CN213304070U - Ditching groove device for wafer - Google Patents

Abstract

The utility model discloses a ditching groove device for wafers, which comprises a ditching groove body, a cooling groove body, a lifting mechanism and a rotating frame, wherein the cooling groove body is arranged at the side part of the ditching groove body; the lifting mechanism comprises a vertical plate, a rotating shaft, a first motor and a lifting arm; the rotating frame comprises two side plates arranged at opposite intervals, a bottom plate connected between the bottoms of the two side plates and a fixed rod connected between the tops of the two side plates, and baffles are arranged at the left end and the right end of the top of the bottom plate respectively. The utility model discloses be used for the ditching groove device of wafer among the prior art can not be fine the temperature of maintaining acid corrosion liquid, the slot degree of depth uniformity that corrodes out is poor, and the quality low scheduling problem of wafer improves, the utility model has the advantages of temperature of fine maintenance acid corrosion liquid, the slot degree of depth that corrodes out are unanimous, promote the quality of wafer.

Description

Ditching groove device for wafer

Technical Field

The utility model relates to a wafer processing technology field especially relates to a ditching groove device for wafer.

Background

Wafers are generally thin slices cut from single crystal silicon, have a diameter of 6 inches, 8 inches, 12 inches, and are mainly used for producing integrated circuits, and wafers are only raw materials and can be used for electronic components after a series of finishing treatments. In the process of processing the wafer, a groove is often required to be formed on the surface of the wafer according to requirements, and in the prior art, the groove on the surface of the wafer is generally formed by chemical etching, and the chemical etching process is as follows: coating a layer of negative photoresist on two sides of a wafer, placing the wafer in a Mylar film with patterns, and performing light sensing to form light refraction (the negative photoresist has a light refraction function), so that the patterns on the Mylar film are refracted onto the negative photoresist on the two sides of the wafer, lines are formed on the negative photoresist on the two sides of the wafer, the positions of the lines are positions where people need to groove, then removing the negative photoresist with line parts on the wafer through a developer, flattening the lines through a fixer, and then placing the wafer in an acid etching solution, so that the positions where the grooves need to be grooved on the two sides of the wafer are corroded by acid liquor to form grooves due to the fact that the positions are not protected by the negative photoresist.

In addition, when the existing ditching groove device for the wafer carries out acid corrosion on the wafer, the wafer is often vertically inserted on a wafer rack, then the wafer rack is fixed on a shelf in a ditching body, the flow of the acid liquor is pushed to corrode the surface of the wafer by means of the forward and backward swinging of the shelf, so that the resistance generated by the contact of different positions of the surface of the wafer and the acid liquor is different in magnitude, therefore, the depth consistency of the groove etched on the surface of the wafer is poor, the error can reach 10 mu m at most, acid liquor adhered on the surface of the wafer cannot be cleaned and removed in time after acid etching, and the quality of the wafer is seriously influenced.

To above technical problem, the utility model discloses a ditching groove device for wafer, the utility model has the advantages of be convenient for maintain the acidizing fluid temperature, improve production efficiency, the slot degree of depth homogeneity that corrodes out is good, the slot degree of depth error is less, in time get rid of, promote the quality of wafer to the acidizing fluid.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art not enough, provide a ditching groove device for wafer to solve the temperature that is used for the ditching groove device of wafer can not be fine maintenance acidizing fluid among the prior art, production efficiency is low, and the groove depth uniformity that corrodes out is poor, and the error is big, can not be timely after the acid corrosion wash the acidizing fluid with wafer surface adhesion and get rid of, the low grade technical problem of quality of wafer, the utility model has the advantages of be convenient for maintain acidizing fluid temperature, improve production efficiency, the groove depth homogeneity that corrodes out is good, the groove depth error is less, in time get rid of, promote the quality of wafer to the acidizing fluid.

