CN213295540U - Ceramic substrate electroplating device - Google Patents
Ceramic substrate electroplating device Download PDFInfo
- Publication number
- CN213295540U CN213295540U CN202021856351.XU CN202021856351U CN213295540U CN 213295540 U CN213295540 U CN 213295540U CN 202021856351 U CN202021856351 U CN 202021856351U CN 213295540 U CN213295540 U CN 213295540U
- Authority
- CN
- China
- Prior art keywords
- electroplating
- plate
- cover plate
- ceramic substrate
- rack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 54
- 239000000758 substrate Substances 0.000 title claims abstract description 25
- 239000000919 ceramic Substances 0.000 title claims abstract description 24
- 239000007788 liquid Substances 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 14
- 238000000746 purification Methods 0.000 claims description 6
- 239000002912 waste gas Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 19
- 238000003756 stirring Methods 0.000 abstract description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a ceramic substrate electroplating device, which comprises an electroplating bath and a support frame, wherein the electroplating bath is arranged below the support frame, an ultrasonic generator is arranged in the electroplating bath, and the support frame is connected with a cover plate through a telescopic device; the telescopic device comprises a shell, a sliding plate, a driving motor and a rack plate, wherein a sliding groove and the driving motor are arranged on the inner side of the shell, the sliding plate is arranged in the sliding groove, a connecting rod is arranged at the upper end of the sliding plate, the rack plate is arranged at the lower end of the sliding plate, and a gear on an output shaft of the driving motor is meshed with the rack plate; the bottom of the cover plate is provided with a storage rack, the cover plate is provided with a motor, and an output shaft of the motor penetrates through the cover plate and is connected with the storage rack. The utility model discloses a telescoping device can drive the apron and rise or descend, makes things convenient for opening and shutting of apron. In the electroplating process, the motor can drive the ceramic substrate to rotate, so that the electroplating is more uniform, the rack plays a role in stirring, the concentration of electroplating solution can be uniform, and the influence of bubbles on the electroplating process in the electroplating process can be reduced.
Description
Technical Field
The utility model relates to an electroplate device technical field, especially relate to a ceramic substrate electroplates device.
Background
The ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface (single side or double sides) of an aluminum oxide or aluminum nitride ceramic substrate at a high temperature. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed circuit board), and has great current carrying capacity. Therefore, the ceramic substrate has become a basic material for high-power electronic circuit structure technology and interconnection technology.
At present, the ceramic substrate is required to be electroplated in the production process. But the existing ceramic substrate electroplating device is inconvenient to take the electroplated ceramic substrate, and waste gas can be generated in the electroplating process to influence the environment and the field workers.
SUMMERY OF THE UTILITY MODEL
In order to solve the above-mentioned defects, the utility model aims to provide a ceramic substrate electroplating device with simple structure, convenient use and improved electroplating quality.
In order to achieve the above object, the utility model discloses a following technical scheme realizes: a ceramic substrate electroplating device comprises an electroplating bath and a support frame, wherein the electroplating bath is arranged below the support frame, an ultrasonic generator is arranged in the electroplating bath, and a cross beam of the support frame is fixedly connected with a cover plate through a telescopic device; the telescopic device comprises a shell, a sliding plate, a driving motor and a rack plate, wherein a sliding groove and the driving motor are arranged on the inner side of the shell, the sliding plate capable of sliding along the sliding groove is arranged in the sliding groove, a connecting rod is fixedly arranged at the upper end of the sliding plate, the rack plate is fixedly arranged at the lower end of the sliding plate, a gear is arranged on the surface of an output shaft of the driving motor, and the gear on the output shaft of the driving motor is meshed with the rack plate; the storage rack is fixedly arranged at the bottom of the cover plate, the cover plate is provided with a motor, and an output shaft of the motor penetrates through the cover plate and is fixedly connected with the storage rack.
Preferably, the cover plate is provided with an exhaust hole, and the exhaust hole is fixedly connected with the waste gas purification device on one side of the electroplating bath through an exhaust pipe.
Preferably, a liquid discharge port is formed in the bottom of the electroplating bath, a liquid discharge pipeline is connected to the liquid discharge port, and a liquid discharge valve is arranged on the liquid discharge pipeline.
Preferably, a plurality of storage grooves are arranged in the storage rack.
The utility model has the advantages that: the telescopic device can drive the cover plate to ascend or descend, and the cover plate is convenient to open and close. In the electroplating process, the motor can drive the ceramic substrate to rotate, so that the electroplating is more uniform, the rack plays a role in stirring, the concentration of electroplating solution can be uniform, the influence of bubbles in the electroplating process on the electroplating process is reduced, and the electroplating quality is improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an enlarged schematic structural view of the telescopic device at a in fig. 1.
Wherein: 1. plating bath, 2, support frame, 3, ultrasonic generator, 4, cover plate, 5, shell, 6, slide plate, 7, driving motor, 8, rack plate, 9, chute, 10, connecting rod, 11, output shaft, 12, gear, 13, shelf, 14, motor, 15, exhaust pipe, 16, waste gas purification device, 17, liquid discharge pipeline, 18 and liquid discharge valve.
Detailed Description
In order to make the technical solution of the present invention better understood, the present invention is described in detail below with reference to the accompanying drawings, and the description of the present invention is only exemplary and explanatory, and should not be construed as limiting the scope of the present invention.
As shown in fig. 1 and 2, a specific structure of a ceramic substrate electroplating apparatus includes an electroplating tank 1 and a support frame 2, wherein the electroplating tank 1 is disposed below the support frame 2. An ultrasonic generator 3 is arranged in the plating bath 1, and a cross beam of the support frame 2 is fixedly connected with a cover plate 4 through a telescopic device. The cover plate 4 is provided with an exhaust hole which is fixedly connected with a waste gas purification device 16 at one side of the electroplating bath 1 through an exhaust pipe 15. During electroplating, a large amount of toxic gas generated by electroplating solution electrolysis is discharged into the waste gas purification device 16 through the exhaust holes in the cover plate 4 and the exhaust pipe 15, and then is discharged after purification treatment, so that the direct discharge of polluted atmosphere is avoided, and the electroplating solution is very environment-friendly.
As shown in fig. 2, the telescopic device comprises a housing 5, a sliding plate 6, a driving motor 7 and a rack plate 8, wherein a sliding groove 9 and the driving motor 7 are arranged on the inner side of the housing 5, the sliding plate 6 capable of sliding along the sliding groove 9 is arranged in the sliding groove 9, a connecting rod 10 is fixedly arranged at the upper end of the sliding plate 6, the rack plate 8 is fixedly arranged at the lower end of the sliding plate 6, a gear 12 is arranged on the surface of an output shaft 11 of the driving motor 7, and the gear 12 on the output shaft 11 of the driving motor 7 is meshed with the. The cover plate 4 can be lifted and lowered by the matching of the telescopic device. The bottom of the cover plate 4 is fixedly provided with a shelf 13, and a plurality of storage slots are arranged in the shelf 13 and used for placing the ceramic substrate. The cover plate 4 is provided with a motor 14, and an output shaft 11 of the motor 14 penetrates through the cover plate 4 and is fixedly connected with the shelf 13. The motor 14 on the apron 4 can drive supporter 13 and rotate, and then the ceramic substrate of being convenient for evenly electroplates, and supporter 13 rotates in the inboard of plating bath 1 simultaneously and plays the effect of stirring to be convenient for make the even unanimity of plating bath concentration in the plating bath 1, and help reducing the influence of electroplating in-process bubble to electroplating process, improve electroplating quality.
The bottom of the electroplating bath 1 is provided with a liquid outlet, the liquid outlet is connected with a liquid outlet pipeline 17, and the liquid outlet pipeline is provided with a liquid outlet valve 18. When the electroplating solution in the electroplating bath 1 needs to be discharged, the liquid discharge valve 18 on the liquid discharge pipeline 17 is screwed to discharge the impurities in the waste liquid, so that the inside of the electroplating bath 1 can be cleaned.
The electroplating process of the utility model is as follows: the retractable device drives the cover plate 4 to ascend, and the ceramic substrate to be plated is installed on the storage rack 13. The cover plate 4 is driven by the telescopic device to descend, and the cover plate 4 is tightly covered with the electroplating bath 1. Then, the ceramic substrate to be plated and the plating solution in the plating vessel 1 are energized to start the plating. In the electroplating process, accessible starter motor 14 slowly rotates, the ceramic substrate of being convenient for evenly electroplate, and supporter 13 rotates in the inboard of plating bath 1 simultaneously and plays the effect of stirring to be convenient for make the even unanimity of plating bath concentration in plating bath 1, and help reducing the influence of electroplating in-process bubble to the electroplating process, improve electroplating quality.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The principles and embodiments of the present invention have been explained herein using specific examples, which are presented only to assist in understanding the methods and their core concepts. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes can be made without departing from the principle of the present invention, and the above technical features can be combined in a proper manner; the application of these modifications, variations or combinations, or the application of the concepts and solutions of the present invention in other contexts without modification, is not intended to be considered as a limitation of the present invention.
Claims (4)
1. The ceramic substrate electroplating device comprises an electroplating bath and a support frame, wherein the electroplating bath is arranged below the support frame and is characterized in that: an ultrasonic generator is arranged in the electroplating bath, and a cross beam of the support frame is fixedly connected with the cover plate through a telescopic device; the telescopic device comprises a shell, a sliding plate, a driving motor and a rack plate, wherein a sliding groove and the driving motor are arranged on the inner side of the shell, the sliding plate capable of sliding along the sliding groove is arranged in the sliding groove, a connecting rod is fixedly arranged at the upper end of the sliding plate, the rack plate is fixedly arranged at the lower end of the sliding plate, a gear is arranged on the surface of an output shaft of the driving motor, and the gear on the output shaft of the driving motor is meshed with the rack plate; the storage rack is fixedly arranged at the bottom of the cover plate, the cover plate is provided with a motor, and an output shaft of the motor penetrates through the cover plate and is fixedly connected with the storage rack.
2. A ceramic substrate plating apparatus according to claim 1, characterized in that: the cover plate is provided with an exhaust hole which is fixedly connected with a waste gas purification device on one side of the electroplating bath through an exhaust pipe.
3. A ceramic substrate plating apparatus according to claim 1, characterized in that: the electroplating tank is characterized in that a liquid discharge port is formed in the bottom of the electroplating tank, a liquid discharge pipeline is connected to the liquid discharge port, and a liquid discharge valve is arranged on the liquid discharge pipeline.
4. A ceramic substrate plating apparatus according to claim 1, characterized in that: the shelf is provided with a plurality of storage slots.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021856351.XU CN213295540U (en) | 2020-08-31 | 2020-08-31 | Ceramic substrate electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021856351.XU CN213295540U (en) | 2020-08-31 | 2020-08-31 | Ceramic substrate electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213295540U true CN213295540U (en) | 2021-05-28 |
Family
ID=76027821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021856351.XU Expired - Fee Related CN213295540U (en) | 2020-08-31 | 2020-08-31 | Ceramic substrate electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213295540U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114808059A (en) * | 2022-06-06 | 2022-07-29 | 天津市成吉斯宾科技发展有限公司 | Combined flow plating machine for plating small parts |
| CN117568906A (en) * | 2024-01-17 | 2024-02-20 | 江苏贺鸿电子有限公司 | High-efficient ceramic substrate plating equipment |
-
2020
- 2020-08-31 CN CN202021856351.XU patent/CN213295540U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114808059A (en) * | 2022-06-06 | 2022-07-29 | 天津市成吉斯宾科技发展有限公司 | Combined flow plating machine for plating small parts |
| CN117568906A (en) * | 2024-01-17 | 2024-02-20 | 江苏贺鸿电子有限公司 | High-efficient ceramic substrate plating equipment |
| CN117568906B (en) * | 2024-01-17 | 2024-04-02 | 江苏贺鸿电子有限公司 | High-efficient ceramic substrate plating equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220615 Address after: 226200 No.99, Xinhong South Road, Huilong Town, Qidong City, Nantong City, Jiangsu Province Patentee after: QIDONG HUITONG PLATING Co.,Ltd. Address before: 226200 No.99, Xinhong South Road, Huilong Town, Qidong City, Nantong City, Jiangsu Province Patentee before: Qidong Shentong electronic machinery parts Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210528 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |