CN213278102U - Solder strip manufacturing equipment - Google Patents

Abstract

The utility model discloses a weld and take manufacturing equipment to supply to brush a welding material and form one in a basic unit and weld the area, weld and take manufacturing equipment and include a load-bearing platform and an operation main part, wherein load-bearing platform is in order to supply to bear the basic unit, the operation main part includes that at least one brushes the unit with a brush, wherein brush the unit with a brush and be kept in the load-bearing platform top, brush the unit with a brush can with the welding material brush in the basic unit.

Description

Solder strip manufacturing equipment

Technical Field

The utility model relates to a weld and take manufacturing installation, in particular to weld and take manufacturing installation.

Background

The welding strip has good conductivity and is applied to connection between a photovoltaic module and a cell, for example, a solar module, the solar cell is connected in series or in parallel by the welding strip and is connected with the solar cell and a junction box, so that a complete electric path can be formed between the welded solar cells, and the solar cell can convert solar energy into electric energy in the subsequent use process, and the generated current can be transmitted through the welding strip. Therefore, the quality of the solder strip directly affects the solar energy collection efficiency of the photovoltaic module and the power of the photovoltaic module.

Present solder strip includes a copper base and two tin coating, two the tin coating form respectively in the upper surface and the lower surface of copper base, at present manufacturing process, will the copper base is taken out after soaking a tin alloy solution for a period and is dried and can form smoothly on the copper base the tin coating will through utilizing a soldering tin the solder strip the tin coating weld respectively in a solar wafer, then can be with a plurality of solar wafer interconnect. However, in an actual use process, since the photovoltaic module receives sunlight by means of the surface of the solar cell, when the photovoltaic solder strip is soldered to the solar cell, the photovoltaic solder strip blocks the surface of the solar cell, so that sunlight directly irradiated on the solar cell is reduced, an area of the solar cell capable of receiving the sunlight is reduced, receiving efficiency of the photovoltaic module on solar energy is reduced, and utilization efficiency of the photovoltaic module on solar energy is further affected.

Disclosure of Invention

An object of the utility model is to provide a weld and take manufacture equipment, wherein weld and take manufacture equipment and can produce a welding strip that has unsmooth surface.

Another object of the present invention is to provide a solder strip manufacturing apparatus, wherein the solder strip manufacturing apparatus includes at least one operation body, the operation body can brush a solder material on a base layer, and form a solder layer on the base layer, and the solder layer has a concave-convex structure, so that via the solder strip manufacturing apparatus can produce a solder strip having a concave-convex surface.

Another object of the present invention is to provide a welding strip manufacturing apparatus, wherein the welding strip manufacturing apparatus the operation body includes a painting unit, the painting unit can move according to a preset rule to brush the welding material at intervals to the base layer.

Another object of the present invention is to provide a solder strip manufacturing apparatus, wherein the solder strip manufacturing apparatus includes a spacer element, wherein the spacer element has at least one through hole, the base layer is held in the spacer element below the through hole, the solder material can be coated with a brush the unit evenly in the through hole, and then the solder material from the through hole falls on the base layer, and can the base layer forms a plurality of welding parts spaced from each other, so as to make the solder layer having a concave-convex structure in the base layer.

Another object of the present invention is to provide a solder strip manufacturing apparatus, wherein the spacer member of the solder strip manufacturing apparatus has a plurality of the through holes, and a plurality of the through holes are provided at intervals to each other, so that when the solder material is filled into the through holes, the soldering portion at the base layer can be formed at intervals to each other.

Another object of the present invention is to provide a solder strip manufacturing apparatus, wherein the operation body is even the solder material in the process of the through hole, the spacer element is attached to the base layer all the time, so as to ensure that the soldering portion can be formed on the base layer uniformly.

Another object of the present invention is to provide a solder strip manufacturing apparatus, wherein the spacer element is deformable, and further the operation body is capable of leveling the welding material's in-process, extruding all the time the spacer element is deformed and laminated downwards the base layer.

Another object of the present invention is to provide a solder strip manufacturing apparatus, wherein the solder strip manufacturing apparatus includes two fixing units, wherein the two ends of the spacing element are fixed to two fixing units, respectively, and the fixing units can be operated to move up and down, so as to adjust the spacing element with the distance between the base layers.

Another object of the present invention is to provide a solder strip manufacturing apparatus, wherein the solder strip manufacturing apparatus is disposed on the supporting platform, the base layer and the spacing element have a reserved space therebetween, the reserved space is higher than the depth of the through hole, so as to avoid the spacing element, the through hole is located on the base layer, the solder material is being moved by the base layer, and the friction is generated between the through hole and the spacing element.

Another object of the present invention is to provide a solder strip manufacturing apparatus, wherein the spacer element receives after the action force of the operating body is cancelled, the spacer element can recover the deformation, so that form in the base layer the weld portion can be followed pass in the reserved space, and avoided the weld portion with the spacer element takes place the friction.

Another object of the present invention is to provide a solder strip manufacturing apparatus, wherein the solder strip can be applied to a solder material interval ground brush in a semi-finished solder strip, and then a solder strip having a concave-convex surface is manufactured.

Another object of the present invention is to provide a welding strip manufacturing apparatus, wherein the welding strip manufacturing apparatus is capable of simultaneously applying paint to a plurality of base layers, and then simultaneously a plurality of forming on the base layers the welding layer is favorable to improving the production efficiency of the welding strip manufacturing apparatus, and then shortens the manufacturing cycle of the welding strip.

According to an aspect of the present invention, the present invention further provides a solder strip manufacturing apparatus for brushing a solder material on a base layer to form a solder strip, wherein the solder strip manufacturing apparatus comprises:

a bearing platform for bearing the base layer; and

the operation body comprises at least one painting unit, wherein the painting unit is kept above the bearing platform and can be used for painting the welding flux material on the base layer to obtain the welding strip.

According to an embodiment of the present invention, the operation body further includes a movable unit, wherein the painting unit is disposed in the movable unit, wherein the movable unit can be driven, and the movable unit can drive the painting unit to move.

According to the utility model discloses an embodiment, the movable unit includes a horizontal movable element and an at least vertical movable element, wherein vertical movable element is set up in horizontal movable element, apply paint the unit with a brush set up in vertical movable element, horizontal movable element can drive vertical movable element moves with applying paint the unit with a brush transversely, vertical movable element can be driven and drive apply paint the unit with a brush and move longitudinally, horizontal movable element with vertical movable element mutually supports so that apply paint the unit with a brush will welding material interval ground brush in the basic unit.

According to an embodiment of the invention, the operating body comprises a support frame, wherein the support frame comprises a support body and a movable rail, the movable rail is arranged in the support body, the transverse movable element is movably arranged in the movable rail, and the transverse movable element can be driven to move along the movable rail.

According to an embodiment of the present invention, the brushing unit includes a connecting member and a leveling member, the leveling member includes an assembly portion and a leveling portion, the connecting member is connected to the movable unit the longitudinal movable member and the leveling member the assembly portion, the leveling portion has a leveling surface, the leveling surface of the leveling portion can level the welding material in the base layer.

According to an embodiment of the invention, the operating device comprises two of the support frames, two of the support frames are arranged relatively, wherein the two ends of the transverse movable element are movably arranged in two of the movable guide rails of the support frames, respectively.

According to an embodiment of the present invention, the leveling portion extends obliquely downward from the fitting portion.

According to the utility model discloses an embodiment, apply paint the unit with a brush and further include two stop parts, two the stop part respectively set up in the both sides of even flat portion.

According to an embodiment of the present invention, the number of the brushing units and the longitudinal moving elements is two, two the longitudinal moving elements are arranged at intervals in the transverse moving elements, two the brushing units are arranged respectively in the longitudinal moving elements, and two the brushing units the leveling portions of the brushing units the leveling planes are opposite.

According to an embodiment of the invention, the extension direction of the movable rail is parallel to the width direction of the carrying platform.

According to the utility model discloses an embodiment, the extending direction perpendicular to of movable guide rail load-bearing platform's width direction.

According to an embodiment of the present invention, the solder strip manufacturing apparatus further comprises a control unit, wherein the control unit can control the horizontal moving unit and the vertical moving unit to move according to a predetermined rule, so that the solder material is distributed at intervals on the base layer.

According to an embodiment of the present invention, the solder strip manufacturing apparatus further comprises a spacer member, the spacer member has at least one through hole, the spacer member is disposed above the supporting platform, and an accommodating space is formed between the spacer member and the supporting platform, the through hole of the spacer member communicates with the accommodating space, and the spacer member is held below the leveling member of the applying brush unit.

According to an embodiment of the present invention, the solder strip manufacturing apparatus further comprises two fixing units, wherein both ends of the spacing member are respectively installed at the two fixing units.

According to an embodiment of the invention, the spacer element is deformable.

According to an embodiment of the invention, the fixing unit is operatively arranged to the support body, the fixing unit being longitudinally movable.

According to an embodiment of the invention, the spacer element has a plurality of said through holes, wherein a plurality of said through holes are formed at the spacer element at intervals and in lines.

According to an embodiment of the invention, the spacer element has a plurality of said through holes, wherein a plurality of said through holes are formed at the spacer element at intervals and in a row.

According to an embodiment of the invention, the base layer has a plurality of mutually spaced recesses, which communicate with the through-holes of the spacer elements.

Drawings

Fig. 1A is a schematic perspective view of a solder strip manufacturing apparatus according to a preferred embodiment of the present invention.

Fig. 1B is a schematic perspective view of a solder strip manufacturing apparatus according to a preferred embodiment of the present invention.

Fig. 2 is a schematic diagram of one stage of the manufacturing process of manufacturing a solder strip by the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 3 is a schematic diagram of one stage of the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 4 is a schematic diagram of one stage of the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 5 is a schematic diagram of one stage of the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 6 is a schematic diagram of one stage of the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 7 is a schematic diagram of one stage of the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

Fig. 8A is a schematic view of a solder strip manufacturing apparatus according to another preferred embodiment of the present invention.

Fig. 8B is a schematic view of a solder strip manufacturing apparatus according to another preferred embodiment of the present invention.

Fig. 9 is a schematic diagram of one of the stages in the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to the above preferred embodiment of the present invention.

FIG. 10 is a schematic diagram of one of the stages in the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to another preferred embodiment of the present invention.

Fig. 11A is a schematic diagram of one of the stages in the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to another preferred embodiment of the present invention.

Fig. 11B is a schematic diagram of one of the stages in the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to another preferred embodiment of the present invention.

Fig. 12A is a schematic diagram of one of the stages in the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to another preferred embodiment of the present invention.

Fig. 12B is a schematic diagram of one of the stages in the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to another preferred embodiment of the present invention.

Fig. 13 is a schematic diagram of one of the stages in the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to another preferred embodiment of the present invention.

Fig. 14 is a schematic diagram of one of the stages in the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to another preferred embodiment of the present invention.

Fig. 15 is a schematic diagram of one of the stages in the manufacturing process of the solder strip by the solder strip manufacturing apparatus according to another preferred embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, as the terms are used in the description to indicate that the referenced device or element must have the specified orientation, be constructed and operated in the specified orientation, and not for the purposes of limitation.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 1A to 7 of the specification, a solder ribbon manufacturing apparatus 100 according to a preferred embodiment of the present invention will be explained in the following description, wherein the solder ribbon manufacturing apparatus 100 can be used to produce a solder ribbon 200 having a concave-convex surface, the solder ribbon 200 can be used to connect a photovoltaic module, such as a solar cell panel, and the concave-convex surface of the solder ribbon 200 increases a soldering area, so that the photovoltaic module can be more stably connected to improve stability and reliability of the photovoltaic module. Further, the concave-convex surface of the welding strip 200 increases the light reflection area of the welding strip 200, so that the light reflection rate of the welding strip 200 is improved, and when the welding strip 200 is subsequently applied to connecting a solar cell, the welding strip 200 can reflect sunlight to the solar cell, so that the influence of the welding strip 200 on the conversion efficiency of the solar cell when the solar cell is converted into electric energy is reduced.

Referring to fig. 1A and 2, the solder ribbon manufacturing apparatus 100 includes at least one operating body 10 and a supporting platform 20, wherein the operating body 10 is held above the supporting platform 20, the supporting platform 20 is capable of supporting a base layer 210, and the base layer 210 is held below the operating body 10 in a manner corresponding to the operating body 10, the operating body 10 is capable of obtaining a solder material and applying the solder material to the base layer 210, thereby forming a solder layer 220 on a surface of the base layer 210, and preferably, the solder layer 220 has a concave-convex structure, so that the solder ribbon 200 manufactured by the solder ribbon manufacturing apparatus 100 has a concave-convex surface. It will be understood by those skilled in the art that the shape of the welding material applied to the base layer 210 is not a limitation of the present invention. The welding material may be uniformly disposed on one surface or both of the upper and lower surfaces of the base layer 210 at a time in the same thickness; or the welding materials are coated on the base layer 210 at intervals, a certain preset interval is formed between adjacent welding materials, and the thicknesses of the welding materials are consistent or different. And the shape of the welding material formed when it is coated on the base layer 210 is also not a limitation of the present invention.

Further, referring to fig. 3 to 7, the operation body 10 includes at least one support frame 11, a movable unit 12, and at least one painting unit 13, wherein the movable unit 12 is connected to the support frame 11 and the painting unit 13, and the painting unit 13 is held above the bearing platform 20. The movable unit 12 is movably disposed on the supporting frame 11, and the movable unit 12 can be driven to move, so as to drive the brushing unit 13 to move and change the relative position between the brushing unit 13 and the bearing platform 20. Furthermore, the painting unit 13 can obtain the welding material, when the base layer 210 is placed on the bearing platform 20, the movable unit 12 can be driven to drive the painting unit 13 to be close to the base layer 210, and when the painting unit 13 is in contact with the base layer 210, the painting unit 13 can paint the welding material on the base layer 210 at a position corresponding to the painting unit 13, so as to form the welding layer 220 on the base layer 210.

It is worth mentioning that a transmission mechanism is connected to the painting unit 13, the transmission mechanism is used for storing different types of welding materials, and the transmission mechanism transmits the welding materials to the painting unit 13. The frequency of the transmission mechanism for transmitting the welding material is synchronous with the painting frequency of the painting unit 13, so that the welding material is distributed in the painting unit 13, the transmission mechanism can improve the working efficiency of the painting unit 13, and reduce the time for distributing the welding material to the painting unit 13.

Further, the movable unit 12 includes a transverse movable element 121 and at least one longitudinal movable element 122, wherein the longitudinal movable element 122 is movably disposed on the transverse movable element 121, the transverse movable element 121 is movably disposed on the supporting frame 11, and the brushing unit 13 is connected to a lower portion of the longitudinal movable element 122. The transverse moving element 121 can be driven to move transversely along the support frame 11 according to a preset trajectory, so as to drive the longitudinal moving element 122 and the painting unit 13 to move transversely, as shown in fig. 4 and 6. The longitudinal movable element 122 can be driven to move up and down relative to the transverse movable element 121, so as to drive the brushing unit 13 to approach the bearing platform 20 or to move away from the bearing platform 20, as shown in fig. 3, 5 and 7. It is noted that the lateral movement of the present invention means a movement in a direction parallel to the horizontal plane, and the longitudinal movement means a movement in a direction perpendicular to the horizontal plane.

Preferably, the longitudinally movable member 122 of the movable unit 12 can be driven to hydraulically extend and retract, for example, the longitudinally movable member 122 of the movable unit 12 can be implemented as, but not limited to, a hydraulic arm, and the longitudinally movable member 122 can be driven by a hydraulic pump to extend downward or retract upward. For example, when the longitudinally movable member 122 extends downward, the painting unit 13 connected to the lower portion of the longitudinally movable member 122 can contact the base layer 210 disposed on the carrying platform 20 and apply the welding material to the base layer 210, and when the longitudinally movable member 122 is driven to move upward, the painting unit 13 is away from the base layer 210, and the base layer 210 can be moved or replaced.

In a preferred embodiment of the present invention, as shown in fig. 11A, 12A and 14, the supporting frame 11 includes a supporting body 111 and a transverse movable rail 112, the transverse movable rail 112 is disposed in the supporting body 111 in a manner parallel to the horizontal plane, the transverse movable element 121 of the movable element 12 is movably disposed in the transverse movable rail 112 of the supporting frame 11, and the transverse movable element 121 can be driven to move back and forth along the transverse movable rail 112, so as to drive the longitudinal movable element 122 and the painting unit 13 to move back and forth along the transverse movable rail 112. For example, when the painting unit 13 is driven by the longitudinal movable element 122 to approach the base layer 210 and apply the welding material to the base layer 210, the transverse movable element 121 can be driven to move back and forth along the transverse movable rail 112 of the supporting frame 11, so as to brush the welding material applied to the base layer 210 to form the welding layer 220 on the base layer 210. The lateral movable element 121 drives the painting unit 13 to move back and forth with respect to the base layer 210, so that the welding material is uniformly distributed on the surface of the base layer 210. But the relative movement between the transverse mobile element 121 and the base layer 210 is not limited, the transverse mobile element 121 is allowed to slide relative to the base layer 210 at a rate such that the bonding material is distributed on the base layer 210, but the relative sliding between the transverse mobile element 210 and the base layer 210 is performed once.

Preferably, the extending direction of the transverse movable rail 112 is parallel to the width extending direction of the base layer 210, that is, the extending direction of the transverse movable rail 112 is parallel to the width direction of the carrying platform 20. Specifically, when at least one substrate 210 is placed on the supporting platform 20 from left to right, the transverse movable element 121 can be driven to move back and forth along the supporting platform 20, so as to drive the painting unit 13 to move back and forth relative to the substrate 210, that is, the painting unit 13 paints the solder material on the substrate 210 during the movement along the width direction of the substrate 210, so as to form the solder layer 220 on the substrate 210. Preferably, the length of the welding layer 220 formed on the base layer 210 may be implemented to be identical to the width of the applying brush unit 13, the width of the welding layer 220 being equal to the width of the base layer 210. It should be understood that the size of the weld layer 220 should not be construed as limiting the scope and content of the weld manufacturing apparatus of the present invention.

Preferably, the extending direction of the transverse movable rail 112 is perpendicular to the width extending direction of the base layer 210, that is, the extending direction of the transverse movable rail 112 is perpendicular to the width direction of the carrying platform 20. Specifically, when at least one of the base layers 210 is placed on the bearing platform 20 from left to right, the transverse movable element 121 can be driven to move left and right along the bearing platform 20, so as to drive the painting unit 13 to move back and forth relative to the base layer 210, that is, the painting unit 13 paints the welding material on the base layer 210 during the movement along the length direction of the base layer 210. Further, the transverse movable member 121 can be controlled to move along the length direction of the base layer 210 by a predetermined distance, thereby controlling the length of the welding layer 220 formed on the base layer 210, wherein the length of the welding layer 220 is not limited.

In other embodiments of the present invention, the supporting frame 11 is implemented as two, two the supporting frame 11 is disposed relatively, two the supporting frame 11 the transverse movable rail 112 is disposed relatively, and is kept at the same height, the two ends of the transverse movable element 121 of the movable element 12 are movably disposed at two of the transverse movable rails 112 of the supporting frame 11 respectively, and the two ends of the transverse movable element 121 can be driven to move back and forth along two of the transverse movable rails 112, so as to drive the longitudinal movable element 122 and the painting unit 13 to move along the back and forth direction of the transverse movable rails 112.

Further, the solder strip manufacturing apparatus 100 further includes a control unit 30, wherein the control unit 30 is communicably connected to the transverse moving member 121 and the longitudinal moving member 122 of the movable unit 12, and is capable of controlling the transverse moving member 121 and the longitudinal moving member 122 to move according to a preset rule, and making the transverse moving member 121 and the longitudinal moving member 122 cooperate with each other, and driving the applying brush unit 13 to move according to the preset rule, so as to apply the solder material to the base layer 210 and form the solder strip 200 having a concave-convex surface. Specifically, the preset rules include, but are not limited to, the distance the lateral motion element 121 moves laterally, the time the lateral motion element 121 moves in intervals, the distance the longitudinal motion element 122 moves longitudinally, the time the longitudinal motion element 122 moves in intervals, and the like.

For example, the base layer 210 is placed on the carrying platform 20 side by side from left to right, the longitudinal movable element 122 is driven to move downwards, and the painting unit 122 is enabled to paint the welding material on the base layer 210; further, the transverse moving element 121 is driven to move back and forth relative to the carrying platform 20 to brush the welding material uniformly on the base layer 210 to form a welding part 221; further, the longitudinal moving member 122 is driven to move upward and move the base layer 210 from left to right, and a preset distance is kept between the position of the base layer 210 corresponding to the painting unit 13 and the welding portion 221; further, the longitudinally movable member 122 is driven to move downwards again, and the painting unit 122 is enabled to paint the welding material on the base layer 210; further, the transverse moving element 121 is driven to move back and forth relative to the supporting platform 20 again to brush the welding material uniformly on the base layer 210, so as to form the welding portions 221 spaced from each other. The above-mentioned steps are repeated to form a plurality of welding portions 221 spaced apart from each other on the base layer 210, and the plurality of welding portions 221 form the welding layer 220, thereby forming the solder strip 200 with a concave-convex surface.

Referring to fig. 1A to 15, the applying brush unit 13 includes a connecting member 131 and a leveling member 132, wherein the connecting member 131 is connected to the movable unit 12 and the leveling member 132, and the leveling member 132 is detachably provided to the connecting member 131, so that a user can replace or maintain the leveling member 132. Further, the leveling member 132 includes a fitting portion 1321, a leveling portion 1322, and two blocking portions 1323, the leveling portion 1322 extends obliquely downward from the fitting portion 1321, the two blocking portions 1323 are respectively held at both sides of the leveling portion 1322, and the fitting portion 1321 is detachably mounted to the connecting member 131. Specifically, the leveling 1322 has a leveling surface forming an angle with the central axis of the connecting element 131, the leveling 1322 is capable of leveling the welding material, and the blocking portion 1323 is capable of blocking the welding material from flowing away from both sides of the leveling 1322.

In a preferred embodiment of the present invention, the number of the longitudinal movable elements 122 of the movable unit 12 and the brushing unit 13 is two, and two longitudinal movable elements 122 are respectively disposed at intervals on the transverse movable element 121. The connecting elements 131 of the two painting units 13 are respectively provided to the laterally movable element 121, and the two painting units 13 are provided at intervals in such a manner that the leveling surfaces of the leveling portions 1322 of the leveling elements 132 are opposed, and further, the two painting units cooperate with each other to level the welding material uniformly on the base layer, and the welding material waste can be avoided.