The utility model discloses a following technical scheme realizes: the utility model discloses a ditching groove device for wafers, which comprises a ditching groove body, a cooling groove body, a lifting mechanism and a rotating frame, wherein the cooling groove body is arranged at the side part of the ditching groove body; an overflow port is arranged on the side wall of the ditching groove body, the overflow port is higher than the cooling groove body, the overflow port is connected with the overflow pipe, the other end of the overflow pipe penetrates through the top wall of the cooling groove body downwards and is communicated with the inner cavity of the cooling groove body, a liquid pump is arranged on the side portion of the cooling groove body, a liquid pumping port is arranged at the bottom of the side wall of the cooling groove body, the liquid pumping port is connected with a liquid inlet of the liquid pumping pump through a liquid pumping pipe, a liquid outlet of the liquid pumping pump is connected with a return pipe, the other end of the return pipe extends downwards into the inner cavity of the ditching groove body from the top of; the lifting mechanism comprises vertical plates, a rotating shaft, a first motor and lifting arms, wherein the vertical plates are relatively and fixedly arranged at the front end and the rear end of the top of the ditching groove body, the rotating shaft is rotatably arranged between the two vertical plates, the first motor is fixedly arranged on the outer wall of one vertical plate, the rotating shaft end part of the first motor is fixedly connected with one end of the rotating shaft, the lifting arms are vertically and fixedly arranged at the front end and the rear end of the rotating shaft, a first cavity is formed in the middle of one end of the rotating shaft, a second cavity is formed in the middle of one lifting arm, the second cavity is communicated with the first cavity, a second motor is fixedly arranged in the first cavity, and a driving gear is fixedly; the rotating turret includes the curb plate that two relative intervals set up, connect bottom plate between two curb plate bottoms and connect the dead lever between two curb plate tops, the middle part of two curb plate lateral walls still is provided with the minor axis respectively, two minor axes are kept away from the one end rotation of axis of rotation with two lift arms respectively and are connected, the fixed cover is equipped with driven gear on the minor axis of being connected with the lift arm that is provided with the second cavity, driven gear is located the second cavity, still be provided with drive chain in the second cavity, drive chain's both ends are connected with driving gear and driven gear respectively, both ends are provided with the baffle respectively about the bottom plate top.

Further, in order to facilitate the detachment and installation of the fixing rod, through holes are respectively and relatively formed in the tops of the side walls of the two side plates, the fixing rod is arranged between the relative through holes, screw holes are respectively formed in two ends of the fixing rod, locking bolts are respectively arranged on the outer sides of the two side plates, and the end portions of the locking bolts penetrate through holes and are in threaded connection with the screw holes.

Further, in order to timely wash and remove acid liquor adhered to the surface of the wafer after acid corrosion, a partition plate is arranged in the ditching groove body, the partition plate separates an inner cavity of the ditching groove body into a ditching cavity and a cleaning cavity, two vertical plates are located right above the partition plate relatively, an overflow port is arranged on the side wall of the ditching cavity, the bottom of a return pipe is located in the ditching cavity, a water outlet is formed in the bottom of the side wall of the cleaning cavity, and a water valve is arranged on the water outlet.

Furthermore, in order to better cool the acid corrosion liquid in the ditching cavity, a second refrigeration coil is arranged at the bottom of the ditching cavity.

Furthermore, in order to improve the fixing effect on the wafer rack, the number of the fixing rods is not less than two.

The utility model has the advantages of it is following:

(1) the utility model discloses in the lateral part of ditching cell body is provided with the cooling bath, realize the circulation flow of sour corrosive liquid in the ditching cell body through cooling cell body and drawing liquid pump to cool down sour corrosive liquid through the first refrigeration coil pipe in the cooling bath body and the second refrigeration coil pipe in the ditching intracavity, the temperature of better maintenance sour corrosive liquid need not wait for the time of falling back after the sour corrosive liquid temperature risees in the process of ditching the wafer through sour corrosion, has improved the efficiency of production;

(2) the utility model discloses be provided with lifting mechanism at the top of ditching cell body, the rotating turret rotates and installs the tip at lifting mechanism, and during operation, places the wafer on the wafer frame, then fixes the wafer frame in the rotating turret to through the rotation of rotating turret, realize the rotation of wafer, thereby make the surface of wafer and acidizing fluid contact atress even, thereby make the groove depth that forms on the wafer surface through acid corrosion even, reduce the error;

(3) the utility model discloses be provided with the baffle in the ditching cell body, the ditching chamber is separated into with the inner chamber of ditching cell body to the baffle and the chamber is washd, and the during operation holds the acid-etched liquid at the ditching intracavity, holds the clear water at the washing intracavity to after the pickling is accomplished, lift the rotating turret and rotate the washing intracavity through lifting mechanism, rinse the quality of getting rid of through the timely acid-etched liquid with wafer surface adhesion of clear water, promote the wafer.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a connection structure of a lifting mechanism and a rotating frame;

fig. 3 is an exploded view of the turret.

