CN213304076U - Water heater temperature-sensing chip packaging machine - Google Patents
Water heater temperature-sensing chip packaging machine Download PDFInfo
- Publication number
- CN213304076U CN213304076U CN202022438408.0U CN202022438408U CN213304076U CN 213304076 U CN213304076 U CN 213304076U CN 202022438408 U CN202022438408 U CN 202022438408U CN 213304076 U CN213304076 U CN 213304076U
- Authority
- CN
- China
- Prior art keywords
- sensing chip
- plate
- water heater
- temperature
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 title abstract description 11
- 239000004593 Epoxy Substances 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 abstract description 6
- 238000005538 encapsulation Methods 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a water heater temperature sensing chip packaging machine, which comprises a bottom plate, a containing pool, a vertical plate, a mounting bracket, a clamping mechanism, a lifting cylinder and a translation mechanism; the vertical plate is provided with a sliding groove; the translation mechanism comprises a moving plate, rollers arranged at two ends of the moving plate and positioned in the sliding groove, and a translation cylinder fixedly connected with one end of the moving plate; through the lift cylinder, clamping machine constructs and installs the frame, can immerse the temperature-sensing chip in the middle of the epoxy who holds the pond, through the spout, the movable plate, gyro wheel and translation cylinder, can realize the translation of temperature-sensing chip in holding the pond again, thereby make epoxy can horizontal submergence temperature-sensing chip, improve the homogeneity and the uniformity that the temperature-sensing chip sealed, it is effectual to pack, consequently, this machine of sealing has realized that the automation of temperature-sensing chip is sealed, the efficiency of sealing is improved, the workman intensity of labour has been alleviateed, it is effectual to seal.
Description
Technical Field
The utility model relates to a temperature-sensing chip encapsulates machine, concretely relates to water heater temperature-sensing chip encapsulates machine.
Background
The temperature sensing chip is fragile and easy to be damaged by external force, and a protective layer is required to be sealed to prevent the chip from being damaged; in the prior art, the commonly used encapsulating materials are: epoxy resin encapsulation, glass encapsulation, ceramic encapsulation and the like, and different encapsulation materials can bring different effects to the temperature sensing chip.
The epoxy resin encapsulation mode in the prior art is finished by manually immersing the temperature sensing chip into the epoxy resin pool, and the manual encapsulation mode has low encapsulation efficiency, strong labor intensity of workers, difficulty in achieving the purpose of uniform encapsulation and poor encapsulation effect.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a water heater temperature sensing chip packaging machine with improved packaging efficiency, reduced labor intensity and good packaging effect.
In order to solve the technical problem, the technical scheme of the utility model is that: a water heater temperature sensing chip packaging machine comprises a bottom plate, a containing pool, vertical plates, a mounting bracket, a clamping mechanism, a lifting cylinder and a translation mechanism, wherein the containing pool is arranged on the bottom plate and used for containing epoxy resin, the vertical plates are arranged on the bottom plate and located on two sides of the containing pool, the mounting bracket is arranged above the containing pool and used for fixing a temperature sensing chip, the clamping mechanism is fixedly clamped with the mounting bracket and located above the containing pool, the lifting cylinder is fixedly connected with the top of the clamping mechanism and located above the clamping mechanism, and the translation mechanism is fixedly connected with the top of the lifting cylinder and located above the vertical plates; the upper surface of the vertical plate is provided with a sliding chute in a downward concave manner; the translation mechanism comprises a moving plate fixedly connected with the top of the lifting cylinder and positioned above the vertical plate, rollers arranged at two ends of the moving plate and positioned in the sliding groove, and a translation cylinder fixedly connected with one end of the moving plate and positioned above the vertical plate; the friction force between the idler wheel and the sliding groove is small, and the moving plate is driven by the translation cylinder to move along the track of the sliding groove.
Preferably, the top of the vertical plate is fixedly provided with an installation plate positioned on one side of the sliding groove, and the translation cylinder is fixedly arranged on the top of the installation plate.
Preferably, the clamping mechanism comprises a fixed plate fixedly connected with the lower end of the lifting cylinder, connecting columns arranged at two ends of the fixed plate, and two clamping plates arranged below the fixed plate and clamped and fixed with the mounting bracket, wherein the fixed plate is fixedly connected with the clamping plates through the connecting columns.
Preferably, the upper surface of the clamping plate is provided with a plurality of first clamping grooves in a downward concave mode, and the clamping plate is clamped and fixed with the mounting bracket through the first clamping grooves.
Preferably, the lower surfaces of the two ends of the mounting bracket are upwards provided with second clamping grooves in a concave mode, and the mounting bracket is fixedly clamped with the first clamping grooves through the second clamping grooves.
Preferably, the first card slot is provided with more than two.
The utility model discloses technical effect mainly embodies: through the lift cylinder, clamping machine constructs and installs the frame, can immerse the temperature-sensing chip in the middle of the epoxy who holds the pond, through the spout, the movable plate, gyro wheel and translation cylinder, can realize the translation of temperature-sensing chip in holding the pond again, thereby make epoxy can horizontal submergence temperature-sensing chip, improve the homogeneity and the uniformity that the temperature-sensing chip sealed, it is effectual to pack, consequently, this machine of sealing has realized that the automation of temperature-sensing chip is sealed, the efficiency of sealing is improved, the workman intensity of labour has been alleviateed, it is effectual to seal.
Drawings
Fig. 1 is a schematic front view of the water heater temperature sensing chip packaging machine of the present invention;
FIG. 2 is a schematic top view of the structure of FIG. 1;
FIG. 3 is a perspective view of the mounting frame of FIG. 1;
fig. 4 is a schematic structural view of the clamping mechanism of fig. 1.
Detailed Description
The following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings, so that the technical solution of the present invention can be more easily understood and grasped.
In the present embodiment, it should be understood that the terms "middle", "upper", "lower", "top", "right", "left", "above", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the present embodiment, if the connection or fixing manner between the components is not specifically described, the connection or fixing manner may be a bolt fixing manner, a pin connecting manner, or the like, which is commonly used in the prior art, and therefore, details thereof are not described in the present embodiment.
A water heater temperature sensing chip packaging machine is shown in figures 1-2 and comprises a bottom plate 1, a containing pool 2 arranged on the bottom plate 1 and used for containing epoxy resin, vertical plates 3 arranged on the bottom plate 1 and located on two sides of the containing pool 2, a mounting bracket 4 arranged above the containing pool 2 and used for fixing a temperature sensing chip 101, a clamping mechanism 5 fixedly clamped with the mounting bracket 4 and located above the containing pool 2, a lifting cylinder 6 fixedly connected with the top of the clamping mechanism 5 and located above the clamping mechanism 5, and a translation mechanism fixedly connected with the top of the lifting cylinder 6 and located above the vertical plates 3; the upper surface of the vertical plate 3 is provided with a sliding groove 31 in a downward concave manner, the top of the vertical plate 3 is fixedly provided with a mounting plate 32 positioned on one side of the sliding groove 31, and the translation cylinder 73 is fixedly mounted on the top of the mounting plate 32. The translation mechanism 7 comprises a moving plate 71 fixedly connected with the top of the lifting cylinder 6 and positioned above the vertical plate 3, rollers 72 arranged at two ends of the moving plate 71 and positioned in the sliding groove 31, and a translation cylinder 73 fixedly connected with one end of the moving plate 71 and positioned above the vertical plate 3; the friction between the roller 72 and the chute 3 is small, which is beneficial for the moving plate 71 to move along the track of the chute 31 under the driving of the translation cylinder 73. Because epoxy has certain thixotropy, the mobility is relatively low, when temperature-sensing chip 101 immerses, can make epoxy separate toward temperature-sensing chip 101 both sides, make temperature-sensing chip 101 afterbody not have epoxy to soak, can not totally seal temperature-sensing chip 101, drive the method that installing support down-moved and translation mechanism 7 drive installing support 4 and carry out the translation through lift cylinder 6, can make each temperature-sensing chip 101 of epoxy horizontal submergence, guarantee that encapsulating of temperature-sensing chip 101 reaches better homogeneity and uniformity, it is effectual to pack.
As shown in fig. 3, the lower surfaces of the two ends of the mounting bracket 4 are recessed upwards to form second locking grooves 41, and the mounting bracket 41 is fixed to the first locking groove 531 through the second locking grooves 41.
As shown in fig. 4, the clamping mechanism 5 includes a fixed plate 51 fixedly connected to the lower end of the lifting cylinder 6, connecting posts 52 disposed at two ends of the fixed plate 51, and two clamping plates 53 disposed below the fixed plate 52 and fixedly clamped to the mounting bracket 4, wherein the fixed plate 51 is fixedly connected to the clamping plates 53 through the connecting posts 52. The upper surface of the clamping plate 53 is provided with a plurality of first clamping grooves 531 in a downward concave manner, and the clamping plate 53 is clamped and fixed with the mounting bracket 4 through the first clamping grooves 531.
In this embodiment, eight first card slots 531 are provided.
