CN211404514U

CN211404514U - Brush mechanism and solder strip manufacturing device

Info

Publication number: CN211404514U
Application number: CN201921385984.4U
Authority: CN
Inventors: 孙益民
Original assignee: Ningbo Senlian Photoelectric Technology Co ltd
Current assignee: Ningbo Senlian Photoelectric Technology Co ltd
Priority date: 2019-08-23
Filing date: 2019-08-23
Publication date: 2020-09-01
Anticipated expiration: 2029-08-23

Abstract

The utility model provides a brush mechanism and solder strip manufacturing installation, wherein brush mechanism includes a base, an at least lifting unit and an at least brush subassembly, lifting unit with the brush subassembly is installed respectively in the base, the baseband be transmitted in a workspace of base, lifting unit is in order to adjust the baseband with relative distance between the brush subassembly, on the brush subassembly the welding thing is formed at the baseband relates to solder strip manufacturing installation and solder strip manufacturing method simultaneously.

Description

Brush mechanism and solder strip manufacturing device

Technical Field

The utility model relates to an electric brush mechanism, in particular to electric brush mechanism and solder strip manufacturing installation.

Background

The solder strip has good conductivity, is applied to the connection between photovoltaic module and the battery piece, for example solar module, utilizes the solder strip to link mutually solar cell piece electricity to can form complete electric path between the solar cell piece after making the welding accomplish, so as to be favorable to in subsequent use, solar cell piece converts solar energy into the electric energy, and the electric current that produces can transmit through the solder strip. Therefore, the quality of the solder strip directly affects the solar energy collection efficiency of the photovoltaic module and the power of the photovoltaic module.

The existing solder strip comprises a copper base and at least one soldering layer, wherein two soldering layers are respectively formed on the upper surface and the lower surface of the copper base, or the soldering layer is only formed on the upper surface of the copper base. In the manufacturing process, the copper base is immersed in a tin alloy solution for a period of time and then taken out to be dried, namely, the copper base can be formed with a flat tin coating, and the tin coating of the solder strip is respectively welded on a solar cell piece through utilizing a soldering tin, so that the solar cell pieces can be connected with each other. However, in an actual use process, since the photovoltaic module receives sunlight by means of the surface of the solar cell, when the photovoltaic solder strip is soldered to the solar cell, the photovoltaic solder strip blocks the surface of the solar cell, so that sunlight directly irradiated on the solar cell is reduced, an area of the solar cell capable of receiving the sunlight is reduced, receiving efficiency of the photovoltaic module on solar energy is reduced, and utilization efficiency of the photovoltaic module on solar energy is further affected.

In addition, the existing production process cannot accurately form a welding layer on a copper base structure, the reflectivity of a welding strip to a light source is seriously influenced, and the production efficiency is influenced.

Disclosure of Invention

An object of the utility model is to provide an electric brush mechanism and weld and take manufacturing installation, wherein a welding layer of welding the area is formed on an at least surface of a baseband through the mode of brushing.

An object of the utility model is to provide an electric brush mechanism with weld and take manufacturing installation, one of them electric brush subassembly with a brush with a welding thing apply paint in the surface, so that the surface that welds the area forms concave-convex structure and flat structure.

An object of the utility model is to provide an it provides a brush mechanism and welds area manufacturing installation, wherein the baseband enters into the workspace, the brush subassembly towards the displacement change takes place for the baseband direction, so that the brush subassembly the welding thing form in the baseband.

An object of the utility model is to provide a brush mechanism and solder strip manufacturing installation, wherein the baseband enters into the workspace, and the baseband towards the displacement takes place for the brush subassembly, so that the welding thing formed in the baseband.

An object of the utility model is to provide a brush mechanism and weld and take manufacturing installation, wherein the brush subassembly towards longitudinal displacement takes place for the baseband, with the baseband keeps certain predetermined distance after, then the brush subassembly for baseband lateral displacement, on the brush subassembly the welding thing is formed at the baseband.

An object of the utility model is to provide a brush mechanism and weld area manufacturing installation, wherein the baseband towards brush subassembly takes place longitudinal displacement, with brush subassembly keeps certain predetermined distance back, then the baseband for brush subassembly lateral displacement, on the brush subassembly the welding thing formed in the baseband.

An object of the utility model is to provide an electric brush mechanism and solder strip manufacturing installation, wherein electric brush mechanism is located respectively the upper portion space and the lower part space of baseband, electric brush mechanism is right respectively the front and the reverse side of baseband form the welding layer.

An object of the utility model is to provide a brush mechanism and solder strip manufacturing installation, wherein the brush subassembly includes a brush board, the baseband gets into the workspace, the baseband set up in the brush board, the brush subassembly the welding passes through the brush board is formed with the baseband, so that the baseband forms different shape structures the welding layer.

An object of the utility model is to provide a brush mechanism and solder strip manufacturing installation, wherein a movable subassembly of brush subassembly be used for leveling the brush in the baseband the welding layer, so that the welding thing uniformly formed in the baseband.

An object of the utility model is to provide a brush mechanism with weld and take manufacturing installation, wherein the surface of baseband forms the welding layer, a cutting mechanism is right according to certain length of predetermineeing weld the area and cut, an installation mechanism with an at least battery piece laminate in the baseband, in order to form weld the area.

The other advantages and features of the invention will be fully apparent from the following detailed description and realized by means of the instruments and combinations particularly pointed out in the appended claims.

According to the utility model discloses, can realize aforementioned purpose and other purposes and advantage the utility model discloses an electric brush mechanism, it includes

A base;

at least one lifting component; and

the lifting assembly and the brush assembly are respectively arranged on the base, the base band is transmitted to a working area of the base, the lifting assembly is used for adjusting the relative distance between the base band and the brush assembly, and the welding object on the brush assembly is formed on the base band.

According to a preferred embodiment, the lifting assembly is connected to a working platform of the base, and the lifting assembly is used for adjusting the distance between the base belt of the working platform and the longitudinal direction of the brush assembly.

According to a preferred embodiment, the lifting assembly is connected to the brush assembly, the lifting assembly being adapted to adjust the distance between the brush assembly and the base strip in the longitudinal direction of the base strip on a work platform of the base.

According to a preferred embodiment, the brush assemblies are respectively located in the upper space and the lower space of the base, the lifting assembly is connected to the brush assemblies to drive the brush assemblies to slide toward the base, and the base has at least one slot so that the welding objects of the brush assemblies are formed on the front and the back surfaces of the base strip through the slot.

According to a preferred embodiment, the brush mechanism includes a translation assembly coupled to the work platform to drive a change in displacement of the work platform relative to the horizontal direction of the brush assembly.

According to a preferred embodiment, the brush mechanism includes a translation assembly coupled to the brush assembly to drive a change in displacement of the brush assembly relative to the work platform in a horizontal direction.

According to a preferred embodiment, the brush assembly includes at least one brush plate having at least one opening, and a movable assembly, the base tape being transferred to the work platform, the brush plate being disposed on the base tape, and the solder on the movable assembly being formed on the base tape through the opening.

According to a preferred embodiment, the lifting assembly comprises at least one first lifting member and at least one second lifting member, the second lifting member being movably connected to the first lifting member so as to drive the working platform or the movable assembly to longitudinally displace.

According to a preferred embodiment, the translation assembly comprises a transmission member, a driving member and a transmission member, the transmission member is mounted on the working platform or the movable assembly, the driving member is connected to the transmission member through the transmission member, and the driving member drives the working platform or the movable assembly to generate horizontal displacement change.

According to another aspect of the present invention, the present invention further provides a solder strip manufacturing apparatus for forming a solder on a substrate to make the solder strip, wherein the solder strip manufacturing apparatus includes:

a cutting mechanism;

a mounting mechanism; and

at least one brush mechanism, the brush mechanism includes a base, at least one lifting component and at least one brush component, the lifting component and the brush component are respectively installed on the base, the base band is transmitted to a working area of the base, the lifting component is used for adjusting the relative distance between the base band and the brush component, and the welding object on the brush component is formed on the base.

According to a preferred embodiment, the brush assemblies are located in upper and lower spaces of the base, the elevating assemblies are respectively connected to the brush assemblies to drive the brush assemblies to slide toward the base, and the base has at least one slot so that the solder of the brush assemblies is formed on front and rear surfaces of the base tape through the slot.

According to a preferred embodiment, the solder ribbon manufacturing apparatus comprises at least one conveying mechanism including a loading member in which the solder ribbon is stored and a pulling member which transfers the solder ribbon to the brush mechanism.

According to a preferred embodiment, the lifting assembly comprises at least one first lifting member and at least one second lifting member, the second lifting member is movably located on the first lifting member, and therefore the longitudinal displacement change of the working platform or the movable assembly is driven.

Drawings

Fig. 1 is a schematic diagram according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of another embodiment according to the present invention.

Fig. 3 is a schematic diagram according to another embodiment of the present invention.

Fig. 4 is a schematic diagram of another embodiment according to the present invention.

Fig. 5 is a schematic diagram of another embodiment according to the present invention.

Fig. 6 is a schematic diagram of another embodiment according to the present invention.

Fig. 7 is a schematic diagram of another embodiment according to the present invention.

Fig. 8 is a schematic diagram of another embodiment in accordance with the present invention.

Fig. 9 is a schematic diagram according to another embodiment of the present invention.

Fig. 10 is a schematic diagram of another embodiment according to the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, as the terms are used in the description to indicate that the referenced device or element must have the specified orientation, be constructed and operated in the specified orientation, and not for the purpose of limitation.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

As shown in fig. 1, the present invention relates to a solder strip manufacturing apparatus, a base strip 100 enters into a working area 1000 of the solder strip manufacturing apparatus, the solder strip manufacturing apparatus forms a solder 200 on the surface of the base strip 100 through a brushing technique to make the solder strip, a surface of the solder strip forms a concave-convex structure or a flat structure to facilitate the reflection of light on the surface, thereby improving the light reflection efficiency of the solder strip. It is worth mentioning that the welding object is more uniformly formed on the base tape 100 by a brush coating process, so as to improve the connection between the welding tape and the at least one battery piece 300 and the light reflection efficiency of the welding tape.

Further, the solder ribbon manufacturing apparatus includes a feeding mechanism 10 and a brush mechanism 20, the base ribbon 100 is disposed on the feeding mechanism 10, the feeding mechanism 10 transfers the base ribbon 100 to the brush mechanism 20 at a certain speed, and the brush mechanism 20 forms the solder to the base ribbon 100. It is understood by those skilled in the art that the connection structure and relative position of the conveying mechanism 10 and the brush mechanism 20 are not intended to limit the present invention, and the conveying mechanism 10 and the brush mechanism 20 may be an integral structure or the conveying mechanism 10 may be separated from the brush mechanism 20.

It should be noted that the conveying mechanism 10 includes at least one loading element 11 and at least one pulling element 12, the base tape 100 is mounted on the loading element 11, the other end of the base tape 100 is connected to the pulling element 12, the pulling element 12 drives the base tape 100 to be conveyed towards the brush mechanism 20, so that a part to be brushed of the base tape 100 enters the working area 1000, and the conveying mechanism 10 keeps the conveying of the base tape 100 in a continuous state, so as to improve the manufacturing efficiency of the solder tape.

It is worth mentioning that the quantity of loader 11 does not act as the utility model discloses a restriction, according to the production demand installation of difference certainly predetermine quantity loader 11, different quantity baseband 100 be installed respectively in loader 11, and then weld and take manufacturing installation to many simultaneously baseband 100 carries out the process of brushing. The carrier 11 can be matched to different types of structures of the base tapes 100, that is, the welding tape manufacturing device can perform a brushing process on one or more base tapes 100. The pulling member 12 provides a pulling force to the base tape 100 to adjust the transmission efficiency of the base tape 100, and the base tape 100 is at a constant transmission rate. Since the base tape 100 forms the welding layer under the action of the brush mechanism 20, the transmission speed of the base tape 100 is affected when the brush mechanism 20 applies a force to the base tape 100, and the traction member 12 adjusts the transmission speed of the base tape 100 to keep the brush mechanism 20 uniformly forming the welding object 200 on the base tape 100.

Preferably, the base band 100 is a disc structure, the carrier 11 has a rotation function at the same time to reduce the force transmitted by the traction element 12 driving the base band 100, and the carrier 11 provides a driving force to the base band 100 during the rotation. It will be understood by those skilled in the art that the structure of the carrier member 11 is not a limitation of the present invention. Preferably, the pulling member 12 is located below the loading member 11, and the number of the pulling members 12 is one or more. When the number of the pulling members 12 is one, the pulling members 12 have a plurality of connecting grooves, the base tapes 100 of the loading member 11 are respectively disposed on the connecting grooves, and the pulling members 12 can provide a pulling action to the plurality of base tapes 100 at the same time. When the number of the pulling members 12 is plural, the loading members 11 correspond to the pulling members 12 respectively, the base belts 100 coming out of the loading members 11 are connected to the pulling members 12, and the pulling members 12 are controlled at the same transmission rate or different transmission rates at the same time, and the control mode is controlled according to different production requirements.

In one embodiment as shown in fig. 2, the brush mechanism 20 includes a base 21, a lifting assembly 22, and a brush assembly 24, the lifting assembly 22 and the brush assembly 24 are respectively mounted on the base 21, a working platform 211 of the base 21 is connected to the base 21 through the lifting assembly 22, the brush assembly 24 is located in an upper space of the working platform 211, and the working platform 211 and the brush assembly 24 are the working area 1000. The base tape 100 is transferred to the working platform 211 through the transfer mechanism 10, the working platform 211 provides a bearing force for the base tape 100, and the base tape 100 is transferred radially on the working platform 211. Preferably, the working platform 211 has at least one slot 2110, each slot 2110 is arranged at a predetermined interval, the shape and depth of the slot 2110 are matched with the width and thickness of the base tape 100, and thus the base tape 100 can be smoothly transported along the slot 2110.

When the portion of the base tape 100 to be brushed enters the working area 1000, the lifting assembly 22 drives the working platform 211 to displace toward the brush assembly 24. In this embodiment, the lifting assembly 22 drives the working platform 211 to move longitudinally, and the brush assembly 24 is always kept in a stationary state.

When the base tape 100 on the working platform 211 is close to the brush assembly 24 by a predetermined distance, that is, when the brush assembly 24 is attached to the base tape 100, the base tape 100 continues to slide along the slot 2110, and the solder on the brush assembly 24 is formed on the surface of the base tape 100 to form the solder strip.

