as "upper", "lower", "bottom", "top" and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, and the relationship term determined only for the convenience of describing the structural relationship of each component or element of the present invention is not particularly referred to any component or element of the present invention, and the limitation of the present invention cannot be understood.
In the present invention, terms such as "connected" and "connected" should be understood in a broad sense, and may be either fixedly connected or integrally connected or detachably connected; may be directly connected or indirectly connected through an intermediate. The meaning of the above terms in the present invention can be determined according to specific situations by persons skilled in the art, and should not be construed as limiting the present invention.
The present invention will be further explained with reference to the drawings and examples.
As shown in fig. 1-3, a mobile chemical vapor deposition apparatus includes a deposition cylinder 1, a gas distribution member 2, a wafer distribution member 3;
the sedimentation cylinder 1 is of a cylindrical structure with two sealed ends;
as shown in fig. 4-6, the gas uniform distribution piece 2 is of a cylindrical structure, and an annular uniform distribution cavity 21 extending along the axial direction of the cylinder is arranged in the cylinder side wall of the gas uniform distribution piece 2; a plurality of gas uniform distribution holes 22 communicated with the annular uniform distribution cavity 21 are uniformly formed in the inner side wall of the cylinder of the gas uniform distribution piece 2; a gas inlet pipe 23 communicated with the annular uniform distribution cavity 21 is arranged on the outer side wall of the cylinder of the gas uniform distribution piece 2; the arrangement of the annular uniform distribution cavity 21 firstly reduces the flow rate of incoming gas in the gas inlet pipe 23, and prevents the reaction gas from being sprayed onto the wafer at a higher speed to influence the generation of a film; second, as a containment and buffer space for the reactant gases; thirdly, the annular design and the design of the gas uniformly distributed holes uniformly distributed on the inner side of the annular design enable the reaction gas to be diffused to the positions of all wafers from all directions of the circumference of the wafer arrangement piece 3, so that the diffusion uniformity of the reaction gas is greatly improved, and the consistency of the thickness of the generated film is ensured;
the wafer arrangement piece 3 is of a cylindrical structure, and a plurality of clamping cylinders 31 for mounting wafers are uniformly arranged on the side wall of the wafer arrangement piece 3;
as shown in fig. 7, the cartridge 31 includes an upper holding arm 311 and a lower holding arm 312, which are symmetrically arranged in the up-down direction and have an arc structure;
the upper clamping arm 311 is fixedly arranged on the outer side wall of the wafer arranging part 3, and the central axis of the upper clamping arm 311 is vertically intersected with the central axis of the wafer arranging part 3;
the lower clamping arm 312 is connected with the wafer arranging part 3 in a sliding manner in the vertical direction, and the central axis of the lower clamping arm 312 is vertically intersected with the central axis of the wafer arranging part 3; an adjusting screw rod 313 is connected to the lower wall surface of the lower clamping arm 312;
a control seat 314 is arranged on the wafer arranging part 3 below the lower clamping arm 312, and an adjusting nut 315 is rotatably connected in the control seat 314;
the adjusting screw rod 313 is in threaded connection with an adjusting nut 315;
the gas uniform distribution piece 2 is coaxially arranged inside the precipitation cylinder 1, and a through hole for a gas inlet pipe 23 to pass through is formed in the side wall of the precipitation cylinder 1;
the wafer arrangement piece 3 is coaxially arranged inside the gas uniform distribution piece 2, and the bottom end of the wafer arrangement piece 3 is fixedly connected with the bottom end of the inner side of the precipitation cylinder 1;
the bottom of the sedimentation cylinder 1 is provided with a base 5; the bottom of the base 5 is provided with four rollers 51 which are convenient to move;
the periphery of the base 1 is provided with a support stud 52 respectively;
the periphery of the base 1 is respectively provided with a threaded hole penetrating through the top surface and the bottom surface of the base 1; the support stud 52 is in threaded connection with the threaded hole;
the bottom end of the support stud 52 is rotatably connected with the support base 53 through a bearing.
Preferably, a support adjusting handle 521 is disposed on the upper portion of the support stud 52.
Preferably, a level is arranged on the base 1.
When the sedimentation device is required to be moved, the four support studs 52 are respectively rotated to enable the support studs 52 to move upwards until the roller 51 contacts the ground, and the sedimentation device is moved through the roller 51;
when the sedimentation device needs to be fixed, the support stud 52 is rotated reversely, so that the support stud 52 moves downwards until the support base 53 contacts the ground to play a supporting role; when the bottom surface of a workshop supporting the sedimentation device is uneven, the four support studs 52 are respectively adjusted, the base 1 can be adjusted to be horizontal, and meanwhile, a level gauge on the base 1 detects the levelness of the base 1, so that the regulation of the support studs 52 is guided; simultaneously in this application support stud 52 not with the holding surface contact, supporting seat 53 and holding surface direct contact, and can rotate relatively between supporting seat 53 and the support stud 52, consequently at the in-process of rotatory support stud 52, supporting seat 53 does not take place to rotate, can not fish tail the contact surface.