In the present embodiment, the lifting cylinder 6 is SC50 × 200, and the translation cylinder 73 is SC63 × 500.
The working principle is as follows: (1) welding the temperature sensing chip 101 on the mounting bracket 4;
(2) the prepared epoxy resin is put into the accommodating pool 2, and the mounting bracket 4 welded with the temperature sensing chip 101 is correspondingly clamped and fixed on the clamping plate 53.
(3) The lifting cylinder 6 is started, the lifting cylinder 6 drives the mounting bracket 4 to move downwards through the clamping mechanism 5, the temperature sensing chip 101 is immersed into the epoxy resin in the accommodating pool 2, the translation cylinder 73 is started again, the translation cylinder 73 drives the lifting cylinder 6 to move through the movable plate 71, and the lifting cylinder 6 drives the mounting bracket 4 to move through the clamping mechanism 5, so that the epoxy resin packaging work is completed.
(4) After the packaging is finished, the translation cylinder 73 drives the mounting bracket 4 to return to the original position, and the lifting cylinder 6 drives the mounting bracket 4 to reset upwards through the clamping mechanism 5.
The utility model discloses technical effect mainly embodies: through the lift cylinder, clamping machine constructs and installs the frame, can immerse the temperature-sensing chip in the middle of the epoxy who holds the pond, through the spout, the movable plate, gyro wheel and translation cylinder, can realize the translation of temperature-sensing chip in holding the pond again, thereby make epoxy can horizontal submergence temperature-sensing chip, improve the homogeneity and the uniformity that the temperature-sensing chip sealed, it is effectual to pack, consequently, this machine of sealing has realized that the automation of temperature-sensing chip is sealed, the efficiency of sealing is improved, the workman intensity of labour has been alleviateed, it is effectual to seal.
Of course, the above is only a typical example of the present invention, and besides, the present invention can also have other various specific embodiments, and all technical solutions adopting equivalent replacement or equivalent transformation are all within the scope of the present invention as claimed.
Claims (6)
1. The utility model provides a water heater temperature-sensing chip encapsulates machine, includes the bottom plate, sets up on the bottom plate, be used for holding epoxy's the pond that holds, set up on the bottom plate, be located hold the riser of pond both sides, set up hold the pond top, be used for fixed temperature-sensing chip's installing support, with the installing support card is held fixed, is located hold the clamping mechanism of pond top, with the top fixed connection's of clamping mechanism lift cylinder, its characterized in that: the translation mechanism is fixedly connected with the top of the lifting cylinder; the upper surface of the vertical plate is provided with a sliding chute in a downward concave manner; the translation mechanism comprises a moving plate fixedly connected with the top of the lifting cylinder and positioned above the vertical plate, rollers arranged at two ends of the moving plate and positioned in the sliding groove, and a translation cylinder fixedly connected with one end of the moving plate.
2. The water heater temperature sensing chip wrapping machine of claim 1, wherein: the top of riser fixed mounting be located the mounting panel of spout one side, translation cylinder fixed mounting is at the top of mounting panel.
3. The water heater temperature sensing chip wrapping machine of claim 1, wherein: the clamping mechanism comprises a fixed plate fixedly connected with the lower end of the lifting cylinder, connecting columns arranged at two ends of the fixed plate, and two clamping plates which are arranged below the fixed plate and clamped and fixed by the mounting bracket, wherein the fixed plate is fixedly connected with the clamping plates through the connecting columns.
4. A water heater temperature sensing chip wrapping machine as claimed in claim 3, wherein: the upper surface of clamping plate is provided with a plurality of first draw-in grooves down sunken, the clamping plate passes through first draw-in groove and installing support card are held fixedly.
5. The water heater temperature sensing chip wrapping machine of claim 4, wherein: the lower surface at installing support both ends is provided with the second draw-in groove up sunkenly, the installing support is held fixedly through second draw-in groove and first draw-in groove card.
6. The water heater temperature sensing chip wrapping machine of claim 4, wherein: the first clamping groove is provided with more than two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022438408.0U CN213304076U (en) | 2020-10-27 | 2020-10-27 | Water heater temperature-sensing chip packaging machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022438408.0U CN213304076U (en) | 2020-10-27 | 2020-10-27 | Water heater temperature-sensing chip packaging machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213304076U true CN213304076U (en) | 2021-05-28 |
Family
ID=76015510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022438408.0U Expired - Fee Related CN213304076U (en) | 2020-10-27 | 2020-10-27 | Water heater temperature-sensing chip packaging machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213304076U (en) |
-
2020
- 2020-10-27 CN CN202022438408.0U patent/CN213304076U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210528 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |