CN113737264B - Micropore pretreatment and electroplating integrated device and method - Google Patents

Abstract

The invention provides a micropore pretreatment and electroplating integrated device and a method, wherein the device comprises the following steps: the pretreatment box and the electroplating box are fixedly connected; the pretreatment box is used for carrying out pretreatment on a sample and comprises: the box body assembly, the first heating plate and the first ultrasonic rod; the electroplating box is used for electroplating the sample after pretreatment, and comprises: plating bath, plating solution circulation system, spouting and pressing device, second hot plate and second ultrasonic rod. The invention is convenient for thoroughly cleaning and filling the inside of the micropore part, and avoids the occurrence of holes or cracks; the high-pressure spraying mode is adopted to ensure convection and mass transfer of plating solution in the micropores and promote filling of substances in the blind holes; through selecting the installation shower nozzle and adjusting the distance between spouting the pressure pipe and the electroplating sample, can pack a plurality of samples or a plurality of holes on same sample, reduce the experiment number of times, shortened the experiment time, improved work efficiency.

Description

Micropore pretreatment and electroplating integrated device and method

Technical Field

The invention relates to the field of micropore filling electroplating of printed circuit boards, in particular to a micropore pretreatment and electroplating integrated device and method.

Background

Along with the development of the age and the progress of technology, the requirements of the electronic products for lightness, thinness, shortness, multifunction and high reliability are increasingly urgent, and the technical requirements on the printed circuit board are also higher. The electroplating to fill the blind holes is to fill copper in the blind holes in an electroplating way, so that the wiring space can be saved to the greatest extent, and the requirement of high reliability of the circuit board is met. The electroplating blind hole filling technology is widely applied to the manufacture of high-order HDI boards of PCBs, and becomes an overwhelming trend. Common abnormal problems in the process of electroplating blind hole filling, such as excessive dishing degree, leakage filling, hole hollowness and the like, are partially caused by insufficient pre-electroplating treatment, and do not perform the treatments of removing oxidization, bubbles and residues in the blind holes, so that the mass transfer speed is low due to slow flow of electroplating solution in the holes in the electroplating process, and the growth of a deposition layer in the holes is inhibited. These problems, which are caused by the electroplating operation, are caused by the failure of the circuit board and the influence on the reliability of the product, are to be solved.

In addition, the existing electroplating pretreatment equipment has low integration level, complex pretreatment operation, difficult deoxygenation, bubble removal and the like in the blind hole of the printed circuit board; the pretreatment is not thorough, so that the subsequent electroplating filling is not ideal. In the electroplating process, the blind holes are small in aperture and large in depth, so that the problems of void, crack and the like are solved, and the defects of quick mass transfer in the micropores, uniform electric field distribution inside and outside the holes and the like cannot be solved because mass transfer of plating solution in the holes is difficult in the electroplating process, and growth of sediments is inhibited.

Disclosure of Invention

Aiming at the problems, the invention provides a micropore pretreatment and electroplating integrated device and method, which solve the problem of difficult convection of plating solution inside and outside micropores, thereby improving the deep plating capacity of electroplating filling holes, enhancing the hole filling effect and reducing the occurrence of hole filling defects.

In order to solve the technical problems, the invention adopts the following technical scheme:

a microwell pretreatment and electroplating integrated device, comprising: the pretreatment box and the electroplating box are fixedly connected; the pretreatment box is used for carrying out pretreatment on a sample and comprises: the box body assembly, the first heating plate and the first ultrasonic rod; the electroplating box is used for electroplating the sample after pretreatment, and comprises: plating bath, plating solution circulation system, spouting and pressing device, second hot plate and second ultrasonic rod.

In some examples, the first ultrasonic bar and the second ultrasonic bar are used to provide ultrasonic vibration for a pretreatment process and an electroplating process, respectively.

In some examples, further comprising: a thermometer for measuring the temperature of the pretreatment liquid during pretreatment; the first heating plate is externally arranged and used for heating the pretreatment liquid so as to control the temperature of the pretreatment process; and/or, further comprising: a thermometer for measuring the temperature of the plating solution during the plating process; the second heating plate is externally arranged and used for heating the electroplating liquid so as to control the temperature of the electroplating process.

In some examples, an electrode holder is disposed within the plating cell for securing an anode, a reference electrode, and the sample.

In some examples, the plating solution circulation system is for providing a circulating flow of plating solution to a plating tank, comprising: the device comprises a conveying pump, a liquid suction pipe, a liquid conveying pipe, a liquid dividing pipe and a shock pad; the shock pad is arranged at the bottom end of the conveying pump and used for reducing vibration; the liquid suction pipe and the liquid delivery pipe are connected to the delivery pump; the liquid outlet of the liquid feeding pipe is communicated with the liquid separating pipe.

In some examples, the spray pressure device is for providing plating solution to a sample spray plating solution circulation system, comprising: a spray-pressing bracket and a spray-pressing pipe; the spray-pressing support is arranged in the electroplating bath, the liquid distribution pipe is arranged inside the spray-pressing support, the spray-pressing support is provided with a liquid conveying pipe socket, and a liquid outlet of the liquid conveying pipe penetrates through the liquid conveying pipe socket and is communicated with the liquid distribution pipe.

In some examples, further comprising: and the vacuumizing assembly is used for vacuumizing the pretreatment box and the electroplating box.

In some examples, further comprising: and the control device is connected with the pretreatment box and the electroplating box and is used for controlling the pretreatment process of the sample in the pretreatment box and the electroplating process in the electroplating box.

A micro-hole pretreatment method for pretreating a printed circuit board sample using the above micro-hole pretreatment and electroplating integrated apparatus, the micro-hole pretreatment method comprising:

step S1: installing a sample to be pretreated and a first ultrasonic rod;

step S2: loading pretreatment liquid and sealing a pretreatment box;

step S3: vacuumizing the pretreatment box;

step S4: opening a first heating plate and a first ultrasonic rod to perform pretreatment on a sample;

step S5: after reaching the pretreatment time, the sample was taken out.

A micro-hole plating method for plating micro-holes of a printed circuit board sample using the micro-hole pretreatment and plating integrated apparatus described above, the micro-hole plating method comprising:

step S1, loading electroplating solution into an electroplating box, and mounting a sample and an electrode;

step S2: vacuumizing the electroplating bath;

step S3: opening a plating solution circulating system, a second heating plate and a second ultrasonic rod to start electroplating the sample;

step S4: after the plating time was reached, the sample was taken out.

The invention has the following beneficial effects: (1) The micropore pretreatment and electroplating integrated device is convenient for thoroughly cleaning and filling the interior of the micropore part, and avoids the occurrence of holes or cracks; (2) During electroplating, a high-pressure spraying mode is adopted to ensure convection and mass transfer of plating solution in the micropores and promote filling of substances in the blind holes; (3) By selecting the mounting spray head and adjusting the distance between the spray pressure pipe and the electroplating sample, a plurality of samples or a plurality of holes on the same sample can be filled, so that the experiment times are reduced, the experiment time is shortened, and the working efficiency is improved; (4) The device is convenient to detach, and is beneficial to cleaning, installation and adjustment of equipment.

Drawings

FIG. 1 is a schematic diagram of a micro-pore pretreatment and electroplating integrated device according to an embodiment of the present invention.

Fig. 2 is a schematic structural view of a pretreatment tank according to an embodiment of the present invention.

Fig. 3 is a schematic structural view of a hanger in a pretreatment tank according to an embodiment of the present invention.

Fig. 4 is a schematic structural view of a sealing cover plate of a pretreatment tank according to an embodiment of the present invention.

FIG. 5 is a schematic view of a plating tank according to an embodiment of the present invention.

FIG. 6 is a schematic view of a seal cover of an electroplating tank according to an embodiment of the invention.

Fig. 7 is a schematic structural diagram of a spraying device according to an embodiment of the invention.

FIG. 8 is a schematic view of a liquid suction pipe of a plating solution circulating system according to an embodiment of the present invention.

Fig. 9 is a schematic structural diagram of a spray pipe and a spray head of the spray device according to the embodiment of the invention.

FIG. 10 is a schematic view showing the structure of an electrode holder and an electrode in a plating tank according to an embodiment of the invention.

FIG. 11 is a flow chart of a microwell pretreatment method according to an embodiment of the present invention.

FIG. 12 is a flowchart of a micro-hole plating method according to an embodiment of the invention.

Symbol description

1. A pretreatment tank; 11. a case; 12. sealing the cover plate; 121. a vacuum hole; 122. a vent hole; 13. a thermometer; 14. a hanging frame; 141. a thermometer socket; 142. a sample jack; 143. an ultrasonic rod socket; 15. a first ultrasonic bar; 16. an external pipeline; 17. a first heating plate; 18. an external vacuum pump;

2. an electroplating box; 21. plating bath; 211. an electrode holder; 212. an ultrasonic bar bracket; 213. a thermometer; 214. a thermometer holder; 215. an anode; 216. a sample hanger; 217. a reference electrode; 218. a scale; 22. a plating solution circulation system; 221. a transfer pump; 222. a liquid suction pipe; 223. a liquid feeding pipe; 224. a liquid separating pipe; 225. a shock pad; 226. a liquid inlet; 227. an ultrafiltration membrane; 23. a spraying and pressing device; 231. spraying and pressing the bracket; 232. a spray pressure pipe; 233. an infusion pipeline socket; 234. a clamping plate; 235. an injection hole; 236. a spray head; 24. a second ultrasonic bar; 25. a second heating plate; 26. sealing cover; 261. an air filling hole; 262. an exhaust hole; 263. a wire guide; 264. the liquid suction pipe penetrates into the hole; 265. the liquid feeding pipe penetrates into the hole.

Detailed Description

The embodiment of the invention provides a micropore pretreatment and electroplating integrated device, as shown in fig. 1-4, which comprises: a pretreatment box 1 and an electroplating box 2 which are fixedly connected; the pretreatment box 1 is used for pretreatment of a sample, and comprises: a box assembly, a first heating plate, a first ultrasonic bar 15; the plating tank 2 is used for plating a sample after pretreatment, and includes: plating bath 21, plating solution circulation system 22, spray press 23, second heating plate 25 and second ultrasonic bar 24. The micropore pretreatment and electroplating integrated device further comprises: and the vacuumizing assembly is used for vacuumizing the pretreatment box 1 and the electroplating box 2.

The pretreatment tank 1 and the plating tank 2 of the present embodiment are fixedly connected together, thereby forming a microporous pretreatment and plating integrated device. The present embodiment does not limit the manner of fixing the pretreatment tank 1 to the plating tank 2. In one example, the pre-treatment tank 1 and the plating tank 2 are riveted by screws. Compared with the prior art, the device of the embodiment has high integration level, and overcomes the defects of separate pretreatment and electroplating equipment.

The box body assembly of the pretreatment box 1 is used for containing pretreatment liquid and containing components such as a sample, a built-in first ultrasonic rod 15 and the like. The housing assembly comprises a housing 11 and a sealing cover 12. In one example, the housing 11 is square. A detachable hanging frame 14 is arranged on one side of the inner wall of the box body, as shown in fig. 3, a sample inserting opening 142 is formed in the hanging frame 14, and a sample is arranged in the sample inserting opening 142 through a clamp.

The first ultrasonic bar 15 is used to provide ultrasonic vibration for the pretreatment process. The suspension bracket 14 is also provided with an ultrasonic rod socket 143, and the built-in first ultrasonic rod 15 is arranged in the ultrasonic rod socket 143 through a clamp.

The first heating plate 17 is installed outside the cabinet for heating the pretreatment liquid in the cabinet 11 to control the temperature of the pretreatment process. In one example, the external heater is a first heater plate 17 mounted on the floor of the housing 11. The integrated device of the present embodiment further includes: a thermometer 13 for measuring the temperature of the pretreatment liquid during pretreatment. The hanger 14 is also provided with a thermometer socket 141, and the thermometer 13 is mounted on the thermometer socket 141 by a corresponding jig.

The sealing cover 12 is used to seal the case 11. As shown in fig. 4, the sealing cover plate 12 is provided with a vacuum-drawing hole 121 and a vent hole 122. During the pretreatment, a gas, such as nitrogen, introduced into the pretreatment liquid may enter from the vent 122. The gas in the case 11 can be drawn out through the vacuum hole 121.

The evacuation assembly includes: an external pipeline 16 and an external vacuum pump 18, wherein the external vacuum pump 18 is connected with the vacuumizing hole 121 through the external pipeline 16. The external vacuum pump 18 may evacuate the tank.

The micro-pore pretreatment and electroplating integrated device of this embodiment further includes: and the control device is used for controlling the pretreatment process of the samples in the pretreatment box 1. The control device is connected with the first heating plate 17, the first ultrasonic bar 15, the thermometer 13 and the external vacuum pump 18, and respectively controls the temperature of the first heating plate 17, the power of the first ultrasonic bar 15, the temperature measured by the thermometer 13 and the operation of the external vacuum pump 18.

The working process of the microporous pretreatment and electroplating integrated device of this embodiment is as follows. The printed circuit board sample to be pretreated is subjected to the process of opening the sealing cover plate 12, detaching the hanging frame 14 from the box body 11, respectively installing the sample, the thermometer 13 and the first ultrasonic rod 15 in the sample jack 142, the thermometer jack 141 and the ultrasonic rod jack 143 of the hanging frame 14 through the clamps, and then putting the hanging frame 14 back in the fixed position in the box body. The prepared pretreatment liquid is filled into a box 11, the top end of the sample is submerged, a sealing cover plate 12 is covered, and the box 11 is sealed. In one example, the pretreatment liquid floods the top of the sample by 2-5 cm. The external vacuum pump 18 is connected with the vacuumizing hole 121 through the external pipeline 16, the control device opens the external vacuum pump 18, and the inside of the box 11 is vacuumized according to the preset negative pressure value. In one example, the predetermined negative pressure value may range from 0.01MPa to 0.1MPa. In an example, before the vacuumizing operation, the pretreatment liquid in the box 11 may be further filled with a gas such as nitrogen through the air hole 122, so as to better deoxidize and remove bubbles from the blind hole of the sample, and further improve the pretreatment effect of the sample. After the evacuation is completed, the control device opens the first heating plate 17, heats the pretreatment liquid according to the set predetermined temperature value, and obtains the temperature value of the pretreatment liquid measured by the thermometer 13, thereby adjusting the temperature of the first heating plate 17. The control means simultaneously opens the first ultrasonic bar 15 to provide ultrasonic vibration for the pretreatment process according to the set predetermined power value. In one example, the predetermined temperature value may range from 0 to 100 ℃ and the predetermined power value may range from 100W to 3000W. After the preset treatment time is 30 s-30 min, the control device closes the first heating plate 17 and the first ultrasonic rod 15, the pretreatment process is finished, and the sealing cover plate 12 is opened to take out the sample.

Therefore, the micropore pretreatment and electroplating integrated device of the embodiment controls the components to work cooperatively by arranging the first heating plate 17, the first ultrasonic rod 15, the external vacuum pump 18 and the like, so that the effect of the electroplating pretreatment of the blind hole with the height-depth ratio is effectively improved, and the device is mainly characterized in the following aspects: (1) The liquid in the blind hole is fully infiltrated, so that air bubbles in the hole are removed, and the problems of deoxygenation, bubble removal and the like in the blind hole of the printed circuit board in the prior art are overcome; (2) Under the condition of proper temperature and ultrasonic vibration, the pretreatment liquid reacts with the inner wall of the blind hole to remove impurities and oxides in the blind hole and activate the metal reaction surface. Fundamentally solves the defects of the prior art that the subsequent electroplating filling effect is not ideal, such as holes, cracks and the like, caused by incomplete pretreatment of the sample.

As shown in FIGS. 1 and 5-10, the plating tank 21 is used for containing a plating solution and containing a sample, a built-in second ultrasonic bar 24 and other components. In one example, the plating tank 21 is square. An electrode assembly is provided in the plating tank 21, and includes: an electrode holder 211, an anode 215, a cathode, and a reference electrode 217. The cathode is a sample held by a sample holder 216. The electrode holder 211 is disposed in the plating tank 21, and in particular, both ends of the electrode holder 211 may be fixed to two opposite inner sidewalls of the plating tank 21 for fixing the anode 215, the cathode and the reference electrode 217.

The plating solution circulation system 22 is configured to provide a circulating plating solution to the plating tank 21, and includes a transfer pump 221, a pump-out pipe 222, a feed pipe 223, a distribution pipe 224, and a shock pad 225.

The present embodiment employs an external transfer pump 221, which may be mounted on the outer sidewall of the plating tank 21. In one example, a shock pad 225 is also placed under the transfer pump 221 to dampen vibrations. The liquid suction pipe 222 and the liquid feed pipe 223 are connected to the transfer pump 221. The liquid inlet of the liquid pumping pipe 222 is positioned at a position 5-10 cm below the plating liquid level in the plating tank. The liquid outlet of the liquid feeding pipe 223 is communicated with the liquid dividing pipe 224. Preferably, as shown in fig. 8, the liquid inlet 226 of the liquid suction pipe 222 is in a perforated sphere shape, so that the plating liquid can be better sucked. An ultrafiltration membrane 227 is also disposed in the liquid extraction tube 222 to filter large particulate matter in the plating solution so as not to affect the pore-filling effect.

The spraying device 23 is used for spraying the plating solution provided by the plating solution circulating system 22 to the sample, and comprises: a spray-pressure bracket 231 and a spray-pressure pipe 232.

The spray-pressing bracket 231 is disposed in the plating tank 21, and specifically, both ends of the spray-pressing bracket 231 may be fixed to two inner sidewalls of the plating tank 21 to which the electrode brackets 211 are fixed, and in one example, the spray-pressing bracket 231 is riveted with the plating tank 21 by screws. The electrode holder 211 and the spray holder 231 are each a bar-shaped holder and are arranged in parallel in the plating tank 21. The inside of the spray-pressure support 231 is hollow, the liquid distribution pipe 224 is arranged inside the spray-pressure support 231, the spray-pressure support 231 is provided with an infusion pipeline socket 233, and a liquid outlet of the liquid delivery pipe 223 passes through the infusion pipeline socket 233 to be communicated with the liquid distribution pipe 224.

In this embodiment, N spray pipes 232 are adopted, N is greater than or equal to 1, the spray pipes 232 are hollow round pipes, and the top ends of the spray pipes pass through the openings of the spray supports 231 and are communicated with the liquid distribution pipes 224. The spray-pressing support 231 is provided with N groups of clamping plates matched with the spray-pressing pipes 232 in shape, each spray-pressing pipe 232 is fixed on the spray-pressing support 231 through a group of two clamping plates 234, shaking or sliding of the spray-pressing pipes 232 when spraying electroplating liquid is avoided, and stability of the spray-pressing pipes 232 is improved so as to improve electroplating effect. N (N is more than or equal to 1) spray holes 235 are uniformly distributed on one side of the spray pressure pipe 232 facing the electrode bracket 231, and spray heads 236 capable of adjusting flow and pressure are arranged on the spray holes 235. The spraying and pressing device adopts a high-pressure spraying mode, can ensure convection and mass transfer of plating solution in the blind hole of the sample, promotes filling of substances in the blind hole, and greatly improves the electroplating effect. Through setting up a plurality of spouts and press the pipe and spout and press the pipe to set up a plurality of jet orifices, can realize filling a plurality of samples or a plurality of holes on the same sample once to plating times has significantly reduced, has shortened electroplating time, has greatly improved electroplating work efficiency.

The second heating plate 25 is installed outside the plating tank 21 for heating the plating solution in the plating tank 21 to control the temperature of the plating process. In one example, the external heater is a second heating plate 25 that is mounted on the floor of the plating tank 21. The integrated device of the present embodiment further includes: a thermometer 213 is installed in the plating tank 21 through a thermometer holder 214 for measuring the temperature of the plating solution during the plating process.

The second ultrasonic bar 24 is used to provide ultrasonic vibration for the electroplating process, and is installed in the electroplating tank 21 through the ultrasonic bar bracket 212.

The present embodiment further includes a sealing cover 26 for the plating tank 21. As shown in fig. 6, the sealing cap 26 is provided with an air charging hole 261, an air discharging hole 262, a wire hole 263, an extractor tube penetration hole 264 and a liquid feeding tube penetration hole 265.

The gas filling hole 261 is used for filling gas, such as nitrogen or argon, into the plating solution, and the gas discharged from the plating solution is discharged from the gas discharging hole 262, so that the oxygen content in the plating solution can be reduced, and the plating effect can be improved. The external vacuum pump 18 of the vacuum pumping assembly is connected to the exhaust hole 262 through the external pipe 16, and the external vacuum pump 18 can pump the plating tank 21 to vacuum. The wire guides 263 are used for wires of the cathode, anode and reference electrode that are led out from the plating tank 21. The suction pipe penetration hole 264 and the delivery pipe penetration hole 265 are respectively penetrated by the suction pipe 222 and the delivery pipe 223.

The control device of the present embodiment is also used to control the sample plating process in the plating tank 21. The control device is connected to the second heating plate 25, the second ultrasonic bar 24, the thermometer 213 and the transfer pump 221, and controls the temperature of the second heating plate 25, the power of the second ultrasonic bar 24, the temperature measured by the thermometer 213, and the operation of the transfer pump 221, respectively.

In this embodiment, the respective holes formed in the pretreatment tank cover 12 and the plating tank sealing cover 26 are closed by sealing plugs when not in use, so as to ensure the sealing between the tank 11 and the plating tank 21.

The working process of the microporous pretreatment and electroplating integrated device of this embodiment is as follows. The method comprises the steps of opening a sealing cover 26 of a printed circuit board sample to be electroplated, filling prepared electroplating solution into an electroplating tank 21, fixing the sample to an electrode bracket 211 through a sample hanger 216, connecting the sample to a cathode line, placing an anode 215 and a reference electrode 217 on the electrode bracket 211 in the electroplating tank 21, and connecting the anode line and the reference electrode line respectively. The plating vessel 21 is sealed by covering the sealing cover 26. The external vacuum pump 18 is connected with the exhaust hole 262 through the external pipeline 16, the control device turns on the external vacuum pump 18, and the inside of the electroplating tank 21 is vacuumized according to the preset negative pressure value. In one example, the predetermined negative pressure value may range from 0.01MPa to 0.1MPa. In one example, before the vacuum pumping operation, the plating solution in the plating tank 21 may be further filled with a gas such as nitrogen or argon through the filling holes 261, and the gas discharged from the plating solution is discharged from the gas discharge holes 262 to reduce the oxygen content in the plating solution. After the evacuation is completed, the controller turns on the transfer pump 221, and the plating liquid starts to circulate in the plating tank 21. The control device opens the second heating plate 25, heats the plating liquid according to the set predetermined temperature value, and acquires the temperature value of the plating liquid measured by the thermometer 213, thereby adjusting the temperature of the second heating plate 25. The control device simultaneously opens the second ultrasonic bar 24 to provide ultrasonic vibration for the electroplating process according to the set predetermined power value. In one example, the predetermined temperature value may range from 0 to 100 ℃ and the predetermined power value may range from 100W to 3000W. The corresponding ports of the electroplating power supply (a stabilized voltage power supply or a pulse power supply) are respectively connected with a cathode line, an anode line and a reference electrode line. And (3) switching on an electroplating power supply, and starting micropore electroplating filling after setting parameters such as deposition potential, deposition current, deposition time and the like on the power supply. After the deposition time (30 min-180 min) is reached, the electroplating power supply is turned off, the control device turns off the second heating plate 25, the second ultrasonic rod 24 and the conveying pump 221, the electroplating process is finished, and after the internal and external pressures of the electroplating tank 21 are balanced, the sealing cover 26 is opened to take out the sample.

Therefore, the micropore pretreatment and electroplating integrated device of the embodiment controls the components such as the second heating plate 25, the second ultrasonic rod 24, the external vacuum pump 18, the conveying pump 221 and the like to cooperatively work, adopts a high-pressure injection mode during electroplating, ensures convection and mass transfer of plating solution in the blind hole, promotes filling of substances in the blind hole, effectively solves the problem of difficult convection of the plating solution inside and outside the blind hole, thereby improving deep plating capacity of electroplating hole filling, enhancing hole filling effect of deep holes and reducing hole filling defects.

In the integrated device for micropore pretreatment and electroplating of this embodiment, further, the liquid feeding tube 223 adopts a hose, the spray-pressing bracket 231 and the electrode bracket 211 are detachably mounted on the electroplating tank 21, and the side walls of the electroplating tank 21, where the electrode bracket 211 and the spray-pressing bracket 231 are fixed, are provided with a plurality of fixing positions for mounting the spray-pressing bracket 231 and the electrode bracket 211. The plating tank 21 is fixed with the electrode holder 211 and the side wall of the spray-pressure holder 231 is marked with a scale 218, and the scale 218 is used for accurately marking the distance between the spray-pressure tube 232 and the sample during plating. Through will spout and press support 231 and electrode support 211 to the change spouts and press the interval of support 231 and electrode support 211, then adjust spouts and press the distance between the micropore on the pipe 232 and the sample that is plated, thereby can realize spouting the electroplating operation of pressing the micropore distance on pipe 232 and the sample to the difference, improved electroplating operation's flexibility, reduced electroplating times, shortened electroplating time, improved work efficiency.

Another embodiment of the present invention provides a micro-pore pretreatment method for pretreating a printed circuit board sample by using the micro-pore pretreatment and electroplating integrated device of the above embodiment, the micro-pore pretreatment method comprising:

step S1: a sample to be pre-treated and a first ultrasonic wand 15 are provided.

The method specifically comprises the following steps: the sealing cover plate 12 is opened, the hanging frame 14 is detached from the box body 11, the sample, the thermometer 13 and the first ultrasonic rod 15 are respectively installed in the sample insertion opening 142, the thermometer insertion opening 141 and the ultrasonic rod insertion opening 143 of the hanging frame 14 through the clamps, and then the hanging frame 14 is put back in a fixed position in the box body.

Step S2: the pretreatment liquid is filled and the pretreatment tank is sealed.

The method specifically comprises the following steps: the prepared pretreatment liquid is filled into a box 11, the top end of the sample is submerged, a sealing cover plate 12 is covered, and the box 11 is sealed. In one example, the pretreatment liquid floods the top of the sample by 2-5 cm.

Step S3: vacuum is drawn on the pretreatment tank.

The method specifically comprises the following steps: the external vacuum pump 18 is connected with the vacuumizing hole 121 through the external pipeline 16, the control device opens the external vacuum pump 18, and the inside of the box 11 is vacuumized according to the preset negative pressure value. In one example, the predetermined negative pressure value may range from 0.01MPa to 0.1MPa.

In an example, before the vacuumizing operation, the pretreatment liquid in the box 11 may be further filled with a gas such as nitrogen through the air hole 122, so as to better deoxidize and remove bubbles from the blind hole of the sample, and further improve the pretreatment effect of the sample.

Step S4: the first heating plate 17 and the first ultrasonic bar 15 are opened to perform pretreatment on the sample.

The method specifically comprises the following steps: after the evacuation is completed, the control device opens the first heating plate 17, heats the pretreatment liquid according to the set predetermined temperature value, and obtains the temperature value of the pretreatment liquid measured by the thermometer 13, thereby adjusting the temperature of the first heating plate 17. The control means simultaneously opens the first ultrasonic bar 15 to provide ultrasonic vibration for the pretreatment process according to the set predetermined power value. In one example, the predetermined temperature value may range from 0 to 100 ℃ and the predetermined power value may range from 100W to 3000W.

Step S5: after reaching the pretreatment time, the sample was taken out.

The method specifically comprises the following steps: after the preset treatment time is 30 s-30 min, the control device closes the first heating plate 17 and the first ultrasonic rod 15, the pretreatment process is finished, and the sealing cover plate 12 is opened to take out the sample.

Another embodiment of the present invention provides a micro-hole plating method for plating micro-holes of a printed circuit board sample using the micro-hole pretreatment and plating integrated apparatus of the above embodiment, the micro-hole plating method comprising:

and S1, filling electroplating liquid, and mounting a sample and an electrode.

The method specifically comprises the following steps: the sealing cover 26 is opened, the prepared electroplating solution is filled into the electroplating bath 21, a sample is fixed on the electrode bracket 211 through the sample hanger 216, the sample is connected with a cathode line, and the anode 215 and the reference electrode 217 are placed on the electrode bracket 211 in the electroplating bath 21 and are respectively connected with the anode line and the reference electrode line. The plating vessel 21 is sealed by covering the sealing cover 26.

In one example, the sample is a pre-treated sample, e.g., a sample treated by the microwell pre-treatment method of the above-described embodiments. The micro-pore plating method of the present embodiment further includes, before step S1: and S0, preprocessing the sample.

Step S2: the plating vessel 21 is evacuated.

The method specifically comprises the following steps: the external vacuum pump 18 is connected with the exhaust hole 262 through the external pipeline 16, the control device turns on the external vacuum pump 18, and the inside of the electroplating tank 21 is vacuumized according to the preset negative pressure value. In one example, the predetermined negative pressure value may range from 0.01MPa to 0.1MPa.

In one example, before the vacuum pumping operation, the plating solution in the plating tank 21 may be further filled with a gas such as nitrogen or argon through the filling holes 261, and the gas discharged from the plating solution is discharged from the gas discharge holes 262 to reduce the oxygen content in the plating solution.

Step S3: the plating solution circulation system 22, the second heating plate 25 and the second ultrasonic bar 24 are turned on to start plating the sample.

The method specifically comprises the following steps: after the evacuation is completed, the controller turns on the transfer pump 221, and the plating liquid starts to circulate in the plating tank 21. The control device opens the second heating plate 25, heats the plating liquid according to the set predetermined temperature value, and acquires the temperature value of the plating liquid measured by the thermometer 213, thereby adjusting the temperature of the second heating plate 25. The control device simultaneously opens the second ultrasonic bar 24 to provide ultrasonic vibration for the electroplating process according to the set predetermined power value. In one example, the predetermined temperature value may range from 0 to 100 ℃ and the predetermined power value may range from 100W to 3000W. And (3) switching on an electroplating power supply (a stabilized voltage power supply or a pulse power supply), setting parameters such as a deposition potential, a deposition current, a deposition time and the like on the power supply, and starting micropore electroplating filling.

Step S4: after the plating time was reached, the sample was taken out.

The method specifically comprises the following steps: after the preset treatment time is 30-180 min, the electroplating power supply is turned off, the control device turns off the second heating plate 25, the second ultrasonic rod 24 and the conveying pump 221, the electroplating process is finished, and after the internal and external pressures of the electroplating tank 21 are balanced, the sealing cover 26 is opened to take out the sample.

In summary, the foregoing description is only of the preferred embodiments of the present invention, and all equivalent changes and modifications made in accordance with the claims should be construed to fall within the scope of the invention.

Claims (1)

1. A micropore pretreatment and electroplating integrated treatment method is characterized in that,

the method comprises the steps that a micropore pretreatment and electroplating integrated device is adopted to carry out pretreatment and electroplating on a sample with a blind hole with a high depth-to-diameter ratio, the integrated device comprises a pretreatment box and an electroplating box which are fixedly connected, the pretreatment box comprises a box body, a first heating plate and a first ultrasonic rod, and the electroplating box comprises an electroplating bath, a second heating plate, a second ultrasonic rod, a plating solution circulating system and a spraying and pressing device;

the method comprises the following steps:

step S1: installing the sample to be pretreated in the pretreatment tank;

step S2: filling pretreatment liquid into the pretreatment box body, submerging the top end of the sample, and sealing the pretreatment box body;

step S3: filling nitrogen into the pretreatment liquid to deoxidize and bubble the blind holes of the sample, and vacuumizing the pretreatment box;

step S4: opening the first heating plate to heat the pretreatment liquid according to a preset temperature value, measuring the temperature value of the pretreatment liquid, and adjusting the temperature of the first heating plate according to the temperature value; simultaneously, the first ultrasonic rod is opened to provide ultrasonic vibration for the pretreatment process according to the preset power value, so that the pretreatment liquid and the inner wall of the blind hole are subjected to chemical reaction under the condition of proper temperature and ultrasonic vibration to remove impurities and oxides in the blind hole and activate the metal reaction surface;

step S5: taking the sample out of the pretreatment tank after a set predetermined pretreatment time is reached;

step S6: loading electroplating solution into an electroplating tank of an electroplating tank, and loading a sample and an electrode into the electroplating tank, wherein the sample is a sample subjected to pretreatment by the pretreatment tank;

step S7: vacuumizing the electroplating bath according to the preset negative pressure value;

step S8: opening the plating solution circulating system to enable the plating solution to start circulating flow in the plating tank, and spraying the plating solution provided by the plating solution circulating system to the sample by utilizing the spraying device; simultaneously opening a second heating plate of the electroplating tank, heating the electroplating liquid according to a preset temperature value, measuring the temperature value of the electroplating liquid, and adjusting the temperature of the second heating plate according to the temperature value; simultaneously opening the second ultrasonic rod, and providing ultrasonic vibration for the electroplating process according to the preset power value; the spraying device adopts a high-pressure spraying mode to ensure convection and mass transfer of plating solution in a blind hole of a sample and promote filling of substances in the blind hole, and comprises a plurality of spraying pipes, wherein the spraying pipes are provided with a plurality of spraying holes, and the distance between the spraying pipes of the spraying device and micropores on the sample is adjusted to fill a plurality of samples or a plurality of blind holes on the same sample at one time;

step S9: and taking the sample out of the electroplating box after the preset electroplating time is reached.

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