In the figure: 1. ditching a groove body; 11. an overflow port; 12. an overflow pipe; 2. cooling the tank body; 21. a liquid extraction port; 22. a first refrigeration coil; 3. a lifting mechanism; 31. a vertical plate; 32. a rotating shaft; 33. a first motor; 34. a lifting arm; 35. a second motor; 321. a first cavity; 341. a second cavity; 351. a driving gear; 4. a rotating frame; 41. a side plate; 42. a base plate; 411. a through hole; 5. a liquid pump; 51. a liquid pumping pipe; 52. a return pipe; 6. fixing the rod; 61. a screw hole; 7. locking the bolt; 8. a minor axis; 81. a driven gear; 9. a drive chain; 10. a baffle plate; 100. a partition plate; 110. a ditching cavity; 120. a cleaning chamber; 130. a water outlet; 140. a water valve; 150. a second refrigeration coil.

Detailed Description

The following embodiments of the present invention are described in detail, and the present embodiment is implemented on the premise of the technical solution of the present invention, and detailed embodiments and specific operation procedures are given, but the scope of the present invention is not limited to the following embodiments, and in the description of the present invention, words like "front", "back", "left", "again" etc. indicating directions or position relations are only for convenience of description of the present invention and simplifying the description, but do not indicate or imply that the indicated device or element must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention.

Example 1

Embodiment 1 discloses a ditching groove device for wafers, as shown in fig. 1, comprising a ditching groove body 1, a cooling groove body 2, a lifting mechanism 3 and a rotating frame 4, wherein the cooling groove body 2 is arranged at the side part of the ditching groove body 1, the lifting mechanism 3 is arranged at the top end of the ditching groove body 1, and the rotating frame 4 is rotatably arranged at the end part of the lifting mechanism 3; an overflow port 11 is arranged on the side wall of the ditching tank body 1, the overflow port 11 is higher than the cooling tank body 2, the overflow port 11 is connected with an overflow pipe 12, the other end of the overflow pipe 12 downwards penetrates through the top wall of the cooling tank body 2 to be communicated with the inner cavity of the cooling tank body 2, a liquid pump 5 is arranged on the side part of the cooling tank body 2, a liquid pumping port 21 is arranged at the bottom of the side wall of the cooling tank body 2, the liquid pumping port 21 is connected with a liquid inlet of the liquid pumping pump 5 through a liquid pumping pipe 51, a liquid outlet of the liquid pumping pump 5 is connected with a return pipe 52, the other end of the return pipe 52 downwards extends into the inner cavity of the ditching tank body 1 from the top of the ditching; as shown in fig. 1 and 2, the lifting mechanism 3 includes a vertical plate 31, a rotating shaft 32, a first motor 33 and a lifting arm 34, the vertical plate 31 is relatively fixedly installed at the front end and the rear end of the top of the ditching groove body 1, the rotating shaft 32 is rotatably installed between the two vertical plates 31, specifically, both ends of the rotating shaft 32 are rotatably connected with the vertical plate 31 through first bearings (not shown in the figures), the first motor 33 is fixedly installed on the outer wall of one vertical plate 31, and the end of the rotating shaft of the first motor 33 is fixedly connected with one end of the rotating shaft 32, the first motor 33 is of a type SEWR27, the lifting arm 34 is vertically and fixedly installed at the front end and the rear end of the rotating shaft 32, a first cavity 321 is opened in the middle of one end of the rotating shaft 32, a second cavity 341 is opened in the middle of one lifting arm 34, the second cavity 341 is communicated with the first cavity 321, a second motor 35 is fixedly installed in the first cavity 321, the second, a driving gear 351 is fixedly sleeved at the end part of the rotating shaft of the second motor 35; as shown in fig. 3, the rotating frame 4 includes two side plates 41 arranged at an interval, a bottom plate 42 connected between bottoms of the two side plates 41, and a fixing rod 6 connected between tops of the two side plates 41, specifically, the number of the fixing rods 6 is not less than two, through holes 411 are respectively oppositely formed at tops of side walls of the two side plates 41, the fixing rod 6 is arranged between the opposite through holes 411, screw holes 61 are respectively formed at two ends of the fixing rod 6, locking bolts 7 are respectively arranged at outer sides of the two side plates 41, end portions of the locking bolts 7 penetrate through the through holes 411 and are screwed in the screw holes 61, and short shafts 8 are respectively arranged at middle portions of outer side walls of the; as shown in fig. 2 and fig. 3, the two short shafts 8 are respectively rotatably connected to one ends of the two lifting arms 34 far away from the rotating shaft 32, specifically, the short shafts 8 are rotatably connected to the lifting arms 34 through second bearings (not shown), a driven gear 81 is fixedly sleeved on the short shaft 8 connected to the lifting arm 34 provided with the second cavity 341, the driven gear 81 is located in the second cavity 341, a transmission chain 9 is further provided in the second cavity 341, two ends of the transmission chain 9 are respectively connected to the driving gear 351 and the driven gear 81, and the left and right ends of the top of the bottom plate 42 are respectively provided with a baffle 10; as shown in fig. 1, a partition board 100 is disposed in a trench body 1, the partition board 100 divides an inner cavity of the trench body 1 into a trench cavity 110 and a cleaning cavity 120, two vertical boards 31 are disposed right above the partition board 100, an overflow port 11 is disposed on a side wall of the trench cavity 110, a bottom of a return pipe 52 is disposed in the trench cavity 110, a bottom of a side wall of the cleaning cavity 120 is disposed with a water outlet 130, a water valve 140 is disposed on the water outlet 130, a second refrigeration coil 150 is disposed at a bottom of the trench cavity 110, the first refrigeration coil 22 and the second refrigeration coil 150 are both connected to a refrigeration compressor (not shown in the figure) during operation, the refrigeration compressor belongs to the prior art, and the structure and the operating principle thereof are common knowledge of those skilled in the art, and therefore, no detailed description is given in the specification and drawings of the present.

The working process of the utility model is as follows: when the device works, the ditching cavity 110 in the ditching groove body 1 is filled with acid corrosive liquid, the cleaning cavity 120 in the ditching groove body 1 is filled with clear water, then a wafer to be processed is vertically and fixedly placed on a wafer rack (not marked in the figure), the wafer rack is a rack for placing the wafer, the wafer rack belongs to a mature product in the prior art and is a common tool in a wafer processing workshop, then a rotating shaft 32 is driven to rotate by a first motor 33 so as to drive a lifting arm 34 to rotate, the rotating rack 4 is rotated to the top of the ditching groove body 1, the rotating rack is driven to rotate 4 by a second motor 35 so as to enable openings formed by baffle plates 10 at the left and right ends of the top of a bottom plate 42 to be upward, then the wafer rack containing the wafer is placed on the bottom plate 42 of the rotating rack 4, the wafer rack is limited by the baffle plates 10 at the left and right sides of the bottom plate 42, then a fixing rod 6 is placed between through holes 411 opposite to the tops of two side plates 41, the fixed rod 6 is locked with the side plate 41 through the locking bolt 7, so that the top of the wafer rack is limited and fixed through the fixed rod 6, at the moment, the first motor 33 drives the rotating shaft 32 to rotate, the lifting arm 34 is driven to rotate, the rotating frame 4 is driven to rotate to the acid corrosion liquid in the ditching cavity 110 in the ditching groove body 1, at the moment, the second motor 35 drives the rotating frame 4 to rotate, so that the wafer uniformly rotates in the acid corrosion liquid, the surface of the wafer is corroded by the acid corrosion liquid, during the acid corrosion process, the acid corrosion liquid in the ditching cavity 110 continuously flows into the cooling groove body 2 through the overflow port 11 and then is pumped back into the ditching cavity 110 through the liquid pump 5, the circulating flow of the acid corrosion liquid in the ditching cavity 110 is realized, and the temperature of the acid corrosion liquid is reduced through the first cooling coil 22 in the cooling groove body 2 and the second cooling coil 150 in the ditching cavity 110, in order to maintain the temperature of the acid etching solution, after the acid etching is completed, the first motor 33 is controlled to rotate reversely, so that the rotating frame 4 rotates to clean water in the cleaning cavity 120 in the ditching groove body 1, the residual acid etching solution on the surface of the wafer is cleaned and removed by the clean water, and the water in the cleaning cavity 120 can be discharged through the water outlet 130 for replacement. The utility model has the advantages of be convenient for maintain the acidizing fluid temperature, improve production efficiency, the slot degree of depth homogeneity that corrodes out is good, the slot degree of depth error is less, in time get rid of, promote the quality of wafer to the acidizing fluid.

Claims (5)

1. A ditching groove device for wafers is characterized by comprising a ditching groove body, a cooling groove body, a lifting mechanism and a rotating frame, wherein the cooling groove body is arranged on the side part of the ditching groove body;

an overflow port is formed in the side wall of the ditching groove body, the overflow port is higher than the cooling groove body, the overflow port is connected with an overflow pipe, the other end of the overflow pipe downwards penetrates through the top wall of the cooling groove body and is communicated with the inner cavity of the cooling groove body, a liquid pump is arranged on the side portion of the cooling groove body, a liquid pumping port is formed in the bottom of the side wall of the cooling groove body, the liquid pumping port is connected with a liquid inlet of the liquid pumping pump through a liquid pumping pipe, a liquid outlet of the liquid pumping pump is connected with a return pipe, the other end of the return pipe downwards extends into the inner cavity of the ditching groove body from the top of the ditching groove body, and a first refrigeration coil pipe is arranged inside;

the lifting mechanism comprises vertical plates, a rotating shaft, a first motor and a lifting arm, wherein the vertical plates are relatively and fixedly arranged at the front end and the rear end of the top of the ditching groove body, the rotating shaft is rotatably arranged between the two vertical plates, the first motor is fixedly arranged on the outer wall of one vertical plate, the rotating shaft end part of the first motor is fixedly connected with one end of the rotating shaft, the lifting arm is vertically and fixedly arranged at the front end and the rear end of the rotating shaft, a first cavity is formed in the middle of one end of the rotating shaft, a second cavity is formed in the middle of one lifting arm and communicated with the first cavity, a second motor is fixedly arranged in the first cavity, and a driving gear is fixedly sleeved at the rotating shaft end part of the second motor;

the rotating turret includes curb plate, connection that two relative intervals set up and connects bottom plate between the curb plate bottom and connects two dead lever between the curb plate top, two the middle part of curb plate lateral wall still is provided with the minor axis respectively, two the minor axis is kept away from with two the lifting arm the one end of axis of rotation is rotated and is connected, with be provided with the second cavity the lifting arm is connected fixed the cover is equipped with driven gear on the minor axis, driven gear is located in the second cavity, still be provided with drive chain in the second cavity, drive chain's both ends respectively with the driving gear with driven gear connects, both ends are provided with the baffle respectively about the bottom plate top.

2. A ditching device for a chip as claimed in claim 1 wherein said side walls of said two side plates have through holes at the top thereof, said securing rod is disposed between said through holes, said securing rod has screw holes at both ends thereof, and locking bolts are disposed at the outer sides of said two side plates, and the ends of said locking bolts are screwed into said screw holes through said through holes.

3. The device of claim 1, wherein a partition is disposed in the trench body, the partition divides an inner cavity of the trench body into a trench cavity and a cleaning cavity, the two vertical plates are disposed above the partition, the overflow port is disposed on a side wall of the trench cavity, the bottom of the return pipe is disposed in the trench cavity, the bottom of the side wall of the cleaning cavity is provided with a water outlet, and the water outlet is provided with a water valve.

4. A trench device for wafers as recited in claim 3, wherein said trench chamber is provided at the bottom with a second refrigeration coil.

5. A trenching assembly for wafer as claimed in claim 1 wherein said retaining bar is not less than two in number.

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