CN213327431U - Silica gel insulating pad - Google Patents
Silica gel insulating pad Download PDFInfo
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- CN213327431U CN213327431U CN202022038974.2U CN202022038974U CN213327431U CN 213327431 U CN213327431 U CN 213327431U CN 202022038974 U CN202022038974 U CN 202022038974U CN 213327431 U CN213327431 U CN 213327431U
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Abstract
The utility model discloses a silica gel insulating pad piece, include: the heat-conducting silicone adhesive comprises a first heat-conducting silicone layer, a second heat-conducting silicone layer and a polyimide layer positioned between the first heat-conducting silicone layer and the second heat-conducting silicone layer, wherein the surface of the second heat-conducting silicone layer opposite to the polyimide layer is provided with an aluminum foil layer, the surface of the first heat-conducting silicone layer opposite to the polyimide layer is provided with a heat-conducting adhesive layer, and a release film is in adhesive connection with the heat-conducting adhesive layer; a plurality of I-shaped through holes distributed at intervals are formed in the polyimide layer, and the interval between every two adjacent I-shaped through holes is 6-12 mm. The utility model discloses silica gel insulating pad had both improved stretch-proofing performance and insulating properties, also strengthened binding force, had avoided in the use layering phenomenon, had realized the better radiating effect of silica gel insulating pad.
Description
Technical Field
The utility model relates to an electronic equipment subsidiary heat dissipation technical field especially relates to a silica gel insulating pad piece.
Background
With the miniaturization and high integration of integrated circuits, the packing density of electronic components continues to increase, providing powerful usage functions, while also leading to a dramatic increase in the operating power consumption and heat generation thereof. High temperatures can have detrimental effects on the stability, reliability and lifetime of electronic components, such as excessive temperatures that can compromise semiconductor junctions, damage the circuit connection interfaces, increase the resistance of the conductors and cause mechanical stress damage. The reliability of the communication device or the electronic component is reduced by 50 percent for each 10 ℃ rise of the working temperature. Therefore, in order to ensure high reliability while the device exhibits optimum performance, it is necessary to ensure that the heat generated by the heat-generating electronic component can be discharged in time.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a silica gel insulating pad piece, this silica gel insulating pad piece had both improved stretch-proofing performance and insulating properties, has also strengthened binding power, has avoided in the use layering phenomenon, has realized the better radiating effect of silica gel insulating pad piece.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a silicone insulating gasket comprising: the heat-conducting silicone adhesive comprises a first heat-conducting silicone layer, a second heat-conducting silicone layer and a polyimide layer positioned between the first heat-conducting silicone layer and the second heat-conducting silicone layer, wherein the surface of the second heat-conducting silicone layer opposite to the polyimide layer is provided with an aluminum foil layer, the surface of the first heat-conducting silicone layer opposite to the polyimide layer is provided with a heat-conducting adhesive layer, and a release film is in adhesive connection with the heat-conducting adhesive layer; a plurality of I-shaped through holes distributed at intervals are formed in the polyimide layer, and the interval between every two adjacent I-shaped through holes is 6-12 mm.
1. In the above scheme, the respective thickness of the first heat-conducting silica gel layer and the second heat-conducting silica gel layer is 1-3 mm.
2. In the scheme, the thickness of the polyimide layer is 40-60 mu m.
3. In the scheme, the release film consists of a substrate layer and a silicon oil layer coated on one surface of the substrate layer.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model discloses silica gel insulating pad, it is located and is provided with the polyimide layer between first heat conduction silica gel layer and the second heat conduction silica gel layer, and it has a plurality of interval distribution's I-shaped through-hole to open on the polyimide layer, and the interval between the adjacent I-shaped through-hole is 6~12 mm, has both improved tensile resistance and insulating properties, has also strengthened the cohesion between first heat conduction silica gel layer, the second heat conduction silica gel layer, has avoided the layering phenomenon in the use, has realized the better radiating effect of silica gel insulating pad; in addition, the surface of the second heat conduction silica gel layer, which is back to the polyimide layer, is provided with an aluminum foil layer, so that the heat expansion and the shielding performance improvement are further facilitated, and the safety performance of the electronic component is improved.
Drawings
FIG. 1 is a schematic structural view of the silica gel insulating spacer of the present invention;
fig. 2 is a partial schematic view of fig. 1.
In the above drawings: 1. a first heat-conducting silica gel layer; 2. a second heat-conducting silica gel layer; 3. a polyimide layer; 4. an aluminum foil layer; 5. a thermally conductive adhesive layer; 6. a release film; 61. a substrate layer; 62. a silicon oil layer; 7. an I-shaped through hole.
Detailed Description
Example 1: a silicone insulating gasket comprising: the heat-conducting silicone adhesive comprises a first heat-conducting silicone layer 1, a second heat-conducting silicone layer 2 and a polyimide layer 3 positioned between the first heat-conducting silicone layer 1 and the second heat-conducting silicone layer 2, wherein the surface of the second heat-conducting silicone layer 2 opposite to the polyimide layer 3 is provided with an aluminum foil layer 4, the surface of the first heat-conducting silicone layer 1 opposite to the polyimide layer 3 is provided with a heat-conducting adhesive layer 5, and a release film 6 is in adhesive connection with the heat-conducting adhesive layer 5; a plurality of I-shaped through holes 7 distributed at intervals are formed in the polyimide layer 3, and the interval between every two adjacent I-shaped through holes 7 is 6-12 mm.
The thickness of each of the first heat-conducting silica gel layer 1 and the second heat-conducting silica gel layer 2 is 1.2 mm.
The thickness of the polyimide layer 3 was 50 μm.
Example 2: a silicone insulating gasket comprising: the heat-conducting silicone adhesive comprises a first heat-conducting silicone layer 1, a second heat-conducting silicone layer 2 and a polyimide layer 3 positioned between the first heat-conducting silicone layer 1 and the second heat-conducting silicone layer 2, wherein the surface of the second heat-conducting silicone layer 2 opposite to the polyimide layer 3 is provided with an aluminum foil layer 4, the surface of the first heat-conducting silicone layer 1 opposite to the polyimide layer 3 is provided with a heat-conducting adhesive layer 5, and a release film 6 is in adhesive connection with the heat-conducting adhesive layer 5; a plurality of I-shaped through holes 7 distributed at intervals are formed in the polyimide layer 3, and the interval between every two adjacent I-shaped through holes 7 is 6-12 mm.
The thickness of each of the first heat-conducting silica gel layer 1 and the second heat-conducting silica gel layer 2 is 2.5 mm.
The thickness of the polyimide layer 3 was 55 μm.
The release film 6 is composed of a substrate layer 61 and a silicone oil layer 62 coated on one surface of the substrate layer 61.
When the silica gel insulating gasket is adopted, the polyimide layer is arranged between the first heat-conducting silica gel layer and the second heat-conducting silica gel layer, the polyimide layer is provided with a plurality of I-shaped through holes distributed at intervals, and the interval between every two adjacent I-shaped through holes is 6-12 mm, so that the tensile resistance and the insulating property are improved, the binding force between the first heat-conducting silica gel layer and the second heat-conducting silica gel layer is enhanced, the phenomenon of layering in use is avoided, and the better heat dissipation effect of the silica gel insulating gasket is realized; in addition, the surface of the second heat conduction silica gel layer, which is back to the polyimide layer, is provided with an aluminum foil layer, so that the heat expansion and the shielding performance improvement are further facilitated, and the safety performance of the electronic component is improved.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. A silica gel insulating gasket is characterized in that: the method comprises the following steps: the heat-conducting silicone adhesive comprises a first heat-conducting silicone layer (1), a second heat-conducting silicone layer (2) and a polyimide layer (3) positioned between the first heat-conducting silicone layer (1) and the second heat-conducting silicone layer (2), wherein the surface of the second heat-conducting silicone layer (2) opposite to the polyimide layer (3) is provided with an aluminum foil layer (4), the surface of the first heat-conducting silicone layer (1) opposite to the polyimide layer (3) is provided with a heat-conducting adhesive layer (5), and a release film (6) is in adhesive connection with the heat-conducting adhesive layer (5); a plurality of I-shaped through holes (7) distributed at intervals are formed in the polyimide layer (3), and the interval between every two adjacent I-shaped through holes (7) is 6-12 mm.
2. The silicone insulating gasket of claim 1, wherein: the respective thickness of first heat conduction silica gel layer (1), second heat conduction silica gel layer (2) is 1~3 mm.
3. The silicone insulating gasket of claim 1, wherein: the thickness of the polyimide layer (3) is 40-60 mu m.
4. The silicone insulating gasket of claim 1, wherein: the release film (6) is composed of a base material layer (61) and a silicon oil layer (62) coated on one surface of the base material layer (61).
5. The silicone insulating gasket of claim 4, wherein: the substrate layer (61) of the release film (6) is a polyester film, a polypropylene film or a polyethylene film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022038974.2U CN213327431U (en) | 2020-09-17 | 2020-09-17 | Silica gel insulating pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022038974.2U CN213327431U (en) | 2020-09-17 | 2020-09-17 | Silica gel insulating pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213327431U true CN213327431U (en) | 2021-06-01 |
Family
ID=76064114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022038974.2U Active CN213327431U (en) | 2020-09-17 | 2020-09-17 | Silica gel insulating pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213327431U (en) |
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2020
- 2020-09-17 CN CN202022038974.2U patent/CN213327431U/en active Active
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