CN213278080U

CN213278080U - Chip heat dissipation device of LED lighting drive controller

Info

Publication number: CN213278080U
Application number: CN202022574456.2U
Authority: CN
Inventors: 蔡晓雄
Original assignee: Shanghai Sx Microelectronics Co ltd
Current assignee: Shanghai Sx Microelectronics Co ltd
Priority date: 2020-11-10
Filing date: 2020-11-10
Publication date: 2021-05-25
Anticipated expiration: 2030-11-10

Abstract

The utility model discloses a chip heat abstractor of LED illumination drive controller belongs to heat dissipation technical field. It includes the fan, base plate and chip, the fan is located the base plate outside, logical groove has been seted up on the base plate, chip fixed connection leads to the inslot, install the honeycomb duct on the base plate, chip top fixedly connected with fin, the fixedly connected with cover the body on the base plate, the cover body is detained and is established the bottom surface at base plate surface and cover chip, two through-holes have been seted up on the base plate, two through-holes all communicate to cover body inner chamber, the chip is located between two through-holes, be provided with the baffle in the inner chamber of the one end that is close to the chip on the honeycomb duct, the baffle is. The utility model discloses a to the fixed fin in chip top, the chip bottom carries out the forced air cooling through the honeycomb duct, ensures that the chip can in time dispel the heat when the operation generates heat to reduce the emergence that the chip work efficiency that causes because the chip is overheated and descends.

Description

Chip heat dissipation device of LED lighting drive controller

Technical Field

The utility model relates to a chip heat abstractor of LED lighting drive controller belongs to heat dissipation technical field.

Background

With the rapid development of the chip industry, electronic products become intelligent and complicated, the volume of electronic components tends to be miniaturized, and the density of the electronic components in unit area is higher and higher. The direct effect of this is that the electronic product generates more and more heat during operation. If there is no good heat dissipation means to remove the heat generated by the electrons, these excessive temperatures will cause the electronic device to generate electron dissociation and thermal stress, which will result in the overall stability being reduced and the lifetime of the electronic device itself being shortened. Therefore, how to remove the heat to avoid overheating of the electronic components is a problem that is not negligible, a chip in the LED lighting driving controller generates a certain amount of heat during operation, and if the LED lighting driving controller cannot disperse the heat at the chip in time, even if the chip has a certain high temperature resistance, a certain influence still exists, so that the whole LED lighting driving controller cannot operate normally.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve lies in: the chip heat dissipation device of the LED illumination driving controller solves the problem of insufficient heat dissipation of the LED illumination driving controller.

The utility model discloses the technical problem that will solve takes following technical scheme to realize:

a chip heat sink of LED lighting drive controller comprises a fan, a substrate and a chip, the fan is positioned at the outer side of the substrate, a through groove is arranged on the substrate, the chip is fixedly connected in the through groove, a flow guide pipe is arranged on the substrate, the air outlet of the fan points to one end of the flow guide pipe, the other end of the flow guide pipe points to the chip, the top end of the chip is fixedly connected with a radiating fin, the base plate is fixedly connected with a cover body, the cover body is buckled on the surface of the base plate and covers the bottom end surface of the chip, the substrate is provided with two through holes which are communicated with the inner cavity of the cover body, the chip is positioned between the two through holes, and a partition plate is arranged in an inner cavity at one end of the flow guide pipe close to the chip, and the partition plate guides the gas part flowing through the flow guide pipe into one of the through holes.

As a preferred example, the heat sink includes a bottom plate and a plurality of legs, the legs are fixed on the side walls of the bottom plate, the end of each leg is fixed on the substrate, one side of the bottom plate is attached to the top end of the chip, and the other side of the bottom plate extends upward to form an integrally formed fin.

As a preferred example, a thermal interface material for improving heat transfer efficiency is filled between the bottom plate and the top end of the chip, and the thermal interface material is silicone grease.

As a preferable example, the bore of the inner cavity of the flow guide pipe is gradually reduced from the end of the flow guide pipe close to the fan to the end of the flow guide pipe close to the chip.

As a preferable example, the bottom end surface of the chip is provided with a heat conducting sheet, and the heat conducting sheet covers the bottom end surface of the chip and blocks a gap between the chip and the through groove.

As a preferable example, a cavity is disposed in the side wall of the cover, a water inlet and a water outlet are disposed on the outer side of the cover, the water inlet and the water outlet are both communicated with the cavity, a water tank is disposed on the outer side of the cover, a refrigeration element is disposed in the water tank, the input end of the water tank is communicated with the water outlet, and the output end of the water tank is communicated with the water inlet.

The utility model has the advantages that: the utility model discloses set up the chip on the base plate, the both ends terminal surface of chip is cooled down, the one end terminal surface fixed connection fin of chip, the other end terminal surface of chip utilizes fixed through-hole, the cover body and honeycomb duct on the base plate, and the gas of air outlet department removal on the fan outside the base plate is shunted for the fan can be cooled down to the two sides of chip simultaneously, improves the radiating efficiency of chip, ensures that the temperature of chip department can not be so high as to influence the normal work of chip.

Drawings

Fig. 1 is a schematic structural view (a view is a top view of a substrate surface on which a chip top is located) of the present invention;

FIG. 2 is a schematic structural view of the present invention;

fig. 3 is an exploded view of the substrate, the chip and the heat sink according to the present invention.

In the figure: the fan comprises a fan 1, a substrate 2, a chip 3, a flow guide pipe 4, a cover body 5, a through hole 6, a through groove 7, a radiating fin 8, a water inlet 9, a water outlet 10 and a partition plate 11.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand and understand, the present invention is further explained by combining the following specific drawings.

As shown in fig. 1-3, a chip heat dissipation device of an LED lighting driving controller includes a fan 1, a substrate 2 and a chip 3, wherein the fan 1 is located outside the substrate 2, a through groove 7 is formed on the substrate 2, the chip 3 is fixedly connected in the through groove 7 (pins at the edge of the chip 3 can be welded or embedded in the through groove 7), a flow guide tube 4 is installed on the substrate 2, an air outlet of the fan 1 points at one end of the flow guide tube 4, the other end of the flow guide tube 4 points at the chip 3, a heat sink 8 is fixedly connected to the top end of the chip 3, a cover 5 is fixedly connected to the substrate 2, the cover 5 is fastened to the surface of the substrate 2 and covers the bottom end surface of the chip 3, two through holes 6 are formed on the substrate 2, and the two through holes 6 are both communicated to an inner cavity of the, the chip 3 is located between two of the through holes 6 (i.e. the air flow passing through the cover 5 passes from one through hole 6 to another through hole 6, and the air flow will pass through the bottom surface of the chip 3 located in the region between the two through holes 6, thereby carrying away part of the heat), a partition plate 11 is arranged in the inner cavity of the flow guide tube 4 near one end of the chip 3, and the partition plate 11 guides part of the air passing through the flow guide tube 4 into one of the through holes 6.

The radiating fin 8 comprises a bottom plate and a plurality of supporting legs, the supporting legs are fixed on the side wall of the bottom plate, the end part of each supporting leg is fixed on the substrate 2, one side of the bottom plate is attached to the top end of the chip 3, and the surface of the other side of the bottom plate extends upwards to form an integrally-formed fin (namely, one side of the bottom plate is a smooth surface and is used for being in contact with the top end of the chip 3, the surface of the other side of the bottom plate is provided with a plurality of fins vertical to the surface of the bottom plate, the fins are integrally formed with the bottom plate, the plurality of fins are arranged in parallel, the outlet direction of the flow guide pipe 4 is parallel to the fins, so that the fins penetrate through gaps among; every stabilizer blade tip is provided with the screw hole, corresponds the stabilizer blade tip on the base plate 2 and also is provided with the screw hole, and the stabilizer blade screw hole that contacts is fixed by same group screw nut with base plate 2 screw holes, and the body of rod part of screw rod runs through stabilizer blade screw hole and base plate 2 screw holes to establish the nut at the tip cover of the body of rod, run through stabilizer blade screw hole and the screw hole on the base plate 2 simultaneously through the screw rod, and stretch out two screw holes at the screw rod after the nut is established to the cover and fix.

The bore of the inner cavity of the flow guide pipe 4 is gradually reduced from one end of the flow guide pipe 4 close to the fan 1 to one end of the flow guide pipe 4 close to the chip 3, and the wind at the air outlet of the fan 1 is guided to the chip 3 in a concentrated manner.

The thermal interface material used for improving the heat transfer efficiency is filled between the bottom plate and the top end of the chip 3, the thermal interface material is silicone grease, the whole radiating fin 8 can be detached from the substrate 2, when the volatilization of the silicone grease is reduced or the coating amount is too small, the whole radiating fin 8 can be detached, and the silicone grease coating and filling are carried out, all the surfaces of the thermal interface material have roughness, so when the two surfaces (the top end surface of the chip 3 and the bottom end surface of the radiating fin 8) are contacted together, the two surfaces can not be completely contacted together, air gaps are always included in the thermal interface material, the heat conductivity coefficient of air is very small, and therefore, the relatively large contact thermal resistance is caused. The air gap can be filled with thermal interface material, so that the contact thermal resistance can be reduced, and the heat dissipation performance can be improved

The bottom surface of the chip 3 is provided with a heat conducting fin, the heat conducting fin is coated on the bottom surface of the chip 3 and is sealed in a gap between the chip 3 and the through groove 7, the heat conducting fin at the position can be a metal sheet and can also be a structure close to the radiating fin 8, when the heat conducting fin coats the lower end surface of the chip 3, the gap between the chip 3 and the substrate 2 is filled, the contact radiating area is increased, the gap between the chip 3 and the through groove 7 of the substrate 2 is prevented from forming a heat detention area, and the radiating efficiency is improved.

The side wall of the cover body 5 is provided with a cavity, the outer side of the cover body 5 is provided with a water inlet 9 and a water outlet 10, the water inlet 9 is communicated with the water outlet 10, the cavity is communicated with the water tank, the outer side of the cover body 5 is provided with a water tank, a refrigerating element is arranged in the water tank, the input end of the water tank is communicated with the water outlet 10, the output end of the water tank is communicated with the water inlet 9, the refrigerating element cools the circulating water on the whole cover body 5, thereby reducing the temperature of the air flowing through the inner cavity of the cover body 5 and indirectly reducing the temperature of the bottom end of the chip 3 (the refrigerating element can be a semiconductor refrigerating sheet, also called a thermoelectric refrigerating sheet, is a heat pump, has the advantages of no sliding part, is limited in some spaces, has high reliability requirement and has no refrigerant pollution, and utilizes the Peltier effect of semiconductor materials, the two ends of the couple can respectively absorb heat and emit heat, and the aim of refrigeration can be achieved).

The working principle is as follows: the utility model improves the heat dissipation efficiency by arranging the radiating fins 8 at the top end of the chip 3 and arranging the silicone grease between the radiating fins 8 and the chip 3, arranging the cover body 5 outside the bottom end of the chip 3, wherein the cover body 5 and the two through holes 6 on the base plate 2 form a pipeline passage, the air outlet of the fan 1 outside the base plate 2 guides the air to the radiating fins 8 of the chip 3 through the flow guide pipe 4 arranged on the base plate 2, the baffle plate 11 is arranged in one end of the inner cavity of the flow guide pipe 4 close to the chip 3, the baffle plate 11 divides the airflow part in the flow guide pipe 4 into one through hole 6, the airflow enters the cover body 5 through one through hole 6 and leaves the cover body 5 through the other through hole 6, and in the process, the airflow takes away the heat at the bottom end of the base plate 2 between the two through holes 6, the utility model discloses a through groove 7 is arranged on the base plate 2, and the, ensuring proper operation of the chip 3.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that various changes and modifications may be made without departing from the spirit and scope of the invention, and such changes and modifications fall within the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a chip heat abstractor of LED illumination drive controller, includes fan (1), base plate (2) and chip (3), fan (1) is located the base plate (2) outside, its characterized in that: the LED chip is characterized in that a through groove (7) is formed in the substrate (2), the chip (3) is fixedly connected in the through groove (7), a flow guide pipe (4) is installed on the substrate (2), an air outlet of the fan (1) points to one end of the flow guide pipe (4), the other end of the flow guide pipe (4) points to the chip (3), a radiating fin (8) is fixedly connected to the top end of the chip (3), a cover body (5) is fixedly connected to the substrate (2), the cover body (5) is buckled on the surface of the substrate (2) and covers the bottom end surface of the chip (3), two through holes (6) are formed in the substrate (2), the two through holes (6) are communicated with the inner cavity of the cover body (5), the chip (3) is located between the two through holes (6), and a partition plate (11) is arranged in the inner cavity, close to one end of the chip (3), the partition (11) guides the gas portion flowing through the flow guide tube (4) into one of the through-holes (6).

2. The chip heat sink of the LED lighting driving controller as claimed in claim 1, wherein: the radiating fin (8) comprises a bottom plate and a plurality of support legs, the support legs are fixed on the side wall of the bottom plate, the end portions of the support legs are fixed on the substrate (2), one side of the bottom plate is attached to the top end of the chip (3), and the surface of the other side of the bottom plate extends upwards to form integrally-formed fins.

3. The chip heat sink of the LED lighting driving controller as claimed in claim 2, wherein: and a thermal interface material for improving heat transfer efficiency is filled between the bottom plate and the top end of the chip (3), and the thermal interface material is silicone grease.

4. The chip heat sink of the LED lighting driving controller as claimed in claim 1, wherein: the bore of the inner cavity of the flow guide pipe (4) is gradually reduced from one end, close to the fan (1), on the flow guide pipe (4) to one end, close to the chip (3), on the flow guide pipe (4).

5. The chip heat sink of the LED lighting driving controller as claimed in claim 1, wherein: the bottom end surface of the chip (3) is provided with a heat conducting sheet, and the heat conducting sheet is coated on the bottom end surface of the chip (3) and blocks a gap between the chip (3) and the through groove (7).

6. The chip heat sink of the LED lighting driving controller as claimed in claim 1, wherein: the solar water heater is characterized in that a cavity is arranged in the side wall of the cover body (5), a water inlet (9) and a water outlet (10) are arranged on the outer side of the cover body (5), the water inlet (9) and the water outlet (10) are communicated with each other through the cavity, a water tank is arranged on the outer side of the cover body (5), a refrigerating element is arranged in the water tank, the input end of the water tank is communicated with the water outlet (10), and the output end of the water tank is communicated with the water inlet (9).