Furthermore, in this embodiment, the welding layer of the welding strip is a flat surface or a concave-convex surface, and when the welding layer of the welding strip is a flat surface, the lifting assembly 22 drives the working platform 211 to always keep adhering to the static state of the brush assembly 24, so that the welding objects 200 on the brush assembly 24 are uniformly disposed on the base strip 100. When the welding layer of the welding strip is in a concave-convex structure, namely, a height difference exists between the highest point and the lowest point of the welding surface. The lifting assembly 22 drives the working platform 211 to change the displacement relative to the longitudinal direction of the brush assembly 24, and when the lifting assembly 22 drives the working platform 211 to reduce the distance between the base strip 100 and the brush assembly 24, the thickness of the welding layer on the base strip 100 is reduced; when the lifting assembly 22 drives the working platform 211 to increase the distance between the base band 100 and the brush assembly 24, the thickness of the welding layer located on the base band 100 increases, so that the distance between the working platform 211 and the brush assembly 24 is changed to control the thickness of the welding layer located on the base band 100.

It is worth mentioning that, when the welding layer is a plane, the welding layer is located the thickness size of baseband 100 does not regard as the utility model discloses the restriction of content, the welding layer can carry out the regulation of different thickness according to the production demand of difference and user demand. When the welding layer is concave-convex structure, the welding layer can be regular or irregular dentate structure, the welding layer is in the connected state in proper order or has a preset interval each other, and the well-known relevant technical personnel in this field can understand that the shape of the concave-convex structure of welding layer does not act as the limitation of the content of the utility model.

In another embodiment, as shown in fig. 3, the brush assembly 24 includes a brush plate 241 and a movable assembly 242, and the brush plate 241 is disposed between the work platform 211 and the movable assembly 242. When the base tape 100 is transferred to the work platform 211, the brush plate 241 is covered on a welding surface of the base tape 100, the brush plate 241 is attached to the base tape 100, when the brush plate 241 is disposed on the base tape 100, the brush portion of the base tape 100 is exposed to the outside through the brush plate 241, the welding object 200 on the movable element 242 is formed on the base tape 100 after passing through the brush plate 241, and the brush plate 241 is used for controlling the shape and thickness structure of the welding layer on the welding tape.

In this embodiment, compared to the above embodiments, the soldering layer 200 of the above embodiments is directly formed on the base tape 100 through the brush assembly 24. In this embodiment, the welding object 200 is formed on the base tape 100 after the brush assembly 24 passes through the brush plate 241. The addition of the brush plate 241 reduces the brushing technique of the brush mechanism 20 and improves the accuracy of the welding layer 200 on the base strip 100.

Further, the brush plate 241 has at least one opening 2411, the opening 2411 is communicated with the front and back of the brush plate 241, when the base tape 100 is located on the working platform 211, the brushing portion of the base tape 100 is communicated with the external space through the opening 2411, and after the movable element 242 acts on the brush plate 241, the welding object 200 is formed on the surface of the base tape 100 through the opening 2411. It is understood by those skilled in the art that the number and shape of the openings 2411 and the pattern of the openings 2411 arranged on the brush plate 241 are not intended to limit the present invention, and the number of the openings 2411 is matched to the number of the solder strips manufactured by the solder strip manufacturing apparatus.

More specifically, the openings 2411 are in a straight line shape, and a predetermined interval is formed between the openings 2411. When the brush plate 241 covers the base tape 100, the brushing portion of the base tape 100 is located in the opening 2411, the working platform 211 is driven by the lifting assembly 22 to longitudinally displace and change relative to the movable assembly 242, the movable assembly 242 keeps a static state, and the base tape 100 transversely displaces and changes in the brush plate 241, so that the welding object of the movable assembly 242 is horizontally formed in the brushing portion or is formed in the brushing portion in a concave-convex structure.

When the welding layer is formed on the brushing portion in a horizontal plane, the lifting assembly 22 drives the working platform 211, so that the movable assembly 242 is attached to the brush plate 241, the base band 100 moves horizontally in the brush plate 241, and moves horizontally from one end of the brush plate 241 to the other end, or moves back and forth for multiple times, so that the welding objects 200 are uniformly arranged on the brushing portion.

When the welding layer is formed on the brushing portion in a concave-convex structure, the base tape 100 is horizontally displaced with respect to the brush plate 241, and the lifting assembly 22 drives the movable assembly 242 to longitudinally reciprocate with respect to the brush plate 241 at a predetermined frequency. In other words, the lifting assembly 22 drives the movable assembly 242 to move closer to or away from the brush plate 241, and the thickness of the welding layer decreases when the distance between the movable assembly 242 and the brush plate 242 decreases; when the distance between the movable member 242 and the brush plate 242 is increased, the thickness of the welding layer is increased. The spacing distance between the raised and recessed structures is dependent on the frequency at which the lifting assembly 22 drives the movable assembly 242 to produce different configurations of the weld layer according to different production requirements.

In one embodiment as shown in fig. 4, the brush mechanism 20 includes a base 21, a lifting assembly 22, and a brush assembly 24, the lifting assembly 22 and the brush assembly 24 are respectively mounted on the base 21, a working platform 211 of the base 21 is connected to the base 21 through the lifting assembly 22, the brush assembly 24 is located in an upper space of the working platform 211, and the working platform 211 and the brush assembly 24 are the working area 1000. The base tape 100 is transferred to the working platform 211 through the transfer mechanism 10, the working platform 211 provides a bearing force for the base tape 100, and the base tape 100 is transferred radially on the working platform 211. Preferably, the working platform 211 has at least one slot 2110, each slot 2110 is arranged at a predetermined interval, the shape and depth of the slot 2110 are matched with the width and thickness of the base tape 100, and thus the base tape 100 can be smoothly transported along the slot 2110. In this embodiment, whether the working platform 211 has the slot 2110 is not a limitation of the present invention, and the working platform 211 is used for carrying the baseband 100.

When the base tape 100 on the working platform 211 is close to the brush assembly 24 by a predetermined distance, that is, when the brush assembly 24 is attached to the base tape 100, the base tape 100 is held in the slot 2110, and the solder 200 on the brush assembly 24 is formed on the surface of the base tape 100 to manufacture the solder strip.

Furthermore, in this embodiment, the welding layer of the welding strip is a flat surface or a concave-convex surface, and when the welding layer of the welding strip is a flat surface, the lifting assembly 22 drives the working platform 211 to always keep adhering to the static state of the brush assembly 24, so that the welding objects 200 on the brush assembly 24 are uniformly disposed on the base strip 100. When the welding layer of the welding strip is of a concave-convex structure, namely, a height difference exists between the highest point and the lowest point of the welding layer. The lifting assembly 22 drives the working platform 211 to change the displacement relative to the longitudinal direction of the brush assembly 24, and when the lifting assembly 22 drives the working platform 211 to reduce the distance between the base strip 100 and the brush assembly 24, the thickness of the welding layer on the base strip 100 is reduced; when the lifting assembly 22 drives the working platform 211 to increase the distance between the base band 100 and the brush assembly 24, the thickness of the welding layer located on the base band 100 increases, so that the distance between the working platform 211 and the brush assembly 24 is changed to control the thickness of the welding layer located on the base band 100.

It is worth mentioning that, when the welding layer is a plane, the welding layer is located the thickness of baseband 100 does not regard as the utility model discloses the restriction of content, the welding layer can carry out the regulation of different thickness according to the production demand and the user demand of difference. When the welding layer is concave-convex structure, the welding layer can be regular or irregular dentate structure, the welding layer is in the connected state in proper order or has a preset interval each other, and the well-known relevant technical personnel in this field can understand that the shape of the concave-convex structure of welding layer does not act as the limitation of the content of the utility model.

The brush mechanism 20 further includes a translation assembly 23, the translation assembly 23 is connected to the working platform 211, and the translation assembly 23 controls the horizontal displacement of the working platform 211. The brush assembly 24 is close to the base tape 100 on the working platform 211 by a predetermined distance, that is, when the brush assembly 24 is attached to the base tape 100, the base tape 100 is located in the working area 1000 and is in a static state, the translation assembly 23 drives the working platform 211 to move transversely relative to the movable assembly 242, so that the brush assembly 24 moves back and forth relative to the base tape 100 in the horizontal direction, and the welding object 200 on the brush assembly 24 is formed on the surface of the base tape 100 to manufacture the welding strip. After the base tape 100 forms the welding layer, the translation assembly 23 drives the working platform 211 to return to a predetermined position, which is understood as an edge of the working platform 211.

Furthermore, in this embodiment, the welding layer of the welding strip is a flat surface or a concave-convex surface, when the welding layer of the welding strip is a flat surface, the lifting assembly 22 drives the working platform 211 to always keep attached to the static state of the electric brush assembly 24, the translation assembly 23 drives the working platform 211 to horizontally slide relative to the electric brush assembly 24, and then the welding objects 200 on the electric brush assembly 24 are uniformly arranged on the base strip 100. When the welding layer of the welding strip is of a concave-convex structure, namely, a height difference exists between the highest point and the lowest point of the welding layer. The lifting assembly 22 drives the working platform 211 to move longitudinally relative to the brush assembly 24, and when the lifting assembly 22 drives the working platform 211 to move towards the brush assembly 24 to reduce the distance between the base strip 100 and the brush assembly 24, the thickness of the welding layer on the base strip 100 is reduced; when the lifting assembly 22 drives the working platform 211 to move in the opposite direction of the brush assembly 24, and the distance between the base band 100 and the brush assembly 24 is increased, the thickness of the welding layer located on the base band 100 is increased, so that the distance between the working platform 211 and the brush assembly 24 is changed to control the thickness of the welding layer located on the base band 100. The lifting assembly 22 and the translation assembly 23 drive the working platform 22 to generate a continuous synchronous state of longitudinal displacement and transverse displacement, so that the welding layer is formed on the welding strip.

It is worth mentioning that the brush assembly 24 comprises a brush plate 241 and a movable assembly 242, the brush plate 241 being arranged between the work platform 211 and the movable assembly 242. When the base tape 100 is transferred to the work platform 211, the brush plate 241 is covered on a welding surface of the base tape 100, the brush plate 241 is attached to the base tape 100, when the brush plate 241 is disposed on the base tape 100, the brush portion of the base tape 100 is exposed to the outside through the brush plate 241, the welding object 200 on the movable element 242 is formed on the base tape 100 after passing through the brush plate 241, and the brush plate 241 is used for controlling the shape and thickness structure of the welding layer on the welding tape.

In this embodiment, compared to the above embodiments, the soldering layer of the above embodiments is directly formed on the base tape 100 through the brush assembly 24. In this embodiment, the welding object is formed on the base tape 100 after the brush assembly 24 passes through the brush plate 241. The technical process of the brush plate 241 allows to reduce the technology of the brush mechanism 20 and to improve the accuracy of the positioning of the welding layer on the base band 100.

Further, the brush plate 241 has at least one opening 2411, the opening 2411 is communicated with the front and back of the brush plate 241, when the base tape 100 is located on the working platform 211, the brushing portion of the base tape 100 is communicated with the external space through the opening 2411, and after the movable element 242 acts on the brush plate 241, the welding object 200 acts on the surface of the base tape 100 through the opening 2411. It is understood by those skilled in the art that the number and shape of the openings 2411 and the pattern of the openings 2411 on the brush plate 241 are not intended to limit the present invention, and the number of the openings 2411 is matched to the number of the solder strips manufactured by the solder strip manufacturing apparatus.

Further, the openings 2411 are in a straight line shape, and a predetermined interval is formed between the openings 2411. When the brush plate 241 is covered on the base tape 100, the brushing portion of the base tape 100 is located in the opening 2411, the working platform 211 is longitudinally displaced and changed relative to the movable assembly 242 under the driving of the lifting assembly 22, and the working platform 211 is transversely displaced and changed relative to the movable assembly 242 under the driving of the translating assembly 24, so that the welding object 200 of the movable assembly 242 is horizontally formed on the brushing portion or is formed on the brushing portion in a concave-convex structure.

When the welding layer is formed on the brushing portion in a horizontal plane, the movable component 242 keeps a static state under the driving of the translation component 23 by the working platform 211, and horizontally moves from one end of the brush plate 241 to the other end, or moves back and forth for multiple times, so that the welding object is uniformly arranged on the brushing portion. When the welding layer is formed on the brushing part in a concave-convex structure, the translation assembly 23 drives the working platform 211 to horizontally displace relative to the movable assembly 242, and the lifting assembly 22 drives the working platform 211 to longitudinally reciprocate relative to the movable assembly 242 according to a certain preset frequency. In other words, the lifting assembly 22 drives the working platform 211 to move toward or away from the movable assembly 242, and the thickness of the welding layer decreases when the distance between the movable assembly 242 and the brush plate 242 decreases; when the distance between the movable member 242 and the brush plate 242 is increased, the thickness of the welding layer is increased.

The spacing distance between the raised and recessed structures is dependent on the frequency at which the lift assembly 22 drives the movable assembly 242 to conform to the weld strip of different production specifications.

In one embodiment as shown in fig. 6, the brush mechanism 20 includes a base 21, a lifting assembly 22, and a brush assembly 24, the lifting assembly 22 and the brush assembly 24 are respectively mounted on the base 21, the brush assembly 24 is movably mounted on the base 21 through the lifting assembly 22, and the brush assembly 24 is located in an upper space of the working platform 211. The base tape 100 is transferred to a working platform 211 of the base 21 through the transfer mechanism 10, and the working platform 211 and the brush assembly 24 are the working area 1000. The working platform 211 provides a bearing force for the base band 100, and the base band 100 is radially transmitted on the working platform 211. Preferably, the working platform 211 has at least one slot 2110, each slot 2110 is arranged at a predetermined interval, the shape and depth of the slot 2110 are matched with the width and thickness of the base tape 100, and thus the base tape 100 can be smoothly transported along the slot 2110.

When the portion of the base tape 100 to be brushed enters the working area 1000, the lifting assembly 22 drives the brush assembly 24 to displace toward the working platform 211. In this embodiment, the lifting assembly 22 drives the brush assembly 24 to move longitudinally, and the working platform 211 is always kept in a stationary state.

When the brush assembly 24 approaches the base tape 100 on the working platform 211 by a predetermined distance, that is, when the brush assembly 24 is attached to the base tape 100, the base tape 100 continues to slide along the slot 2110, and the solder 200 on the brush assembly 24 is formed on the surface of the base tape 100 to form the solder strip.

Further, in this embodiment, the welding layer of the welding strip is a flat surface or a concave-convex surface, when the welding layer of the welding strip is a flat surface, the lifting assembly 22 drives the brush assembly 24 to always keep in a static state attached to the base strip 100, and then the welding objects 200 on the brush assembly 24 are uniformly disposed on the base strip 100. When the welding layer of the welding strip is of a concave-convex structure, namely, a height difference exists between the highest point and the lowest point of the welding layer. The lifting assembly 22 drives the brush assembly 24 to change the displacement relative to the longitudinal direction of the working platform 211, and when the lifting assembly 22 drives the brush assembly 24 to move towards the base belt 100 to reduce the distance between the base belt 100 and the brush assembly 24, the thickness of the welding layer on the base belt 100 is reduced; when the lifting assembly 22 drives the brush assembly 24 to move against the base tape 100, and the distance between the base tape 100 and the brush assembly 24 is increased, the thickness of the welding layer on the base tape 100 is increased, so that the distance between the working platform 211 and the brush assembly 24 is changed to control the thickness of the welding layer on the base tape 100.

In another embodiment, as shown in fig. 7, the brush assembly 24 includes a brush plate 241 and a movable assembly 242, and the brush plate 241 is disposed between the work platform 211 and the movable assembly 242. When the base tape 100 is transferred to the work platform 211, the brush plate 241 is covered on a welding surface of the base tape 100, the brush plate 241 is attached to the base tape 100, when the brush plate 241 is disposed on the base tape 100, the brush portion of the base tape 100 is exposed to the outside through the brush plate 241, the welding object 200 on the movable element 242 is formed on the base tape 100 after passing through the brush plate 241, and the brush plate 241 is used for controlling the shape and thickness structure of the welding layer on the welding tape.

In this embodiment, compared to the above embodiments, the soldering layer of the above embodiments is directly formed on the base tape 100 through the brush assembly 24. In this embodiment, the welding object 200 is formed on the base tape 100 after the brush assembly 24 passes through the brush plate 241. The technical process of the brush plate 241 allows to reduce the technology of the brush mechanism 20 and to improve the accuracy of the positioning of the welding layer 200 on the base tape 100.

Further, the openings 2411 are in a straight line shape, and a predetermined interval is formed between the openings 2411. When the brush plate 241 covers the base tape 100, the brushing portion of the base tape 100 is located in the opening 2411, the movable assembly 242 is longitudinally displaced and changed relative to the brush plate 241 under the driving of the lifting assembly 22, and the base tape 100 is located on the working platform 211 and is in a sliding state, so that the welding object 200 of the movable assembly 242 is horizontally formed on the brushing portion or is formed on the welding layer in a concave-convex structure.

When the welding layer is formed on the brushing portion in a horizontal plane, the lifting assembly 22 drives the movable assembly 242 to move and change relative to the brush plate 241, so that the movable assembly 242 horizontally slides along the brush plate 241, and horizontally moves from one end of the brush plate 241 to the other end, or moves back and forth for multiple times, so that the welding object is uniformly arranged on the brushing portion.

When the welding layer is formed on the brushing portion in a concave-convex structure, the base tape 100 is horizontally displaced with respect to the brush plate 241, and the lifting assembly 22 drives the movable assembly 242 to longitudinally reciprocate with respect to the brush plate 241 at a predetermined frequency. In other words, the lifting assembly 22 drives the movable assembly 242 to move closer to or away from the brush plate 241, and the thickness of the welding layer decreases when the distance between the movable assembly 242 and the brush plate 242 decreases; when the distance between the movable member 242 and the brush plate 242 is increased, the thickness of the welding layer is increased. The spacing distance between the raised and recessed structures is dependent on the frequency at which the lifting assembly 22 drives the movable assembly 242 to produce different configurations of the bonding layer 200 according to different production requirements.

In one embodiment as shown in fig. 8, the brush mechanism 20 includes a base 21, a lifting assembly 22, and a brush assembly 24, the lifting assembly 22 and the brush assembly 24 are respectively mounted on the base 21, the brush assembly 24 is movably mounted on the base 21 through the lifting assembly 22, and the brush assembly 24 is located in an upper space of the working platform 211. The base tape 100 is transferred to a working platform 211 of the base 21 through the transfer mechanism 10, and the working platform 211 and the brush assembly 24 are the working area 1000. The working platform 211 provides a bearing force for the base band 100, and the base band 100 is radially transmitted on the working platform 211. Preferably, the working platform 211 has at least one slot 2110, each slot 2110 is arranged at a predetermined interval, the shape and depth of the slot 2110 are matched with the width and thickness of the base tape 100, and thus the base tape 100 can be smoothly transported along the slot 2110.

The brush mechanism 20 further includes a translation component 23, the brush component 24 is close to the base tape 100 on the working platform 211 by a predetermined distance, that is, when the brush component 24 is attached to the base tape 100, the base tape 100 is located in the working area 1000 and is in a static state, the translation component 23 drives the brush component 24 to move transversely relative to the base tape 100, and then the brush component 24 reciprocates horizontally relative to the base tape 100, and the solder 200 on the brush component 24 is formed on the surface of the base tape 100 to form the solder strip. After the base tape 100 forms the welding layer, the translation assembly 23 drives the brush assembly 24 to return to a predetermined position, which is understood to be an edge of the working platform 211.

Further, in this embodiment, the welding layer of the welding strip is a flat surface or a concave-convex surface, when the welding layer of the welding strip is a flat surface, the lifting assembly 22 drives the brush assembly 24 to always keep a static state attached to the base strip 100, the translation assembly 23 drives the brush assembly 24 to horizontally slide relative to the base strip 100, and the welding objects 200 on the brush assembly 24 are uniformly disposed on the base strip 100. When the welding layer of the welding strip is of a concave-convex structure, namely, a height difference exists between the highest point and the lowest point of the welding layer. The lifting assembly 22 drives the brush assembly 24 to change the displacement relative to the longitudinal direction of the working platform 211, and when the lifting assembly 22 drives the brush assembly 24 to move towards the base belt 100 to reduce the distance between the base belt 100 and the brush assembly 24, the thickness of the welding layer on the base belt 100 is reduced; when the lifting assembly 22 drives the brush assembly 24 to move against the base tape 100, and the distance between the base tape 100 and the brush assembly 24 is increased, the thickness of the welding layer on the base tape 100 is increased, so that the distance between the working platform 211 and the brush assembly 24 is changed to control the thickness of the welding layer on the base tape 100. The lifting assembly 22 and the translation assembly 23 drive the brush assembly 22 to perform continuous synchronous longitudinal displacement and transverse displacement, so that the welding layer 200 is formed on the welding strip.

In another embodiment, as shown in fig. 9, the brush assembly 24 includes a brush plate 241 and a movable assembly 242, and the brush plate 241 is disposed between the work platform 211 and the movable assembly 242. When the base tape 100 is transferred to the work platform 211, the brush plate 241 is covered on a welding surface of the base tape 100, the brush plate 241 is attached to the base tape 100, when the brush plate 241 is disposed on the base tape 100, the brush portion of the base tape 100 is exposed to the outside through the brush plate 241, the welding object 200 on the movable element 242 is formed on the base tape 100 after passing through the brush plate 241, and the brush plate 241 is used for controlling the shape and thickness structure of the welding layer on the welding tape.

In this embodiment, compared to the above embodiments, the soldering layer of the above embodiments is directly formed on the base tape 100 through the brush assembly 24. In this embodiment, the welding object 200 is formed on the base tape 100 after the brush assembly 24 passes through the brush plate 241. The technical process of the brush plate 241 allows to reduce the technology of the brush mechanism 20 and to improve the accuracy of the positioning of the welding layer on the base band 100.

Further, the openings 2411 are in a straight line shape, and a predetermined interval is formed between the openings 2411. When the brush plate 241 covers the base strip 100, the brushing portion of the base strip 100 is located in the opening 2411, the movable assembly 242 is driven by the lifting assembly 22 to longitudinally displace and change relative to the brush plate 241, the working platform 211 keeps a static state, and the movable assembly 242 transversely displaces and changes relative to the brush plate 241, so that the welding layer of the movable assembly 242 is horizontally formed on the brushing portion or is formed on the brushing portion in a concave-convex structure.

When the welding layer is formed on the brushing portion in a horizontal plane, the lifting assembly 22 drives the movable assembly 242 so that the movable assembly 242 is attached to the brush plate 241, and the movable assembly 242 horizontally moves from one end of the brush plate 241 to the other end, or moves back and forth for multiple times, so that the welding objects 200 are uniformly arranged on the brushing portion.

When the welding layer is formed on the brushing part in a concave-convex structure, the translation assembly 23 drives the movable assembly 242 to horizontally displace relative to the brush plate 241, and the lifting assembly 22 drives the movable assembly 242 to longitudinally reciprocate relative to the brush plate 241 according to a certain preset frequency. In other words, the lifting assembly 22 drives the movable assembly 242 to move closer to or away from the brush plate 241, and the thickness of the welding layer decreases when the distance between the movable assembly 242 and the brush plate 242 decreases; when the distance between the movable member 242 and the brush plate 242 is increased, the thickness of the welding layer is increased. The spacing distance between the raised and recessed structures is dependent on the frequency at which the lifting assembly 22 drives the movable assembly 242 to produce different configurations of the bonding layer 200 according to different production requirements.

In another embodiment, in the present embodiment, the brush assemblies 24 are respectively located in the upper space and the lower space of the working platform 211, the brush assemblies 24 respectively undergo displacement change relative to the working platform 211, and the solder on the brush assemblies 24 is formed on the front surface and the back surface of the base tape 100, and both surfaces of the solder tape have the solder layer, so as to increase the connection efficiency and the light reflection efficiency of the battery piece 300. It is understood by those skilled in the art that the structure of the welding layer on the base band 100 is not a limitation of the present invention, the welding layer on the front and back sides of the base band 100 has a planar structure or a concave-convex structure, and the welding layer on the front side has a structure corresponding to the welding layer 200 on the back side, or the welding layers on the front and back sides do not correspond to each other.

The brush mechanism 20 further includes two lifting assemblies 22 and two translation assemblies 23, the lifting assemblies 22 and the translation assemblies 23 are respectively mounted on the base 21, the brush assemblies 24 are movably mounted on the base 21 through the lifting assemblies 22 and the translation assemblies 23, and the brush assemblies 24 are located on the upper and lower sides of the working platform 211. The base tape 100 is transferred to a working platform 211 of the base 21 through the transfer mechanism 10, and the working platform 211 and the brush assembly 24 are the working area 1000. The working platform 211 provides a bearing force for the base tape 100, and the base tape 100 is radially transmitted on the working platform 211. Preferably, the working platform 211 has at least one slot 2110, each slot 2110 is arranged at a predetermined interval, the shape and depth of the slot 2110 are matched with the width and thickness of the base tape 100, and thus the base tape 100 can be smoothly transported along the slot 2110. When the base tape 100 is transferred to the working platform 211, the base tape 100 is located in the slot 2110, the front surface of the base tape 100 faces the brush assembly 24 located in the upper space of the working platform 211, the back surface of the base tape 100 faces the brush assembly 24 located in the lower space of the working platform 211 through the slot 2110, and the brush assembly 24 is displaced toward the front surface and the back surface of the base tape 100 through the lifting assembly 23.

When the portion of the base tape 100 to be brushed enters the working area 1000, the lifting assembly 22 drives the brush assembly 24 to displace toward the working platform 211. In this embodiment, the lifting assembly 22 drives the brush assembly 24 to move longitudinally, and the working platform 211 is always kept in a stationary state. The brush assembly 24 is close to the base tape 100 on the working platform 211 by a predetermined distance, that is, when the brush assembly 24 is attached to the base tape 100, the base tape 100 is located in the working area 1000 and is in a static state, the translation assembly 23 drives the brush assembly 24 to move transversely relative to the base tape 100, so that the brush assembly 24 moves back and forth relative to the base tape 100 in the horizontal direction, and the welding objects on the brush assembly 24 are formed on the front surface and the back surface of the base tape 100 to obtain the welding strip. After the base tape 100 forms the welding layer 200, the translation assembly 23 drives the brush assembly 24 to return to a predetermined position, which is understood to be an edge of the working platform 211.

Further, in this embodiment, the welding layer of the welding strip is a flat surface or a concave-convex surface, when the welding layer of the welding strip is a flat surface, the lifting assembly 22 drives the brush assembly 24 to always keep a static state attached to the base strip 100, the translation assembly 23 drives the brush assembly 24 to horizontally slide relative to the base strip 100, and the welding objects 200 on the brush assembly 24 are uniformly disposed on the base strip 100. When the welding layer is of a concave-convex structure, namely, a height difference exists between the highest point and the lowest point of the welding layer. The lifting assembly 22 drives the brush assembly 24 to change the displacement relative to the longitudinal direction of the working platform 211, and when the lifting assembly 22 drives the brush assembly 24 to move towards the base belt 100 to reduce the distance between the base belt 100 and the brush assembly 24, the thickness of the welding layer on the base belt 100 is reduced; when the lifting assembly 22 drives the brush assembly 24 to move against the base tape 100, and the distance between the base tape 100 and the brush assembly 24 is increased, the thickness of the welding layer on the base tape 100 is increased, so that the distance between the working platform 211 and the brush assembly 24 is changed to control the thickness of the welding layer on the base tape 100. The lifting assembly 22 and the translation assembly 23 drive the brush assembly 22 to generate continuous synchronous state of longitudinal displacement and transverse displacement, so that the welding layer is formed on the welding strip.

In another embodiment, the brush assembly 24 includes a brush plate 241 and a movable assembly 242, and the brush plate 241 is disposed between the working platform 211 and the movable assembly 242. When the base tape 100 is transferred to the work platform 211, the brush plate 241 is covered on a welding surface of the base tape 100, the brush plate 241 is attached to the base tape 100, when the brush plate 241 is disposed on the base tape 100, the brush portion of the base tape 100 is exposed to the outside through the brush plate 241, the welding object 200 on the movable element 242 is formed on the base tape 100 after passing through the brush plate 241, and the brush plate 241 is used for controlling the shape and thickness structure of the welding layer on the welding tape. Preferably, the brush plate 241 located below the working platform 211 connects the brush plate 241 to the working platform 211 through a connector, so as to prevent the brush plate 241 from separating from the working platform 211 under the action of gravity.

In this embodiment, compared to the above embodiments, the soldering layer of the above embodiments is directly formed on the base tape 100 through the brush assembly 24. In this embodiment, the welding object is formed on the base tape 100 after the brush assembly 24 passes through the brush plate 241. The technical process of the brush plate 241 allows to reduce the technology of the brush mechanism 20 and to improve the accuracy of the positioning of the welding layer 200 on the base tape 100.

According to the different embodiments, the lifting assembly 22 includes at least one first lifting member 221 and at least one second lifting member 222, the first lifting member 221 and the second lifting member 222 are respectively located on the base 21, the first lifting member 221 is connected to the second lifting member 222, so that the first lifting member 221 is movable relative to the second lifting member 222, and the first lifting member 221 is connected to the working platform 211 or the movable assembly 242 to change the relative distance between the base tape 100 and the movable assembly 242, so as to form the welding layers 200 with different structures on the base tape 100.

It should be noted that the second lifting members 222 are respectively disposed at the top end of the edge of the base 21, and the second lifting members 222 form a regular shape with each other, so as to ensure that after the first lifting member 221 is connected to the second lifting member 222, the driving acting force of the first lifting member 221 on the working platform 221 or the movable assembly 242 is uniformly stressed, and the stable transmission of the working platform 221 or the movable assembly 242 is maintained. Preferably, a sleeve structure is arranged between the first lifting member 221 and the second lifting member 222, and the first lifting member 221 moves in the second lifting member 222 under the action of an external force. It is understood by those skilled in the art that the driving manner of the first lifting member 221 is not a limitation of the present invention. In addition, the structure of the lifting assembly 22 is just mentioned as an embodiment, and the different lifting structures of the lifting assembly 22 are not limitations of the present invention.

In the above-mentioned different embodiments, the movable element 242 further includes a flat end 2421, a mounting portion 2422 and a stopping portion 2423, the flat end 2421, the mounting portion 2422 and the stopping portion 2423 respectively extend from the movable element 242, the mounting portion 242 is used for filling the solder, the solder in the mounting portion 242 is transmitted to the flat end 2421, when the flat end 2421 is attached to the base tape 100 or the brush board 241, the solder is brushed on the base tape 100, and the flat end 2421 is used for smoothing the smoothness of the solder layer on the surface of the base tape 100. The stopping part 2423 is used for guiding the flow direction of the welding object so as to improve the manufacturing precision of the welding strip.

In the above different embodiments, the translation assembly 23 further includes at least one transmission element 231, at least one driving element 232, and at least one transmission element 233, the transmission element 231 is connected to the movable assembly 232 or the working platform 211, the transmission element 231 is connected to the driving element 232 through the transmission element 233, and the driving element 232 drives the movable assembly 232 or the working platform 211 to translate through the transmission element 233 when in the working state.

Further, the driving member 232 is a power generating member, which is preferably a motor, the conveying member 233 is preferably a transmission belt, the transmission members 231 are respectively located at two sides of the movable assembly 242 or the working platform 211, and the driving member 232 drives the movable assembly 242 or the working platform 211 at two sides. It is understood by those skilled in the art that the number of the translation assemblies 23 on the base 21 is not a limitation of the present invention, and the number of the translation assemblies 23 may be one or more, and when the number of the translation assemblies 23 is one, the transmission member 231 is preferably disposed at the middle position of the movable assembly 242 or the working platform 211 to keep the force applied by the translation assemblies 23 uniform. The structure of the translation assembly 23 of the present invention is used for describing the embodiments, and is not intended to limit the present invention, and the translation assembly 23 can be another translation structure, such as a sliding rail.

As shown in fig. 10, the solder strip manufacturing apparatus further includes at least one cutting mechanism 30, the base strip 100 is manufactured into the solder strip through the brush mechanism 20, and the cutting mechanism 30 is configured to cut the solder strip according to a predetermined length according to different production requirements and to transport the cut solder strip. The cutting length of the welding strip by the cutting mechanism 30 is adjusted, and the cutting mechanism 30 can cut the welding strip one by one or simultaneously cut a plurality of welding strips. It is understood by those skilled in the art that the specific structure of the cutting mechanism 30 is not a limitation of the present invention, and the cutting mechanism 30 can adopt different technical structures for cutting the length.

It should be noted that the solder ribbon manufacturing apparatus further includes at least one mounting mechanism 40, and the mounting mechanism 40 is used for respectively welding at least one battery piece 300 to the front surface or the back surface of the solder ribbon to manufacture a photovoltaic mechanism. The mounting mechanism 40 is preferably a transmission mechanism or a robot arm mechanism, the battery piece 300 is stored in the mounting mechanism 40, and the mounting mechanism 40 mounts the battery piece 300 to be welded on the front and back surfaces of the welding strip in a predetermined manner when the welding strip is transmitted to the mounting mechanism 40. It will be understood by those skilled in the art that the specific configuration of the mounting mechanism 40 is not intended to be limiting, and that the mounting mechanism 40 can be implemented in a variety of transmission and welding configurations.

It should be noted that in the above different embodiments, the relative displacement between the working platform 211 and the movable assembly 242 in the horizontal direction is in the transverse direction. The lateral direction is understood to mean the displacement of the working platform 211 or the movable element 242 along the direction of transport of the base strip 100 on the base 21. It is understood by those skilled in the art that the relative displacement direction between the working platform 211 or the movable assembly 242 is not a limitation of the present invention, and the relative displacement of the working platform 211 or the movable assembly 242 can be vertical. The longitudinal direction is understood to mean that the relative displacement between the working platform 211 or the movable element 242 is perpendicular to the transport direction of the base strip 100. In summary, the welding object can be formed on the surface of the base tape 100 by the transverse displacement or the longitudinal displacement between the working platform 211 and the movable element 242.

It should be noted that in the above different embodiments, the welding object is stored in the movable element 242, and the welding object is formed on the surface of the base tape 100 when the movable element 242 is attached to the brush plate 241 or the base tape 100. It will be understood by those skilled in the art that the location where the solder is stored during the brushing process is not a limitation of the present invention. The solder is placed on the base tape 100 or the brush plate 241, and the movable member 242 uniformly forms the solder on the base tape 100.

The utility model relates to a manufacturing approach of solder strip and a manufacturing approach of photovoltaic mechanism, the utility model discloses a solder strip manufacturing approach adopts the brush mode will the welding thing is formed at the surface of baseband 100, will moreover the solder strip weld in cell piece 300 is in order to make photovoltaic mechanism.

It is worth mentioning that the manufacturing method of the solder strip comprises the following steps:

(A) transporting a substrate 100 in a working area 1000; and

(B) the solder is formed on the surface of the base tape 100 by brushing to obtain the solder tape.

Further described, the step (B) includes:

(b.1) adjusting a relative distance between the base band 100 and a movable element 242;

(b.2) one or more horizontal displacement changes of the movable element 242 relative to the base band 100; and (b.3) while the movable component 242 is horizontally displaced, changing the longitudinal distance of the movable component 242 relative to the base strip 100 within a certain preset distance, so that the solder strip forms a concave-convex structure or a flat structure.

Further described, the step (B) includes:

(b.2) one or more horizontal displacement changes of the work platform 211 relative to the movable assembly 242; and (b.3) while the working platform 211 is horizontally displaced, changing the longitudinal distance between the working platform 211 and the movable assembly 242 within a certain preset distance, so that the solder strip forms a concave-convex structure or a flat structure.

It is worth mentioning that the step (B) and (a) further includes a step (C) of disposing a brush plate 241 on the base tape 100. The base tape 100 is transported to the working area 1000, the brush plate 241 is disposed on the base tape 100, the brush plate 241 has at least one opening 2411, the opening 2411 is used for the shape and size of the base tape 100, and the brush plate 241 is used for controlling the thickness of a solder layer 200 on the surface of the base tape 100.

Further, the step (C) is selected according to different production requirements, that is, the movable element 242 forms the solder directly on the base tape 100, or the movable element 242 forms the solder on the base tape 100 after passing through the brush plate 241.

It is worth mentioning that, in the step (b.1), the base tape 100 enters the working area 1000, the base tape 100 is located on the working platform 211, the working platform 211 is displaced toward the movable element 242 under an external force to change the distance between the working platform 211 or the brush plate 241 and the movable element 242, and the distance between the working platform 211 or the brush plate 241 and the movable element 242 is increased or decreased.

It is worth mentioning that, in the step (b.1), the base tape 100 enters the working area 210, the movable element 242 is displaced towards the working platform 211 or the brush plate 241 under an external force, so as to change the distance between the movable element 242 and the working platform 211 or the brush plate 241, and the distance between the movable element 242 and the working platform 211 or the brush plate 241 is increased or decreased.

It is worth mentioning that the step (B) further includes (b.3) forming the solder by a brush coating process on the front and back surfaces of the base tape 100, respectively, and the structure of the solder layer of the solder tape is not limited.

The utility model discloses a manufacturing method of photovoltaic mechanism, its method step includes:

(a) transporting a substrate 100 in a working area 1000;

(b) forming the welding object on the surface of the base band 100 by adopting a brush coating mode to form the welding band;

(c) segmenting the welding strip according to a certain preset distance; and

(d) at least one cell 300300 is soldered to the solder strip to produce the photovoltaic device.

Further described, the step (b) includes:

(b.1) adjusting the relative distance between the base band 100 and a movable element 242;

(b.2) one or more horizontal displacement changes of said movable element 242 relative to said base band 100; and (b.3) changing the longitudinal distance of the movable assembly 242 relative to the base strip 100 within a certain preset distance while the movable assembly 242 is horizontally displaced, so that the welding strip forms a concave-convex structure or a flat structure.

Further described, the step (b) includes:

(b.2) one or more horizontal displacement changes of said work platform 211 relative to said movable assembly 242; and (b.3) while the working platform 211 is horizontally displaced, changing the longitudinal distance between the working platform 211 and the movable assembly 242 within a certain preset distance, so that the solder strip forms a concave-convex structure or a flat structure.

It is worth mentioning that the step (b) and (a) further includes the step (c) of disposing a brush plate 241 on the base tape 100. The base tape 100 is transferred to the working area 1000, the brush plate 241 is disposed on the base tape 100, the brush plate 241 has at least one opening 2411, the opening 2411 is used for the shape and size of the base tape 100, and the brush plate 241 is used for controlling the thickness of a welding layer on the surface of the base tape 100.

It should be noted that, in the step (b.1), the base tape 100 enters the working area 1000, the base tape 100 is located on the working platform 211, the working platform 211 is displaced toward the movable element 242 under an external force to change the distance between the working platform 211 or the brush plate 241 and the movable element 242, and the distance between the working platform 211 or the brush plate 241 and the movable element 242 is increased or decreased.

It should be noted that, in the step (b.1), the base tape 100 enters the working area 1000, the movable element 242 is displaced toward the working platform 211 or the brush plate 241 under an external force, so as to change the distance between the movable element 242 and the working platform 211 or the brush plate 241, and the distance between the movable element 242 and the working platform 211 or the brush plate 241 is increased or decreased.

Those skilled in the art will appreciate that the embodiments of the present invention illustrated in the drawings and described above are merely examples of the invention and not limitations.

It can thus be seen that the objects of the invention have been fully and effectively accomplished. The embodiments have been fully illustrated and described for the purpose of explaining the functional and structural principles of the present invention, and the present invention is not limited by changes based on the principles of these embodiments. Accordingly, this invention includes all modifications encompassed within the scope and spirit of the following claims.

Claims

1. A brush mechanism for forming a solder on a surface of a substrate, comprising

A base;

at least one lifting component; and

2. The brush mechanism of claim 1, wherein the lift assembly is coupled to a work platform of the base, the lift assembly being adapted to adjust a distance between the base strip of the work platform and a longitudinal direction of the brush assembly.

3. The brush mechanism of claim 1, wherein the lift assembly is coupled to the brush assembly, the lift assembly for adjusting a distance longitudinally between the brush assembly and the base strip on a work platform of the base.

4. The brush mechanism according to claim 1, wherein the brush assembly is located in an upper space and a lower space of the base, respectively, the elevating assembly is connected to the brush assembly to drive the brush assembly to slide toward the base, and the base has at least one slot so that the solder of the brush assembly is formed on the front and rear surfaces of the base tape through the slot.

5. The brush mechanism of claim 2, wherein the brush mechanism includes a translation assembly coupled to the work platform to drive a change in displacement of the work platform relative to a horizontal direction of the brush assembly.

6. The brush mechanism of claim 3, wherein the brush mechanism includes a translation assembly coupled to the work platform to drive a change in displacement of the work platform relative to a horizontal direction of the brush assembly.

7. The brush mechanism of claim 2, wherein the brush mechanism includes a translation assembly coupled to the brush assembly to drive a change in displacement of the brush assembly relative to the work platform in a horizontal direction.

8. The brush mechanism of claim 3, wherein the brush mechanism includes a translation assembly coupled to the brush assembly to drive a change in displacement of the brush assembly relative to the work platform in a horizontal direction.

9. The brush mechanism of claim 4, wherein the brush mechanism includes a translation assembly, wherein the base includes a work platform, the translation assembly coupled to the brush assembly to drive a change in displacement of the brush assembly relative to the work platform in a horizontal direction.

10. The brush mechanism of claim 1, wherein the lift assembly is coupled to a work platform of the base, wherein the brush assembly includes at least one brush plate having at least one opening and a movable assembly, the base strip being transported to the work platform, the brush plate being disposed on the base strip, the weld on the movable assembly being formed on the base strip through the opening.

11. The brush mechanism according to any one of claims 5-9, wherein the brush assembly includes at least one brush plate having at least one opening, and a movable member, the base strip being transported to the working platform, the brush plate being disposed on the base strip, the weld on the movable member being formed on the base strip through the opening.

12. The brush mechanism of claim 10, wherein the lift assembly includes at least a first lift member and at least a second lift member movably coupled to the first lift member to drive longitudinal displacement changes of the work platform or the movable assembly.

13. The brush mechanism of claim 11, wherein the lift assembly includes at least a first lift member and at least a second lift member movably coupled to the first lift member to drive longitudinal displacement changes of the work platform or the movable assembly.

14. The brush mechanism of claim 11, wherein the brush mechanism includes a translating assembly, wherein the translating assembly includes a driving member, and a transmission member, the driving member is mounted to the work platform or the movable assembly, the driving member is connected to the transmission member via the transmission member, and the driving member drives the work platform or the movable assembly to undergo a horizontal displacement change.

15. The brush mechanism of claim 11, wherein the translating element includes a driving member, and a transmission member, the driving member being mounted to the working platform or the movable element, the driving member being coupled to the transmission member via the transmission member, the driving member driving the working platform or the movable element to undergo a horizontal displacement change.

16. A solder ribbon manufacturing apparatus for forming a solder to a base tape to manufacture the solder ribbon, comprising:

a cutting mechanism;

a mounting mechanism; and

the brush mechanism of any of claims 1-15, wherein the brush mechanism forms the weld to the base strip, wherein the cutting mechanism cuts the base strip to a predetermined length, and wherein the mounting mechanism couples at least one battery tab to the base strip.