Preferably, a plurality of limiting sliding grooves 32 extending axially are arranged on the wafer arranging member 3 along the circumferential direction;
the end of the lower clamping arm 312 is provided with a limit slider 316 which is in sliding fit with the corresponding chute 32.
Under the sliding limit matching of the limit sliding groove 32 and the limit sliding block 316 and the thread matching of the adjusting screw rod 313 and the adjusting nut 315, when the adjusting nut 315 is rotated, the adjusting screw rod 313 can move up and down, so that the lower clamping arm 312 is driven to be close to the upper clamping arm 311 or to be far away from the upper clamping arm 311, and therefore wafers with different thicknesses and sizes can be clamped between the upper clamping arm 311 and the lower clamping arm 312, and the applicability is improved.
Preferably, the limiting sliding block 316 is a T-shaped sliding block, and the limiting sliding groove 32 is a T-shaped sliding groove.
Preferably, the adjusting nut 315 is provided with an adjusting handle 317.
Preferably, the sedimentation cylinder 1 comprises an upper sedimentation cylinder 11 and a lower sedimentation cylinder 12 which are arranged in an up-and-down symmetrical manner;
the bottom end of the upper settling cylinder 11 is provided with an upper connecting flange 13; the top end of the lower settling cylinder 12 is provided with a lower connecting flange 14;
the upper connecting flange 13 and the lower connecting flange 14 are connected by bolts.
Preferably, the middle part of the outer side wall of the gas uniform distribution piece 2 is provided with an annular mounting plate 24; a plurality of connecting holes are uniformly formed in the annular mounting plate 24 along the circumferential direction;
the annular mounting plate 24 is positioned between the upper connecting flange 13 and the lower connecting flange 14;
the upper connecting flange, the annular mounting plate 24 and the lower connecting flange 14 are connected by bolts.
Preferably, an inlet valve 231 is provided on the gas inlet pipe 23.
Preferably, a filter member 4 for filtering the gas is provided on the gas inlet pipe 23 at the front end of the inlet valve 231.
Preferably, the filter element 4 includes a filter cartridge 41 having a cylindrical structure, and a plurality of layers of steel wire filter screens 42 are uniformly embedded in the inner side surface of the filter cartridge 41 along the axial direction;
the filter cartridge 42 is flanged at both ends to the gas inlet pipe 23 to facilitate cleaning and replacement of the filter element 4.
A chemical vapor deposition device convenient to move comprises the following specific embodiments:
before use, each wafer is clamped on the wafer arrangement part 3, when the wafer is clamped, the adjusting nut 315 is firstly rotated to enable the adjusting screw rod 313 to move downwards, and then the wafer is placed between the upper clamping arm 311 and the lower clamping arm 312; the adjustment nut 315 is then rotated in the opposite direction, causing the adjustment screw to move upward until the upper clamp arm 311 and lower clamp arm 312 clamp the wafer.
After the wafer clamping is finished, the deposition device is moved to a proper position of a workshop through the roller 51, and connection and assembly with other systems are completed; the support studs 52 are then rotated to move the support studs 52 downwardly until the support seats 53 contact the underside of the workcell to provide support.
During the use, reactant gas enters into the annular equipartition chamber 21 in the gas equipartition piece 2 after the filtration of the interior filter piece 4 of gas inlet pipe 23, after the diffusion and the cushioning effect of annular equipartition chamber 21, evenly diffuses to each wafer position department along each direction of 3 circumferences of wafer arrangement piece through gas equipartition hole 22, has greatly promoted reactant gas's diffusion homogeneity to guarantee to generate film thickness's uniformity.
Although the present invention has been described with reference to the accompanying drawings, it is not intended to limit the present invention, and those skilled in the art should understand that, based on the technical solution of the present invention, various modifications or variations that can be made by those skilled in the art without inventive labor are still within the scope of the present invention.
Claims (9)
1. A chemical vapor deposition device convenient to move is characterized by comprising a deposition cylinder, a gas uniform distribution piece and a wafer distribution piece;
the sedimentation cylinder is of a cylindrical structure with two ends blocked;
the gas uniform distribution piece is of a cylindrical structure, and an annular uniform distribution cavity extending along the axial direction of the cylinder is arranged in the side wall of the cylinder of the gas uniform distribution piece; a plurality of gas uniform distribution holes communicated with the annular uniform distribution cavity are uniformly formed in the inner side wall of the cylinder of the gas uniform distribution piece; a gas inlet pipe communicated with the annular uniform distribution cavity is arranged on the outer side wall of the cylinder of the gas uniform distribution piece;
the wafer arrangement piece is of a cylindrical structure, and a plurality of clamping cylinders for mounting wafers are uniformly arranged on the side wall of the wafer arrangement piece;
the clamping cylinder comprises an upper clamping arm and a lower clamping arm, wherein the upper clamping arm and the lower clamping arm are arranged in an up-down symmetrical mode and are of arc structures;
the upper clamping arm is fixedly arranged on the outer side wall of the wafer arrangement piece, and the central axis of the upper clamping arm is vertically intersected with the central axis of the wafer arrangement piece;
the lower clamping arm is in up-and-down sliding connection with the wafer arrangement piece, and the central axis of the lower clamping arm is vertically intersected with the central axis of the wafer arrangement piece; the lower wall surface of the lower clamping arm is connected with an adjusting screw rod;
a control seat is arranged on the wafer arranging piece below the lower clamping arm, and an adjusting nut is rotationally connected in the control seat;
the adjusting screw rod is in threaded connection with the adjusting nut;
the gas uniform distribution piece is coaxially arranged inside the precipitation cylinder, and the side wall of the precipitation cylinder is provided with a through hole for a gas inlet pipe to pass through;
the wafer arrangement piece is coaxially arranged inside the gas uniform distribution piece, and the bottom end of the wafer arrangement piece is fixedly connected with the bottom end of the inner side of the precipitation cylinder;
the bottom of the sedimentation cylinder is provided with a base; the bottom of the base is provided with four rollers;
the periphery of the base is provided with a supporting stud respectively;
the periphery of the base is provided with a threaded hole which penetrates through the top surface and the bottom surface of the base; the support stud is in threaded connection with the threaded hole;
the bottom end of the supporting stud is rotatably connected with the supporting seat through a bearing.
2. The mobile chemical vapor deposition apparatus as recited in claim 1, wherein the wafer arranging member is provided with a plurality of axially extending limiting chutes along a circumferential direction;
and the end part of the lower clamping arm is provided with a limiting slide block which is in sliding fit with the corresponding sliding groove.
3. The chemical vapor deposition apparatus convenient for movement of claim 2, wherein the limiting slide block is a T-shaped slide block, and the limiting chute is a T-shaped chute.
4. The chemical vapor deposition apparatus facilitating movement of the same as claimed in claim 1, wherein the adjustment nut is provided with an adjustment handle.
5. The chemical vapor deposition apparatus convenient to move as set forth in claim 1, wherein the deposition drum comprises an upper deposition drum and a lower deposition drum which are disposed in an up-down symmetrical manner;
the bottom end of the upper settling cylinder is provided with an upper connecting flange; the top end of the lower sedimentation cylinder is provided with a lower connecting flange;
the upper connecting flange and the lower connecting flange are connected through bolts.
6. The chemical vapor deposition apparatus convenient to move as set forth in claim 5, wherein an annular mounting plate is provided in the middle of the outer side wall of the gas uniforming member; a plurality of connecting holes are uniformly formed in the annular mounting plate along the circumferential direction;
the annular mounting plate is positioned between the upper connecting flange and the lower connecting flange;
the upper connecting flange, the annular mounting plate and the lower connecting flange are connected through bolts.
7. The mobile facilitated chemical vapor deposition apparatus of claim 1, wherein an inlet valve is provided on said gas inlet pipe.
8. The mobile chemical vapor deposition apparatus of claim 7, wherein a filter member for filtering the gas is provided on the gas inlet pipe at a front end of the inlet valve.
9. The mobile chemical vapor deposition apparatus according to claim 8, wherein the filter member comprises a filter cartridge having a cylindrical structure, and a plurality of layers of steel wire filter nets are uniformly embedded in the inner side surface of the filter cartridge along the axial direction;
and two ends of the filter cylinder are connected with the gas inlet pipe through flanges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022389338.4U CN213357742U (en) | 2020-10-24 | 2020-10-24 | Chemical vapor deposition device convenient to remove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022389338.4U CN213357742U (en) | 2020-10-24 | 2020-10-24 | Chemical vapor deposition device convenient to remove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213357742U true CN213357742U (en) | 2021-06-04 |
Family
ID=76131996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022389338.4U Expired - Fee Related CN213357742U (en) | 2020-10-24 | 2020-10-24 | Chemical vapor deposition device convenient to remove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213357742U (en) |
-
2020
- 2020-10-24 CN CN202022389338.4U patent/CN213357742U/en not_active Expired - Fee Related
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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Granted publication date: 20210604 |