For example, two painting units 13 are arranged left and right with respect to the carrying platform 20, the welding material is located between the leveling parts 1322 of the leveling elements 132 of the two painting units 13 arranged oppositely, when the transverse moving element 121 is driven to move transversely from left to right, the leveling of the leveling part 1322 of the painting unit 13 on the left side can push the welding material to move from left to right; when the laterally moving member 121 is driven to move laterally from right to left, the leveling surface of the leveling portion 1322 of the applying brush unit 13 on the right side can push the welding material to move from right to left, thereby leveling the welding material uniformly on the base layer 210.

In the embodiment shown in fig. 1A to 7, two painting units 13 are arranged in front and back with respect to the carrying platform 20, when the base layer 210 is placed on the carrying platform 20 from left to right, the welding material is painted on the base layer 210, wherein the longitudinal movable element 122 on the front side is driven to extend downward, so as to bring the painting unit 13 on the front side close to the base layer 210 and contact the welding material; at this time, the laterally movable member 121 is driven to move laterally from front to back, and the leveling portion 1322 of the leveling member 132 of the applying brush unit 13 contacting the welding material is enabled to level the welding material from front to back to the base layer 210 during the movement from front to back; further, the longitudinally movable member 122 on the front side is driven to move upward, and at the same time, the longitudinally movable member 122 on the rear side is driven to move downward and can contact the welding material pushed to the right side; at this time, the laterally movable member 121 is driven to move laterally from back to front, and the applying brush unit 13 at the rear side horizontally pushes the welding material pushed to the rear side by the applying brush unit 13 at the front side to the front side, so that the welding material is uniformly applied to the base layer 210. It should be understood by those skilled in the art that the specific embodiment of the transverse movable element 121, the longitudinal movable element 122 and the painting unit 13 are only examples and should not be construed as limiting the scope and content of the solder strip manufacturing apparatus of the present invention.

In another embodiment, the bearing platform 20 is movable relative to the applying brush unit 13, and the difference of this embodiment compared with the above embodiments is that the applying brush unit 13 is in a movable state, the bearing platform 20 is in a static state, and the applying brush unit 13 moves relative to the bearing platform 20. In this embodiment, the applying brush unit 13 is in a static state, and the bearing platform 20 can slide up and down and move back and forth relative to the applying brush unit 13. In other words, when the welding material is specifically coated on the applying brush unit 13, the base layer 210 on the bearing platform 20 slides towards the applying brush unit 13 and is attached to the applying brush unit 13, and then the bearing platform 20 moves back and forth relative to the applying brush unit 13 one or more times, so that the welding material is formed on the base layer 210.

Preferably, the painting unit 13 can paint a plurality of base layers 210 at the same time to improve the manufacturing efficiency of the solder strip 200. For example, a plurality of the welding strips 200 are placed side by side on the carrying platform 20, the transverse movable element 121 of the movable unit 12 can be driven to drive the leveling element 132 of the applying brush unit 13 to move back and forth according to the preset rule, and the preset distance is greater than or equal to the sum of the widths of the plurality of the welding strips 200, so that the leveling element 132 of the applying brush unit 13 moves from the upper surface of the most front base layer 210 to the upper surface of the most rear base layer 210, the leveling element 132 can apply the welding material to the plurality of base layers 210 at intervals, and further the welding layer 220 is formed on the upper surfaces of the plurality of base layers 210 at the same time, so that a plurality of the welding strips 200 with concave-convex surfaces can be manufactured at the same time, and the production efficiency of the welding strips 200 is improved.

Preferably, the base layer 210 is made of a metal having good conductive ability, such as copper, silver, etc. Preferably, the base layer 210 has a band shape. Preferably, the soldering material may be implemented as, but not limited to, tin, silver, lead, bismuth, etc. metal with good soldering performance. It should be understood by those skilled in the art that the embodiments of the base layer 210 and the solder material are merely exemplary and should not be construed as limiting the scope and content of the solder ribbon manufacturing apparatus of the present invention.

In the embodiment shown in fig. 8A to 15, the solder ribbon manufacturing apparatus 100 further includes a spacer element 40, and the solder ribbon manufacturing apparatus 100 has a receiving space 50, the spacer element 40 is disposed above the carrying platform 20, and the receiving space 50 is formed between the spacer element 40 and the carrying platform 20 for receiving at least one base layer 210. Further, both ends of the accommodating space 50 are open to communicate with the external space, thereby allowing the base layer 210 to pass through the accommodating space 50. Further, a space 51 can be formed between the upper surface of the base layer 210 and the lower surface of the spacer element 40 of the carrying platform 20 for accommodating the welding layer 220 formed on the base layer 210, and it is beneficial to avoid friction between the welding layer 220 and the spacer element 40 during the process that the base layer 210 carries the welding layer 220 through the accommodating space 50.

The spacer element 40 further has at least one through hole 41, the through hole 41 communicating with the receiving space 50, the spacer element 40 being able to be arranged below the painting unit 13 in such a way that the through hole 41 corresponds to the levelling element 132 of the painting unit 13. The base layer 210 is held under the through-hole 41 of the spacer member 40, the applying brush unit 13 can apply the welding material to the spacer member 40, and the welding material can be formed from the through-hole 42 of the spacer member 40 on the base layer 210 under the through-hole 42.

Preferably, the base layer 210 has a plurality of grooves spaced apart from each other, the grooves of the base layer 210 placed in the receiving space 50 communicate with the through holes 41 of the spacer members 40, and the solder material enters the grooves of the base layer 210 from the through holes 42 of the spacer members 40 and is held therein.

Preferably, said spacer element 40 is deformable, see fig. 11B and 12B. On one hand, the brushing unit 13 can always press the spacing element 40 to deform downward and attach to the base layer 210 in the process of leveling the welding material, so as to ensure that the welding part can be uniformly formed on the base layer. On the other hand, after the spacer element 40 is removed by the force of the painting unit 13, the spacer element 40 can recover its shape, so as to prevent the spacer element 40 from scraping the welding layer 220 formed on the base layer 210 during the movement of the base layer 210.

Preferably, the thickness of the spacer element 40 is smaller than the height of the reserved space 51, that is, the depth of the through hole 41 is smaller than the height of the reserved space 51, so that the thickness of the welding layer 220 formed on the base layer 210 is smaller than the height of the reserved space 51, and thus the base layer 210 can pass through the accommodating space 50, and friction between the spacer element 40 and the welding layer 220 is avoided.

In a specific embodiment of the present invention, a manufacturing process of manufacturing the solder strip 200 by the solder strip manufacturing apparatus 100 is illustrated with reference to fig. 9 to 15.

Referring to fig. 9 to 12B, two painting units 13 are disposed left and right relative to the bearing platform 20, when the base layer 210 is placed on the bearing platform 20 from left to right, the welding material is applied to the spacing element 40, wherein the longitudinally movable element 122 on the right side is driven to extend downward, so as to drive the leveling portion 1322 of the leveling element 132 of the painting unit 13 on the right side to move downward and to fit the spacing element 40, and the longitudinally movable element 122 continues to move downward, so that the painting unit 13 presses the spacing element 40 downward, so that the spacing element 40 deforms downward, presses the reserved space 51, and can fit the base layer 210.

As shown in fig. 11A, the laterally movable element 121 is driven to move laterally from right to left, the painting unit 13 always applies a downward force to the spacing unit 40 during the movement from right to left, and makes the spacing unit 40 always fit to the base layer 210, so that the leveling portion 1322 of the leveling element 132 of the painting unit 13 can level the welding material in the through hole 41 of the spacing unit 40 from right to left during the movement from right to left, and the welding material falls from the through hole 41 to the base layer 210.

As shown in fig. 13, the longitudinally movable member 122 on the right side is driven to move upward, the corresponding painting unit 13 is moved away from the spacer member 40, the pressing force applied to the spacer member 40 is removed, the spacer member 40 is deformed again, and simultaneously, the reserved space 51 is restored, the welding material is uniformly disposed on the base layer 210, and at least one welding part 221 is formed on the base layer 210. Further, the base layer 210 is moved from left to right such that the welding layer 220 moves outwardly from the headspace 51 and the base layer 210, which is not coated with welding material, corresponds to the spacer element 40. At this time, the longitudinal movable element 122 on the left side is driven to move downward, so as to drive the brushing unit 13 on the left side to move downward and to be capable of fitting the spacing element 40, and the longitudinal movable element 122 continues to move downward, so that the leveling element 132 of the brushing unit 13 presses the spacing element 40, so that the spacing element 40 deforms downward and fits the base layer 210.

Referring to fig. 14, the transverse movable element 121 is driven to move transversely from left to right, the brushing unit 13 is driven to move from left to right to always apply a downward force to the spacing unit 40 and make the spacing unit 40 deform downward and always fit to the base layer 210, and then the leveling portion 1322 of the leveling element 132 of the brushing unit 13 levels the welding material in the through hole 41 of the spacing unit 40 from left to right, and the welding material falls from the through hole 41 to the base layer 210. Further, the longitudinally movable element 122 on the left side is driven to move upward, the corresponding painting unit 13 is far away from the spacing element 40, the pressing force applied to the spacing element 40 is removed, the deformation of the spacing element 40 is recovered, and the welding material is uniformly disposed on the base layer 210 again, so as to form the welding layers 220 spaced from each other on the base layer 210. Referring to fig. 15, the painting unit 13 is driven to move alternately and cyclically according to a predetermined rule, so that the welding layer 220 having a concave-convex structure can be formed on the base layer 210 to manufacture the welding strip 200 having a concave-convex surface.

Preferably, the spacer element 40 has a plurality of the through holes 41, wherein the plurality of the through holes 41 are spaced apart from each other and formed in a row in the spacer element 40. Specifically, in this specific embodiment of the present invention, the base layer 210 is disposed under the spacing element 40 from left to right, and the through holes 41 can be distributed in the length extending direction of the base layer 210, so that the welding material can be uniformly coated in the through holes 41 distributed in a row by the coating unit 13 in the following, and then a plurality of welding portions 221 spaced from each other can be formed on one base layer 210 during the process of coating the coating unit 13 once, so as to facilitate shortening the manufacturing cycle of manufacturing the welding strip 200.

Preferably, a plurality of said through holes 41 are formed at intervals and in columns in said spacer element 40. Specifically, in this specific embodiment of the present invention, a plurality of base layers 210 are allowed to be disposed in the accommodating space 50 in a manner corresponding to the through holes 41, and then the painting unit 13 is allowed to paint the welding material on the plurality of base layers 210 uniformly in the process of painting once, that is, the welding strip manufacturing apparatus can simultaneously produce a plurality of welding strips 200, thereby facilitating to improve the manufacturing efficiency of the welding strip manufacturing apparatus. Preferably, the spacer element 40 may be implemented as a steel wire mesh, and the spacer element 40 has at least five through holes 41 distributed in the spacer element 40 in a row, that is, the solder strip manufacturing apparatus can simultaneously manufacture at least five solder strips 200.

Referring to fig. 8A to 15, according to a preferred embodiment of the present invention, the solder strip manufacturing apparatus 100 further includes two fixing units 60, the fixing units 60 are disposed at intervals on the supporting body 111 of the supporting frame 11, below the painting unit 13, and above the bearing platform, two ends of the spacing element 40 can be detachably mounted on the two fixing units 60, and the accommodating space 50 is formed between the spacing element 40 and the bearing platform 20 for accommodating the base layer 210.

Preferably, the fixing unit 60 is operatively arranged to the support body 111, and the fixing unit 60 can be driven to move longitudinally, thereby changing the distance between the spacer element 40 and the base layer 210, i.e. the height of the headspace 51 formed between the spacer element 40 and the base layer 210 placed on the load-bearing platform 20 can be adjusted. Specifically, in a preferred embodiment of the present invention, the supporting frame 11 comprises a longitudinally movable rail, the fixing unit 60 is movably disposed on the longitudinally movable rail, and the fixing unit 60 can move longitudinally along the longitudinally movable rail. For example, the fixing unit 60 is driven to move downward, so that the spacer member 40 fixed to the fixing unit 60 moves downward at the same time, compresses the reserved space 51, and enables the lower surface of the spacer member 40 to fit the base layer 210; further, the longitudinal movable element 122 can drive the painting unit 13 to move downwards, and enable the painting unit 13 to be attached to the upper surface of the spacing element 40; further, the lateral moving element 121 drives the brushing unit 13 to move laterally, so as to brush the welding material accumulated on the spacing element 40 into the through hole 41; further, the longitudinally movable member 122 moves the applying brush unit 13 upward, and at the same time, the fixing unit 60 is driven to move upward along the longitudinally movable rail, so that the reserved space 51 between the spacer member 40 and the base layer 210 is restored, and the welding layer 220 formed on the base layer 210 can pass through the reserved space 51.

It is worth mentioning that in other embodiments of the present invention, a welding strip semi-finished product can be kept on the supporting platform 20, and the welding strip semi-finished product is made to correspond to the painting unit 13, and then the welding strip manufacturing equipment 100 can form the welding layer 220 at intervals on the welding strip semi-finished product, and then the welding strip 200 with a concave-convex surface is formed. Specifically, the solder strip half-product includes the base layer 210 and a first solder layer, wherein the first solder layer covers the surface of the base layer 210. The solder strip semi-finished product may form the first solder layer by dipping the base layer 210 into the solder material so that the solder material covers the base layer 210. Alternatively, the semi-finished solder strip may be formed by placing the base layer 210 under the painting unit 13, placing the solder material on the base layer 210, and the painting unit 13 can continuously paint the solder material flat on the base layer 210 during the continuous movement of the painting unit 13 and/or the base layer to form the continuous first solder layer. Further, the semi-finished product of the solder strip is placed on the bearing platform 20, and the painting unit 13 can paint the solder material on the first solder layer at intervals to form the soldering portions 221 distributed at intervals on the first solder layer, so as to manufacture the solder strip 200 with a concave-convex surface. That is, the welding material may continuously cover the base layer 210, so that the light reflection rate of the welding strip 200 is improved, and the stability of the welding strip 200 in connection with the solar cell is improved.

According to another aspect of the present invention, the present invention further provides a method for manufacturing a solder strip, wherein the method for manufacturing a solder strip further comprises the steps of:

(a) the base layer 210 is held under the applying brush unit 13. Preferably, the base layer 210 is made of a metal material having good electrical conductivity, such as copper, silver, etc. Preferably, the base layer 210 has a band shape.

In one embodiment of the present invention, the base layer 210 is held between the applying brush unit 13 and the carrying platform 13.

In another embodiment of the present invention, the base layer 210 is held between the carrier platform 20 and the spacer element 40 in a manner corresponding to at least one of the through holes 41 of the spacer element 40.

(b) The welding portions 221 are formed on the base layer 210 at intervals.

Specifically, the step (b) further comprises a step (b.1): the solder material is brushed onto the base layer 210.

Preferably, step (b.1) further comprises step (c): the longitudinal movable member 122 is driven to extend downward, so as to drive the painting unit 13 to contact the welding material coated on the base layer 210.

Said step (c) is followed by the further steps of: the transverse moving element 121 is driven to move transversely, so as to drive the brushing unit 13 to move transversely to brush the welding material evenly on the base layer 210.

Preferably, step (d) is further included in step (b.1): the applying brush unit 13 is driven to move downward and press the spacing member 40, and the spacing member 40 is deformed downward to be attached to the base layer 210.

Preferably, the step (d) further comprises the step (e): the applying brush unit 13 is driven to move laterally to apply the welding material into the through-hole 41 of the spacer member 40.

Preferably, the step (e) further comprises the step (f): moving the painting unit 13 upwards restores the deformation of the spacer element 40.

According to another aspect of the present invention, the present invention further provides a method for manufacturing a solder strip, the method comprising the steps of:

(A) holding a base layer 210 under at least one of the applying brush units 13;

(B) a welding portion is formed on the base layer 210 at a distance from each other.

Specifically, the step (B) further comprises a step (C): a welding material is leveled on the base layer 210 by moving at least one of the applying brush units 13.

Preferably, the step (C) further comprises the steps of: the applying brush unit 13 moves according to a predetermined rule to level the welding material at intervals on the base layer 210.

Preferably, the step (C) further comprises a step (D): when the applying brush unit 13 levels the welding material, the applying brush unit 13 fills the welding material in at least one through hole 41 of a spacer member 40.

Preferably, the step (D) further comprises a step (E): when the brushing unit 13 smoothes the welding material, the spacer member 40 is deformed to fit the base layer 210.

Preferably, the step (D) further comprises the step (F): moving the spacer element downward and against the base layer.

Preferably, wherein the step (D) further comprises the step (F): moving the spacer element downward and against the base layer. It will be appreciated by persons skilled in the art that the above embodiments are only examples, wherein features of different embodiments may be combined with each other to obtain embodiments which are easily imaginable in accordance with the disclosure of the invention, but which are not explicitly indicated in the drawings.

It will be understood by those skilled in the art that the embodiments of the present invention as described above and shown in the drawings are given by way of example only and are not limiting of the present invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments without departing from the principles, embodiments of the present invention may have any deformation or modification.

Claims (26)

1. A solder ribbon manufacturing apparatus for applying a solder material to a substrate to form a solder ribbon, the solder ribbon manufacturing apparatus comprising:

a bearing platform for bearing the base layer; and

the operation body comprises at least one painting unit, wherein the painting unit is kept above the bearing platform and can be used for painting the welding material on the base layer.

2. The solder strip manufacturing apparatus according to claim 1, wherein the operation body further includes a movable unit, wherein the applying brush unit is provided to the movable unit, wherein the movable unit can be driven, and the movable unit can move the applying brush unit.

3. The solder strip manufacturing apparatus according to claim 2, wherein the movable unit includes a transverse movable member and at least one longitudinal movable member, wherein the longitudinal movable member is disposed on the transverse movable member, the painting unit is disposed on the longitudinal movable unit, the transverse movable member can drive the longitudinal movable member and the painting unit to move transversely, the longitudinal movable member can be driven to drive the painting unit to move longitudinally, and the transverse movable member and the longitudinal movable member cooperate with each other to allow the painting unit to brush the solder material to the base layer at intervals.

4. Solder strip manufacturing apparatus according to claim 3, wherein the operating body comprises at least one support frame, wherein the support frame comprises a support body and a movable rail, the movable rail being arranged to the support body, the transverse movable element being movably arranged to the movable rail, the transverse movable element being drivable for movement along the movable rail.

5. The solder strip manufacturing apparatus according to claim 4, wherein said operating means includes two of said support frames, which are oppositely disposed, wherein both ends of said laterally movable member are movably disposed to said movable rails of the two of said support frames, respectively.

6. The solder strip manufacturing apparatus according to claim 5, wherein said applying brush unit includes a connecting member and a leveling member, said leveling member including a fitting portion and a leveling portion, said connecting member being connected to said longitudinally movable member of said movable unit and said fitting portion of said leveling member, said leveling portion having a leveling surface, said leveling surface of said leveling portion being capable of leveling said solder material on said base layer.

7. The solder strip manufacturing apparatus according to claim 6, wherein the leveler portion extends obliquely downward from the fitting portion.

8. The solder strip manufacturing apparatus according to claim 6, wherein the applying brush unit further includes two blocking portions provided on both sides of the leveling portion, respectively.

9. The solder strip manufacturing apparatus according to claim 6, wherein the number of the applying brush units and the longitudinally movable members is two, two of the longitudinally movable members are provided at intervals to the transversely movable member, two of the applying brush units are provided to the longitudinally movable members, respectively, and the leveling surfaces of the leveling portions of the two applying brush units are opposed to each other.

10. The solder strip manufacturing apparatus according to claim 6, wherein an extending direction of the movable rail is parallel to a width direction of the carrying platform.

11. The solder strip manufacturing apparatus according to claim 6, wherein an extending direction of the movable rail is perpendicular to a width direction of the carrying platform.

12. The solder strip manufacturing apparatus according to claim 3, wherein the solder strip manufacturing apparatus further comprises a control unit, wherein the control unit is capable of controlling the transverse movable member and the longitudinal movable member to move according to a predetermined rule so that the solder material is distributed at intervals on the base layer.

13. The solder strip manufacturing apparatus according to any one of claims 1 to 3, wherein the solder strip manufacturing apparatus further comprises a spacer member, the applying brush unit comprises a leveling member, the spacer member has at least one through hole, the spacer member is disposed above the carrying platform and forms an accommodating space between the spacer member and the carrying platform, the through hole of the spacer member communicates with the accommodating space, and the spacer member is held below the leveling member of the applying brush unit.

14. The solder strip manufacturing apparatus according to any one of claims 6 to 11, wherein the solder strip manufacturing apparatus further comprises a spacer member having at least one through hole, the spacer member being disposed above the carrying platform and forming an accommodating space between the spacer member and the carrying platform, the through hole of the spacer member communicating with the accommodating space, and the spacer member being held below the leveling member of the applying brush unit.

15. The solder strip manufacturing apparatus according to claim 13, wherein the solder strip manufacturing apparatus further comprises two fixing units, wherein both ends of the spacing member are respectively mounted to the two fixing units.

16. The solder strip manufacturing apparatus according to claim 14, wherein the solder strip manufacturing apparatus further comprises two fixing units, wherein both ends of the spacing member are respectively mounted to the two fixing units.

17. Solder strip manufacturing apparatus according to claim 15, wherein the spacer element is deformable.

18. Solder strip manufacturing apparatus according to claim 16, wherein the spacer elements are deformable.

19. The solder strip manufacturing apparatus according to claim 15, wherein the operating body includes at least one support frame, wherein the support frame includes a support body, wherein the fixing unit is operatively provided to the support body, the fixing unit being longitudinally movable.

20. The solder strip manufacturing apparatus according to claim 16, wherein the fixing unit is operatively provided to the support main body, the fixing unit being longitudinally movable.

21. The solder strip manufacturing apparatus according to claim 13, wherein said spacing member has a plurality of said through holes, wherein a plurality of said through holes are formed in said spacing member in a row and spaced from each other.

22. The solder strip manufacturing apparatus according to claim 14, wherein said spacing member has a plurality of said through holes, wherein a plurality of said through holes are formed in said spacing member in a row and spaced from each other.

23. The solder strip manufacturing apparatus according to claim 19, wherein said spacing member has a plurality of said through holes, wherein a plurality of said through holes are formed in said spacing member in spaced and aligned relation to each other.

24. The solder strip manufacturing apparatus according to claim 20, wherein said spacing member has a plurality of said through holes, wherein a plurality of said through holes are formed in said spacing member in spaced and aligned relation to each other.

25. Solder strip manufacturing apparatus according to claim 19, wherein the base layer has a plurality of mutually spaced recesses communicating with the through holes of the spacer elements.

26. Solder strip manufacturing apparatus according to claim 20, wherein the base layer has a plurality of mutually spaced recesses communicating with the through holes of the spacer elements.

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